High power light emitting diode package

0001Notice: More than one reissue application has been filed for the reissue of U.S. Pat. No. 7,208,772. The reissue applications are the present application, Ser. No. 13/330,239 and Ser. No. 12/029,220. Ser. No. 12/029,220 is a reissue application of U.S. Pat. No. 7,208,772 and has been issued as Reissued Pat. No. Re. 43,200. The present application and Ser. No. 13/330,239 are Continuation Reissue Applications of Ser. No. 12/029,220.

CLAIM OF PRIORITY

0002This application claims the benefit of Korean Patent Application Nos. 2004-69730 filed on Sep. 1, 2004 and 2005-37421 filed on May 4, 2005, in the Korean Intellectual Property Office, the disclosures of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

00031. Field of the Invention

0004The present invention relates to a Light Emitting Diode (LED) package, and more particularly, a high power LED package designed to raise thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

00052. Description of the Related Art

0006LEDs are one type of semiconductors, and generate various colors of light when applied with voltage. When each LED generates light, its color is generally determined by chemical ingredients of the LED. Demand for the LEDs is continuously growing since the LEDs have various merits such as long lifetime, low drive voltage, excellent initial drive properties, high vibration resistance and high tolerance with respect to repeated power switching compared to lighting devices using filaments.

0007However, the LEDs also fail to convert electricity into light for 100%, thereby creating a considerable amount of heat. As a consequence, the LEDs adopt metal lead frames to radiate heat to the outside because internal components of the LEDs become stressed owing to their thermal expansion coefficient difference if heat is not properly dissipated.

0008In particular, some LEDs such as high power LEDs are recently adopted in illumination systems and backlight units for large-sized Liquid Crystal Displays (LCDs). Such high power LEDs are required to have superior thermal radiation performance because these systems or units require larger power.

0009<figref idref="DRAWINGS">FIG. 1</figref> is a perspective sectional view of a conventional high power LED package. Referring to <figref idref="DRAWINGS">FIG. 1</figref>, the LED package <b>1</b> includes an LED chip <b>2</b> made of for example InGaN semiconductor, a metal slug <b>3</b> for seating the LED chip <b>2</b> thereon while functioning as heat guide means, a housing <b>4</b> for containing the metal slug <b>3</b>, a silicone encapsulant <b>5</b> for sealing the LED chip <b>2</b> and the top of the metal slug <b>3</b>, a plastic lens <b>6</b> for covering the silicon encapsulant <b>5</b>, and a pair of wires <b>7</b> (only one is shown) for supplying voltage to the LED chip <b>2</b>. In the meantime, the wires <b>7</b> are electrically connected with terminals <b>8</b>. The LED chip <b>2</b> is connected to a submount by means of solders, and the submount seats the LED chip <b>2</b> on the metal slug <b>3</b>.

0010Referring to <figref idref="DRAWINGS">FIG. 2</figref>, the LED package <b>1</b> of <figref idref="DRAWINGS">FIG. 1</figref> is mounted on a board <b>10</b> of a heat sink, and a thermal conductive pad <b>9</b> such as solder is interposed between the metal slug <b>3</b> of the LED package <b>1</b> and the board <b>10</b> to facilitate the heat conduction between them.

0011The LED package <b>1</b> and its mounting structure on the board <b>10</b> as shown in <figref idref="DRAWINGS">FIGS. 1 and 2</figref> are focused on thermal radiation to efficiently radiate heat to the outside. That is, the LED package <b>1</b> is so designed that the metal slug <b>3</b> as a heat sink is mounted directly or via the thermal conductive pad <b>9</b> on the board <b>10</b> in order to absorb heat generated from the LED chip <b>2</b> and radiate heat to the outside. Then, a major quantity of heat from the LED chip <b>2</b> flows through the metal slug <b>3</b> to the board <b>10</b> and only a minor quantity of heat is radiated to the air through the surface of the LED package <b>1</b> including the housing <b>4</b> and the lens <b>6</b>.

0012Thanks to these reasons, LED packages of the above structure are widely adopted in the LED field.

0013However, the above conventional thermal radiation structure of the LED package has a bulky size thereby to obstruct the miniaturization of an illumination system. This structure is also complicated obstructing the automation of LED package production as well as requiring a large number of components to be assembled together thereby to burden manufacture cost.

SUMMARY OF THE INVENTION

0014The present invention has been made to solve the foregoing problems of the prior art and it is therefore an object of the present invention to provide a high power Light Emitting Diode (LED) package in which radiating means conducting heat generated from LED chip to a metal plate of a board is made into a sheet metal member, thereby raising thermal radiation efficiency while reducing the size and thickness thereof It is another object of the invention to provide a high power LED package which secures effective radiating means and in which a package body thereof is injection-molded with resin, thereby simplifying a construction thereof and facilitating its manufacture as well.

0015It is still another object of the invention to provide a high power LED package in which a sheet metal member serving as both radiating means and a terminal is fixedly surrounded with a resinous package body, thereby obtaining a thinner and solid construction thereof.

0016According to an aspect of the invention for realizing the object, there is provided a high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package comprising: an LED chip; a package body integrally formed with resin to have a recess for receiving the LED chip; a first sheet metal member electrically connected with the LED chip while supporting the LED chip at its upper partial portion in the recess, the first sheet metal member surrounded by the package body and extending to the side face of the package body, the first sheet metal member having a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board; a second sheet metal member electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member; and a transparent sealant sealingly filled up into the recess.

0017Preferably, the heat transfer section of the first sheet metal member is protruded downward from the bottom face of the package body.

0018Preferably, the first and second sheet metal members each have at least one hole, and the package body has a plurality of connecting posts that are integrally formed and connected with the upper and lower portions of the package body through the holes.

0019Preferably, the first sheet metal member is contacted with one electrode of the LED chip, and further has an external terminal integrally formed therewith to extend over the outside of the package body thereby contacting one pattern line of the board, and wherein the second sheet metal member is connected at one end of the recess-side with the other electrode of the LED chip and extended at the other end of the recess-side out of the package body, thereby contacting the other pattern line of the board.

0020Preferably, the second sheet metal member is divided into a pair of first and second terminals insulated from each other, in which the first terminal is connected at one end with one electrode of the LED chip and extended at the other end out of the package body, thereby contacting one pattern line of the board, and wherein the second terminal is connected at one end with the other electrode of the LED chip and extended at the other end over the outside of the package body, thereby being contacting the other pattern line of the board.

