Capacitive charge measurement

BACKGROUND

Input devices including proximity sensor devices (also commonly called touchpads or touch sensor devices) are widely used in a variety of electronic systems. A proximity sensor device typically includes a sensing region, often demarked by a surface, in which the proximity sensor device determines the presence, location and/or motion of one or more input objects. Proximity sensor devices may be used to provide interfaces for the electronic system. For example, proximity sensor devices are often used as input devices for larger computing systems (such as opaque touchpads integrated in, or peripheral to, notebook or desktop computers). Proximity sensor devices are also often used in smaller computing systems (such as touch screens integrated in cellular phones and tablet computers). Such touch screen input devices are typically superimposed upon or otherwise collocated with a display of the electronic device.

SUMMARY

A circuit for measuring a capacitive charge comprises a latched comparator and a determination module. The latched comparator comprises an input and an output. The input is coupled with a sensor electrode of a capacitive input device. An inverted version of the output is coupled with a feedback loop. The feedback loop is configured to provide feedback to the input to maintain the input at a predetermined voltage. The feedback is provided in clocked charge quanta steps based on a clock signal. The determination module is coupled with the output and configured to determine a change in capacitance on the sensor electrode by equating output signals from the output with an amount of charge provided to the input to reach the predetermined voltage.

BRIEF DESCRIPTION OF DRAWINGS

The drawings referred to in this Brief Description of Drawings should not be understood as being drawn to scale unless specifically noted. The accompanying drawings, which are incorporated in and form a part of the Description of Embodiments, illustrate various embodiments and, together with the Description of Embodiments, serve to explain principles discussed below, where like designations denote like elements, and:

<figref idref="DRAWINGS">FIG. 1</figref> is a block diagram of an example input device, in accordance with embodiments;

<figref idref="DRAWINGS">FIG. 2</figref> shows a portion of an example sensor electrode pattern which may be utilized in a sensor to generate all or part of the sensing region of an input device, such as a touch screen, according to some embodiments;

<figref idref="DRAWINGS">FIG. 3</figref> shows a processing system with a capacitive charge measuring circuit, according to some embodiments;

<figref idref="DRAWINGS">FIG. 4</figref> shows a processing system with a capacitive charge measuring circuit, according to some embodiments;

<figref idref="DRAWINGS">FIG. 5</figref> shows a processing system with a capacitive charge measuring circuit, according to some embodiments;

<figref idref="DRAWINGS">FIG. 6</figref> shows a processing system with a capacitive charge measuring circuit, according to some embodiments; and

<figref idref="DRAWINGS">FIG. 7</figref> shows a processing system with a capacitive charge measuring circuit, according to some embodiments.

DESCRIPTION OF EMBODIMENTS

The following Description of Embodiments is merely provided by way of example and not of limitation. Furthermore, there is no intention to be bound by any expressed or implied theory presented in the preceding technical field, background, brief summary or the following detailed description.

Various embodiments described herein provide input devices and methods that facilitate improved usability.

Turning now to the figures, <figref idref="DRAWINGS">FIG. 1</figref> is a block diagram of an exemplary input device <b>100</b>, in accordance with various embodiments. Input device <b>100</b> may be configured to provide input to an electronic system (not shown). As used in this document, the term “electronic system” (or “electronic device”) broadly refers to any system capable of electronically processing information. Some non-limiting examples of electronic systems include personal computers of all sizes and shapes, such as desktop computers, laptop computers, netbook computers, tablets, web browsers, e-book readers, and personal digital assistants (PDAs). Additional example electronic systems include composite input devices, such as physical keyboards that include input device <b>100</b> and separate joysticks or key switches. Further example electronic systems include peripherals such as data input devices (including remote controls and mice), and data output devices (including display screens and printers). Other examples include remote terminals, kiosks, and video game machines (e.g., video game consoles, portable gaming devices, and the like). Other examples include communication devices (including cellular phones, such as smart phones), and media devices (including recorders, editors, and players such as televisions, set-top boxes, music players, digital photo frames, and digital cameras). Additionally, the electronic system could be a host or a slave to the input device.

Input device <b>100</b> can be implemented as a physical part of the electronic system, or can be physically separate from the electronic system. As appropriate, input device <b>100</b> may communicate with parts of the electronic system using any one or more of the following: buses, networks, and other wired or wireless interconnections Examples include, but are not limited to: Inter-Integrated Circuit (I2C), Serial Peripheral Interface (SPI), Personal System 2 (PS/2), Universal Serial Bus (USB), Bluetooth®, Radio Frequency (RF), and Infrared Data Association (IrDA).

