LCD module with thermal sensor integrated and its implementation

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to the field of personal computers and component parts thereof, and more particularly to an apparatus and method for monitoring and controlling the temperature of monitor devices, particularly liquid crystal display modules (“LCMs”) used in conjunction with certain personal computers. The predominant current usage of the inventive temperature sensing apparatus and method is in preventing problems related with overheating in portable computers, particularly but not exclusively in tablet type computer devices, wherein heat is a particular problem because certain heat producing components may be directly behind the LCM.

2. Description of the Background Art

Thermal management in computer systems, especially in laptops, is a very challenging issue. Many components, primarily the Central Processing Unit (“CPU”), the Graphics Processing Unit (“GPU”), the hard drive, the optical drive, and the LCM, generate heat during operation and contribute to a total thermal loading of the system. These same components are also very sensitive to high temperatures. The temperature on an LCM and/or a temperature gradient, can affect the display optical performance, including causing undesirable artifacts and non-uniformity in displayed images. The problem might look more severe when viewed in the mid gray levels and over wide viewing angles.

Of course, the designers of the LCMs do what they can to reduce the amount of destructive heat produced by the LCM. However, despite the fact that it has been known in the prior art that excessive heating of the LCM may cause problems, to the inventors' knowledge, there has not been a significant effort to try to control or otherwise insure that the temperature of the LCM, or portions thereof, do not exceed optimal temperature ranges while the LCM is in operation.

Prior to the present invention, it was thought that either the problems associated with heat in the LCM were not significant enough to address separately, or else the expense in additional parts, and the like, would make an effort to control the temperature of the LCM less than cost effective.

It is known in the art to incorporate temperature sensors in CPUs, graphics processor units (“GPUs”). hard drives, and battery packs. However, to the inventors' knowledge, for reasons including those discussed above, no such device has been included in, on, or in close proximity to an LCM module, or the like.

SUMMARY

An example of an embodiment of the invention is a computer video display temperature control system having at least one temperature sensor positioned on or near the LCM display device, such as on the printed circuit board of the LCM. The temperature sensor(s) communicate to the CPU of the computer system through an Inter-Integrated Circuit interface (“I²C”), which is already connected to the LCM. The I²C is one of the several busses in the computer system. One use of the I²C is to communicate extended display identification data (“EDID”) data from the LCM to the computer. The EDID is stored in an EDID EEPROM on the printed circuit board of the LCM.

Since the I²C already connects the LCM to the computer, temperature data can be communicated from the temperature sensor(s) to the computer without requiring additional hardware communication means or wiring between the units. When the CPU of the computer receives the temperature information from the LCM it can take remedial action to lower the temperature, as is deemed necessary or desirable. The remedial action can include, but is not limited to increasing the speed of a fan in the enclosure to remove the heat from the computer or, in some manner, throttling the system in an attempt to reduce the total heat generated within the computer. A key aspect to the above thermal control mechanism is the ability to accurately measure the temperature of the critical components in the LCM. This accuracy is accomplished by incorporating a temperature-sensing device within, or next to, any such critical component(s).

In various embodiments of the invention, the invention is employed in various types of computers, including but not limited to a laptop computer and a tablet type computer. In the later of these, the invention is particularly important, due to the proximity of the LCM to other heat producing elements in the tablet type computer.

Accordingly, it is an object of the present invention to provide an apparatus and method for preventing excessive heat buildup in the LCM of a computer.

It is another object of the present invention to provide an apparatus and method which is an easy and inexpensive addition to existing computer system designs.

It is still another object of the present invention to prevent premature failure of a computer display device caused by excessive heat.

It is yet another object of the present invention to prevent undesirable operational conditions and effects caused by heat in a computer display device.

It is still another object of the present invention to provide an apparatus and method for determining when and if remedial action is required to correct the temperature of an LCM display device while in operation

It is yet another object of the present invention to provide an apparatus and method for controlling the temperature of a computer so as to prevent the temperature of an associated LCM module from exceeding predetermined temperature conditions.