0021Preferably, the heat transfer section of the first sheet metal member has a T-shaped cross section and extends downwardly.

0022Alternatively, the heat transfer section of the first sheet metal member is formed such that its lower end facing the second sheet metal member is cut at a slant away from the second sheet metal member and the cut portion of the heat transfer section is covered with the package body.

0023According to another aspect of the invention for realizing the object, there is provided a high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package comprising: an LED chip; a package body integrally formed with resin to have a recess for receiving the LED chip; a half T-shaped first sheet metal member electrically connected with the LED chip while supporting the LED chip at its upper partial portion in the recess, the first sheet metal member surrounded by the package body and extending to the side face of the package body, wherein the first sheet metal member has an upper section electrically connected at one end with the LED chip and a lower section overlapped on the lower portion of the upper section, the bottom surface of the lower section being exposed through the bottom face of the package body to contact the board; a second sheet metal member electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member; and a transparent sealant sealingly filled up into the recess.

0024Preferably, the upper and lower sections of the first sheet metal member are bonded together with conductive epoxy with high thermal and electric conductivities.

0025Preferably, wherein the first sheet metal member is folded up at the other end that is exposed through the package body side so that the upper and lower sections thereof are overlapped vertically on each other.

0026Preferably, the other ends of the first and second sheet metal members are protruded from a sidewall of the package body.

0027Preferably, the second sheet metal member has a structure symmetrical to that of the first sheet metal member.

0028Preferably, the first and second sheet metal members are protruded at their lower ends downwardly from the bottom face of the package body.

0029According to still another aspect of the invention for realizing the object, there is provided a high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package comprising: an LED chip; a package body integrally formed with resin to have a recess for receiving the LED chip; a first sheet metal member electrically connected with the LED chip while supporting the LED chip at its upper partial portion in the recess, the first sheet metal member surrounded by the package body and extending to the side face of the package body, with a partial bottom surface of the first sheet metal member bent downward to be exposed through the bottom face of the package body and to contact the conductive pattern of the board; a second sheet metal member electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member; and a transparent sealant sealingly filled up into the recess.

0030Preferably, the bent shape of the first sheet metal member is formed by etching or press working of a source sheet metal.

0031Preferably, a lower portion of the first sheet metal member is exposed at a middle portion in length through the bottom face of the package body. At this time, the exposed lower portion of the first sheet metal member is extended out of the bottom face of the package body.

0032Preferably, the other end of the first sheet metal member is protruded out of a sidewall of the package body.

0033Meanwhile, preferably, the bottom surface of the first sheet metal member adjacent to one side thereof is cut at a slant away from the second sheet metal member, and the cut portion of the heat transfer section is covered with the package body.

0034In addition, preferably, the second sheet metal member has a structure symmetrical to that of the first sheet metal member.

0035The LED packages above may further comprise a high reflectivity reflective layer coated on the inner surface of the recess.

0036Preferably, any one of the LED packages above may further comprise a lens assembled onto the upper surface of the package body, and wherein the package body has a step at its upper edge so as to be engaged with the lower portion of the lens.

BRIEF DESCRIPTION OF THE DRAWINGS

0037<figref idref="DRAWINGS">FIG. 1</figref> is a sectional perspective view illustrating a conventional high power LED package;

0038<figref idref="DRAWINGS">FIG. 2</figref> is a sectional view illustrating the high power LED package of <figref idref="DRAWINGS">FIG. 1</figref> mounted on a board;

0039<figref idref="DRAWINGS">FIG. 3</figref> is a plan view illustrating a high power LED package according to a first embodiment of the invention;

0040<figref idref="DRAWINGS">FIG. 4</figref> is a sectional view taken along a line A-A of <figref idref="DRAWINGS">FIG. 3</figref>;

0041<figref idref="DRAWINGS">FIG. 5</figref> is a plan view illustrating the high power LED package of <figref idref="DRAWINGS">FIG. 3</figref> with the upper portion of the package body removed;

0042<figref idref="DRAWINGS">FIG. 6</figref> is a bottom view of <figref idref="DRAWINGS">FIG. 3</figref>;

0043<figref idref="DRAWINGS">FIG. 7</figref> is a sectional view illustrating the high power LED package according to the first embodiment of the present invention with a lens attached thereto;

0044<figref idref="DRAWINGS">FIG. 8</figref> is a sectional view illustrating another form of the high power LED package as shown in <figref idref="DRAWINGS">FIG. 4</figref>;

0045<figref idref="DRAWINGS">FIG. 9</figref> is a sectional view corresponding to <figref idref="DRAWINGS">FIG. 4</figref>, illustrating a high power LED package according to a second embodiment of the present invention;

0046<figref idref="DRAWINGS">FIG. 10</figref> is a sectional view illustrating a state in which the LED package of <figref idref="DRAWINGS">FIG. 9</figref> is mounted on a board;

0047<figref idref="DRAWINGS">FIG. 11</figref> is a sectional view illustrating a modification to the high power LED package of <figref idref="DRAWINGS">FIG. 9</figref>;

0048<figref idref="DRAWINGS">FIG. 12</figref> is a plan view illustrating a high power LED package according to a third embodiment of the present invention;

0049<figref idref="DRAWINGS">FIG. 13</figref> is a sectional view taken along a line A-B of <figref idref="DRAWINGS">FIG. 12</figref>.

0050<figref idref="DRAWINGS">FIG. 14</figref> is a plan view illustrating the high power LED package of <figref idref="DRAWINGS">FIG. 12</figref> with the upper portion of the package body removed;

0051<figref idref="DRAWINGS">FIG. 15</figref> is a sectional view illustrating a high power LED package according to a fourth embodiment of the present invention;

0052<figref idref="DRAWINGS">FIG. 16</figref> is a sectional view illustrating a high power LED package according to a fifth embodiment of the present invention;

0053<figref idref="DRAWINGS">FIG. 17</figref> is a sectional view illustrating a modification to the high power LED package of <figref idref="DRAWINGS">FIG. 16</figref>.

0054<figref idref="DRAWINGS">FIG. 18</figref> is a sectional view illustrating another modification to the high power LED package of <figref idref="DRAWINGS">FIG. 16</figref>.

