AT360889T

Electronic assembly comprising substrate with embedded capacitors and methods of manufacture

Abstract

This record has no abstract on file.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

29 members in 11 offices

This recordMember, by publication datePriority claim1 more office is in the list below

Priority claims1

Priority claims
DocumentOfficeKindDate
63103700United States of AmericaA

Members29

Family members, oldest first
DocumentOfficeKind
WO0211206A2World Intellectual Property Organization (WIPO)A2
WO0211207A2World Intellectual Property Organization (WIPO)A2
AU8084901AAustraliaA
AU8085001AAustraliaA
KR20020042698ARepublic of KoreaA
WO0211206A3World Intellectual Property Organization (WIPO)A3
EP1305830A2European Patent Office (EPO)A2
US6611419B1United States of AmericaB1
WO0211207A3World Intellectual Property Organization (WIPO)A3
HK1052252A1Hong Kong, ChinaA1
EP1358675A2European Patent Office (EPO)A2
CN1470069AChinaA
CN1470070AChinaA
JP2004505469AJapanA
EP1515365A2European Patent Office (EPO)A2
US6970362B1United States of AmericaB1
US2006012966A1United States of AmericaA1
KR100591217B1Republic of KoreaB1
EP1515365A3European Patent Office (EPO)A3
EP1358675B1European Patent Office (EPO)B1
AT360889TThis recordAustriaT
DE60128145D1GermanyD1
MY133591AMalaysiaA
DE60128145T2GermanyT2
US7339798B2United States of AmericaB2
MY136263AMalaysiaA
CN100492628CChinaC
CN100492629CChinaC
EP1515365B1European Patent Office (EPO)B1