Nova Patents
WO02090245A3

Methods of forming microstructure devices

Abstract

The invention includes methods of forming microstructure devices. In an exemplary method, a substrate is provided which includes a first material and a second material. At least one of the first and second materials is exposed to vapor-phase alkylsilane-containing molecules to form a coating over the at least one of the first and second materials.

Term

No projected expiry on record.

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  4. Today

Every citation, both waysCites: the store holds 4 of 5

Citations
DocumentRelationOfficeCategoryCited duringRelevant claims
US5694740ACitesUnited States of AmericaAInternational search1-48
US5694740ACitesUnited States of AmericaAInternational search1-48
US6096149ACitesUnited States of AmericaAInternational search1-48
US6096149ACitesUnited States of AmericaAInternational search1-48
SRINIVASAN U ET AL: "ALKYLTRICHLOROSILANE-BASED SELF-ASSEMBLED MONOLAYER FILMS FOR STICTION REDUCTION IN SILICON MICROMACHINES", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, IEEE INC. NEW YORK, US, vol. 7, no. 2, June 1998 (1998-06-01), pages 252 - 259, XP000834745, ISSN: 1057-7157Non-patent––International search–
KIM B-H ET AL: "A NEW CLASS OF SURFACE MODIFIERS FOR STICTION REDUCTION", TECHNICAL DIGEST OF THE IEEE INTERNATIONAL MEMS '99 CONFERENCE. 12TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS. ORLANDO, FL, JAN. 17 - 21, 1999, IEEE INTERNATIONAL MICRO ELECTRO MECHANICAL SYSTEMS CONFERENCE, NEW YORK, NY: IEE, 1999, pages 189 - 193, XP000830745, ISBN: 0-7803-5195-9Non-patent––International search–
SMITH B K ET AL: "Thin Teflon-like films for eliminating adhesion in released polysilicon microstructures", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 70, no. 1-2, 1 October 1998 (1998-10-01), pages 159 - 163, XP004140127, ISSN: 0924-4247Non-patent––International search–