0055<figref idref="DRAWINGS">FIG. 19</figref> is a sectional view illustrating a high power LED package according to a sixth embodiment of the present invention;

0056<figref idref="DRAWINGS">FIGS. 20 through 23</figref> are stepwise sectional views illustrating a manufacturing process of a high power LED package according to the present invention;

0057<figref idref="DRAWINGS">FIG. 24</figref> is a plan view illustrating a high power LED package according to a seventh embodiment of the present invention;

0058<figref idref="DRAWINGS">FIG. 25</figref> is a sectional view taken along a line C-C of the LED package of <figref idref="DRAWINGS">FIG. 24</figref>;

0059<figref idref="DRAWINGS">FIG. 26</figref> is a bottom view of the LED package of <figref idref="DRAWINGS">FIG. 24</figref>;

0060<figref idref="DRAWINGS">FIG. 27</figref> is a sectional view illustrating a modification to the high power LED package according to the seventh embodiment of the present invention;

0061<figref idref="DRAWINGS">FIG. 28</figref> is a sectional view illustrating a high power LED package according to an eighth embodiment of the present invention;

0062<figref idref="DRAWINGS">FIG. 29</figref> is a sectional view illustrating a high power LED package according to a ninth embodiment of the present invention; and

0063<figref idref="DRAWINGS">FIG. 30</figref> is a sectional view illustrating a modification to the high power LED package of <figref idref="DRAWINGS">FIG. 29</figref>.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

0064Hereinafter the above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

0065First, a high power Light Emitted Diode (LED) package according to a first embodiment of the present invention will now be described with reference to <figref idref="DRAWINGS">FIGS. 3 through 6</figref>. <figref idref="DRAWINGS">FIG. 3</figref> is a plan view illustrating a high power LED package according to a first embodiment of the invention, <figref idref="DRAWINGS">FIG. 4</figref> is a sectional view taken along a line A-A of <figref idref="DRAWINGS">FIG. 3</figref>, <figref idref="DRAWINGS">FIG. 5</figref> is a plan view illustrating the high power LED package of <figref idref="DRAWINGS">FIG. 3</figref> with the upper portion of the package body removed, and <figref idref="DRAWINGS">FIG. 6</figref> is a bottom view of <figref idref="DRAWINGS">FIG. 3</figref>.

0066As shown in <figref idref="DRAWINGS">FIGS. 3 through 6</figref>, the high power LED package <b>100</b> of the present invention is used as mounted on a board (see <figref idref="DRAWINGS">FIG. 10</figref>) having a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer. The high power LED package includes an LED chip <b>112</b> for emitting light when applied with electric current, a package body <b>102</b> integrally formed with resin and having a recess <b>108</b> to receive the LED chip <b>112</b>, a first sheet metal member <b>114</b> positioned in the package body <b>102</b>, functioning as a terminal and radiating means while supporting the LED chip <b>112</b>, a second sheet metal member <b>116</b> functioning as a terminal, and a sealant <b>110</b> for sealingly filling up the recess <b>108</b>.

0067First, the package body <b>102</b> is formed by injection molding of resin, such that the upper surface of the upper portion <b>102</b>A thereof is sunk toward its center portion, forming the recess <b>108</b>. Herein, the inner wall of the recess <b>108</b> is preferably formed to have a certain slant. A lower portion <b>102</b>B of the package body receives the first and second sheet metal members <b>114</b> and <b>116</b> together with the upper portion <b>102</b>A of the package body.

0068Herein, as shown in <figref idref="DRAWINGS">FIGS. 4 and 5</figref>, the upper and lower portions <b>102</b>A and <b>102</b>B of the package body are connected with each other at their both longitudinal edges as well as by a plurality of posts <b>104</b> extending vertically through holes formed to the first and second sheet metal members <b>114</b> and <b>116</b>. Thus, the posts serve to strengthen a connection between the upper and lower portions <b>102</b>A and <b>102</b>B of the package body. Meanwhile, although illustrated as a circular shape, the sectional end shape of the post may become oval or rectangular. In this case, because a cross-sectional area thereof becomes larger at the same width position relative to the circular shape, the connection between the upper and lower portions <b>102</b>A and <b>102</b>B of the package body may be further strengthened.

0069A first section <b>114</b>a of the first sheet metal member <b>114</b> supports at its upper portion the LED chip <b>112</b> in the recess <b>108</b>, and extends downwardly through the inside of the package body <b>102</b> thus to be exposed at its lower portion through the bottom surface of the lower portion <b>102</b>B of the package body <b>102</b> to the outside thereof. As a result, heat generated at the LED chip <b>112</b> can be transferred smoothly through the first section <b>114</b>a of the first sheet metal member <b>114</b> to the metal plate of the board. That is, it can be understood that in the present invention, the first section <b>114</b>a of the first sheet metal member <b>114</b> may function as radiating means. Herein, since the first section <b>114</b>a of the first sheet metal member <b>114</b> as radiating means, is a part of the sheet metal member, a thickness thereof is seriously reduced relative to the metal slug <b>3</b> (see <figref idref="DRAWINGS">FIGS. 1 and 2</figref>) of the prior art. It can be accordingly seen that a heat transfer path from the LED chip <b>112</b> to the metal plate below the first section <b>114</b>a is greatly reduced, thereby increasing thermal radiation efficiency considerably.

0070A second section <b>114</b>b of the first sheet metal member <b>114</b> is a portion integrally extended from the first section <b>114</b>a toward the side of the package body <b>102</b>, whose thickness is reduced relative to the first section <b>114</b>a such that its upper surface extends on the same plane as the upper portion of the first section <b>114</b>a, and its bottom face is stepped upwards from the lower portion of the first section <b>114</b>a. Thus, differently from the first section <b>114</b>a, the second section <b>114</b>b extends laterally toward the side of the package body <b>102</b> without being exposed at its bottom face to the outside, thereby being connected with a third section <b>114</b>a outside of the package body <b>102</b>. The third section <b>114</b>c extends integrally with and in the same thickness as the second section <b>114</b>b, and has at its middle portion a bent portion twice-bent so as to facilitate the connection with one pattern line of the conductive pattern of the board. The third section <b>114</b>c functions as an external terminal in the first sheet metal member <b>114</b>.

