Backlight unit for liquid crystal display device
Summary by NHIP
Backlight unit with conductive pads
The backlight unit connects a printed circuit board to a chassis via a power socket. The socket housing contains terminals made of conductive elastic material that engage pads exposed on the board end.
Claim Score by NHIP
Abstract
Provided is a backlight unit for a liquid crystal display device. The backlight unit includes: a chassis; a printed circuit board connected to a side of the chassis, the printed circuit board including a plurality of light emitting diodes, and a pair of conductive pads through which power is supplied to the light emitting diodes, wherein the pair of conductive pads are disposed on an end of the printed circuit board; and a power socket into which the pair of the conductive pads are inserted.

Term
4 yearsleft in the term
Expires 15 September 2030, including 468 days of term adjustment.
- Priority
- Filed
- Granted
- Today
- Expires
19 claims: 2 independent, 17 dependent
- 1Broadest claimClaim Score 70, broad(NHIP)A backlight unit for a liquid crystal display (LCD) device, the backlight unit comprising:a chassis;a printed circuit board connected to a side of the chassis, the printed circuit board comprising a plurality of light emitting diodes, and a pair of conductive pads through which power is supplied to the light emitting diodes, wherein the pair of conductive pads are disposed on an end of the printed circuit board;and a power socket which is fixed to at least one side of the chassis to which the printed circuit board is connected and into which the pair of the conductive pads are inserted.
- 13An edge light emitting type light emitting diode (LED) backlight unit for a liquid crystal display (LCD) device, the backlight unit comprising:a chassis;a printed circuit board connected to a side of the chassis, the printed circuit board comprising a plurality of light emitting diodes, and a pair of conductive pads formed on an end of the printed circuit board;a power socket which is fixed to at least one side of the chassis to which the printed circuit board is connected and into which the pair of the conductive pads are inserted.
Independent claims2
43 paragraphs in 5 sections, as filed
CROSS-REFERENCE TO RELATED PATENT APPLICATION
This application claims the priority from Korean Patent Application No. 10-2008-0057025, filed on Jun. 17, 2008, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a backlight unit for a liquid crystal display device, and more particularly, to a backlight unit for a liquid crystal display device using a light emitting diode (LED) as a light source.
2. Description of the Related Art
A liquid crystal display (LCD) device is a type of light receiving display device that form images by receiving external light instead of using self-emitting light, unlike a plasma display panel (PDP) and a field emission display (FED). Thus, an LCD has a backlight unit for emitting light to a liquid crystal layer at a rear surface thereof.
A related art backlight unit for an LCD device uses a cold cathode fluorescent lamp (CCFL) as a light source. However, when a CCFL is used as a light source, brightness may be decreased and it is difficult to secure uniform brightness as the screen size of the LCD device increases. Thus, in order to overcome these problems, a backlight unit using light emitting diodes (LEDs) as a light source has been developed recently.
<figref idrefs="DRAWINGS">FIG. 1</figref> is an exploded perspective view of a related art backlight unit for a LCD device, which uses LEDs as a light source. In particular, the backlight unit illustrated in <figref idrefs="DRAWINGS">FIG. 1</figref> is an edge light emitting type LED backlight unit.
Referring to <figref idrefs="DRAWINGS">FIG. 1</figref>, one end of a chassis <b>100</b> is bent at a right angle to form a bent portion <b>100</b><i>a</i>. A printed circuit board (PCB) <b>120</b>, on which a plurality of LEDs <b>121</b> are aligned, is connected to an inner surface of the bent portion <b>100</b><i>a</i>. A connector <b>140</b> for supplying power is formed at one end of the PCB <b>120</b>. The connector <b>140</b> is electrically connected to a housing <b>150</b> which includes power supply terminals. The housing <b>150</b> is connected to power supply lines <b>151</b><i>a </i>and <b>151</b><i>b </i>for supplying power, and the chassis <b>100</b> has a through hole <b>160</b> through which the power supply lines <b>151</b><i>a </i>and <b>151</b><i>b </i>pass. According to <figref idrefs="DRAWINGS">FIG. 1</figref>, the PCB <b>120</b> is connected to one side of the bent portion <b>100</b><i>a </i>using screws <b>130</b> that engage first screw holes <b>105</b> formed in the bent portion <b>100</b><i>a </i>and second screw holes <b>125</b> formed in the PCB <b>120</b>. A light guide plate which guides light emitted from the LEDs <b>121</b> to a liquid crystal layer (not shown) of the LCD device is aligned at an inner portion of the chassis <b>100</b>.
