Contamination controlling method and plasma processing chamber

(57) The summary plasma treatment chamber contains a substrate holding fixture and silicon carbide components, such as Rajna, a focusing ring, punched バッフル, and a gas distribution board, and it has the exposure surface where a component adjoins a substrate holding fixture, and is effective for the exposure surface making contamination under substrate processing the minimum. The antenna with which a chamber carries out inductive coupling of the RF energy through a gas distribution board, and excites processing gas to a plasma state can be included.