0071The second sheet metal member <b>116</b> extends in an opposite direction and spaced apart for a predetermined gap from the first sheet metal member <b>114</b>. The second sheet metal member <b>116</b> extends laterally with a certain thickness from the inside of the package body <b>102</b> toward outside of the package body <b>102</b>, and a portion thereof outside the package body has a bent portion twice-bent so as to facilitate the connection with the other pattern line of the conductive pattern of the board. A cross-sectional shape of these sheet metal members <b>114</b> and <b>116</b> may be formed by, for example, cutting and punching a source sheet metal plate, and selectively reducing thickness through etching and the like.

0072Herein, the first and second sheet metal members <b>114</b> and <b>116</b> are connected with the electrodes, respectively, of the LED chip <b>112</b> by means of a pair of wires <b>118</b>. As a result, the LED chip <b>112</b> can be supplied with electric power from a power supply through the wires <b>118</b>, the first and second sheet metal members <b>114</b> and <b>116</b>, and the conductive pattern of the board.

0073A reflective layer <b>106</b> composed of a high reflectivity film is formed at an inner wall of the recess <b>108</b> in order to effectively guide light emitted from the LED chip <b>112</b> upwards. The reflective layer <b>106</b> may be formed by coating Ag, Pt, Al or alloy thereof onto the inner wall of the recess <b>108</b> with for example, an electroless plating or a deposition and the like. Alternatively, the recess <b>108</b> is precisely machined at its inner wall so that a certain amount of reflectivity may be achieved although it is not perfect. Furthermore, a glass layer may be formed on the inner wall of the recess <b>108</b> so as to intensify a function of reflecting mirror using a density difference from resin of the package body below the glass layer.

0074<figref idref="DRAWINGS">FIG. 7</figref> is a sectional view illustrating the high power LED package <b>100</b> according to the first embodiment of the present invention with a lens attached thereto. In <figref idref="DRAWINGS">FIG. 7</figref>, the lens <b>120</b> is attached to the upper surface of the package body <b>102</b> to protect a sealant <b>110</b> and the LED chip <b>112</b> contained therein. Herein, the lens <b>120</b> is generally transferred and formed onto the package body <b>102</b>, or otherwise fabricated separately and then bonded to the package body <b>102</b> with proper means such as an adhesive and the like.

0075Structured like this, the first and second sheet metal members <b>114</b> and <b>116</b> with a simple construction serve as radiating means and terminals, and the integrated package body <b>102</b> injection-molded with resin bonds these members strongly, thereby greatly improving thermal radiation efficiency as well as securing excellent robustness while reducing their dimension significantly.

0076<figref idref="DRAWINGS">FIG. 8</figref> is a sectional view illustrating another form of the high power LED package as shown in <figref idref="DRAWINGS">FIG. 4</figref>.

0077In the LED package <b>100</b> in <figref idref="DRAWINGS">FIG. 8</figref>, the first sheet metal member <b>114</b> adjacent to the second sheet metal member <b>116</b> has at a part thereof a step <b>114</b>d, thus to form a T-shaped overall cross section. This step <b>114</b>d has the following function.

0078The LED chip <b>112</b> may be mal-functioned by moisture, foreign substances and so forth, thus it is important to protect the LED chip from such condition. In addition, because of high temperature accompanied by an operation thereof, repetitive ON/OFF operations or a long time ON operation cause heterogeneous substances such as the metallic sheet metal member and the plastic package body to gradually separate from each other at an interface thereby forming a passageway for the moisture or foreign substances and the like. Thus, in order to improve reliability of products, it is needed to prevent such problem. Preferable one method to do this is to lengthen a way from the outside of the package to the LED chip <b>112</b>.

0079In addition, such T shape of the first sheet metal member <b>114</b> functions very well to fix the package body <b>102</b>, like a reinforced concrete structure. That is, it makes the connection between the sheet metal member and the package body <b>102</b> more facilitated and strengthened. Accordingly, the finished LED package <b>100</b> can endure well against shocks and external force applied thereto.

0080<figref idref="DRAWINGS">FIG. 9</figref> is a sectional view corresponding to <figref idref="DRAWINGS">FIG. 4</figref>, illustrating a high power LED package according to a second embodiment of the present invention, and <figref idref="DRAWINGS">FIG. 10</figref> is a sectional view illustrating a state in which the LED package of <figref idref="DRAWINGS">FIG. 9</figref> is mounted on the board.

0081Referring first to <figref idref="DRAWINGS">FIG. 9</figref>, the high power LED package <b>200</b> of the present embodiment has a construction identical to that of the LED package <b>100</b> of the first embodiment, except that a first section <b>214</b>a of a first sheet metal member <b>214</b> is protruded outside from the bottom surface of a package body <b>202</b> for a predetermined length. Thus, constitutional elements the same as or similar to those of the LED package <b>100</b> are designated with corresponding reference numerals, increased by 100, and detailed description thereof will be omitted.

0082When the first section <b>214</b>a of the first sheet metal member of radiating means are protruded from the bottom surface of the package body <b>202</b> as such, it is advantageous when mounting the LED package <b>200</b> on the board <b>10</b> as illustrated in <figref idref="DRAWINGS">FIG. 10</figref>. In detail, the board <b>10</b> on which the LED package <b>200</b> is mounted includes a metal plate <b>12</b> of a heat sink, an insulating layer <b>14</b> on the metal plate <b>12</b>, and a conductive pattern with plural lines <b>18</b> printed on the insulating layer <b>14</b>. When mounting the LED package <b>200</b> on the board <b>10</b>, the third section <b>214</b>c of the first sheet metal member and a distal end or an outer end of the second sheet metal member functioning as a lead are bonded to the corresponding line <b>18</b> of the board <b>10</b> by soldering and so forth. As a result, there is an effect in that solder is interposed between the whole LED package <b>200</b> and the board <b>10</b>, so that a distance between the first section of the first sheet metal member and the corresponding portion of the board may be increased. However, since the first section <b>214</b>a of the first sheet metal member of this embodiment is protruded outside from the bottom surface of the package body <b>202</b> for a predetermined length, it is not required to increase the thickness of the solder that is attached between the first section and the corresponding portion of the board. Therefore, it may be possible to maintain a thin thickness in the solder, thereby securing excellent heat transfer effect continuously. Furthermore, depending on the protruded length, a contact between the first section of the first sheet metal member and the corresponding portion of the board can be maintained without forming the solder and the like therebetween, thereby intensifying the effect.