In order to manufacture a backlight unit having the structure described above, the housing <b>150</b> is connected to the connector <b>140</b> of the PCB <b>120</b>, and the PCB <b>120</b> is connected to one side of the bent portion <b>100</b><i>a</i>. However, the related art backlight unit needs to include elements such as the connector <b>140</b> and the housing <b>150</b>, and the time required to manufacture the unit may be increased since the PCB <b>120</b> and the chassis <b>100</b> are assembled after the housing <b>150</b> and the connector <b>140</b> are assembled.
SUMMARY OF THE INVENTION
The present invention provides a backlight unit for an LCD using an LED as a light source, whereby the backlight unit can be manufactured inexpensively using a relatively simple process.
According to an aspect of the present invention, there is provided a backlight unit for an LCD device, the backlight unit comprising: a chassis; a printed circuit board connected to at least one side of the chassis, comprising a plurality of light emitting diodes aligned in a predetermined shape, and comprising a pair of conductive pads for supplying power to the light emitting diodes, wherein the pair of conductive pads are disposed at least one end of the printed circuit board, respectively; and a power socket into which the pair of the conductive pads are inserted, respectively.
The power socket may be fixed to at least one side of the chassis. The power socket may comprise: a socket housing; and a pair of power supply terminals corresponding to the pair of the conductive pads and formed in the socket housing. The pair of the conductive pads may be inserted into the socket housing to be electrically connected to the pair of power supply terminals.
The pair of power supply terminals may comprise a conductive elastic material.
The socket housing may comprise a pair of grooves into which the pair of the conductive pads are inserted. The socket housing may comprise a single groove into which the pair of the conductive pads are inserted.
The chassis may have a through hole through which power supply lines for supplying power to the pair of power supply terminals of the power socket pass.
The pair of the conductive pads may be formed by exposing a conductive material which is formed on the printed circuit board.
At least one end of the chassis may be bent at a right angle to form a bent portion, and the printed circuit board is connected to an inner surface of the bent portion of the chassis. The printed circuit board may have a strip shape, and the light emitting diodes are aligned on the printed circuit board in a line.
According to another aspect of the present invention, there is provided an edge light emitting type LED backlight unit for an LCD device comprising a plurality of LEDs on at least one side of a chassis, the backlight unit comprising: a printed circuit board connected to at least one side of the chassis, comprising a plurality of light emitting diodes aligned in a predetermined shape, and comprising a pair of conductive pads at least one end of the printed circuit board; and a power socket, fixed to at least one side of the chassis, into which the pair of the conductive pads are inserted, respectively.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other aspects of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:
<figref idrefs="DRAWINGS">FIG. 1</figref> is an exploded perspective view of a related art backlight unit for an LCD;
<figref idrefs="DRAWINGS">FIG. 2</figref> is an exploded perspective view of a backlight unit for an LCD, according to an exemplary embodiment of the present invention;
<figref idrefs="DRAWINGS">FIG. 3</figref> is a perspective view of a power socket that may be used in the backlight unit illustrated in <figref idrefs="DRAWINGS">FIG. 2</figref>, according to an exemplary embodiment of the present invention;
<figref idrefs="DRAWINGS">FIGS. 4A and 4B</figref> are perspective views of conductive pads of PCBs which can be inserted into the power socket illustrated in <figref idrefs="DRAWINGS">FIG. 3</figref>, according to exemplary embodiments of the present invention.
<figref idrefs="DRAWINGS">FIG. 5</figref> is a perspective view of a power socket that may be used in the backlight unit illustrated in <figref idrefs="DRAWINGS">FIG. 2</figref>, according to another exemplary embodiment of the present invention; and
<figref idrefs="DRAWINGS">FIGS. 6A and 6B</figref> are perspective views of conductive pads of PCBs which can be inserted into the power socket illustrated in <figref idrefs="DRAWINGS">FIG. 5</figref>, according to exemplary embodiments of the present invention.
DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS OF THE INVENTION
Hereinafter, exemplary embodiments of the present invention will now be described more fully with reference to the accompanying drawings. In the drawings, like reference numerals in the drawings denote like elements, and the thickness and size of elements are exaggerated for clarity.
The present invention provides an edge light emitting type LED backlight unit using a plurality of LEDs as a light source in which the LEDs are aligned on one side or on both sides of a chassis.
