AT360889T
Electronic assembly comprising substrate with embedded capacitors and methods of manufacture
Abstract
This record has no abstract on file.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
29 members in 11 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 63103700 | United States of America | A |
Members29
| Document | Office | Kind | |
|---|---|---|---|
| WO0211206A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO0211207A2 | World Intellectual Property Organization (WIPO) | A2 | |
| AU8084901A | Australia | A | |
| AU8085001A | Australia | A | |
| KR20020042698A | Republic of Korea | A | |
| WO0211206A3 | World Intellectual Property Organization (WIPO) | A3 | |
| EP1305830A2 | European Patent Office (EPO) | A2 | |
| US6611419B1 | United States of America | B1 | |
| WO0211207A3 | World Intellectual Property Organization (WIPO) | A3 | |
| HK1052252A1 | Hong Kong, China | A1 | |
| EP1358675A2 | European Patent Office (EPO) | A2 | |
| CN1470069A | China | A | |
| CN1470070A | China | A | |
| JP2004505469A | Japan | A | |
| EP1515365A2 | European Patent Office (EPO) | A2 | |
| US6970362B1 | United States of America | B1 | |
| US2006012966A1 | United States of America | A1 | |
| KR100591217B1 | Republic of Korea | B1 | |
| EP1515365A3 | European Patent Office (EPO) | A3 | |
| EP1358675B1 | European Patent Office (EPO) | B1 | |
| AT360889TThis record | Austria | T | |
| DE60128145D1 | Germany | D1 | |
| MY133591A | Malaysia | A | |
| DE60128145T2 | Germany | T2 | |
| US7339798B2 | United States of America | B2 | |
| MY136263A | Malaysia | A | |
| CN100492628C | China | C | |
| CN100492629C | China | C | |
| EP1515365B1 | European Patent Office (EPO) | B1 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 1959277
Titles2
- German
- ELEKTRONISCHER AUFBAU MIT SUBSTRAT UND EINGEBETTETEM KONDENSATOR UND HERSTELLUNGSVERFAHREN
- English
- ELECTRONIC CONSTRUCTION WITH SUBSTRATE AND EMBEDDED CONDENSER AND MANUFACTURING METHOD
Classification
- CPC, 21
- H01L23/50
- H01L23/49822
- H01L2224/05571
- H01L2224/05573
- H01L2224/16225
- H01L2224/16235
- H01L2924/00014
- H01L2924/01078
- H01L2924/09701
- H01L2924/15311
- H05K1/0306
- H05K1/112
- H05K1/162
- H05K1/185
- H05K3/4611
- H05K3/4629
- H05K3/4688
- H05K2201/0187
- H05K2201/049
- H05K2201/10674
- H05K2201/10734
- IPC, 9
- H01L23 12
- H01L23 13
- H01L23 498
- H01L23 50
- H05K1 03
- H05K1 11
- H05K1 16
- H05K1 18
- H05K3 46