0083<figref idref="DRAWINGS">FIG. 11</figref> is a sectional view illustrating a modification to the high power LED package of <figref idref="DRAWINGS">FIG. 9</figref>.

0084In the LED package <b>200</b> in <figref idref="DRAWINGS">FIG. 11</figref>, a part of the first sheet metal member <b>214</b> adjacent to the second sheet metal member <b>216</b> is formed with a step <b>214</b>d, so that the first sheet metal member <b>214</b> has a T-shaped overall cros-ssection. Such structure of the LED package <b>200</b> is obtained by combining the structure of <figref idref="DRAWINGS">FIG. 8</figref> with that of <figref idref="DRAWINGS">FIG. 9</figref>. Accordingly, this provides improved heat transfer effect and intensified reliability of the package as well.

0085<figref idref="DRAWINGS">FIG. 12</figref> is a plan view illustrating a high power LED package according to a third embodiment of the present invention, <figref idref="DRAWINGS">FIG. 13</figref> is a sectional view taken along a line B-B of <figref idref="DRAWINGS">FIG. 10</figref>, and <figref idref="DRAWINGS">FIG. 14</figref> is a plan view illustrating the high power LED package of <figref idref="DRAWINGS">FIG. 12</figref> with the upper portion of the package body removed.

0086Referring to <figref idref="DRAWINGS">FIGS. 12 through 14</figref>, the LED package <b>300</b> according to the third embodiment is discriminated from the LED package <b>100</b> according to the first embodiment, in that a first sheet metal member <b>314</b> consists of first and second sections <b>314</b>a and <b>314</b>b without protruded beyond the side of a package body <b>302</b>, and a second sheet metal member <b>316</b> consists of first and second terminals <b>316</b>A and <b>316</b>B. Thus, constitutional elements the same as or similar to those of the LED package <b>100</b> are designated with corresponding reference numerals, increased by 200, and detailed description thereof will be omitted.

0087According to this embodiment, the first sheet metal member <b>314</b> functions as radiating means, the first and second terminals <b>316</b>A and <b>316</b>B each serve to electrically connect the LED chip <b>312</b> to the power supply through wires <b>318</b>.

0088Meanwhile, in the high power LED package <b>300</b>, the first section <b>314</b>a of the first sheet metal member may be constructed such that it is protruded outside from the bottom face of the package body <b>302</b> as shown in <figref idref="DRAWINGS">FIGS. 9 and 10</figref>.

0089<figref idref="DRAWINGS">FIG. 15</figref> is a sectional view illustrating a high power LED package according to a fourth embodiment of the present invention. Referring to <figref idref="DRAWINGS">FIG. 15</figref>, the construction thereof is substantially identical to the construction of <figref idref="DRAWINGS">FIG. 3</figref>, except that an LED chip <b>412</b> is bonded onto a submount <b>430</b> with a flip chip bonding method, and supported on a first section <b>414</b>a of a first sheet metal member <b>414</b>. Thus, constitutional elements the same as or similar to those of the LED package <b>100</b> are designated with corresponding reference numerals, increased by 300, and detailed description thereof will be omitted.

0090The submount <b>430</b> comprises a board made of silicon and the like, and thus can properly buffer the LED chip <b>412</b> against a shock or distortion of the first sheet metal member <b>414</b> and the like. At this time, with the forming of the conductive pattern onto the surface of the submount <b>430</b> and the electrical connecting to the first and second sheet metal members <b>414</b> and <b>416</b> through the wires <b>418</b>, the LED chip <b>412</b> bonded to that pattern with a flip chip bonding method can be electrically connected with the power supply.

0091Meanwhile, the submount <b>430</b> is formed in a size larger than the LED chip <b>412</b> seated thereon, and has preferably high thermal conductivity so as to effectively transfer heat generated from the LED chip <b>412</b> to the first section <b>414</b>a of the first sheet metal member below the submount. Specifically, thermal conductivity may be preferably 100 W/m·K or more, more preferably, 200 W/m·K or more. For reference, it is needed that the sheet metal member has thermal conductivity of about 300 W/m·K.

0092In the meantime, the present embodiment may employ the T-shaped first sheet metal member like in <figref idref="DRAWINGS">FIG. 8</figref>, the protruded first section of the first sheet metal member like in <figref idref="DRAWINGS">FIG. 9</figref>, the protruded T-shaped first sheet metal member like in <figref idref="DRAWINGS">FIG. 11</figref>, and radiating means and the structure of first and second terminals like in <figref idref="DRAWINGS">FIG. 12</figref>.

0093<figref idref="DRAWINGS">FIG. 16</figref> is a sectional view illustrating a high power LED package according to a fifth embodiment of the present invention. Referring to <figref idref="DRAWINGS">FIG. 16</figref>, the high power LED package <b>500</b> of the present embodiment is different from the LED package <b>100</b> of the first embodiment, in that the first sections <b>514</b>a and <b>516</b>a as radiating means each are formed at both of the first and second sheet metal members <b>514</b> and <b>516</b>, and the LED chip <b>512</b> is connected to these first and second sheet metal members <b>514</b> and <b>516</b> with the flip chip method. Thus, constitutional elements the same as or similar to those of the LED package <b>100</b> are designated with corresponding reference numerals, increased by 400, and detailed description thereof will be omitted.

0094Structured as such, there is an advantage in that the first sections <b>514</b>a and <b>516</b>a as radiating means has an enlarged area thus to transfer heat of the LED chip <b>512</b> to the board (not shown) below the construction more effectively.

0095However, since the both first sections <b>514</b>a and <b>516</b>a cannot be electrically connected to the metal plate of the board at the same time, any one of the first sections <b>514</b>a or <b>516</b>a should be only thermally connected to the metal plate, but electrically insulated from the same.

0096Of course, the present embodiment may employ the T-shaped first sheet metal member like in <figref idref="DRAWINGS">FIG. 8</figref>, the protruded first section of the first sheet metal member like in <figref idref="DRAWINGS">FIG. 9</figref>, the protruded T-shaped first sheet metal member like in <figref idref="DRAWINGS">FIG. 11</figref>, and radiating means and the structure of first and second terminals like in <figref idref="DRAWINGS">FIG. 12</figref>.

