Method for producing a semiconductor-metal contact through a dielectric layer

A method of electrically contacting a semiconductor layer ( 13 ) coated with at least one dielectic layer ( 12 ) which is coated with a metal layer the metal layer ( 11 ) is applied on the dielectric layer ( 12 ) and the metal layer ( 11 ) is temporarily locally heated in a line, linear or dotted pattern by means of a source of radiation ( 9 ) in a controlled manner in such a way that a local molten mixture, is formed consisting exclusively of the metal layer ( 11 ), the dielectric layer ( 12 ) and the semiconductor layer ( 13 ) are located directly underneath the metal layer ( 11 ) and upon solidification, leads to an electrical contact between the semiconductor layer ( 13 ) and the metal layer ( 11 ).