WO9102380A1

Method of fabricating a binary optics microlens upon a detector array

Abstract

A three dimensional binary optic microlens structure (12) is fabricated within a radiation receiving back surface of a substrate (16) of a radiation detecting array (10). The microlens has a structure predetermined to achieve a concentration of optical radiation within a desired spot size at the plane of a detector (18), thereby facilitating the provision of detectors of reduced active area. The incident radiation may be planar or may be prefocused by externally provided optics. The methods of the invention determines a binary optic microlens solution to a Fresnel lens which achieves the desired optical concentration, the method further providing at least one fabrication masking layer upon the back surface of the array and the selective removal of material from the back surface of the array to create the microlens structure.

WO9102380A1, drawing sheet 1
Sheet 1 of 3

Term

No projected expiry on record.

  1. Priority and filed
  2. Published
  3. Today

14 claims: 3 independent, 11 dependent

  1. 1
    CLAIMS • What is claimed is:1. A method of manufacturing a backside illuminated array of radiation detectors to provide a lens element in registration with each of the radiation detectors for concentrating incident radiation thereon, comprising the steps of: providing a substrate having a back surface and an opposing front surface having a plurality of radiation detector sites;applying a mask to the back surface, the mask having a pattern for defining a plurality of binary optic microlens elements, each of the microlens elements being in registration with one of the radiation detector sites;selectively removing unmasked material from the back surface of the substrate to create the plurality of binary optic microlens elements, the material being selectively removed to a predetermined depth;and stripping away the mask.
  2. 2
    A method as set forth in Claim 1 wherein the steps of applying, selectively removing and stripping are accomplished a plurality of times.
  3. 3
    A method as set forth in Claim 1 wherein the step of selectively removing is accomplished by a dry etch technique.
  4. 4
    A method as set forth in Claim 3 wherein the dry etch technique is accomplished by ion etching.
  5. 5
    A method as set forth in Claim 1 wherein the predetermined depth is represented as d in accordance with the expression d = (2 pi)/((n-l)*2 N ), where n is the index of refraction of the substrate material and N is the mask number or order.
  6. 6
    A method as set forth in Claim 1 wherein the step of applying a mask includes the initial steps of:determining the shape of an equivalent lens element operable for concentrating the incident radiation within a predetermined spot size at a plane of the radiation detector, the equivalent lens element including a plurality of zone plates each of which has a spherical curvature;and determining a number of masks and a pattern of each mask for producing a binary optic microlens element that approximates to a desired accuracy the spherical curvature of the plurality of zone plates.
  7. 7
    A method of manufacturing a backside illuminated array of reduced area radiation detectors to provide an integral back surface lens element in registration with each of the radiation detectors for concentrating incident radiation thereon, comprising the steps of:providing a substrate having a back surface and an opposing front surface having a plurality of reduced area radiation detector sites, the radiation detectors being reduced in area relative to an area of an array unit cell area;determining an amount of optical concentration required to illuminate each of the radiation detectors to a desired per centage of a non-reduced area radiation detector;determining the shape of a back surface lens element operable for concentrating the incident radiation at the desired per a centage, the equivalent lens element including a plurality of zone plates each of which has a spherical curvature;determining a number of masks and a pattern of each mask for producing a binary optic microlens element that approximates to a desired accuracy the spherical curvature of the plurality of zone plates;applying a mask to the back surface, the mask having a pattern for defining a plurality of binary optic microlens elements, each of the microlens elements being in registration with one of the radiation detector sites;selectively removing unmasked material from the back surface of the substrate to create the plurality of . binary optic microlens elements, the material being selectively removed to a predetermined depth;and stripping away the mask.
  8. 8
    A method as set forth in Claim 7 wherein each of the binary optic lens elements so produced substantially fills an associated unit cell area.
  9. 9
    A method as set forth in Claim 7 wherein the steps of applying, selectively removing and stripping are accomplished once for each determined number of masks.
  10. 10
    A method as set forth in Claim 7 wherein the step of selectively removing is accomplished by a dry etch technique.
  11. 11
    A method as set forth in Claim 10 wherein the dry etch technique is accomplished by ion etching.
  12. 12
    A method as set forth in Claim 7 wherein the predetermined depth is represented as d in accordance with the expression d = (2 pi) / ( (n-l) *2 N ) where n is the index of refraction of the substrate material and N is the mask number or order.
  13. 13
    A method of manufacturing a backside illuminated array of radiation detectors to provide a lens element in registration with each of the radiation detectors for concentrating incident radiation thereon, comprising the steps of:providing a substrate having a back surface and an opposing front surface having a plurality of radiation detector sites;applying a mask to the back surface, the mask having a pattern for defining a plurality of binary optic microlens elements, each of the microlens elements being in registration with one of the radiation detector sites;selectively depositing material through the mask to the back surface of the substrate to create the plurality of binary optic microlens elements, the material being selectively deposited to a predetermined depth;and stripping away the mask.
  14. 14
    A method as set forth in Claim 13 wherein the steps of applying, selectively depositing and stripping are accomplished a plurality of times. 15. A method as set forth in Claim 13 wherein the predetermined depth is represented as d in accordance with the expression d = (2 pi)/((n-l)*2 N ), where n is the index of refraction of the substrate material and N is the mask number or order.