AT445230T - METHOD OF PLANARIZING THE UPPER SURFACE OF A SEMICONDUCTOR WAFER

35 members in 13 offices

This recordMember, by publication datePriority claim3 more offices are in the list below

Priority claims
Document	Office	Kind	Date
84672697	United States of America	A	1997-04-30
9808693	United States of America	W	1998-04-30

Family members, oldest first
Document	Office	Kind
CA2287404A1	Canada	A1	1998-11-05
WO9849723A1	World Intellectual Property Organization (WIPO)	A1	1998-11-05
AU7170698A	Australia	A	1998-11-24
CN1254441A	China	A	2000-05-24
BR9809311A	Brazil	A	2000-07-04
EP1016133A1	European Patent Office (EPO)	A1	2000-07-05
US6194317B1	United States of America	B1	2001-02-27
KR20010020384A	Republic of Korea	A	2001-03-15
AU734883B2	Australia	B2	2001-06-21
JP2001523395A	Japan	A	2001-11-20
TW479285B	Taiwan Province of China	B	2002-03-11
CN1165975C	China	C	2004-09-08
KR100571892B1	Republic of Korea	B1	2006-04-18
MY125856A	Malaysia	A	2006-08-30
CA2287404C	Canada	C	2007-10-16
US2008026583A1	United States of America	A1	2008-01-31
WO2009023387A2	World Intellectual Property Organization (WIPO)	A2	2009-02-19
WO2009023387A3	World Intellectual Property Organization (WIPO)	A3	2009-04-02
TW200918654A	Taiwan Province of China	A	2009-05-01
EP1016133B1	European Patent Office (EPO)	B1	2009-10-07
AT445230TThis record	Austria	T	2009-10-15
ATE445230T1	Austria	T1	2009-10-15
DE69841220D1	Germany	D1	2009-11-19
EP2186121A2	European Patent Office (EPO)	A2	2010-05-19
KR20100065328A	Republic of Korea	A	2010-06-16
CN101779274A	China	A	2010-07-14
JP2010537404A	Japan	A	2010-12-02
EP2186121A4	European Patent Office (EPO)	A4	2011-10-12
US8092707B2	United States of America	B2	2012-01-10
US2012094487A1	United States of America	A1	2012-04-19
CN101779274B	China	B	2012-09-05
JP5513384B2	Japan	B2	2014-06-04
TWI460261B	Taiwan Province of China	B	2014-11-11
KR101494034B1	Republic of Korea	B1	2015-02-16
EP2186121B1	European Patent Office (EPO)	B1	2017-05-17

1 legal event, as the office reported them to INPADOC

Legal events, newest first
	Event	Code
2010-04-15	Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER	RER

CPC, 6: B24B37/22
B24B37/245
B24D11/00
H01L21/31053
H01L21/3212
H01L21/76819
Filled: the office’s first classification
IPC, 9: B24B37 22
B24B37 24
B24D11 00
B24D3 20
C09K3 14
H01L21 304
H01L21 3105
H01L21 321
H01L21 768

Method of planarizing the upper surface of a semiconductor wafer