These and other objects and advantages of the present invention will become clear to those skilled in the art in view of the description of modes of carrying out the invention, and the industrial applicability thereof, as described herein and as illustrated in the several figures of the drawing. The objects and advantages listed or discussed herein are not an exhaustive list of all possible objects or advantages of the invention. Moreover, it will be possible to practice the invention even where one or more of the intended objects and/or advantages might be absent or not required in the application.

Further, those skilled in the art will recognize that various embodiments of the present invention may achieve one or more, but not necessarily all, of the above described objects and/or advantages. Accordingly, the listed objects and advantages are not essential elements of the present invention, and should not be construed as limitations.

BRIEF DESCRIPTION OF THE DRAWINGS

<figref idref="DRAWINGS">FIG. 1</figref> is a block diagrammatic view of a computer system showing the principle components for practicing the present invention;

<figref idref="DRAWINGS">FIG. 2</figref> is side cross-sectional view of an example of a laptop type computer application of the present invention;

<figref idref="DRAWINGS">FIG. 3</figref> is a partially cut away perspective view of an example of a tablet type computer application of the present invention; and

<figref idref="DRAWINGS">FIG. 4</figref> is a flow diagram depicting the basic operations of the present inventive method.

DETAILED DESCRIPTION

This invention is described in the following description with reference to the Figures, in which like numbers represent the same or similar elements. While this invention is described in terms of modes for achieving this invention's objectives, it will be appreciated by those skilled in the art that variations may be accomplished in view of these teachings without deviating from the spirit or scope of the present invention. The embodiments and variations of the invention described herein, and/or shown in the drawings, are presented by way of example only and are not limiting as to the scope of the invention. Unless otherwise specifically stated, individual aspects and components of the invention may be omitted or modified, or may have substituted therefore known equivalents, or as yet unknown substitutes such as may be developed in the future or such as may be found to be acceptable substitutes in the future. The invention may also be modified for a variety of applications while remaining within the spirit and scope of the claimed invention, since the range of potential applications is great, and since it is intended that the present invention be adaptable to many such variations.

A known mode for carrying out the invention is a temperature sensing apparatus <b>10</b> configured as part of a computer system <b>11</b>. The computer system <b>11</b> has a LCM <b>12</b> and a computer <b>14</b>, where the computer <b>14</b> is here defined as being, generally, those portions of the computer system <b>11</b> exclusive of the video display LCM <b>12</b> and its housing, if the LCM <b>12</b> is housed separately. As will be described by example in greater detail hereinafter, in a laptop type computer the computer <b>14</b> will generally have a keyboard, a pointing device (such as a touch pad, or the like), a hard disk drive, a circuit board having thereon a plurality of components, and other components familiar to those skilled in the art, while the LCM <b>12</b> will be in distinctly separate but generally attached enclosure. In a tablet type computer, the LCM <b>12</b> and the computer <b>14</b> might be housed in the same enclosure.

The LCM <b>12</b> has a glass portion <b>16</b> (including a backlight portion not shown separately in <figref idref="DRAWINGS">FIG. 1</figref>) and a PCB <b>18</b> attached thereto. The PCB <b>18</b> will have thereon integrated circuits and other components for driving the LCM to produce an image thereon. Additionally, the PCB <b>18</b> generally will have thereon an EDID EEPROM <b>20</b>. The EDID EEPROM <b>20</b> is a component for identifying the particular type of LCM <b>12</b> to the computer <b>14</b>. One skilled in the art will recognize that the information provided by the EDID EEPROM <b>20</b> allows the computer <b>14</b> to adjust several factors, including image color shift to conform to the color response of the particular LCM <b>12</b> type. Also, the computer <b>14</b> will know, from the information provided by the EDID EEPROM <b>20</b> and information provided by software, the size, native resolution, and other characteristics of the LCM <b>12</b>.

