US8513693B2

Miniature leadless surface mount lamp with dome and reflector cup

Summary by NHIP

Leadless lamp with dome and reflector

The optical device mounts a light source to an attach pad within a non-conductive mold containing a reflector cup. Two bonding wires extend over the cup edge to connect the source to separate leads, with one wire optionally passing through a recess in the cup top surface.

Claim Score by NHIP

Read claim 18, the broadest

Abstract

A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides many features offered by traditional surface mount technology lamps, but also has a decreased height, increased light output, and enables a smaller viewing angle as compared to traditional surface mount technology lamps.

US8513693B2, drawing sheet 1 — Sheet 1 of 11

Term

Projected expiry 9 September 2031.

20 claims: 3 independent, 17 dependent

1
An optical device, comprising:a lead frame comprising an attach pad, a first conductive lead, and a second conductive lead;a non-conductive mold that physically separates the attach pad from both the first conductive lead and the second conductive lead, wherein the non-conductive mold also comprises a reflector cup that encloses the attach pad and is positioned between the attach pad and both the first conductive lead and the second conductive lead such that the first and second conductive leads are not within the reflector cup;a light source mounted to the attach pad;a first bonding wire connecting the light source to the first conductive lead;and a second bonding wire connecting the light source to the second conductive lead.
11
A package for a light source, comprising:a non-conductive mold substantially surrounding an attach pad that is configured to receive a light source and further including a reflector cup that also surrounds the attach pad and extends above a top surface of the attach pad;a first conductive lead positioned completely outside of the reflector cup on a first outer side surface of the non-conductive mold;and a second conductive lead positioned completely outside of the reflector cup on a second outer side surface of the non-conductive mold.
18
Broadest claimClaim Score 72, broad(NHIP)A method, comprising:receiving a lead frame that comprises a plurality of attach pads and a plurality of lead fingers, the plurality of attach pads and lead fingers being connected by a series of tie bars;forming a non-conductive mold around at least a portion of the lead frame such that reflector cups are established around at least some of the attach pads and both of the first and second conductive leads are positioned completely outside of the reflector cup;and performing a singulation processes where at least some of the tie bars are removed thereby electrically isolating the attach pads from the lead fingers.

Independent claims3

62 paragraphs in 4 sections, as filed

FIELD OF THE DISCLOSURE

The present disclosure is generally directed toward light emitting devices and packages for the same.

BACKGROUND

Light Emitting Diodes (LEDs) have many advantages over conventional light sources, such as incandescent, halogen and fluorescent lamps. These advantages include longer operating life, lower power consumption, and smaller size. Consequently, conventional light sources are increasingly being replaced with LEDs in traditional lighting applications. As an example, LEDs are currently being used in flashlights, camera flashes, traffic signal lights, automotive taillights and display devices.

Among the various packages for LEDs, an LED package of interest is the Plastic Leaded Chip Carrier (PLCC) package for a surface mount LED. Surface mount LEDs in PLCC packages may be used, for example, in automotive interior display devices, electronic signs and signals, and electrical equipment.

Most existing PLCC package designs do not include a reflector cup, which means that light emitted by a light source contained within a traditional PLCC package is diffused. This has restrained PLCC packages from being used for white lamps.

Another type of LED package is known as a Surface Mount Technology (SMT) lamp. As compared to a PLCC package, the SMT lamp is larger in overall size and it particularly taller in height. This increased size consumes significantly more board space than the PLCC package counterpart thereby (1) reducing the number of pixels in a board of a specified size and (2) increasing the overall thickness of the board. The SMT lamp, however, is capable of limiting the amount of light that is diffused—especially when compared to a PLCC package. This means that SMT lamps are most often employed in white lamps.

It would be advantageous to design a package for a light source that incorporates the benefits of the PLCC package and the SMT lamp in a single package.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is described in conjunction with the appended figures:

<figref idref="DRAWINGS">FIG. 1</figref> is a cross-sectional view of a light source package and light source in accordance with embodiments of the present disclosure;

<figref idref="DRAWINGS">FIG. 2A</figref> is a top view of a bare lead frame in accordance with embodiments of the present disclosure;

<figref idref="DRAWINGS">FIG. 2B</figref> is an exploded view of a portion of the lead frame depicted in <figref idref="DRAWINGS">FIG. 2A</figref>;

<figref idref="DRAWINGS">FIG. 3</figref> is a cross-sectional view along line 3-3 depicted in <figref idref="DRAWINGS">FIG. 2B</figref> of a first intermediate product in accordance with embodiments of the present disclosure;

