WO9317455A3
Integrated-circuit package configuration for packaging an integrated-circuit die and method of packaging an integrated-circuit die
Abstract
This record has no abstract on file.
Term
No projected expiry on record.
- Priority and filed
- Published
- Today
Every citation, both ways
| Document | Relation | Office | Category | Cited during |
|---|---|---|---|---|
| EP0036907A1 | Cites | European Patent Office (EPO) | A | International search |
| EP0351581A1 | Cites | European Patent Office (EPO) | A | International search |
| EP0443044A1 | Cites | European Patent Office (EPO) | A | International search |
| US4754317A | Cites | United States of America | A | International search |
| US4774635A | Cites | United States of America | A | International search |
5 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Ep: pct application non-entry in european phase122 | 122 | |
| Designated statesAK | AK | |
| Designated countries for regional patentsAL | AL | |
| Corrected version of a pamphlet front pageCFP | CFP | |
| Correction of entry in section iPAT.BUL.21/93 UNDER PUBLISHED REPLACE "A1" BY "A2"CR1 | CR1 |
Numbers
- Application
- 9301490
Titles
- English
- INTEGRATED-CIRCUIT PACKAGE CONFIGURATION FOR PACKAGING AN INTEGRATED-CIRCUIT DIE AND METHOD OF PACKAGING AN INTEGRATED-CIRCUIT DIE
Classification
- CPC, 11
- H10W70/40
- H10W70/468
- H10W70/657
- H10W70/65
- H10W90/756
- H10W72/5473
- H10W72/5449
- H10W70/685
- H10W70/682
- H10W74/00
- H10W72/5522
- IPC, 4
- H01L21 60
- H01L23 495
- H01L23 498
- H01L23 50
Designated states18
- Regional, 16
- Austria
- Belgium
- Switzerland
- Germany
- Denmark
- Spain
- France
- United Kingdom
- Greece
- Ireland
- Italy
- Luxembourg
- Monaco
- Netherlands (Kingdom of the)
- Portugal
- Sweden
- National, 2
- Japan
- Republic of Korea