According to the present invention at least one temperature sensor <b>22</b> is provided in close proximity to the LCM <b>12</b>. In this example, the temperature sensor <b>22</b> is located on the PCB <b>18</b> of the LCM <b>12</b>. It will be a relatively simple task for designers in each application of the invention to determine which areas of the LCM <b>12</b> might be susceptible to over heating and, therefore, which areas should have a temperature sensor <b>22</b> placed on or adjacent thereto. Potential locations for the temperature sensor(s) <b>22</b> can be determined by considering the thermal profile of the LCM <b>12</b>, and also by giving consideration to which positions on the LCM <b>12</b> might be most susceptible to performance degradation when subject to excessively high temperatures.

A variety of cost-effective digital temperature sensors that can accurately measure temperature within a few degrees are available. The National Semiconductor™ LM75 is an example of such a device that is being used in the embodiment shown. The LM75 temperature sensor <b>22</b> is capable of measuring temperature at a single location. If it is determined that more than one location on the LCM <b>12</b> should be monitored, then there are alternative solutions. Either multiple LM75 devices can be used, or a single device with multiple sensors (such as the National Semiconductor™ LM89) can be used.

In either case, information from the temperature sensor <b>22</b> is communicated to a CPU <b>24</b> via an I²C bus <b>26</b>. The I²C bus <b>26</b> is a bus already in place in the computer system <b>11</b>. The EDID EEPROM <b>20</b>, discussed previously herein, also communicates with the CPU <b>24</b> via the I²C bus <b>26</b>. When it is determined that the temperature reported by the temperature sensor <b>22</b> exceeds a predetermined limit, then the CPU <b>24</b> will communicate with a control module <b>28</b> to control (increase, in this instance) the speed of a fan <b>30</b>. In some embodiments of the invention, the control module <b>28</b> may be integral with the fan <b>30</b>. One skilled in the art will recognize that the CPU <b>24</b> can communicate individually with the EDID EEPROM <b>20</b>, the temperature sensor <b>22</b> the control module <b>28</b>, and any other components connected to the I²C bus <b>26</b>, because each of these has its own logical address. In an alternate embodiment, temperature sensor <b>22</b> is integrated into one of the other chips (e.g., EDID EEPROM <b>20</b>) already present in the design of LCM <b>12</b>, preferably a chip that already has an existing means of communication (e.g., I²C bus <b>26</b>) with CPU <b>24</b>.

The control module <b>28</b> is also representative of other devices which might be controlled by the CPU <b>24</b> in response to indications from the temperature sensor <b>22</b>. For example, the control module <b>28</b>, or some such equivalent device, might be used to temporarily turn off unused heat producing components, or essentially any other type of remedial action that might reduce the heat produced in the computer system <b>11</b>. According to the presently described embodiment of the temperature sensing apparatus <b>10</b>, the CPU <b>24</b> also modifies its own operating speed in order to reduce the amount of power used and, thereby the amount of heat created. Alternative methods for reducing the amount of heat produced in the computer system <b>11</b> are controlling the speed of the GPU, the system memory, or the like. It should be noted that, in laptop computers and the like, wherein the LCM <b>12</b> is housed separately from the computer <b>14</b>, changes in the temperature within the computer <b>14</b> will only indirectly effect the temperature of the LCM <b>12</b>, however there will be some effect and the remedial methods discussed above are, in fact, applicable even in such applications. For example, notebook style computers can typically operate in a “lid closed” mode where the machine is still operating, but with the lid closed. In such cases, the LCD housing <b>40</b> will be in direct and/or close contact with the computer housing <b>42</b>, so remedial action that reduces power in the base of the unit will also reduce the temperature of the LCD. A more direct type of remedial action that can be taken regarding the LCM <b>12</b> is to modify the power usage of the LCM <b>12</b> as, for example, by controlling the brightness of the LCM <b>12</b> itself. It should be noted that when, after any remedial method is taken and after the temperature sensed by the temperature sensor <b>22</b> falls below a predetermined acceptable value, then the CPU <b>24</b> will generally cause such remedial action to be terminated unless and until such temperature again rises to an unacceptable level.

