AT443344T

Transfer of a thin layer from a wafer comprising a buffer layer

Abstract

This record has no abstract on file.

Term

Term ended

Expired 9 July 2023, 3.2 years ago.

  1. Priority
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76 members in 11 offices

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Priority claims
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0208600FranceA
0303497International Bureau of the World Intellectual Property Organization (WIPO)W

Members76

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WO2004006311A2World Intellectual Property Organization (WIPO)A2
WO2004006326A1World Intellectual Property Organization (WIPO)A1
WO2004006327A2World Intellectual Property Organization (WIPO)A2
FR2842349A1FranceA1
FR2842350A1FranceA1
AU2003247130A1AustraliaA1
AU2003249475A1AustraliaA1
AU2003250462A1AustraliaA1
AU2003250462A8AustraliaA8
WO2004006311A3World Intellectual Property Organization (WIPO)A3
WO2004006327A3World Intellectual Property Organization (WIPO)A3
US2004053477A1United States of AmericaA1
TW200409281ATaiwan Province of ChinaA
FR2848334A1FranceA1
WO2004053961A1World Intellectual Property Organization (WIPO)A1
AU2003294170A1AustraliaA1
TW200411820ATaiwan Province of ChinaA
US2004157409A1United States of AmericaA1
FR2842349B1FranceB1
KR20050018979ARepublic of KoreaA
KR20050018984ARepublic of KoreaA
TW200511393ATaiwan Province of ChinaA
EP1522097A2European Patent Office (EPO)A2
FR2842350B1FranceB1
EP1535326A2European Patent Office (EPO)A2
EP1547146A1European Patent Office (EPO)A1
KR20050084146ARepublic of KoreaA
EP1568073A1European Patent Office (EPO)A1
US2005191824A1United States of AmericaA1
US2005191825A1United States of AmericaA1
CN1666330AChinaA
CN1666331AChinaA
US6953736B2United States of AmericaB2
JP2005532686AJapanA
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US2005255682A1United States of AmericaA1
CN1720605AChinaA
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KR100797210B1Republic of KoreaB1
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TWI296836BTaiwan Province of ChinaB
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US2008164492A1United States of AmericaA1
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CN100477150CChinaC
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EP1535326B1European Patent Office (EPO)B1
AT442667TAustriaT
ATE442667T1AustriaT1
EP1522097B1European Patent Office (EPO)B1
AT443344TThis recordAustriaT
ATE443344T1AustriaT1
DE60329192D1GermanyD1
DE60329293D1GermanyD1
EP1522097B9European Patent Office (EPO)B9
JP2010199617AJapanA
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US7803694B2United States of AmericaB2
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JP4762547B2JapanB2
EP1547146B1European Patent Office (EPO)B1
AT524827TAustriaT
ATE524827T1AustriaT1
US8049224B2United States of AmericaB2
JP4904478B2JapanB2