<figref idref="DRAWINGS">FIG. 4A</figref> is a top view of a second intermediate product in accordance with embodiments of the present disclosure;

<figref idref="DRAWINGS">FIG. 4B</figref> is a cross-sectional view along line 4-4 depicted in <figref idref="DRAWINGS">FIG. 4A</figref>;

<figref idref="DRAWINGS">FIG. 5</figref> is a cross-sectional view of a third intermediate product in accordance with embodiments of the present disclosure;

<figref idref="DRAWINGS">FIG. 6A</figref> is a top view of a fourth intermediate product in accordance with embodiments of the present disclosure;

<figref idref="DRAWINGS">FIG. 6B</figref> is a cross-sectional view along line 6-6 depicted in <figref idref="DRAWINGS">FIG. 6A</figref>;

<figref idref="DRAWINGS">FIG. 7A</figref> is a cross-sectional view of lead frame having encapsulation cast molded thereto in accordance with embodiments of the present disclosure;

<figref idref="DRAWINGS">FIG. 7B</figref> is a top view of a fifth intermediate product in accordance with embodiments of the present disclosure;

<figref idref="DRAWINGS">FIG. 7C</figref> is a cross-sectional view along line 7-7 depicted in <figref idref="DRAWINGS">FIG. 7B</figref>;

<figref idref="DRAWINGS">FIG. 8</figref> is a schematic diagram of a transfer molding system in accordance with embodiments of the present disclosure;

<figref idref="DRAWINGS">FIG. 9A</figref> is a top view of a sixth intermediate product in accordance with embodiments of the present disclosure;

<figref idref="DRAWINGS">FIG. 9B</figref> is a cross-sectional view along line 9-9 depicted in <figref idref="DRAWINGS">FIG. 9A</figref>; and

<figref idref="DRAWINGS">FIG. 10</figref> is a flow diagram depicting a package manufacturing process in accordance with embodiments of the present disclosure.

DETAILED DESCRIPTION

The ensuing description provides embodiments only, and is not intended to limit the scope, applicability, or configuration of the claims. Rather, the ensuing description will provide those skilled in the art with an enabling description for implementing the described embodiments. It being understood that various changes may be made in the function and arrangement of elements without departing from the spirit and scope of the appended claims.

Referring now to <figref idref="DRAWINGS">FIG. 1</figref>, an example of a light source package 100 will be described in accordance with embodiments of the present disclosure. The package 100 depicted and described herein comprises the advantageous small form-factor available in traditional PLCC packages while simultaneously comprising the optical elements which minimize light diffusion, thereby enabling the package to be used for white lamp applications. In some embodiments, the package 100 comprises a lead frame 104 having a plurality of leads separated by a non-conductive mold 108. In some embodiments, the mold 108 may be constructed of any polymer or combination of polymers using extrusion, machining, micro-machining, molding, injection molding, or a combination of such manufacturing techniques. As a non-limiting example, the non-conductive mold 108 may comprise polyphthalamide (PPA). Accordingly, the terms non-conductive mold, PPA, PPA mold, and pre-mold may be used synonymously herein to refer to the element 108 that separates the conductive components of the lead frame 104.

The lead frame 104 may comprise a number of leads that are configured to carry electrical current to and from a light source 116. In some embodiments, the light source 116 is physically connected to a mounting surface of the lead frame 104 and electrically connected to other conductive leads of the lead frame 104. Stated another way, the light source 116 may not be electrically connected to the surface on which it is mounted. In such an embodiment, two or more wires 120 may be connected to the light source 116 and each of the two or more wires 120 may be connected to other leads of the lead frame 104. It may also be possible, however, to electrically connect the light source 116 to a lead on which it is mounted via a conductive adhesive or the like in which case only one wire 120 may be required to connect the light source 116 to another one of the conductive leads.

In the embodiment depicted in <figref idref="DRAWINGS">FIG. 1</figref>, the surface onto which the light source 116 is mounted is not used to carry electrical current to or from the light source 116. Rather, the surface of the lead frame 104 only provides a mounting surface for the light source 116. In this particular non-limiting embodiment, a first end of a first wire 120 is attached (e.g., via soldering, welding, gluing, etc.) at a first point on the top surface of the light source 116. A second end of the first wire 120 is then attached to another lead (e.g., via soldering, welding, gluing, etc.). The creation of an electrical potential between the light source 116 and the other lead (e.g., a first conductive lead) to which the first wire 120 is attached causes electrical current to flow to or from the light source 116 via the first wire 120.