<figref idref="DRAWINGS">FIG. 2</figref> is a cross-sectional side elevational view of a laptop type computer system <b>11</b><i>a </i>embodying an example of the inventive temperature sensing apparatus <b>10</b>. As can be seen in the view of <figref idref="DRAWINGS">FIG. 2</figref>, the LCM <b>12</b> is housed in a generally separate LCM housing <b>40</b>, while the computer <b>14</b> is housed in its own computer housing <b>42</b>.

In applications such as that depicted in the example of <figref idref="DRAWINGS">FIG. 2</figref>, the LCM <b>12</b> is electrically connected to a main circuit board <b>44</b>, and thereby to the CPU <b>24</b> via a connecting cable <b>46</b> which, in this example, is a ribbon type cable. Accordingly, the I²C <b>26</b> is included as a conductor set within the connecting cable <b>46</b>. The computer system <b>11</b><i>a </i>can, optionally, be programmed such that, when the temperature sensor <b>22</b> senses an excessive temperature, the CPU <b>24</b> can cause any of the possible remedial operations discussed above to be initiated.

As can be seen in the view of <figref idref="DRAWINGS">FIG. 2</figref>, in this example the temperature sensor <b>22</b> is located on the PCB <b>18</b> of the LCM <b>12</b>. As previously discussed herein, the placement of the temperature sensor <b>22</b> in the view of <figref idref="DRAWINGS">FIG. 2</figref> is an example only. Designers employing the inventive temperature sensing apparatus <b>10</b> will determine the correct position for the temperature sensor <b>22</b>, or for multiple iterations of the temperature sensor <b>22</b>, by methods such as measuring the temperatures on various portions of the LCM <b>12</b> and/or by determining which portions of the LCM <b>12</b> most need to be protected from heat based upon considerations such as which portions are most adversely affected by excessive heat.

It should be noted that the simple example of <figref idref="DRAWINGS">FIG. 2</figref> omits, for the sake of clarity, many components that must or can be included in the computer system <b>11</b><i>a</i>. A keyboard <b>48</b> is depicted in block diagrammatic form. However, other components, including heat producing components such as a hard drive, a GPU, memory, a CD ROM drive, and the like, are not specifically depicted in this drawing.

<figref idref="DRAWINGS">FIG. 3</figref> is a partially cut away perspective view of a simple example of a tablet type computer system <b>11</b><i>b</i>. In the tablet type computer system <b>11</b><i>b</i>, the LCM <b>12</b> and the computer <b>14</b> are housed generally in a single integrated housing <b>50</b>. As can be seen through the cutaway portion of the drawing, there are two of the temperature sensors <b>22</b> visible in this view. In this example, the temperature sensors <b>22</b> are each single sensor types and are each individually connected to the I²C <b>26</b> (connections not visible in the view of <figref idref="DRAWINGS">FIG. 3</figref>). As discussed previously herein, a multiple sensor type temperature sensor unit could also be used for the application. Also, it should be noted that the quantity of temperature sensors <b>22</b> is not limited to two. As many temperature sensors <b>22</b> could be employed as the designers of a particular application might find to be useful. As previously discussed in relation to <figref idref="DRAWINGS">FIG. 3</figref>, the example of <figref idref="DRAWINGS">FIG. 4</figref> is a very simple example and many components of the computer system <b>11</b><i>b </i>that are not necessary for the explanation of the present invention are omitted for the sake of clarity.

