ATE388487T1
Apparatus for cooling semiconductor devices attached to a printed circuit board
Abstract
This record has no abstract on file.
Term
Term ended
Projected expiry passed 7 August 2023, 3.1 years ago.
- Priority and filed
- Published
- Projected expiry
- Today
8 members in 4 offices
Members8
| Document | Office | Kind | |
|---|---|---|---|
| EP1508916A1 | European Patent Office (EPO) | A1 | |
| US2005128713A1 | United States of America | A1 | |
| US7187553B2 | United States of America | B2 | |
| EP1508916B1 | European Patent Office (EPO) | B1 | |
| AT388487T | Austria | T | |
| ATE388487T1This record | Austria | T1 | |
| DE60319523D1 | Germany | D1 | |
| DE60319523T2 | Germany | T2 |
Numbers
- Application
- 3018046
Titles2
- English
- DEVICE FOR COOLING SEMICONDUCTOR COMPONENTS ON PRINTED CIRCUIT BOARDS
- German
- VORRICHTUNG ZUR KÜHLUNG VON HALBLEITERBAUTEILEN AUF LEITERPLATTEN
Classification
- CPC, 2
- H10W40/77
- H10W40/611
- IPC, 2
- H10W40 60
- H10W40 77