Continuing the above example, a first end of a second wire 120 is also attached to the top surface of the light source 116, but at a second point (different from the first point) on the top surface of the light source 116. A second end of the second wire 120 is then attached to yet another lead (e.g., a second conductive lead). The creation of an electrical potential between the light source 116 and the second conductive lead causes electrical current to flow to or from the light source 116 via the second wire 120. Accordingly, an electrical circuit is created between the two conductive leads and the light source 116 when an electrical potential is created between the two conductive leads.

The light source 116, in some embodiments, comprises an LED or array of LEDs. Where an LED or similar light source is used, one of the bonding wires 120 is connected to an anode of the light source 116 whereas another of the bonding wires 120 is connected to a cathode of the light source 116. In some embodiments, the anode and cathode are both on the top light-emitting surface of the light source 116. In some embodiments, the anode and cathode are on opposite surfaces of the light source 116. Such a light source 116 may be constructed using known flip-chip manufacturing processes or any other known method for establishing both an anode and cathode on a common side of a light source 116. In either configuration, by connecting the anode and cathode of the light source 116 to two different conductive leads, an electrical potential can be applied to the anode and cathode of the light source 116 thereby energizing the light source 116 and causing it to emit light. In some embodiments, the light source 116 is configured to emit light from its top surface (e.g., away from the lead frame 104) when energized. Other suitable light sources include, without limitation, a laser diode, an array of laser diodes, or a combination of laser diodes and LEDs.

In some embodiments, the non-conductive mold 108, which electrically separates the various leads of the lead frame 104, may comprise a reflector cup 112. The reflector cup 112 may be formed in a top portion of the non-conductive mold 108. In some embodiments, the reflector cup 112 encloses the surface of the lead frame 104 onto which the light source 116 is mounted, but does not enclose the conductive leads of the lead frame 104. Accordingly, when the light source 116 is mounted within the reflector cup 112, it may be necessary to have each of the bonding wires 120 extend over the top of the reflector cup 112. It should be appreciated that the reflector cup 112 may be formed in any uniform or non-uniform shape (e.g., circular, elliptical, trapezoidal, square, rectangular, triangular, etc.) depending upon the desired light distribution. In some embodiments, the area of the reflector cup 112 is larger its top surface as compared to its bottom surface. This means that the reflector cup 112 gets larger as it extends away from the light source 116. In some embodiments, the top surface of the reflector cup 112 extends above the top surface of the light source 116.

In some embodiments, the inner surface of the reflector cup 112 is coated with a reflective material. Specifically, since the reflector cup 112 is composed of same material as the non-conductive mold 108, it may be necessary to increase the reflectivity of the reflector cup 112 to improve the optical performance of the package 100. In some embodiments, the inner surface of the reflector cup 112 is coated with a reflective material such as tin, aluminum, etc. to increase the reflectivity of the reflector cup 112. The reflective material may be deposited in the reflector cup via any known deposition process such as electroplating, ALD, CVD, magnetron sputtering, and the like.

In some embodiments, the lead frame 104 may comprise a number of notches 132 on the conductive leads and/or mounting surface. The notches 132 may comprise etchings on the top surface of the lead frame 104 which prevent the non-conductive mold 108 from flowing into active areas of the lead frame 104.

The package 100 may also comprise an encapsulant 124 that is configured to encapsulate the light source 116 and bonding wires 120 onto the lead frame 104. Any number of materials may be suitable for use as the encapsulant 124. Examples of such materials include, without limitation, epoxy, silicone, a hybrid of silicone and epoxy, phosphor, a hybrid of phosphor and silicone, an amorphous polyamide resin or fluorocarbon, glass, plastic, or combinations thereof. Furthermore, the encapsulant 124 may be formed to have one or more light-shaping elements 128 incorporated therein. Specifically, the encapsulant 124 can be formed to have one or more curved surfaces which shape the light emitted by the light source 116 in a desired pattern. As a non-limiting example, the light-shaping element 128 may comprise a dome, a curved surface, a series of curved surfaces, or any other type of surface for directing light in a predetermined pattern. Accordingly, the encapsulant 124 can serve multiple purposes of (1) protecting the light source 116 and/or bonding wires 120 from physical damage, (2) hermetically sealing the light source 116 and/or bonding wires 120, and/or (3) shaping light emitted by the light source 116.