<figref idrefs="DRAWINGS">FIG. 2</figref> is an exploded perspective view of a backlight unit for an LCD according to an exemplary embodiment of the present invention. Referring to <figref idrefs="DRAWINGS">FIG. 2</figref>, the backlight unit for an LCD includes a chassis <b>200</b> including a bent portion <b>200</b><i>a </i>bent at a right angle relative to the chassis <b>200</b>, a PCB <b>220</b> connected to a first side of the bent portion <b>200</b><i>a</i>, and a power socket <b>250</b> fixed to the first side of the bent portion <b>200</b><i>a</i>. Screws <b>230</b>, first screw holes <b>205</b> formed in the bent portion <b>200</b><i>a</i>, and second screw holes <b>225</b> formed in the PCB <b>220</b>, are used to connect the PCB <b>220</b> to the bent portion <b>200</b><i>a. </i>
A plurality of LEDs <b>221</b> are aligned on the PCB <b>220</b>. In this regard, the PCB <b>220</b> may have a strip shape, and the LEDs <b>221</b> may be aligned on the PCB <b>220</b> in a predetermined configuration, for example, in a line. However, the LEDs <b>221</b> may be aligned in various shapes without limitation. In addition, even though the LEDs <b>221</b> may be aligned with one another on the PCB <b>220</b> in a line as illustrated <figref idrefs="DRAWINGS">FIG. 2</figref>, the LEDs <b>221</b> may be aligned in two or more lines.
A pair of conductive pads <b>220</b><i>a </i>and <b>220</b><i>b </i>are formed at one end of the PCB <b>220</b> to supply power to the LEDs <b>221</b>. The conductive pads <b>220</b><i>a </i>and <b>220</b><i>b </i>correspond to a pair of power supply terminals <b>252</b><i>a </i>and <b>252</b><i>b </i>formed in a power socket <b>250</b> which will be described later. In addition, the power socket <b>250</b> is fixed to the first side of the bent portion <b>200</b><i>a </i>to which the PCB <b>220</b> is connected. The power socket <b>250</b> is electrically connected to the conductive pads <b>220</b><i>a </i>and <b>220</b><i>b </i>formed at one end of the PCB <b>220</b> to supply power to the LEDs <b>221</b>. The power socket <b>250</b> is connected to power supply lines <b>251</b><i>a </i>and <b>251</b><i>b </i>which supply power, and a through hole <b>260</b> may be formed in the bottom of the chassis <b>200</b> through which the power supply lines <b>251</b><i>a </i>and <b>251</b><i>b </i>pass.
<figref idrefs="DRAWINGS">FIG. 3</figref> is a perspective view of the power socket <b>250</b> that may be used in the backlight unit illustrated in <figref idrefs="DRAWINGS">FIG. 2</figref>, according to an exemplary embodiment of the present invention. <figref idrefs="DRAWINGS">FIGS. 4A and 4B</figref> are perspective views of exemplary embodiments of the conductive pads <b>220</b><i>a </i>and <b>220</b><i>b</i>, and conductive pads <b>220</b>′<i>a </i>and <b>220</b>′<i>b </i>of the PCB <b>220</b> and a PCB <b>220</b>′, respectively, which can be inserted into the power socket <b>250</b> illustrated in <figref idrefs="DRAWINGS">FIG. 3</figref>.