0097<figref idref="DRAWINGS">FIG. 17</figref> is a sectional view illustrating a modification to the high power LED package of <figref idref="DRAWINGS">FIG. 15</figref>. Referring to <figref idref="DRAWINGS">FIG. 17</figref>, the high power LED package <b>500</b>-<b>1</b> of this embodiment is different from the construction of <figref idref="DRAWINGS">FIG. 16</figref>, in that the first and second sheet metal members <b>514</b> and <b>516</b> of <figref idref="DRAWINGS">FIG. 16</figref> are replaced with the generally T-shaped first and second sheet metal members <b>514</b>A and <b>516</b>A. Of course, the first and second sheet metal members <b>514</b>A and <b>516</b>A may have an inverted L shape or a half T shape like in <figref idref="DRAWINGS">FIG. 16</figref>.

0098The first sheet metal member <b>514</b>A may be formed into a T shape via for example etching, by which the lower portion reduced in diameter is exposed from the bottom face <b>502</b>B of the package body, to form an I/O terminal directly contacting the conductive lines <b>18</b> of the board <b>10</b> as shown in <figref idref="DRAWINGS">FIG. 10</figref>. Herein, the lower portions of the T-shaped sheet metal members <b>514</b>A and <b>516</b>A may be extended from the bottom face <b>502</b>B of the package body, thereby facilitating the electrical connection with the conductive lines <b>18</b>.

0099Meanwhile, the construction of this embodiment may employ the construction of <figref idref="DRAWINGS">FIG. 15</figref>. That is, the LED chip <b>512</b> may be electrically connected with the first and second sheet metal members <b>514</b>A and <b>516</b>A through the wires <b>418</b>.

0100<figref idref="DRAWINGS">FIG. 18</figref> is a sectional view illustrating another modification to the high power LED package of <figref idref="DRAWINGS">FIG. 15</figref>.

0101As shown in <figref idref="DRAWINGS">FIG. 18</figref>, by protruding the first sheet metal member <b>514</b>A downwardly from the package body <b>502</b>, it is possible to improve reliability and further increase heat transfer effect. In addition, if necessary, it may be constructed to protrude the second sheet metal member <b>516</b>A like as such.

0102<figref idref="DRAWINGS">FIG. 19</figref> is a sectional view illustrating a high power LED package according to a sixth embodiment of the present invention. Referring to <figref idref="DRAWINGS">FIG. 19</figref>, the LED package <b>600</b> of the present embodiment has the construction generally identical to that of the LED package <b>100</b> of the first embodiment, except that a step <b>624</b> for mounting a lens is formed at the upper portion of the package body <b>602</b>.

0103By forming such step <b>624</b> like this and a flange <b>622</b> conforming in shape with the step at the lower portion of the lens <b>620</b>, it becomes easy to facilitate coupling since the flange <b>622</b> and the step <b>624</b> are engaged with each other when mounting the lens <b>620</b> to the package body <b>602</b>. This is the case where the lens <b>620</b> is separately manufactured and assembled to the package body. However, even in the case where the lens <b>620</b> is formed with a transfer forming, the lens forming process is easy and the engaging force therebetween is also intensified.

0104The present embodiment may also employ the T-shaped first sheet metal member like in <figref idref="DRAWINGS">FIG. 8</figref>, the protruded first section of the first sheet metal member like in <figref idref="DRAWINGS">FIG. 9</figref>, the protruded T-shaped first sheet metal member like in <figref idref="DRAWINGS">FIG. 11</figref>, and radiating means and the structure of first and second terminals like in <figref idref="DRAWINGS">FIG. 12</figref>.

0105Hereinafter, a manufacturing process of the LED package according to the present invention will be described with reference to the sectional process views of <figref idref="DRAWINGS">FIGS. 20 through 23</figref>. For convenience's sake, as for the LED package adapted to thus process, that of the first embodiment is used.

0106First, a step is conducted to dispose a frame where the first and second sheet metal members <b>114</b> and <b>116</b> are integrally coupled, as shown in <figref idref="DRAWINGS">FIG. 20</figref>. As can be seen from the drawing, holes H are formed vertically through these sheet metal members <b>114</b> and <b>116</b>.

0107Then, as shown in <figref idref="DRAWINGS">FIG. 21</figref>, a step is conducted to form the package body <b>102</b> at a position predetermined by the injection molding. Herein, resin forming the package body <b>102</b> is poured into the holes H and cured to form the posts <b>104</b> (see <figref idref="DRAWINGS">FIGS. 4 and 5</figref>) as described before.

0108Next, as shown in <figref idref="DRAWINGS">FIG. 22</figref>, a step is conducted to form the reflective layer <b>106</b> onto the inner wall of the recess <b>108</b> of the package body <b>102</b>, to seat the LED chip <b>112</b> on the first section of the first sheet metal member <b>114</b>, and to electrically connect the first and second sheet metal members <b>114</b> and <b>116</b> with the power supply through the wires <b>118</b>.

0109Then, as shown in <figref idref="DRAWINGS">FIG. 23</figref>, a step is conducted to fill up the recess <b>108</b> with the sealant <b>110</b> to seal the LED chip <b>112</b> and the like therein. Next, a step is conducted to cut the first and second sheet metal members <b>114</b> and <b>116</b> in frame shape to obtain the LED package <b>100</b> like in <figref idref="DRAWINGS">FIG. 4</figref>.

0110For reference, in manufacturing the LED package <b>300</b> like in <figref idref="DRAWINGS">FIG. 13</figref>, two one-dot chain lines L<b>1</b> and L<b>2</b> are cut together.

0111Hereinafter, an LED package according to a seventh embodiment of the present invention will be described with reference to <figref idref="DRAWINGS">FIGS. 24 through 26</figref>. <figref idref="DRAWINGS">FIG. 24</figref> is a plan view illustrating the high power LED package according to the seventh embodiment of the present invention, <figref idref="DRAWINGS">FIG. 25</figref> is a sectional view taken along a line C-C of the LED package of <figref idref="DRAWINGS">FIG. 24</figref>, and <figref idref="DRAWINGS">FIG. 26</figref> is a bottom view of the LED package of <figref idref="DRAWINGS">FIG. 24</figref>.

0112The high power LED package <b>700</b> of the present embodiment is used mounted on a board (see <figref idref="DRAWINGS">FIG. 10</figref>) having a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer.

