Housing for an electromagnetic radiation emitting optoelectronic component, component and method of making a housing or a component

CROSS REFERENCE TO RELATED APPLICATIONS

0001Pursuant to 35 U.S.C. §119, this application claims the benefit of German Application No. 102005047153.6, filed Sep. 30, 2005, and German Application No. 102005059524.3, filed Dec. 13, 2005. The contents of the prior applications are incorporated herein by reference in their entirety

TECHNICAL FIELD

0002This invention relates to a housing for an optoelectronic component suitable for emitting electromagnetic radiation when operating. The invention also encompasses an electromagnetic radiation emitting component provided with such a housing and a method of making such a housing or component.

BACKGROUND

0003The prior art discloses housings for electromagnetic radiation emitting optoelectronic components comprising a base body that defines a recess. The floor of this recess is provided for mounting a luminescent diode chip. The inner walls of the recess can be shaped in the manner of a reflector, so that a portion of en electromagnetic radiation emitted by the luminescent diode chip can be deflected by the inner walls into a desired solid angle of radiation. An example of a component equipped with such a housing is disclosed in U.S. Pat No. 5,040,868.

0004Optoelectronic components that emit electromagnetic radiation are finding ever-increasing use in floodlight or projection applications. One example of a floodlight in which electromagnetic radiation emitting luminescent diodes are used is described in DE 10315131 A1. That device is a vehicle headlight in which a plurality of luminescent diode chips are disposed in a common recess. A side of the recess that faces in a light radiation direction has a marginal edge whose spatial arrangement relative to the luminescent diode chip is such that a defined luminance gradient for the distribution of light from the headlight is created in the region of the marginal edges.

0005In floodlight applications of this kind, it is important for an electromagnetic radiation emitted by the luminescent diode chip to be radiated with the highest possible radiation density and with a given radiation distribution in a given, narrow solid angle. To achieve this, for example beam cones are projected onto a desired plane by means of optics such as projection lenses. In applications of this kind, irregularities in the radiation characteristic of the optoelectronic components used may be intensified and can therefore be especially troublesome. There is, consequently, a demand for components that are specifically tailored to such applications in terms of their radiation properties.

SUMMARY

0006One object of certain embodiments disclosed herein is to specify a housing of the aforesaid kind which, by technically simple measures, is improved over known housings with respect to the radiation characteristics that can be achieved. The housing is intended in particular to be better suited for floodlight applications. A component provided with such a housing and a method of making such a housing are also to be specified.

0007A housing of the kind cited at the beginning hereof is specified in which an outer surface disposed on an emission side of the housing is provided at least in part with a baffle layer. The baffle layer is suitable for screening electromagnetic radiation, it being provided in particular to screen externally against electromagnetic radiation generated or to be generated within the housing. In suitable optoelectronic components provided with such a housing, this advantageously sharply reduces or completely prevents the egress of electromagnetic radiation from the housing in an undesired solid angle.

0008The housing preferably comprises a housing base body provided with a recess in which a chip interconnect area is disposed, the outer surface provided with the baffle layer being disposed adjacent the recess.

0009In conventional electromagnetic radiation emitting components, it has been found that housing base bodies that are not intended to emit or transmit radiation are often semipermeable to electromagnetic radiation. Particularly when the housings of such housing base bodies have thin walls, the latter are penetrated by some of the electromagnetic radiation generated inside the housing. The electromagnetic radiation consequently is not emitted just within a preferred solid angle.

0010Such an electromagnetic radiation emitted in a non-preferred or even undesired solid angle is not a problem in many applications, since it accounts for only a very small fraction of the total radiation intensity emitted from the housing. However, laterally emitted electromagnetic radiation has been found to exert an interfering effect, particularly in floodlight and projection applications. This is true for example in applications where it is desired to obtain a beam cone with a well-defined luminance distribution and sharp bright-to-dark transitions.

0011Providing the outer surface with a baffle layer constitutes a technically simple and efficient means of improving the radiation characteristic of such housings. Advantageously, the application of the baffle layer does not in principle require a special housing design, but can be executed with many conventional housings. The outer surface preferably comprises a region extending perpendicularly to an optical axis of the housing and/or parallel to the chip mounting surface.

0012In an advantageous embodiment, the housing base body comprises a carrier element on which the chip mounting surface is disposed, and, disposed on the carrier element, a frame element defining the cavity. In this case the baffle layer can be disposed in particular exclusively on the frame element, so that the frame element and the baffle layer can be fabricated independently from the rest of the housing, which can significantly simplify production.

0013The outer surface preferably adjoins an inner wall of the recess that is configured as a light stop wall suitable for suppressing the emission of radiation from the housing in an undesired spatial region. The baffle layer serves to further suppress or completely eliminate the emission of radiation in these undesired spatial regions.

0014According to a particularly preferred embodiment, the light stop wall extends substantially at an angle greater than or equal to 80° and smaller than or equal to 100° with respect to the main plane of extension of the chip mounting surface. It is preferably configured as flat, but can also be provided with curvatures or structures. Particularly preferably, the light stop wall extends substantially perpendicularly to the main plane of extension of the chip mounting surface.