With reference now to <figref idref="DRAWINGS">FIGS. 2A through 10</figref>, a method of manufacturing a package 100 and the intermediate products obtained thereby will be described in accordance with embodiments of the present disclosure. The manufacturing process begins when a bare lead frame 200 is received (step 1004). <figref idref="DRAWINGS">FIGS. 2A and 2B</figref> depict a suitable example of a bare lead frame 200 that can be utilized. In some embodiments, the bare lead frame 200 is constructed of a conductive material such as a metal, metal alloy, or composite. The bare lead frame 200 may comprise a plurality of sections 204a, 204b, 204c, each of which comprise a plurality of units 208. The individual units 208 will eventually be separated from one another to create a plurality of packages 100 from the bare lead frame 200. Although the bare lead frame 200 is depicted as comprising three sections 204a, 204b, 204c, it should be appreciated that a bare lead frame 200 may comprise a greater or lesser number of sections without departing from the scope of the present disclosure.

<figref idref="DRAWINGS">FIG. 2B</figref> depicts additional details of an individual unit 208. In particular, each unit 208 may comprise an attach pad 212, a plurality of lead fingers 216, and a plurality of tie bars 220 connecting the attach pad 212 to the plurality of lead fingers 216. In some embodiments, the attach pad 212 corresponds to an area of the unit 208 onto which a light source 116 may eventually be mounted. Each of the lead fingers 216 may correspond to areas which will eventually become conductive leads for the package 100.

As can be seen in <figref idref="DRAWINGS">FIG. 2B</figref>, a single attach pad 212 may be surrounded by the plurality of lead fingers 216 and each of the plurality of lead fingers 216 may not only be positioned between different attach pads 212, but they may also extend from both sides of a tie bar 220. Accordingly, a single lead finger 216 may be separated into two different conductive leads of two different packages 100 once the units 208 have been singulated by cutting the tie bars 220. By allowing a single lead finger 216 to eventually be separated into two different conductive leads, the utilization of space on the bare lead frame 200 is maximized and material costs are minimized. Therefore, a useful configuration of a single unit 208 will comprise a single attach pad 212 surrounded substantially uniformly by four lead fingers 216. As a non-limiting example, each of the four lead fingers 216 may be separated from the attach pad 212 by substantially the same distance (e.g., within a machining tolerance) and may be distributed at 90 degree increments around the attach pad 212. It should be appreciated, however, that an attach pad 212 can be surrounded by a greater or lesser number of lead fingers 216 (uniformly or non-uniformly) without departing from the scope of the present disclosure.

Although the attach pad 212 is depicted as having generally square dimensions and the lead fingers 216 are depicted as having generally elliptical dimensions, it should be appreciated that the attach pads 212 and lead fingers 216 may be formed in any number of shapes without departing from the scope of the present disclosure. For instance, the attach pads 212 and lead fingers 216 may be generally circular in shape.

In some embodiments, one or more of the attach pads 212 may comprise a notch 224 on a single side thereof. The notch 224 can be used as an orientation indicator during the manufacturing process of the package 100. In particular, the notch 224 can be referenced during various manufacturing stages to ensure that the appropriate manufacturing steps are being performed on the appropriate portions of the bare lead frame 200.

The manufacture of the package 100 continues when a tape 304 is applied to a selected surface of the bare lead frame 200 (step 1008). In some embodiments, the tape 304 may correspond to a thermally-stable adhesive tape that is adhered to a bottom surface of the bare lead frame 200.

The cross-sectional view depicted in <figref idref="DRAWINGS">FIG. 3</figref> also shows additional features of the bare lead frame 200. Specifically, the cross-sectional characteristics of the attach pads 212 and lead fingers 216 are shown in more detail. In some embodiments, the bare lead frame 200 may comprise a half-etched frame to facilitate stable anchoring of the non-conductive mold 108 to the lead frame 104. More particularly, a top section 308 of the bare lead frame 200 may not be etched whereas a bottom section 312 of the bare lead frame 200 is etched. This causes a gap 316 between the attach pad 212 and lead finger 216 to have a t-shaped cross-section. Even more specifically, the width of the gap 316 in the bottom section 312 of the bare lead frame 200 may be larger than the width of the gap 316 in the top section 308 of the bare lead frame 200. This t-shaped cross-section facilitates the stable anchoring of the non-conductive mold 108 to the lead frame 104 in the finished package 100. In some embodiments, the top section 308 and bottom section 312 are of substantially the same thickness (e.g., within a machining tolerance) such that the top section 308 represent the top half of the bare lead frame 200 and the bottom section 312 represents the bottom half of the bare lead frame 200. Such a configuration is not required, however. In some embodiments, the top section 308 may be thicker than the bottom section 312 or the bottom section 312 may be thicker than the top section 308. Even more particularly, and as a non-limiting example, the total thickness of the bare lead frame 200 may be between about 0.1 mm and 0.3 mm and in some embodiments may be about 0.2 mm.