0113As shown in <figref idref="DRAWINGS">FIGS. 24 through 26</figref>, the high power LED package <b>700</b> includes an LED chip <b>712</b> for emitting light when applied with electric current, a package body <b>702</b> integrally formed with resin to have a recess <b>708</b> for receiving the LED chip <b>712</b>, first and second sheet metal members <b>714</b> and <b>716</b> positioned in the package body <b>702</b>, functioning as a terminal and radiating means while supporting the LED chip <b>712</b>, and a sealant <b>710</b> for sealingly filling up the recess <b>708</b>.

0114First, the package body <b>702</b> is formed by injection molding of resin such that the upper surface of the upper portion <b>702</b>A thereof is sunk toward its center portion, forming the recess <b>708</b>. Herein, the inner wall of the recess <b>708</b> is preferably formed to have a certain slant. A lower portion <b>702</b>B of the package body receives the first and second sheet metal members <b>714</b> and <b>716</b> together with the upper portion <b>702</b>A of the package body. Herein, as shown in <figref idref="DRAWINGS">FIG. 22</figref>, the upper and lower portions <b>702</b>A and <b>702</b>B of the package body are connected with each other at their both longitudinal edges to stably fix the first and second sheet metal members <b>714</b> and <b>716</b> therebetween. In addition, although not illustrated, by forming a hole to each of the first sections <b>714</b>A and <b>716</b>A and connecting the upper and lower portions <b>702</b>A and <b>702</b>B of the package body together through the holes, it is possible to fix the first and second sheet metal members <b>714</b> and <b>716</b> more stably.

0115The first sheet metal member <b>714</b> consists of first and second sections <b>714</b>A and <b>714</b>B overlapped vertically and combined in a half T shape, the first and second sections <b>714</b>A and <b>714</b>B having a width smaller than the package body <b>702</b>. The first and second sections <b>714</b>A and <b>714</b>B are attached to each other with conductive epoxy and the like having high thermal and electric conductivity, rendering the current and heat transfer therebetween conducted smoothly. The first section <b>714</b>A supports at one end the LED chip <b>712</b> in the recess <b>708</b> while being electrically connected thereto, and extends at the other end over the sidewall of the package body <b>702</b>. The second section <b>714</b>B is exposed at its bottom surface from the bottom face of the lower portion <b>702</b>B of the package body, and extends at one end (positioned at right side in the drawing) over the sidewall of the package body thus to form a protrusion together with the other end of the first section <b>714</b>A. Meanwhile, the second section <b>714</b>B is formed shorter than the first section <b>714</b>A such that generally half portion thereof adjacent to the LED chip <b>712</b> on the first section <b>714</b>A is completely surrounded and fixed by the package body <b>702</b>.

0116The second sheet metal member <b>716</b> has a mirror image shape to the first sheet metal member <b>714</b>, and consists of the first and second sections <b>716</b>A and <b>716</b>B, whose width is formed smaller than the package body <b>702</b>. The first and second sections <b>716</b>A and <b>716</b>B are attached to each other with conductive epoxy and the like having high thermal and electric conductivity, rendering the current and heat transfer therebetween conducted smoothly. The first section <b>716</b>A is at one end positioned adjacent to the LED chip <b>712</b> in the recess <b>708</b> as to be electrically connected thereto, and extends at the other end over the sidewall of the package body <b>702</b>. The second section <b>716</b>B is exposed at its bottom surface from the bottom face of the lower portion <b>702</b>B of the package body, and extends at one end (positioned at left side in the drawing) over the sidewall of the package body thus to form a protrusion together with the other end of the first section <b>716</b>A. Meanwhile, the second section <b>716</b>B is formed shorter than the first section <b>716</b>A such that generally half portion thereof adjacent to the LED chip <b>712</b> on the first section <b>716</b>A is completely surrounded and fixed by the package body <b>702</b>.

0117As a result, heat generated at the LED chip <b>712</b> can be transferred smoothly through the first and second sections <b>714</b>A and <b>714</b>B of the first sheet metal member <b>714</b> to the metal plate of the board. That is, it can be understood that in the present invention, the first sheet metal member <b>714</b> may function as radiating means. Herein, since the first section <b>714</b>A of the first sheet metal member <b>714</b>, radiating means, is a part of the sheet metal member, a thickness thereof is seriously reduced relative to the metal slug <b>3</b> (see <figref idref="DRAWINGS">FIGS. 1 and 2</figref>) of the prior art. It can be accordingly seen that a heat transfer path from the LED chip <b>712</b> to the metal plate below the first section is greatly reduced, thereby increasing thermal radiation efficiency considerably. In addition, since the second sheet metal member <b>716</b> also functions as radiating means as well, thermal radiation efficiency may be further increased.

0118Furthermore, the first sheet metal member <b>714</b> has the half T shape, so that a path of foreign substances, moisture and the like intruded from the lower portion <b>702</b>B of the package body into the package body becomes longer to improve reliability of the LED package <b>700</b>.

0119The other elements of this embodiment are substantially identical to those of the LED package <b>100</b> of the first embodiment, and thus the detailed description thereof will be omitted.

0120<figref idref="DRAWINGS">FIG. 27</figref> is a sectional view illustrating a modification to the high power LED package according to the seventh embodiment of the present invention. An LED package <b>700</b>-<b>1</b> of this embodiment has substantially the same construction as the LED package <b>700</b> of the seventh embodiment, except that a first sheet metal member <b>714</b>-<b>1</b> consists of first and second sections <b>714</b>A and <b>714</b>B folded up on each other through bending at a bent <b>720</b>A, and a second sheet metal member <b>716</b>-<b>1</b> consists of first and second sections <b>716</b>A and <b>716</b>B folded up on each other through bending at a bent <b>720</b>B. Thus, the detailed description for the other elements will be omitted.

0121<figref idref="DRAWINGS">FIG. 28</figref> is a sectional view illustrating a high power LED package according to an eighth embodiment of the present invention. Referring to <figref idref="DRAWINGS">FIG. 8</figref>, the high power LED package <b>800</b> of the eighth embodiment is substantially identical to the construction of LED package <b>700</b> of the seventh embodiment, except for the first and second sheet metal members <b>814</b> and <b>816</b>.