In <figref idref="DRAWINGS">FIG. 1</figref>, input device <b>100</b> is shown as a proximity sensor device (also often referred to as a “touchpad” or a “touch sensor device”) configured to sense input provided by one or more input objects <b>140</b> in a sensing region <b>120</b>. Example input objects include fingers and styli, as shown in <figref idref="DRAWINGS">FIG. 1</figref>.

Sensing region <b>120</b> encompasses any space above, around, in and/or near input device <b>100</b> in which input device <b>100</b> is able to detect user input (e.g., user input provided by one or more input objects <b>140</b>). The sizes, shapes, and locations of particular sensing regions may vary widely from embodiment to embodiment. In some embodiments, sensing region <b>120</b> extends from a surface of input device <b>100</b> in one or more directions into space until signal-to-noise ratios prevent sufficiently accurate object detection. The distance to which this sensing region <b>120</b> extends in a particular direction, in various embodiments, may be on the order of less than a millimeter, millimeters, centimeters, or more, and may vary significantly with the type of sensing technology used and the accuracy desired. Thus, some embodiments sense input that comprises no contact with any surfaces of input device <b>100</b>, contact with an input surface (e.g., a touch surface) of input device <b>100</b>, contact with an input surface of input device <b>100</b> coupled with some amount of applied force or pressure, and/or a combination thereof. In various embodiments, input surfaces may be provided by surfaces of casings within which the sensor electrodes reside, by face sheets applied over the sensor electrodes or any casings, etc. In some embodiments, sensing region <b>120</b> has a rectangular shape when projected onto an input surface of input device <b>100</b>.

Input device <b>100</b> may utilize any combination of sensor components and sensing technologies to detect user input in sensing region <b>120</b>. Input device <b>100</b> comprises one or more sensing elements for detecting user input. As a non-limiting example, input device <b>100</b> may use capacitive techniques.

Some implementations are configured to provide images that span one, two, three, or higher dimensional spaces. Some implementations are configured to provide projections of input along particular axes or planes.

In some capacitive implementations of input device <b>100</b>, voltage or current is applied to create an electric field. Nearby input objects cause changes in the electric field, and produce detectable changes in capacitive coupling that may be detected as changes in voltage, current, or the like.

Some capacitive implementations utilize arrays or other regular or irregular patterns of capacitive sensing elements to create electric fields. In some capacitive implementations, separate sensing elements may be ohmically shorted together to form larger sensor electrodes. Some capacitive implementations utilize resistive sheets, which may be uniformly resistive.

Some capacitive implementations utilize “self capacitance” (or “absolute capacitance”) sensing methods based on changes in the capacitive coupling between sensor electrodes and an input object. In various embodiments, an input object near the sensor electrodes alters the electric field near the sensor electrodes, thus changing the measured capacitive coupling. In one implementation, an absolute capacitance sensing method operates by modulating sensor electrodes with respect to a reference voltage (e.g., system ground), and by detecting the capacitive coupling between the sensor electrodes and input objects.

Some capacitive implementations utilize “mutual capacitance” (or “transcapacitance”) sensing methods based on changes in the capacitive coupling between sensor electrodes. In various embodiments, an input object near the sensor electrodes alters the electric field between the sensor electrodes, thus changing the measured capacitive coupling. In one implementation, a transcapacitive sensing method operates by detecting the capacitive coupling between one or more transmitter sensor electrodes (also “transmitter electrodes” or “transmitters”) and one or more receiver sensor electrodes (also “receiver electrodes” or “receivers”). Collectively transmitters and receivers may be referred to as sensor electrodes or sensor elements. Transmitter sensor electrodes may be modulated relative to a reference voltage (e.g., system ground) to transmit transmitter signals. Receiver sensor electrodes may be held substantially constant relative to the reference voltage to facilitate receipt of resulting signals. A resulting signal may comprise effect(s) corresponding to one or more transmitter signals, and/or to one or more sources of environmental interference (e.g., other electromagnetic signals). Sensor electrodes may be dedicated transmitters or receivers, or may be configured to both transmit and receive. In some embodiments, one or more receiver electrodes may be operated to receive a resulting signal when no transmitter electrodes are transmitting (e.g., the transmitters are disabled). In this manner, the resulting signal represents noise detected in the operating environment of sensing region <b>120</b>.

