Nova Patents
AT326734T

Method for manufacturing rfid labels

Abstract

The invention claims a RFID rod, comprising a pattern and density of semiconductor wafer array, which is continuous method is connected with a bearing are wide limiting antenna thin plate. The RFID light bar is separated or switching is an independent chip section; said chip of increasing of the RFID side plates cutting groove. The independent chip in section is connected with the corresponding antenna, which are RFID insertion body semifinished material. The method in RFID marks and label shaft semifinished material shaft to the quick generation shaft.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

72 members in 14 offices

This recordMember, by publication datePriority claim4 more offices are in the list below

Priority claims8

Priority claims
DocumentOfficeKindDate
35060602United States of AmericaP
35060602United States of AmericaP
32349002United States of AmericaA
32349002United States of AmericaA
323490
350606P
US20020323490
US20020350606P

Members72

Family members, oldest first
DocumentOfficeKind
WO0243032A2World Intellectual Property Organization (WIPO)A2
WO0243044A2World Intellectual Property Organization (WIPO)A2
AU3928602AAustraliaA
AU3928702AAustraliaA
US2002149107A1United States of AmericaA1
WO02093625A1World Intellectual Property Organization (WIPO)A1
WO0243044A9World Intellectual Property Organization (WIPO)A9
WO02093625B1World Intellectual Property Organization (WIPO)B1
WO0243044A3World Intellectual Property Organization (WIPO)A3
WO0243032A3World Intellectual Property Organization (WIPO)A3
GB0313769D0United KingdomD0
US2003136503A1United States of AmericaA1
GB2385975AUnited KingdomA
US2003214229A1United States of AmericaA1
EP1366509A1European Patent Office (EPO)A1
CA2473729A1CanadaA1
CA2816158A1CanadaA1
CA2816180A1CanadaA1
CA2816324A1CanadaA1
US2003232174A1United States of AmericaA1
WO03105063A2World Intellectual Property Organization (WIPO)A2
AU2003267938A1AustraliaA1
US2004004609A1United States of AmericaA1
WO03105063A3World Intellectual Property Organization (WIPO)A3
KR20040075095ARepublic of KoreaA
GB2385975BUnited KingdomB
MXPA04006913AMexicoA
EP1470528A2European Patent Office (EPO)A2
CN1628321AChinaA
JP2005520266AJapanA
DE03748885T1GermanyT1
US6951596B2United States of AmericaB2
US2005252605A1United States of AmericaA1
EP1470528B1European Patent Office (EPO)B1
AT326734TThis recordAustriaT
ATE326734T2AustriaT2
DE60305295D1GermanyD1
EP1693792A1European Patent Office (EPO)A1
US2006210769A1United States of AmericaA1
US2006213609A1United States of AmericaA1
DE60305295T2GermanyT2
ES2270072T3SpainT3
US7199527B2United States of AmericaB2
CN100342395CChinaC
DE20321502U1GermanyU1
CN101159036AChinaA
US7361251B2United States of AmericaB2
AU2003267938B2AustraliaB2
US7368032B2United States of AmericaB2
US2008142154A1United States of AmericaA1
JP2009048662AJapanA
KR100967856B1Republic of KoreaB1
CN101159036BChinaB
EP2306372A1European Patent Office (EPO)A1
JP4860918B2JapanB2
US8246773B2United States of AmericaB2
US2012297609A1United States of AmericaA1
EP1693792B1European Patent Office (EPO)B1
ES2551274T3SpainT3
CA2473729CCanadaC
BRPI0306992A2BrazilA2
EP2306372B1European Patent Office (EPO)B1
CA2816158CCanadaC
EP1470528B2European Patent Office (EPO)B2
ES2588207T3SpainT3
US9495632B2United States of AmericaB2
DE60305295T3GermanyT3
ES2270072T5SpainT5
CA2816324CCanadaC
BRPI0306992B1BrazilB1
CA2816180CCanadaC
BRPI0306992B8BrazilB8