Referring back to <figref idref="DRAWINGS">FIG. 10</figref>, after the tape 304 has been attached to the bare lead frame 200, the process continues by molding the non-conductive mold 404 around the bare lead frame 200 (step 1012). An intermediate product obtained by this process step is depicted in <figref idref="DRAWINGS">FIGS. 4A and 4B</figref>.

The non-conductive mold 404 may be the same or identical to the non-conductive mold 108 except that it is not singulated. The same statement is true with respect to the bare lead frame 200 and lead frame 104.

In some embodiments, this step is completed by placing the bare lead frame 200 having the tape 304 attached thereto into a transfer mold system. Specifically, the bare lead frame 200 and tape 304 may be placed between a bottom die set 412 and a top die set 416 of a transfer mold system. The bottom die set 412 may comprise a generally flat surface that interfaces with the tape 304. The top die set 416, however, may comprise a number of features or indentations on the surface that interfaces with the top surface of the bare lead frame 200. The features or indentations in the top die set 416 may be positioned relative to the bare lead frame 200 to establish the reflector cups 112 of the non-conductive mold 404 around each attach pad 212. Specifically, the features or indentations in the top die set 416 may be positioned proximate to notches 132 that are established on the top surfaces 420 of the lead fingers 216 and the top surfaces 424 of the attach pads 212. The features or indentations in the top die set 416 along with the notches 132 substantially inhibit the non-conductive mold 404 from covering the entire top surface of either the attach pad 212 or lead finger 216.

In accordance with at least some embodiments of the present disclosure, the entirety of the top surface 420 of each lead finger 216 is left exposed (e.g., not covered with the non-conductive mold 404). On the other hand, a portion of the top surface 424 of the attach pad 212 is covered with the non-conductive mold 404. Particularly, the portion of the top surface 424 of the attach pad 212 is covered with the non-conductive mold 404 to establish the reflector cups 112 around each attach pad 212. In some embodiments, the remaining area of the attach pad 212 that is left exposed is completely enclosed by the reflector cup 112. The still-exposed area of the attach pad 212 may be substantially circular or may have any other suitable shape.

In some embodiments, the height of the reflector cup 112 may be substantially similar to the thickness of the bare lead frame 200. Accordingly, as a non-limiting example, the reflector cup 112 may be between about 0.1 mm and 0.3 mm in height and in some embodiments may be about 0.2 mm in height.

After the non-conductive mold 404 is established about the bare lead frame 200, the manufacturing process continues by attaching a light source 116 to the top surface 424 of each attach pad 212 and also by connecting bonding wires 120 between the light source 116 and the top surface 420 of the lead fingers 216 (step 1016). In this step, a light source 116 may be glued, soldered, welded, or otherwise physically connected to the top surface 424 of an attach pad 212 that is still exposed and within the reflector cup 112.

Then, depending upon the nature of the light source 116 (e.g., depending upon whether both the anode and cathode are on the top surface of the light source 116 or whether both of the anode and cathode are on the bottom surface of the light source 116, which is connected to the attach pad 212), one or more bonding wires 120 are connected between the light source 116 and a lead finger 216 that is outside the reflector cup 112. Accordingly, it may be required to loop one or more of the bonding wires 120 over the reflector cup before or after it has been attached to the light source 116 and/or lead finger 216. In some embodiments, the bonding wires 120 may comprise a cross-sectional profile that is one of square, rectangular, and circular.

<figref idref="DRAWINGS">FIG. 5</figref> depicts one embodiment of an intermediate product obtained by step 1016 where the bonding wire 120 is looped over a fully-formed reflector cup 112. In this embodiment, the bonding wire 120 may comprise a loop height of between about 10 mils and 15 mils and in some embodiments the bonding wire 120 comprises a loop height of about 12 mils (e.g., about 0.3048 mm).