In <figref idref="DRAWINGS">FIG. 1</figref>, a processing system <b>110</b> is shown as part of input device <b>100</b>. Processing system <b>110</b> is configured to operate the hardware of input device <b>100</b> to detect input in sensing region <b>120</b>. Processing system <b>110</b> comprises parts of or all of one or more integrated circuits (ICs) and/or other circuitry components. (For example, a processing system for a mutual capacitance sensor device may comprise transmitter circuitry configured to transmit signals with transmitter sensor electrodes, and/or receiver circuitry configured to receive signals with receiver sensor electrodes). In some embodiments, processing system <b>110</b> also comprises electronically-readable instructions, such as firmware code, software code, and/or the like. In some embodiments, components composing processing system <b>110</b> are located together, such as near sensing element(s) of input device <b>100</b>. In other embodiments, components of processing system <b>110</b> are physically separate with one or more components close to sensing element(s) of input device <b>100</b>, and one or more components elsewhere. For example, input device <b>100</b> may be a peripheral coupled to a desktop computer, and processing system <b>110</b> may comprise software configured to run on a central processing unit of the desktop computer and one or more ICs (perhaps with associated firmware) separate from the central processing unit. As another example, input device <b>100</b> may be physically integrated in a phone, and processing system <b>110</b> may comprise circuits and firmware that are part of a main processor of the phone. In some embodiments, processing system <b>110</b> is dedicated to implementing input device <b>100</b>. In other embodiments, processing system <b>110</b> also performs other functions, such as operating display screens, driving haptic actuators, etc.

Processing system <b>110</b> may be implemented as a set of modules that handle different functions of processing system <b>110</b>. Each module may comprise circuitry that is a part of processing system <b>110</b>, firmware, software, or a combination thereof. In various embodiments, different combinations of modules may be used. Example modules include hardware operation modules for operating hardware such as sensor electrodes and display screens, data processing modules for processing data such as sensor signals and positional information, and reporting modules for reporting information. Further example modules include sensor operation modules configured to operate sensing element(s) to detect input, identification modules configured to identify gestures such as mode changing gestures, and mode changing modules for changing operation modes.

In some embodiments, processing system <b>110</b> responds to user input (or lack of user input) in sensing region <b>120</b> directly by causing one or more actions. Example actions include changing operation modes, as well as GUI actions such as cursor movement, selection, menu navigation, and other functions. In some embodiments, processing system <b>110</b> provides information about the input (or lack of input) to some part of the electronic system (e.g. to a central processing system of the electronic system that is separate from processing system <b>110</b>, if such a separate central processing system exists). In some embodiments, some part of the electronic system processes information received from processing system <b>110</b> to act on user input, such as to facilitate a full range of actions, including mode changing actions and GUI actions.

For example, in some embodiments, processing system <b>110</b> operates the sensing element(s) of input device <b>100</b> to produce electrical signals indicative of input (or lack of input) in sensing region <b>120</b>. Processing system <b>110</b> may perform any appropriate amount of processing on the electrical signals in producing the information provided to the electronic system. For example, processing system <b>110</b> may digitize analog electrical signals obtained from the sensor electrodes. As another example, processing system <b>110</b> may perform filtering or other signal conditioning. As yet another example, processing system <b>110</b> may subtract or otherwise account for a baseline, such that the information reflects a difference between the electrical signals and the baseline. As yet further examples, processing system <b>110</b> may determine positional information, recognize inputs as commands, recognize handwriting, and the like.

“Positional information” as used herein broadly encompasses absolute position, relative position, velocity, acceleration, and other types of spatial information. Exemplary “zero-dimensional” positional information includes near/far or contact/no contact information. Exemplary “one-dimensional” positional information includes positions along an axis. Exemplary “two-dimensional” positional information includes motions in a plane. Exemplary “three-dimensional” positional information includes instantaneous or average velocities in space. Further examples include other representations of spatial information. Historical data regarding one or more types of positional information may also be determined and/or stored, including, for example, historical data that tracks position, motion, or instantaneous velocity over time.

