Nova Patents
AT447771T

Encapsulated microelectronic devices

Abstract

A sealing device of the microelectronic device. The device comprises semiconductor substrate the semiconductor substrate which is adjacent to the microelectronic device and the microelectronic device which is adjacent to the at least one first blocking element laminated. The blocking element laminated packaging micro- electronic device it comprises at least one of the first barrier layer and at least one polymer layer. Said sealing device of the microelectronic device can be selectively comprise the semiconductor substrate with the micro electronic device between at least a second barrier layer. The second barrier layer comprises at least one second barrier layer and at least one second polymer layer. Also claims a method for manufacturing of packing the microelectronic device method for.

Term

No projected expiry on record.

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114 members in 10 offices

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Priority claims
DocumentOfficeKindDate
57164900United States of AmericaA
0106562United States of AmericaW

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WO0036665A1World Intellectual Property Organization (WIPO)A1
TW439308BTaiwan Province of ChinaB
US6268695B1United States of AmericaB1
US2001015620A1United States of AmericaA1
EP1145338A1European Patent Office (EPO)A1
WO0181649A1World Intellectual Property Organization (WIPO)A1
WO0182389A1World Intellectual Property Organization (WIPO)A1
AU4189301AAustraliaA
AU4349801AAustraliaA
KR20010101231ARepublic of KoreaA
WO0189006A1World Intellectual Property Organization (WIPO)A1
AU3996901AAustraliaA
TW493290BTaiwan Province of ChinaB
US6413645B1United States of AmericaB1
US2002125822A1United States of AmericaA1
JP2002532850AJapanA
US2002150745A1United States of AmericaA1
WO02083411A1World Intellectual Property Organization (WIPO)A1
US6497598B2United States of AmericaB2
EP1279197A1European Patent Office (EPO)A1
EP1282922A1European Patent Office (EPO)A1
US6522067B1United States of AmericaB1
US2003064171A1United States of AmericaA1
WO03028903A2World Intellectual Property Organization (WIPO)A2
AU2002330080A1AustraliaA1
US6548912B1United States of AmericaB1
US6570325B2United States of AmericaB2
US6573652B1United States of AmericaB1
US2003104753A1United States of AmericaA1
CN1426605AChinaA
CN1429412AChinaA
US6623861B2United States of AmericaB2
JP2003532260AJapanA
JP2003533892AJapanA
US2003215575A1United States of AmericaA1
TW575671BTaiwan Province of ChinaB
WO03028903A3World Intellectual Property Organization (WIPO)A3
EP1432528A2European Patent Office (EPO)A2
TWI222189BTaiwan Province of ChinaB
US2004265508A9United States of AmericaA9
JP2005504652AJapanA
US6866901B2United States of AmericaB2
EP1524708A2European Patent Office (EPO)A2
US2005158476A9United States of AmericaA9
US6923702B2United States of AmericaB2
US2005176181A1United States of AmericaA1
US2005202646A1United States of AmericaA1
CN1678409AChinaA
US6962671B2United States of AmericaB2
EP1524708A3European Patent Office (EPO)A3
CN1270374CChinaC
JP2006317958AJapanA
US7198832B2United States of AmericaB2
US2007164376A1United States of AmericaA1
CN1327974CChinaC
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JP4115130B2JapanB2
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WO2008094352A1World Intellectual Property Organization (WIPO)A1
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USRE40531EUnited States of AmericaE
EP1432528B1European Patent Office (EPO)B1
AT413931TAustriaT
TW200845314ATaiwan Province of ChinaA
TW200845454ATaiwan Province of ChinaA
EP1279197B1European Patent Office (EPO)B1
DE60229866D1GermanyD1
AT418087TAustriaT
DE60137033D1GermanyD1
USRE40787EUnited States of AmericaE
CN100520538CChinaC
JP4303591B2JapanB2
US2009191342A1United States of AmericaA1
US2009208754A1United States of AmericaA1
EP1282922B1European Patent Office (EPO)B1
AT447771TThis recordAustriaT
EP2126999A1European Patent Office (EPO)A1
DE60140359D1GermanyD1
US7727601B2United States of AmericaB2
WO2010077544A1World Intellectual Property Organization (WIPO)A1
WO2010078405A1World Intellectual Property Organization (WIPO)A1
JP2010526399AJapanA
US2010193468A1United States of AmericaA1
TW201034090ATaiwan Province of ChinaA
TW201034093ATaiwan Province of ChinaA
US2010330748A1United States of AmericaA1
JP4677649B2JapanB2
KR20110091568ARepublic of KoreaA
JP4750339B2JapanB2
JP2011159629AJapanA
EP2373487A1European Patent Office (EPO)A1
CN102256786AChinaA
JP4856313B2JapanB2
US2012118855A1United States of AmericaA1
JP2012512527AJapanA
EP2481578A1European Patent Office (EPO)A1
EP1145338B1European Patent Office (EPO)B1
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