AT388487T
Apparatus for cooling semiconductor devices attached to a printed circuit board
Abstract
This record has no abstract on file.
Term
No projected expiry on record.
- Priority and filed
- Granted
- Today
7 members in 4 offices
Members7
| Document | Office | Kind | |
|---|---|---|---|
| EP1508916A1 | European Patent Office (EPO) | A1 | |
| US2005128713A1 | United States of America | A1 | |
| US7187553B2 | United States of America | B2 | |
| EP1508916B1 | European Patent Office (EPO) | B1 | |
| AT388487TThis record | Austria | T | |
| DE60319523D1 | Germany | D1 | |
| DE60319523T2 | Germany | T2 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 3018046
Titles2
- German
- VORRICHTUNG ZUR KÜHLUNG VON HALBLEITERBAUTEILEN AUF LEITERPLATTEN
- English
- DEVICE FOR COOLING SEMICONDUCTOR COMPONENTS ON PCB
Classification
- CPC, 3
- H01L23/433
- H01L23/4006
- H01L2924/0002
- IPC, 2
- H01L23 40
- H01L23 433