Referring to <figref idrefs="DRAWINGS">FIG. 3</figref>, the power socket <b>250</b> includes a socket housing <b>255</b> fixed to the first side of the bent portion <b>200</b><i>a</i>, a pair of grooves <b>256</b><i>a </i>and <b>256</b><i>b </i>formed in the socket housing <b>255</b>, and a pair of power supply terminals <b>252</b><i>a </i>and <b>252</b><i>b </i>formed in the grooves <b>256</b><i>a </i>and <b>256</b><i>b</i>, respectively. In this regard, the pair of the grooves <b>256</b><i>a </i>and <b>256</b><i>b </i>are separated from each other by the socket housing <b>255</b>. One end of the PCB <b>220</b> illustrated in <figref idrefs="DRAWINGS">FIG. 4A</figref> or the PCB <b>220</b>′ illustrated in <figref idrefs="DRAWINGS">FIG. 4B</figref> is inserted into the pair of the grooves <b>256</b><i>a </i>and <b>256</b><i>b. </i>
Referring to <figref idrefs="DRAWINGS">FIG. 4A</figref>, one end of the PCB <b>220</b> is branched off into two portions, and the pair of conductive pads <b>220</b><i>a </i>and <b>220</b><i>b </i>are formed on the branched portions. In this regard, the pair of the conductive pads <b>220</b><i>a </i>and <b>220</b><i>b </i>are formed so as to correspond to the pair of power supply terminals <b>252</b><i>a </i>and <b>252</b><i>b </i>formed in the power socket <b>250</b>. Accordingly, the pair of the conductive pads <b>220</b><i>a </i>and <b>220</b><i>b </i>are inserted into the grooves <b>256</b><i>a </i>and <b>256</b><i>b </i>of the power socket <b>250</b> to be electrically connected to the pair of the power supply terminals <b>252</b><i>a </i>and <b>252</b><i>b</i>. In this regard, the power supply terminals <b>252</b><i>a </i>and <b>252</b><i>b </i>in the power socket <b>250</b> may be formed of a conductive elastic material such as a metal spring for easy contact with the conductive pads <b>220</b><i>a </i>and <b>220</b><i>b</i>. In addition, the conductive pads <b>220</b><i>a </i>and <b>220</b><i>b </i>may be formed by exposing a conductive material which is formed on the PCB <b>220</b>. That is, if a conductive material which is covered with an insulating layer is formed on the PCB <b>220</b>, the conductive pads <b>220</b><i>a </i>and <b>220</b><i>b </i>may be formed by removing the insulating layer to expose the conductive material.
<figref idrefs="DRAWINGS">FIG. 4B</figref> is a modified example of the terminal of the PCB shown in <figref idrefs="DRAWINGS">FIG. 4A</figref>. Referring to <figref idrefs="DRAWINGS">FIG. 4B</figref>, the PCB <b>220</b>′ is similar to the PCB <b>220</b> of <figref idrefs="DRAWINGS">FIG. 4A</figref>, except that the width of the PCB <b>220</b>′ is greater than that of the PCB <b>220</b>. Thus, more LEDs <b>221</b> (<figref idrefs="DRAWINGS">FIG. 2</figref>) may be aligned on the PCB <b>220</b>′ having a greater width than that of the PCB <b>220</b>. In <figref idrefs="DRAWINGS">FIG. 4B</figref>, the PCB <b>220</b>′ includes a pair of conductive pads <b>220</b>′<i>a </i>and <b>220</b>′<i>b </i>corresponding to the pair of power supply terminals <b>252</b><i>a </i>and <b>252</b><i>b </i>formed in the power socket <b>250</b>.
As described above, the power socket <b>250</b>, into which the conductive pads <b>220</b><i>a </i>and <b>220</b><i>b </i>formed at one end of the PCB <b>220</b> or the conductive pads <b>220</b>′<i>a </i>and <b>220</b>′<i>b </i>formed at one end of the PCB <b>220</b>′ are inserted, is fixed to the first side of the bent portion <b>200</b><i>a </i>of the chassis <b>200</b> in the backlight unit for a LCD. Accordingly, there is no need for elements such as a connector formed on the PCB and a housing connected to the connector which are required for a conventional backlight unit as illustrated in <figref idrefs="DRAWINGS">FIG. 1</figref>. Thus, manufacturing costs may be reduced. In addition, in order to fabricate a backlight unit for LCD according to the present invention, one end of the PCB having a pair of conductive pads may be inserted into the power socket which is fixed to the chassis. Thus, manufacturing processes may be simplified.
<figref idrefs="DRAWINGS">FIG. 5</figref> is a perspective view of a power socket <b>350</b> that may be used in the backlight unit illustrated in <figref idrefs="DRAWINGS">FIG. 2</figref>, according to another exemplary embodiment of the present invention. <figref idrefs="DRAWINGS">FIGS. 6A and 6B</figref> are perspective views of conductive pads <b>320</b><i>a </i>and <b>320</b><i>b</i>, and conductive pads <b>320</b>′<i>a </i>and <b>320</b>′<i>b </i>of PCBs <b>320</b> and <b>320</b>′, respectively, which can be inserted into the power socket <b>350</b> illustrated in <figref idrefs="DRAWINGS">FIG. 5</figref>, according to embodiments of the present invention.
Referring to <figref idrefs="DRAWINGS">FIG. 5</figref>, the power socket <b>350</b> includes a socket housing <b>355</b> fixed to the first side of the bent portion <b>200</b><i>a</i>, a single groove <b>356</b> formed in the socket housing <b>355</b>, and a pair of power supply terminals <b>352</b><i>a </i>and <b>352</b><i>b </i>formed in the groove <b>356</b>. One end of either the PCB <b>320</b> or the PCB <b>320</b>′ illustrated in <figref idrefs="DRAWINGS">FIG. 6A</figref> or <b>6</b>B is inserted into the groove <b>356</b>.