In some embodiments, input device <b>100</b> is implemented with additional input components that are operated by processing system <b>110</b> or by some other processing system. These additional input components may provide redundant functionality for input in sensing region <b>120</b>, or some other functionality. <figref idref="DRAWINGS">FIG. 1</figref> shows buttons <b>130</b> near sensing region <b>120</b> that can be used to facilitate selection of items using input device <b>100</b>. Other types of additional input components include sliders, balls, wheels, switches, and the like. Conversely, in some embodiments, input device <b>100</b> may be implemented with no other input components.

In some embodiments, input device <b>100</b> may be a touch screen, and sensing region <b>120</b> overlaps at least part of an active area of a display screen. For example, input device <b>100</b> may comprise substantially transparent sensor electrodes overlaying the display screen and provide a touch screen interface for the associated electronic system. The display screen may be any type of dynamic display capable of displaying a visual interface to a user, and may include any type of light emitting diode (LED), organic LED (OLED), cathode ray tube (CRT), liquid crystal display (LCD), plasma, electroluminescence (EL), or other display technology. Input device <b>100</b> and the display screen may share physical elements. For example, some embodiments may utilize some of the same electrical components for displaying and sensing. As another example, the display screen may be operated in part or in total by processing system <b>110</b>.

It should be understood that while many embodiments are described in the context of a fully functioning apparatus, the mechanisms are capable of being distributed as a program product (e.g., software) in a variety of forms. For example, the mechanisms that are described may be implemented and distributed as a software program on information bearing media that are readable by electronic processors (e.g., non-transitory computer-readable and/or recordable/writable information bearing media readable by processing system <b>110</b>). Additionally, the embodiments apply equally regardless of the particular type of medium used to carry out the distribution. Examples of non-transitory, electronically readable media include various discs, memory sticks, memory cards, memory modules, and the like. Electronically readable media may be based on flash, optical, magnetic, holographic, or any other tangible storage technology.

<figref idref="DRAWINGS">FIG. 2</figref> shows a portion of an example sensor electrode pattern <b>200</b> which may be utilized in a sensor to generate all or part of the sensing region of a input device <b>100</b>, according to various embodiments. Input device <b>100</b> is configured as a capacitive input device when utilized with a capacitive sensor electrode pattern. For purposes of clarity of illustration and description, a non-limiting simple rectangular sensor electrode pattern <b>200</b> is illustrated. It is appreciated that numerous other sensor electrode patterns may be employed. The illustrated sensor electrode pattern is made up of a plurality of receiver electrodes <b>270</b> (<b>270</b>-<b>0</b>, <b>270</b>-<b>1</b>, <b>270</b>-<b>2</b> . . . <b>270</b>-<i>n</i>) and a plurality of transmitter electrodes <b>260</b> (<b>260</b>-<b>0</b>, <b>260</b>-<b>1</b>, <b>260</b>-<b>2</b> . . . <b>260</b>-<i>n</i>) which overlay one another, in this example. In the illustrated example, touch sensing pixels are centered at locations where transmitter and receiver electrodes cross. Capacitive pixel <b>290</b> illustrates one of the capacitive pixels generated by sensor electrode pattern <b>200</b>. It is appreciated that in a crossing sensor electrode pattern, such as the illustrated example, some form of insulating material or substrate is typically disposed between transmitter electrodes <b>260</b> and receiver electrodes <b>270</b>. However, in some embodiments, transmitter electrodes <b>260</b> and receiver electrodes <b>270</b> may be disposed on the same layer as one another through use of routing techniques and/or jumpers. Further, in various embodiments, transmitter electrodes <b>260</b> and receiver electrodes <b>270</b> may have various different shapes and sizes. In various embodiments, touch sensing includes sensing input objects anywhere in sensing region <b>120</b> and may comprise: no contact with any surfaces of the input device <b>100</b>, contact with an input surface (e.g., a touch surface) of the input device <b>100</b>, contact with an input surface of the input device <b>100</b> coupled with some amount of applied force or pressure, and/or a combination thereof.

Capacitive pixels, such as capacitive pixel <b>290</b>, are areas of localized capacitive coupling between transmitter electrodes <b>260</b> and receiver electrodes <b>270</b>. The capacitive coupling between transmitter electrodes <b>260</b> and receiver electrodes <b>270</b> changes with the proximity and motion of input objects in the sensing region associated with transmitter electrodes <b>260</b> and receiver electrodes <b>270</b>.