<figref idref="DRAWINGS">FIG. 4</figref> is a basic flow diagram depicting the high level operations of a temperature control method <b>60</b>. According to the temperature control method <b>60</b> the temperature of all or portions of the LCM <b>12</b> are detected and digitized by one or more of the temperature sensors <b>22</b> in a “sense temperature” operation <b>62</b>. In a “communicate temperature” operation <b>64</b>, the sensed temperature is communicated to the CPU <b>24</b> of the associated computer <b>14</b>. As discussed previously herein, in the examples provided, such communication is accomplished via the I²C bus <b>26</b>, which is provided also for other purposes in the computer systems <b>11</b>, <b>11</b><i>a </i>and <b>11</b><i>b. </i>

In an “in range” decision operation <b>66</b>, it is decided (by the CPU <b>24</b> according to programmed parameters) if the reported temperature(s) are within a predetermined range. If the result of the “in range” decision operation <b>66</b> is that the temperature is out of range, then remedial action is taken in a “remedial action” operation <b>68</b>. If the reported temperature is outside the predetermined range on the high side, then the remedial action will consist of one or more actions intended to reduce the temperature, such as increasing fan speed, and/or actions to reduce power consumption and, therefore, heat dissipated by components in the computer <b>14</b>, such as reducing operating speed and/or power applied to the computer <b>14</b>, a GPU, hard drive(s), CD ROM drives, the LCM <b>12</b> itself, and the like. One skilled in the art will recognize that this is not an exhaustive list of possible operations that might be performed to reduce and/or regulate the heat production and/or dissipation of the computer systems <b>11</b>, <b>11</b><i>a </i>and <b>11</b><i>b. </i>

A significant aspect to the temperature control method <b>60</b> is the ability to accurately measure the temperature of the critical components. This accuracy is accomplished by incorporating the temperature sensor(s) <b>22</b> within, or next to, the critical components or positions of the LCM <b>12</b>. According to the present inventive temperature control method <b>60</b>, when the temperature sensing apparatus <b>10</b> described herein, or equivalent, is used, then the connectors between the LCM <b>12</b> and the computer <b>14</b> need not be changed, and the pin counts, and the like, will be unaltered. Therefore, the present inventive apparatus and method can be implemented at minimal cost.

Various modifications may be made to the invention without altering its value or scope. For example, the sizes, shapes and quantities of components shown and described in relation to the examples discussed herein could each or all be varied according the needs or convenience of a particular application.

Another possible variation of the present invention would be to used different sensors or types of sensors than those specifically disclosed herein. It should also be noted that the example of the I²C <b>26</b> bus used herein is not the only communications means that might be employed. The invention could be practiced using other communications means, including but not limited to another bus that might already be existing in the computer systems <b>11</b>, <b>11</b><i>a </i>and <b>11</b><i>b</i>. As has been discussed previously, the examples presented herein are not intended to be an exhaustive list of all remedial operations that might be used to modify the temperature of the computer systems <b>11</b>, <b>11</b><i>a </i>and <b>1</b><i>b</i>, or equivalents thereof, and a display apparatus, including but not limited to the LCM <b>12</b> associated therewith.

All of the above are only some of the examples of available embodiments of the present invention. Those skilled in the art will readily observe that numerous other modifications and alterations may be made without departing from the spirit and scope of the invention. Accordingly, the disclosure herein is not intended as limiting and the appended claims are to be interpreted as encompassing the entire scope of the invention.

The inventive temperature sensing apparatus <b>10</b> and temperature control method <b>60</b> are intended to be widely used in essentially any type of computer wherein it is desirable to monitor and/or control the temperature of or near display components thereof. The particular examples presented herein represent applications that are presently contemplated by the inventors, but these examples are not intended to be an exhaustive list of all possible applications. Since, the temperature sensing apparatus <b>10</b> does not require additional components or conductors to communicate temperatures from the temperature sensor <b>22</b> to the computer <b>14</b>, it is expected that the present inventive apparatus and method will be widely adapted for use in the industry.