Referring to <figref idrefs="DRAWINGS">FIG. 6A</figref>, the pair of conductive pads <b>320</b><i>a </i>and <b>320</b><i>b </i>are formed on one end of the PCB <b>320</b>. In this regard, the pair of the conductive pads <b>320</b><i>a </i>and <b>320</b><i>b </i>are formed so as to correspond to the pair of power supply terminals <b>352</b><i>a </i>and <b>352</b><i>b </i>formed in the power socket <b>350</b>. Accordingly, the pair of conductive pads <b>320</b><i>a </i>and <b>320</b><i>b </i>are inserted into the groove <b>356</b> of the power socket <b>350</b> to be electrically connected to the pair of the power supply terminals <b>352</b><i>a </i>and <b>352</b><i>b</i>. In this regard, the power supply terminals <b>352</b><i>a </i>and <b>352</b><i>b </i>of the power socket <b>350</b> may be formed of a conductive elastic material such as a metal spring for easy contact with the conductive pads <b>320</b><i>a </i>and <b>320</b><i>b</i>. In addition, the conductive pads <b>320</b><i>a </i>and <b>320</b><i>b </i>may be formed by exposing a conductive material which is formed on the PCB <b>320</b>.
<figref idrefs="DRAWINGS">FIG. 6B</figref> is a modified exemplary embodiment of the terminal of the PCB shown in <figref idrefs="DRAWINGS">FIG. 6A</figref>. Referring to <figref idrefs="DRAWINGS">FIG. 6B</figref>, the PCB <b>320</b>′ is similar to the PCB <b>320</b> of <figref idrefs="DRAWINGS">FIG. 6A</figref>, except that the width of the PCB <b>320</b>′ is greater than that of the PCB <b>320</b>. Thus, more LEDs <b>221</b> can be aligned on the PCB <b>320</b>′ having a greater width than that of the PCB <b>320</b>. In <figref idrefs="DRAWINGS">FIG. 6B</figref>, the PCB <b>320</b>′ includes a pair of conductive pads <b>320</b>′<i>a </i>and <b>320</b>′<i>b </i>corresponding to the pair of power supply terminals <b>352</b><i>a </i>and <b>352</b><i>b </i>formed in the power socket <b>350</b>.
The power sockets <b>250</b> and <b>350</b> and one end of the PCBs <b>220</b>, <b>220</b>′, <b>320</b> and <b>320</b>′ illustrated in <figref idrefs="DRAWINGS">FIGS. 3 to 6B</figref> are described for illustrative purposes only. The exemplary embodiments described above may be modified in various forms by those skilled in the art, and the scope of the present invention is not limited to these embodiments.
Furthermore, even though it has been described that the PCB including LEDs is formed on only one side of the chassis, the PCB can also be formed on the other side of the chassis. In addition, even though it has been described that a pair of conductive pads are formed on only one end of the PCB, the conductive pads can also be formed on the both ends of the PCB. In this regard, two power sockets which correspond to the two pairs of the conductive pads formed on both ends of the PCB can be fixed to one side of the chassis.
As described above, according to the present invention, a backlight unit for a LCD can be manufactured inexpensively and using a relatively simple process.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.