In some embodiments, sensor electrode pattern <b>200</b> is “scanned” to determine these capacitive couplings. That is, the transmitter electrodes <b>260</b> are driven to transmit transmitter signals. Transmitters may be operated such that one transmitter electrode transmits at one time, or multiple transmitter electrodes transmit at the same time. Where multiple transmitter electrodes transmit simultaneously, these multiple transmitter electrodes may transmit the same transmitter signal and produce an effectively larger transmitter electrode, or these multiple transmitter electrodes may transmit different transmitter signals. For example, multiple transmitter electrodes may transmit different transmitter signals according to one or more coding schemes that enable their combined effects on the resulting signals of receiver electrodes <b>270</b> to be independently determined.

The receiver electrodes <b>270</b> may be operated singly or multiply to acquire resulting signals. The resulting signals may be used to determine measurements of the capacitive couplings at the capacitive pixels.

A set of measurements from the capacitive pixels form a “capacitive image” (also “capacitive frame”) representative of the capacitive couplings at the pixels. Multiple capacitive images may be acquired over multiple time periods, and differences between them used to derive information about input in the sensing region. For example, successive capacitive images acquired over successive periods of time can be used to track the motion(s) of one or more input objects entering, exiting, and within the sensing region.

Example Capacitive Charge Measuring Circuits

<figref idref="DRAWINGS">FIG. 3</figref> shows processing system <b>110</b> with a capacitive charge measuring circuit <b>305</b>, according to some embodiments. As illustrated in <figref idref="DRAWINGS">FIG. 3</figref>, processing system <b>110</b> includes a transmitter module <b>310</b>, a receiver module <b>320</b>A, and a determination module <b>330</b>. Receiver module <b>320</b>A and determination module <b>330</b> are included in capacitive charge measuring circuit <b>305</b>, in some embodiments.

Transmitter module <b>310</b> operates to couple a transmitter signal with a transmitter sensor electrode, TX, of a sensor electrode pattern such as sensor electrode pattern <b>200</b> employed by a capacitive input device such as input device <b>100</b>. In one embodiment, the transmitter signal comprises driving the transmitter electrode from a first voltage potential to a second voltage potential. In one embodiment, the transmitter electrode is driven with VDD and then driven with system ground. The transmitter signal charges a capacitance C_TXon transmitter sensor electrode TX. The transmitter signal is driven by a transmitter input (shown as TXbar) provided by processing system <b>110</b>. As illustrated in <figref idref="DRAWINGS">FIG. 3</figref>, when TXbar is high a first transistor is closed, and transmitter electrode TX is coupled with system ground; when TXbar is low a second transistor is closed and transmitter electrode TX is coupled with VDD. Transmitter sensor electrode TX induces a charge, through a resulting signal coupled through the capacitance under test C_T, onto receiver sensor electrode RX. The induced charge is stored on the parasitic receiver sensor electrode capacitances C_RXand C_P.

Receiver module <b>320</b>A inputs a sample of a resulting signal by measuring charge C_RXfrom receiver sensor electrode RX in response to a clock signal (CLK). The sampled signal is received at a latched input of a latched comparator <b>321</b>, which is coupled with receiver sensor electrode RX. The inverting input of latched comparator <b>321</b> is coupled with Vref. Herein, latched comparator <b>321</b> is illustrated as a generic latched comparator, but it is appreciated that other types of latched comparators, such as, for example, a D flip-flop or a T flip-flop may be utilized with minimal modification. Use of a D flip-flop is illustrated in <figref idref="DRAWINGS">FIGS. 4-7</figref>. In feedback loop <b>322</b>, invertor INV is used to invert the output of the latched comparator for purposes of feedback, this causes the output provided to determination module <b>330</b> to be a complement of the signal used in feedback to the latched input.

Feedback loop <b>322</b> provides feedback to the input of latched comparator <b>321</b> to maintain the input at a predetermined voltage. In some embodiments, the predetermined voltage is an input threshold voltage of latched comparator <b>321</b>. Latched comparator <b>321</b> is clocked at a high frequency (such as 100 MHz), and the feedback is provided in clocked charge quanta steps based on the clock signal CLK received at latched comparator <b>321</b>. When the input of latched comparator <b>321</b> is below the predetermined voltage, the output will be low and the inverted feedback will be high, causing feedback loop <b>322</b> to add a clocked quanta of charge to receiver sensor electrode RX and the input of latched comparator <b>321</b>. When the input of latched, comparator <b>321</b> is above the predetermined voltage, the output will be low, causing feedback loop <b>322</b> to subtract a clocked quanta of charge from receiver sensor electrode RX and the input of latched comparator <b>321</b>.