<figref idref="DRAWINGS">FIGS. 6A and 6B</figref> depict another embodiment of an intermediate product obtained by step 1016 where the reflector cup 112 formed in the non-conductive mold 404 comprises one or more recesses 604 in its top surface. In some embodiments, a recess 604 is established directly between the attach pad 112 and one of the lead finger 216. In some embodiments, a first recess 604 is established between the attach pad 112 and one of the adjacent lead fingers 216 while a second recess 604 is established between the attach pad 112 and another of the adjacent lead fingers 216. In some embodiments, a separate recess is established between the attach pad 112 and each of the adjacent lead fingers 216.

In any of the above embodiments, the depth of the recess 604 may be in substantially the same plane as the top surface of the light source 116. Alternatively, one or more of the recesses 604 can still be higher than the top surface of the light source 116. Still further in the alternative, one or more of the recesses 604 can be below the top surface of the light source 116.

As compared to the embodiment of <figref idref="DRAWINGS">FIG. 5</figref>, the one or more recesses 604 make it possible to lower the loop height of the bonding wires 120 that traverse the reflector cup 112. Thus, the bonding wire 120 can travel a more direct path from the light source 116 to the lead finger 216. In some embodiments, it may be possible to reduce the wire loop height to about 6 mils or less. It may not be preferable, however, to utilize the one or more recesses 604 where precise light radiation patterns are required of the package 100.

Once the light sources 116 have been attached to the bare lead frame 200 and the bonding wires 120 have been appropriately connected, the manufacturing process may continue with an encapsulation step. However, there are a number of possible ways to encapsulate the intermediate product of <figref idref="DRAWINGS">FIG. 5</figref> or <figref idref="DRAWINGS">FIGS. 6A and 6B</figref>. Specifically, either a casting process or a transfer mold process can be performed to achieve the encapsulation step. Accordingly, the method proceeds by first determining whether the encapsulation step will be done via casting or via a transfer mold process (step 1020).

<figref idref="DRAWINGS">FIGS. 7A-C</figref> depict aspects of the encapsulation step via the casting process. Specifically, if a casting process is to be employed, then the intermediate product obtained after step 1016 is pre-dipped in the reflector cup 112 with a first encapsulant and the encapsulant is partially cured (step 1024). In particular, the first encapsulant can be pre-dipped onto the reflector cup 112 with any dispensing method using time pressure, auger, piston pumps or jet technology, etc. The dispensing of the first encapsulant is to fill up the cavity of the reflector cup 112 allowing the air to escape within the cavity of the reflector cup 112 before the intermediate product 712 is fully encapsulated with second encapsulant 708 in the subsequent process (step 1032). This pre-dipping and partial cure also causes the light source 116 and bonding wires 120 to be more securely fixed to the bare lead frame 200. Thereafter, the tape 304 is removed from the bottom surface of the bare lead frame 200 (step 1028) and a casting process is performed (step 1032). Detape (step 1028) is to remove the tape on the encapsulant 404 where the tape is covering the exit of the air vent 716. The air within the cavity of the frame mold cup 704 may escape via the open-end air vents 716 when the second encapsulant 708 occupying the space of the cavity in the frame mold cup 704.

<figref idref="DRAWINGS">FIG. 7A</figref> depicts the intermediate product 712 during the casting process where the intermediate product 712 is placed within a frame mold cup 704 and the encapsulant 708 is supplied to the cavity of the frame mold cup 704. Similar to the bare lead frame 200 and non-conductive mold 404, the encapsulant 708 may be similar or identical to encapsulant 124 except that it is not yet singulated.

As can be seen in <figref idref="DRAWINGS">FIG. 7A</figref>, since the bare lead frame 200 comprises a plurality of units 208, the frame mold cup 704 may comprise a corresponding number of features that form the light-shaping element 128 for each package 100.

Referring to <figref idref="DRAWINGS">FIGS. 7A and 7B</figref>, it should also be noted that for the casting process, one or more air vents 716 may be established in the non-conductive mold 404 in each unit 208. Specifically, the air vents 716 may be provided to allow the release of air that is trapped during the casting process. The air vents 716 may be positioned anywhere within the non-conductive mold 404 between the attach pad 212 and the tie bars 220. It may be preferable not to position the air vents 716 directly between the attach pad 212 and lead finger 216, especially since the reflector cup 112 is positioned between the attach pad 212 and lead finger 216. It should be appreciated that each unit 208 may have one, two, three, four, or more air vents 716. It should also be appreciated that each unit 208 may not necessarily require its own air vent 716 as long as a suitable number of air vents 716 are distributed about the entirety of the non-conductive mold 404.