Contents5
7 sheets
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Every citation, both waysCites: the store holds 18 of 19
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| Communication dated Apr. 4, 2012 issued by the Mexican Patent Office in Corresponding Mexican Application No. MX/a/2010/013573. | Non-patent | – | Applicant |
| Communication dated Oct. 3, 2011 issued by the Mexican Patent Office in counterpart Mexican Patent Application No. MX/a/2010/013573. | Non-patent | – | Applicant |
| Chinese Office Action dated Feb. 28, 2012 issued in Chinese Application No. 200980121480.4. | Non-patent | – | Applicant |
| Office Action, dated Oct. 26, 2012, issued by the Mexican Patent Office in counterpart Mexican Application No. MX/a/2010/013573. | Non-patent | – | Applicant |
| Office Action, dated Nov. 19, 2012, issued by the State Intellectual Property Office of the P.R.C. in counterpart Chinese Application No. 200980121480.4. | Non-patent | – | Applicant |
9 members in 5 offices
Priority claims4
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|---|---|---|---|
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| 20080057025 | Republic of Korea | A | |
| 1020080057025 | – | – | – |
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Members9
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| WO2009154362A2 | World Intellectual Property Organization (WIPO) | A2 | |
| KR20090131175A | Republic of Korea | A | |
| WO2009154362A3 | World Intellectual Property Organization (WIPO) | A3 | |
| CN102057321A | China | A | |
| JP2011525685A | Japan | A | |
| US8360591B2This record | United States of America | B2 | |
| JP5411262B2 | Japan | B2 | |
| CN102057321B | China | B |
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| Reference capture on IDSRCAP | RCAP | |
| Information Disclosure Statement (IDS) FiledM844 | M844 | |
| Information Disclosure Statement (IDS) FiledWIDS | WIDS | |
| Electronic ReviewELC_RVW | ELC_RVW | |
| Email NotificationEML_NTF | EML_NTF | |
| Mail Non-Final RejectionNon-final rejectionMCTNF | MCTNF | |
| Non-Final RejectionNon-final rejectionCTNF | CTNF | |
| Date Forwarded to ExaminerFWDX | FWDX | |
| Response after Final ActionA.NE | A.NE | |
| Electronic ReviewELC_RVW | ELC_RVW | |
| Email NotificationEML_NTF | EML_NTF | |
| Mail Final Rejection (PTOL - 326)Final rejectionMCTFR | MCTFR | |
| Final RejectionFinal rejectionCTFR | CTFR | |
| Information Disclosure Statement consideredIDSC | IDSC | |
| Information Disclosure Statement (IDS) FiledWIDS | WIDS | |
| Information Disclosure Statement (IDS) FiledM844 | M844 | |
| Date Forwarded to ExaminerFWDX | FWDX | |
| Response after Non-Final ActionA... | A... | |
| Electronic ReviewELC_RVW | ELC_RVW | |
| Email NotificationEML_NTF | EML_NTF | |
| Mail Non-Final RejectionNon-final rejectionMCTNF | MCTNF | |
| Non-Final RejectionNon-final rejectionCTNF | CTNF | |
| Case Docketed to Examiner in GAUDOCK | DOCK | |
| Information Disclosure Statement consideredIDSC | IDSC | |
| Reference capture on IDSRCAP | RCAP | |
| Information Disclosure Statement (IDS) FiledM844 | M844 | |
| Information Disclosure Statement (IDS) FiledWIDS | WIDS | |
| Email NotificationEML_NTR | EML_NTR | |
| PG-Pub Issue NotificationPG-ISSUE | PG-ISSUE | |
| Request for Foreign Priority (Priority Papers May Be Included)RQPR | RQPR | |
| Application Dispatched from OIPEOIPE | OIPE | |
| Sent to Classification ContractorPGPC | PGPC | |
| Filing ReceiptFLRCPT.O | FLRCPT.O | |
| Request for Foreign Priority (Priority Papers May Be Included)RQPR | RQPR | |
| Information Disclosure Statement consideredIDSC | IDSC | |
| Information Disclosure Statement (IDS) FiledM844 | M844 | |
| Request from applicant for the USPTO to retrieve the Priority DocumentPDREQUST | PDREQUST | |
| Information Disclosure Statement (IDS) FiledWIDS | WIDS | |
| Cleared by OIPE CSRL194 | L194 | |
| IFW Scan & PACR Auto Security ReviewSCAN | SCAN | |
| Initial Exam Team nnIEXX | IEXX |
6 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Maintenance fee paymentMAFP | MAFP | |
| Maintenance fee paymentMAFP | MAFP | |
| Fee paymentFPAY | FPAY | |
| Information on status: patent grantGrantedPATENTED CASESTCF | STCF | |
| Fee payment procedurePAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITYFEPP | FEPP | |
| AssignmentAS | AS |
Numbers
- Publication
- 08360591
- Publication, DOCDB
- 8360591
- Publication, EPODOC
- US8360591
- Application
- 12478023
- Application, DOCDB
- 47802309
- Application, EPODOC
- US20090478023
Titles
- English
- Backlight unit for liquid crystal display device
Patent term adjustment
- A delay
- +352 daysthe office missed an examination deadline
- B delay
- +239 dayspendency past three years
- Applicant delay
- −123 days
- Net adjustment
- 468 days
Classification
- CPC, 5
- G02F1/133603
- G02F1/1345
- G02F1/133608
- G02F1/133612
- G02F1/1335
- IPC, 2
- G09F13 04
- G09F13 08
- USPC, 6
- 362097100
- 362249020
- 362612000
- 439325000
- 439328000
- 439329000