0015The outer surface can be configured as partially or completely flat. Alternatively or additionally, it may be concavely or convexly curved or in some way structured.

0016The baffle layer is particularly suitable for screening an electromagnetic radiation that encompasses a spectral region of an electromagnetic radiation emitted by a luminescent diode chip provided for a component comprising the housing.

0017Particularly preferably, the baffle layer is suitable for completely screening an electromagnetic radiation, that is, the baffle layer is particularly preferably impermeable to an electromagnetic radiation having a wavelength range that is to be screened. The wavelength range to be screened can in particular be the entire wavelength range of an electromagnetic radiation emitted by a component that is to produced with the housing. It is also possible for the baffle layer to be partially permeable to electromagnetic radiation, however. It can, for example, be partially permeable to electromagnetic radiation of a wavelength range that is not necessarily to be screened to an electromagnetic radiation that is to be screened. The electromagnetic radiation to be screened is preferably visible light.

0018The baffle layer for a wavelength range of an electromagnetic radiation which is to be screened and which is emitted by a component equipped with the housing preferably has a total transmittance of 0.2 or less, particularly preferably 0.1 or less. Particularly advantageously, this total transmittance is roughly 0 at least for the visible component of the radiation.

0019The term “baffle layer” in the present context does not encompass any electrical leads or electrical leadframes of the housing. On the contrary, the outer surface of the housing does not comprise any electrical leadframes or electrical leads, or is provided with at least one baffle layer in addition to any electrical leads or leadframes that may be present.

0020In one advantageous embodiment, the baffle layer comprises a material that is reflective of the electromagnetic radiation. In this way, the electromagnetic radiation can be reflected back into the housing body by the outer surface and is therefore not necessarily lost to use.

0021Additionally or alternatively, the baffle layer advantageously comprises a material that is absorptive of the electromagnetic radiation. Suitable absorptive materials can advantageously be particularly inexpensive and can screen the electromagnetic radiation with high efficiency. Particularly preferably, the absorptive material includes a black material, that is, the color of the material is perceivable by the human eye as a shade of black.

0022In a useful embodiment, the baffle layer is provided with a lacquer. Lacquers are inexpensive materials that can be applied in a technically simple manner.

0023The housing body usefully comprises ceramic material and/or plastic in the region of the outer surface. Plastics and ceramic materials of the kind used in conventional optoelectronic housings are often partially permeable to electromagnetic radiation, such as for example visible light. Attenuated emission of radiation from the housing base body can be utilized within the scope of the present invention to obtain a well-defined radiation characteristic. The emission of radiation in subregions is further attenuated or completely prevented by the baffle layer, which is a more thoroughgoing way of shaping the radiation characteristic.

0024A further advantageous embodiment provides that in addition, at least one outer side surface forming part of the housing base body and adjoining the outer surface is provided with a baffle layer. A common baffle layer preferably extends over both the outer surface and the outer side surface. The outer surface and the outer side surface are advantageously provided at substantially the same time.

0025Particularly advantageously, the outer side surface of the housing is at least partly inclined with respect to a plane extending perpendicularly to a mounting plane of the housing. The outer side surface is inclined in particular such that it at least partly faces away from the mounting plane of the housing. This can be advantageous for the application of the baffle layer, since the inclined portions of the outer side surface do not extend perpendicularly to the mounting plane of the housing and are therefore accessible not only laterally, but also from above. A top side of the housing is to be understood primarily as a side facing away from a mounting plane of the housing.

0026Particularly preferably, the outer side surface is at least partly inclined at an angle of from 30° to 60° inclusively with respect to the plane extending perpendicularly to a mounting plane of the housing.

0027Also disclosed is a housing in which the baffle layer advantageously contains or is made of plastic. Plastics can advantageously possess absorptive properties and can be applied for example in the form of a coating.

0028The electromagnetic radiation emitting optoelectronic component includes the housing and at least one luminescent diode, for example in the form of a luminescent diode chip, which is mounted in the housing.

0029A method of making a housing for an optoelectronic component or an electromagnetic radiation emitting component is specified. One method step comprises preparing a housing or a component provided with a housing. A further method step includes applying a baffle layer to at least a portion of surfaces of the housing that are disposed on an emission side.

0030A housing comprising a housing base body provided with a recess is advantageously prepared. The baffle layer is applied to at least one outer surface disposed on an emission side of the housing and adjoining the recess.

0031Particularly preferably, the application of the baffle layer includes the use of pad printing. Pad printing is an indirect printing process that is particularly suitable for imprinting plastic bodies. Non-planar, for example convexly or concavely arched, surfaces can be provided with a to-be-applied material by pad printing.

0032Additionally or alternatively, the application of the baffle layer can include the use of at least one of the methods screen printing, inkjet printing, plastic coating and powder coating.

