Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board

An apparatus for electrically connecting an electronic element (15) and a base (12) includes an electrode region and a terminal region (20) proximate the electrode region. A conductive paste (22) is deposited on at least a portion of the terminal region. The conductive paste has an oxidation-reduced region thereon, formed by application of an acid to the conductive paste. An oxidation-prevention layer is formed on the oxidation-reduced region by deposition of a flux on the oxidation-reduced region, application of a solder to the flux, and blowing of a heated gas by the solder. The oxidation-prevention layer is adapted to bond the electrode associated with the electronic element to the conductive paste by soldering, when the electrode is present in the electrode region.