Determination module <b>330</b> effectively measures the current, in clocked charge quanta steps, that is provided in feedback to the input of latched comparator <b>321</b> in order to arrive at the predetermined voltage level. This measurement of the amount of current provided in clocked charge quanta steps allows for a measurement of the change in capacitive charge induced through C_Tonto receiver electrode RX. This is measured by coupling the output of latched, comparator <b>321</b> with determination module <b>330</b> and, then utilizing logic to process the signal from this output, where processing may include integration, demodulation, and filtering of the signal received from the output. In this manner determination module <b>330</b> operates to determine a change in capacitance induced on receiver sensor electrode RX by equating output signals from the output with an amount of charge provided to the input of latched comparator <b>321</b> in order to reach the predetermined voltage.

In the feedback loop <b>322</b> illustrated in receiver module <b>320</b>A, an inverter INV and a single resistor R_FBare disposed in series between the output and the input of latched comparator <b>321</b>. Inverter INV provides an inverted version of the output of latched comparator <b>321</b>. R_FB, in some embodiments, is the only analog component utilized in charge measuring circuit <b>305</b>. R_FBprovides symmetric feedback whether the inverted version of the output is high or low. In other embodiments, two feedback resistors of differing size may be employed, along with logic, such that a first feedback resistor is utilized in feedback loop <b>322</b> when the inverted version of the output is high and a second feedback resistor is placed in feedback loop <b>322</b> when the inverted version of the output is low. In such an embodiment, the feedback provided to the input of latched comparator <b>321</b> is non-symmetric. In one embodiment, feedback loop <b>322</b> may comprise a capacitor.

<figref idref="DRAWINGS">FIG. 4</figref> shows processing system <b>110</b> with a capacitive charge measuring circuit <b>305</b>, according to some embodiments. <figref idref="DRAWINGS">FIG. 4</figref> illustrates a variation on circuit <b>305</b> as compared with <figref idref="DRAWINGS">FIG. 3</figref>. In <figref idref="DRAWINGS">FIG. 4</figref>, receiver module <b>320</b>B includes a second feedback resistor R_FB2in parallel with R_FB, and generic latched comparator <b>321</b> and inverter INV have been replaced with D flip-flop <b>321</b>A which includes an output (Q) and an inverted output (Qbar) which are complements of one another. The latched input, which may be referred to herein as simply an input, is depicted as input D of latched comparator <b>321</b>A. A first output (non-inverted output Q in the illustrated example) of latched comparator <b>321</b>A is coupled with determination module <b>330</b>. A second output (inverted output Qbar in the illustrated example) of latched comparator <b>321</b>A is coupled with feedback loop <b>322</b>. The first and second outputs (e.g., Q and Qbar as illustrated) are complements of one another, thus obviating the separate invertor INV depicted in feedback loop <b>322</b> in <figref idref="DRAWINGS">FIG. 3</figref>. Switch SW<b>1</b> can be selectively closed by processing system <b>110</b> to utilize R_FBin feedback loop <b>322</b>. Similarly, Switch SW<b>2</b> can be selectively closed by processing system <b>110</b> to utilize R_FB2in feedback loop <b>322</b>. In some embodiments, R_FB2is smaller in size (e.g., one half or one tenth the value of RFB) so that it can be selected to provide larger quanta of charge at the beginning of a measurement process (first stage of feedback). R_FBcan then be selected to perform finer measurements (second stage of feedback). Providing two stages of feedback allows capacitance measurements to be made more quickly but still with fine resolution. In some embodiments two stage feedback can be implemented using a single feedback resistor with a bypass switch in parallel and no additional feedback resistor. It is further appreciated that, in some embodiments, more than two selectable feedback resistors may be employed to provide more than two stages of feedback. As the first and second outputs (Q and Qbar) of latched comparator <b>321</b>A are compliments of one another, they can be switched in some embodiments such that the first output is coupled with feedback loop <b>322</b> and the second output is coupled with determination module <b>330</b>.