Once the casting process is completed, the separate packages 100 are created by separating the units 208 in a singulation process (step 1036). <figref idref="DRAWINGS">FIGS. 9A and 9B</figref> depict additional details of the singulation process. In particular, the singulation process is the process whereby each of the units 208 are separated from one another and a plurality of discrete packages 100 are obtained thereby. More specifically, during the singulation process, a saw blade 904 or similar cutting apparatus is used to cut through the tie bars 220 connecting each of the lead fingers 216. As can be seen in <figref idref="DRAWINGS">FIG. 9A</figref>, the saw blade 904 may comprise a thickness that is substantially identical to a thickness of the tie bars 220 at their thickest part. Furthermore, the saw blade 904 may cut into the intermediate product such that each of the lead fingers 216 are cut in half and the attach pad 212 is electrically isolated from all of the lead fingers 216. Thus, a separation gap 908 may be created between each of the units 208 and the final package 100 can be achieved.

Referring back to step 1020, if the encapsulation will be performed via a transfer mold process, then the method continues by first performing the transfer mold process to secure the encapsulant 708 to the intermediate product 712 (step 1040). As can be seen in <figref idref="DRAWINGS">FIG. 8</figref>, the transfer molding process may utilize a transfer mold system 804 that includes a mold having a plurality of air vents 808 therein and a mold feeder or runner 812. The material of the encapsulant 708 may be fed into the transfer mold via the mold runner 812 and the air from within the cavity of the transfer mold may escape via the air vents 808 due to the encapsulant 708 occupying the space of the cavity in the transfer mold. After the encapsulant 708 has been completely injected via the transfer mold process, the method continues with the removal of the tape 304 (step 1044) and then singulation of the individual units 208 (step 1048). The singulation step 1048 may be similar or identical to the singulation step 1036.

After the individual packages 100 have been obtained, the method may continue by preparing the packages 100 for sale (either individually or in bulk).

Advantages obtained by employing the embodiments discussed herein are many. In particular, a package 100 can be manufactured that achieves an increased light output, enables a smaller viewing angle, and enables white lamps that are compatible with the PLCC standard. Furthermore, multiple dice can be packaged simultaneously either within a single package 100 or across a plurality of packages 100. Further still, a package 100 with the above qualities can be achieved while also having a smaller form-factor than previous SMT lamps. The package 100 also provides a direct thermal path to the circuit board onto which the package 100 is mounted (e.g., thermal path via the attach pad 212 of the lead frame 104). Also, the manufacturing process described herein leverages chip LED processing techniques, thereby minimizing the capital investment required to produce the package 100 described herein.

Specific details were given in the description to provide a thorough understanding of the embodiments. However, it will be understood by one of ordinary skill in the art that the embodiments may be practiced without these specific details. For example, circuits may be shown in block diagrams without unnecessary detail in order not to obscure the embodiments. In other instances, well-known circuits, processes, algorithms, structures, and techniques may be shown without unnecessary detail in order to avoid obscuring the embodiments.

While illustrative embodiments of the disclosure have been described in detail herein, it is to be understood that the inventive concepts may be otherwise variously embodied and employed, and that the appended claims are intended to be construed to include such variations, except as limited by the prior art.

Contents4

Every citation, both waysCites: the store holds 8 of 9

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Avago Technologies, “ASMT-FJ30 Mini Surface Mount AF LED”, Data Sheet, AV02-0996EN, Jan. 28, 2008, 6 pages.	Non-patent	–	Applicant
Pohl, Andreas, "'SMT Lamps': Merging Through-Hole and Surface-Mount LED Technology", ECN, available at http://www.ecnmag.com/Articles/2011/04/App-Solutions/SMT-Lamps/, Apr. 6, 2011, 6 pages.	Non-patent	–	Applicant
Avago Technologies, "ASMT-FJ30 Mini Surface Mount AF LED", Data Sheet, AV02-0996EN, Jan. 28, 2008, 6 pages.	Non-patent	–	Applicant

2 members in 1 office

This recordMember, by publication datePriority claim

Priority claims2

Priority claims
Document	Office	Kind	Date
201113205396	United States of America	A	2011-08-08
US201113205396	–	–	–

Members2

Family members, oldest first
Document	Office	Kind
US2013037837A1	United States of America	A1	2013-02-14
US8513693B2This record	United States of America	B2	2013-08-20

41 transactions on the USPTO file

Allowed after 1 non-final rejection.

