Organosilicate resin formulation for use in microelectronic devices

In electronic devices of manufacturing in the used to formed a layer or multilayer of can curing of organic Portland combination property, it including: (a) has at least a contains and Silicon Atomic combined of Ene not saturated group of n-oxygen base or n oxygen base of Silicon n-; b) has at least a contains and Silicon Atomic combined of Fong ring group of n-oxygen base or n oxygen base of Silicon n-; (c) potential acid catalyst and (d) any selected of, has at least a and Silicon Atomic combined of C1-C6 alkyl of n-oxygen base or n oxygen base of Silicon n-.