<figref idref="DRAWINGS">FIG. 5</figref> shows processing system <b>110</b> with a capacitive charge measuring circuit <b>305</b>, according to some embodiments. <figref idref="DRAWINGS">FIG. 5</figref> illustrates a variation on circuit <b>305</b> as compared with <figref idref="DRAWINGS">FIG. 3</figref>. In <figref idref="DRAWINGS">FIG. 5</figref>, receiver module <b>320</b>C includes a current source <b>323</b> instead of feedback resistor R_FBof receiver module <b>320</b>A, and again generic latched comparator <b>321</b> and inverter INV have been replaced with D flip-flop <b>321</b>A which includes an output (Q) and an inverted output (Qbar) which are complements of one another. By closing switch SW<b>3</b>, processing system <b>110</b> can selectively couple current source <b>323</b> in series into feedback loop <b>322</b>. It should be appreciated that multiple current sources can be employed to provide a multi-stage feedback as described in conjunction with <figref idref="DRAWINGS">FIG. 4</figref> or to provide non-symmetric feedback.

<figref idref="DRAWINGS">FIG. 6</figref> shows processing system <b>110</b> with a capacitive charge measuring circuit <b>305</b>, according to some embodiments. <figref idref="DRAWINGS">FIG. 6</figref> illustrates a variation on circuit <b>305</b> as compared with <figref idref="DRAWINGS">FIG. 3</figref>. In <figref idref="DRAWINGS">FIG. 6</figref>, generic latched comparator <b>321</b> and inverter INV have again been replaced with D flip-flop <b>321</b>A which includes an output (Q) and an inverted output (Qbar) which are complements of one another; and offset capacitors C<b>1</b> and C<b>2</b> are included in receiver module <b>320</b>D and are coupled with the input of latched comparator <b>321</b>A, and. Various signals such as signals TX<b>1</b> and TX<b>2</b> may be provided to charge offset capacitors C<b>1</b> and C<b>2</b> and offset the capacitance at the input of latched comparator <b>321</b>A. Although two offset capacitors are depicted a greater or lesser number may be utilized. For example, in some embodiments, a selectable bank of two or more capacitors may be utilized in a similar manner instead of just the two separately illustrated capacitors C<b>1</b> and C<b>2</b>.

<figref idref="DRAWINGS">FIG. 7</figref> shows processing system <b>110</b> with a capacitive charge measuring circuit <b>305</b>, according to some embodiments. <figref idref="DRAWINGS">FIG. 7</figref> illustrates a variation on circuit <b>305</b> as compared with <figref idref="DRAWINGS">FIG. 3</figref>. In <figref idref="DRAWINGS">FIG. 7</figref>, receiver sensor electrode RX is coupled with a pull-up to VDD and a pull-down to system ground, and again generic latched comparator <b>321</b> and inverter INV have been replaced with D flip-flop <b>321</b>A which includes an output (Q) and an inverted output (Qbar) which are complements of one another. The pull-up and pull-down may be implemented with selectable switches SWU and SWD, respectively, as illustrated. Further, the pull-up and pull-down may be implemented interior to receiver module <b>320</b>E, as illustrated, or exterior to receiver module <b>320</b>E. In one embodiment, the pull-up and pull-down may be selectively employed by processing system <b>110</b>, when transmitter module <b>310</b> is turned off, such that receiver sensor electrode RX can be utilized for absolute capacitive sensing. For example, by closing switch SWU, VDD may be applied to receiver sensor electrode RX to charge it, and then capacitance measurement circuit <b>305</b> may then be employed to measure any change in capacitance that occurs as the result of an input object capacitive interacting with receiver sensor electrode RX. The absolute capacitance of the receiver electrode may be measured using the same techniques as described above in relation to measuring the transcapacitance. Further, switch SWD may be selectively closed in a similar manner to ground receiver sensor electrode RX.

It should be appreciated that the embodiments illustrated in <figref idref="DRAWINGS">FIGS. 3 through 7</figref> may be utilized in various combinations with one another, and that they have only been depicted and described in isolation for purposes of clarity.

Thus, the examples set forth herein were presented in order to best explain, to describe particular applications, and to thereby enable those skilled in the art to make and use embodiments of the described examples. However, those skilled in the art will recognize that the foregoing description and examples have been presented for the purposes of illustration and example only. The description as set forth is not intended to be exhaustive or to limit the embodiments to the precise form disclosed.