Non-final rejections: 1
Final rejections: 0
RCEs: 0
Appeals: 0

Over time

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Transactions

Prosecution transactions, newest first
	Event	Code
2021-09-27	Expire PatentEXP.	EXP.
2021-04-12	Maintenance Fee Reminder MailedREM.	REM.
2017-09-18	Entity Status Set To Undiscounted (Initial Default Setting or Status Change)BIG.	BIG.
2017-02-24	Applicant Has Filed a Verified Statement of Small Entity Status in Compliance with 37 CFR 1.27SMAL	SMAL
2013-08-20	Recordation of Patent Grant MailedPGM/	PGM/
2013-08-20	Patent Issue Date Used in PTA CalculationAllowedPTAC	PTAC
2013-08-01	Email NotificationEML_NTR	EML_NTR
2013-07-31	Issue Notification MailedAllowedWPIR	WPIR
2013-07-24	Dispatch to FDCD1935	D1935
2013-07-23	Application Is Considered Ready for IssuePILS	PILS
2013-07-19	Issue Fee Payment VerifiedN084	N084
2013-07-19	Issue Fee Payment ReceivedIFEE	IFEE
2013-04-25	Electronic ReviewELC_RVW	ELC_RVW
2013-04-24	Email NotificationEML_NTF	EML_NTF
2013-04-24	Mail Notice of AllowanceAllowedMN/=.	MN/=.
2013-04-19	Notice of Allowance Data Verification CompletedAllowedN/=.	N/=.
2013-02-15	Email NotificationEML_NTR	EML_NTR
2013-02-14	PG-Pub Issue NotificationPG-ISSUE	PG-ISSUE
2013-01-25	Date Forwarded to ExaminerFWDX	FWDX
2013-01-08	Response after Non-Final ActionA...	A...
2012-11-09	Electronic ReviewELC_RVW	ELC_RVW
2012-11-09	Email NotificationEML_NTF	EML_NTF
2012-11-09	Mail Non-Final RejectionNon-final rejectionMCTNF	MCTNF
2012-11-05	Non-Final RejectionNon-final rejectionCTNF	CTNF
2012-10-03	Email NotificationEML_NTR	EML_NTR
2012-10-03	Change in Power of Attorney (May Include Associate POA)PA..	PA..
2012-09-28	Correspondence Address ChangeC.AD	C.AD
2012-08-23	Case Docketed to Examiner in GAUDOCK	DOCK
2011-10-12	Case Docketed to Examiner in GAUDOCK	DOCK
2011-09-13	Application Dispatched from OIPEOIPE	OIPE
2011-08-24	Application Is Now CompleteCOMP	COMP
2011-08-24	Email NotificationEML_NTR	EML_NTR
2011-08-24	Filing ReceiptFLRCPT.O	FLRCPT.O
2011-08-23	Sent to Classification ContractorPGPC	PGPC
2011-08-10	Cleared by OIPE CSRL194	L194
2011-08-08	Information Disclosure Statement consideredIDSC	IDSC
2011-08-08	Reference capture on IDSRCAP	RCAP
2011-08-08	Information Disclosure Statement (IDS) FiledM844	M844
2011-08-08	Information Disclosure Statement (IDS) FiledWIDS	WIDS
2011-08-08	IFW Scan & PACR Auto Security ReviewSCAN	SCAN
2011-08-08	Initial Exam Team nnIEXX	IEXX

12 legal events, as the office reported them to INPADOC

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Events

Legal events, newest first
	Event	Code
2021-10-19	Lapsed due to failure to pay maintenance feeLapsedFP	FP
2021-09-27	Lapse for failure to pay maintenance feesLapsedPATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITYLAPS	LAPS
2021-09-27	Information on status: patent discontinuationPATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362STCH	STCH
2021-04-12	Fee payment procedureMAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITYFEPP	FEPP
2017-09-18	Fee payment procedureENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.)FEPP	FEPP
2017-02-20	Fee paymentFPAY	FPAY
2016-12-02	Fee payment procedurePAT HOLDER CLAIMS SMALL ENTITY STATUS, ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: LTOS); ENTITY STATUS OF PATENT OWNER: LARGE ENTITYFEPP	FEPP
2016-11-17	AssignmentAS	AS
2013-07-31	Information on status: patent grantGrantedPATENTED CASESTCF	STCF
2012-10-31	Fee payment procedurePAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITYFEPP	FEPP
2012-09-17	AssignmentAS	AS
2011-08-12	AssignmentAS	AS