0122That is, the first sheet metal member <b>814</b> is formed such that the second section <b>814</b>B thereof is bent downward to the first and third sections <b>814</b>A and <b>814</b>C thereof, exposing itself through the bottom face of the lower portion <b>802</b>B of the package body, and the third section <b>814</b>C is exposed through the sidewall of the package body <b>802</b>. Also, the second sheet metal member <b>816</b> is formed such that the second section <b>816</b>B thereof is bent downwardly to the first and third sections <b>816</b>A and <b>816</b>C thereof, being exposed through the bottom face of the lower portion <b>802</b>B of the package body, and the third section <b>816</b>C is exposed through the sidewall of the package body <b>802</b>.

0123Such shape of the sheet metal members <b>814</b> and <b>816</b> can be obtained by bending a certain portion of the source sheet metal plate, the second sections <b>814</b>B and <b>816</b>B, by means of a press and the like. In addition, on the contrary, such shape can be formed by selective etching and the like of the source sheet metal plate.

0124As a result, heat generated at the LED chip <b>812</b> can be transferred smoothly through the first and second section <b>814</b>A and <b>814</b>B of the first sheet metal member <b>814</b> to the metal plate of the board. That is, it can be understood that in the present invention, the first sheet metal member <b>814</b> may function as radiating means. Herein, since the first section <b>814</b>A of the first sheet metal member <b>814</b> as radiating means is a part of the sheet metal member, the thickness thereof is seriously reduced relative to the metal slug <b>3</b> (see <figref idref="DRAWINGS">FIGS. 1 and 2</figref>) of the prior art. It can be accordingly seen that a heat transfer path from the LED chip <b>812</b> to the metal plate below the first section is greatly reduced, thereby increasing thermal radiation efficiency considerably. In addition, since the second sheet metal member <b>816</b> also functions as radiating means as well, thermal radiation efficiency may be further increased.

0125In addition, when exposing the terminals in downset manner from the first and second sheet metal members <b>814</b> and <b>816</b>, the bent sheet metal members <b>814</b> and <b>816</b> operates like reinforced concrete structure, rendering the connection with the package body <b>802</b> more effective and intensified. Further, like the T shaped or half T-shaped sheet metal member structure as mentioned before, a path of foreign substances, moisture and the like intruded from the bottom face of the lower portion <b>802</b>B of the package body into the body through a gap (that may be formed later) between the sheet metal members <b>814</b> and <b>816</b> and the package resin becomes longer and complicated to improve reliability of the LED package.

0126<figref idref="DRAWINGS">FIG. 29</figref> is a sectional view illustrating a high power LED package according to a ninth embodiment of the present invention. Referring to <figref idref="DRAWINGS">FIG. 29</figref>, the high power LED package <b>900</b> according to the ninth embodiment has the cross-sectional shape similar to the LED package <b>800</b> of the eighth embodiment in <figref idref="DRAWINGS">FIG. 28</figref>, but has the construction of the first and second sheet metal members <b>914</b> and <b>916</b> deformed from that of the eighth embodiment.

0127That is, the first sheet metal member <b>914</b> includes the first and second sections <b>914</b>A and <b>914</b>B. The first section <b>914</b>A supports at its upper surface the LED chip <b>912</b> in the package body <b>902</b>, and is exposed at its lower surface outside via the lower portion <b>902</b>B of the package body. The second section <b>914</b>B is formed stepped upwards and extends to the outside between the lower portion <b>902</b>B and the upper portion <b>902</b>A of the package body. Meanwhile, the second sheet metal member <b>916</b> includes first and second sections <b>916</b>A and <b>916</b>B. The first section <b>916</b>A is spaced apart for a predetermined distance from the first section <b>914</b>A of the first sheet metal member <b>914</b>, and is exposed at its lower surface to the outside via the lower portion <b>902</b>B of the package body. The second section <b>916</b>B is formed stepped upwards from the first section <b>916</b>A and extends to the outside between the lower portion <b>902</b>B and the upper portion <b>902</b>A of the package body to form a terminal.

0128Such a shape of the sheet metal members <b>914</b> and <b>916</b> can be obtained by bending the sheet metal source plate between the first and second sections <b>914</b>A and <b>914</b>B; <b>916</b>A and <b>916</b>B with a press and the like, or selectively etching the same.

0129Constructed as such, heat generated from the LED chip <b>912</b> can be smoothly transferred through the first section <b>914</b>A of the first sheet metal member <b>914</b> to the metal plate of the board like in <figref idref="DRAWINGS">FIG. 9</figref>, and a height of the whole package body <b>902</b> can be additionally reduced as well.

0130Furthermore, because of the simplified construction relative to the embodiments as mentioned before, it is possible to enable the manufacturing process to be simplified and automated.

0131<figref idref="DRAWINGS">FIG. 30</figref> is a sectional view illustrating a modification to the high power LED package of <figref idref="DRAWINGS">FIG. 29</figref>.

0132Referring to <figref idref="DRAWINGS">FIG. 30</figref>, the lower portion at one end of the first section <b>914</b>A of the first sheet metal member <b>914</b> forms a slant surface <b>914</b>C cut slantly in a direction opposite to the first section <b>916</b>A of the second sheet metal member.

0133Similarly to for example the step <b>114</b>d illustrated in <figref idref="DRAWINGS">FIG. 8</figref>, the slant surface <b>914</b>C makes the path of foreign substances and moisture intruded into the LED chip <b>912</b> longer and complicated. In addition, the slant surface <b>914</b>C is covered with resin of the package body <b>902</b>, to improve the connection and air-tight feature between the first sheet metal member <b>914</b> and the package body <b>902</b>. Further, instead of this slant surface <b>914</b>C, the step <b>114</b>d as in <figref idref="DRAWINGS">FIG. 8</figref> may be employed.

0134Furthermore, it may be also possible to form the slant surface <b>914</b>C or the step <b>114</b>d in <figref idref="DRAWINGS">FIG. 8</figref> to the second sheet metal member <b>916</b>.

0135As described before, the high power LED package of the present invention is constructed to form radiating means for transferring heat generated from the LED chip to the metal plate of the board into the sheet metal member, thereby improving thermal radiation efficiency and reducing the size and thickness thereof.

0136In addition, by securing effective radiating means using the sheet metal member and injection-molding the package body with resin, the high power LED package of the present invention can be easily manufactured into a simple product.

0137Furthermore, by fixedly wrapping the sheet metal member functioning as radiating means and terminal in the package body of resin, the high power LED package of the present invention can be provided thin and robust.

0138While the present invention has been shown and described in connection with the preferred embodiments, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the spirit and scope of the invention as defined by the appended claims.