0033According to a further advantageous embodiment of the method, the application of the baffle layer includes the application of a metal-containing material. This material can be applied in a thick-film process and/or a thin-film process. A thick-film process preferably includes the application of a metal-containing paste. An advantageous thin-film process includes the sputtering of metal-containing material. Alternatively, metal-free materials can be applied by sputtering or the application of a paste.

0034Further advantages, preferred embodiments and improvements of the housing, the component and the method will become apparent from the exemplary embodiments described hereinafter in conjunction with <figref idref="DRAWINGS">FIGS. 1 to 13</figref>.

DESCRIPTION OF DRAWINGS

0035<figref idref="DRAWINGS">FIGS. 1 to 3</figref> are various schematic perspective representations of a housing according to a first exemplary embodiment;

0036<figref idref="DRAWINGS">FIGS. 4 and 5</figref> are various schematic perspective representations of a housing according to a second exemplary embodiment;

0037<figref idref="DRAWINGS">FIG. 6</figref> is a schematic perspective representation of a component according to a first exemplary embodiment and a housing according to a third exemplary embodiment,

0038<figref idref="DRAWINGS">FIG. 7</figref> is a schematic perspective representation of a component according to a second exemplary embodiment and a housing according to a fourth exemplary embodiment,

0039<figref idref="DRAWINGS">FIG. 8</figref> is a schematic sectional view of a housing according to a fifth exemplary embodiment and a component according to a third exemplary embodiment,

0040<figref idref="DRAWINGS">FIGS. 9 to 11</figref> are schematic sectional views of various method stages in an exemplary embodiment of the method.

DETAILED DESCRIPTION

0041In the exemplary embodiments and figures, like or like-acting elements are provided with the same respective reference numerals. The elements shown and the size relationships of the elements to one another are not necessarily to be considered true to scale. Rather, individual details of the figures may be depicted as exaggeratedly large to provide a better understanding. This is true in particular of the exemplary depictions of the baffle layer.

0042The housing <b>2</b> illustrated in <figref idref="DRAWINGS">FIGS. 1 to 3</figref> comprises a housing body <b>25</b> provided with a cavity <b>50</b>. The opening of the cavity <b>50</b> has an elongated cross-sectional area, configured for example in the manner of a rectangle with rounded edges. The cavity <b>50</b> is provided to have at least one luminescent diode chip mounted in it and to be electrically conductively connected. The housing illustrated in <figref idref="DRAWINGS">FIGS. 1 to 3</figref> is provided for example to accommodate four or five luminescent diode chips, which are mounted, for example in a linear arrangement, on a floor of the cavity <b>50</b>.

0043The housing body <b>25</b> for example contains or is made of a plastic material. A thermoplastic or duroplastic plastic, for example polyphthalamide, is preferably used for this purpose. Fillers can be added to the plastic material. Suitable fillers are for example barium sulfate, anatase (a modification of TiO₂) and polytetrafluoroethylene (PTFE, for example Teflon), which are preferably added in a volume ratio of up to 50%. A further preferred volume ratio is in the range of about 5% to about 15%.

0044The housing <b>2</b> comprises, disposed on an emission side, outer surfaces <b>24</b> of the housing body <b>25</b> that extend perpendicularly to an optical axis of the housing or parallel to a chip mounting surface disposed in the recess <b>50</b>. One of these outer surfaces <b>24</b>, which adjoins one of four main edges bounding the recess <b>50</b>, is provided with a baffle layer <b>3</b>. Housing body <b>25</b> also comprises outer side surfaces <b>23</b>. The baffle layer <b>3</b> also extends over one of these outer side surfaces <b>23</b>.

0045In the exemplary embodiment depicted in <figref idref="DRAWINGS">FIGS. 1 to 3</figref>, the baffle layer <b>3</b> covers the one outer side surface <b>23</b> completely and extends on the front-side outer surface as far as the recess <b>50</b>. It is also possible, however, for this outer surface and outer side surface <b>23</b> to be covered only partially by baffle layer <b>3</b>. Likewise, it is possible for the side surfaces <b>23</b> to be free of a baffle layer. For example, although in the exemplary embodiment of <figref idref="DRAWINGS">FIG. 1</figref> outer surface <b>24</b> is completely covered by baffle layer <b>3</b>, it may be covered with baffle layer <b>3</b> only on its half that adjoins recess <b>50</b>.

0046The outer side surface <b>23</b> provided with baffle layer <b>3</b> is inclined with respect to a plane extending perpendicularly to a mounting plane of the housing. The side surface is configured as flat and is tilted with respect to the plane by an angle <b>31</b> (see <figref idref="DRAWINGS">FIG. 3</figref>). Angle <b>31</b> is between 30° and 60° inclusively, for example 40°.

0047Baffle layer <b>3</b> is made for example of a reflective material that contains for example a metallic material such as silver. To form the baffle layer, for example a silver layer with a sufficiently high layer thickness is applied to the appropriate surfaces of the housing. Silver has a high reflectivity over a large region of the visible spectrum. The silver layer can be only a few monoparticulate layers thick and can therefore intentionally be left partially permeable to electromagnetic radiation. To achieve complete screening, the thickness must be significantly greater. For this purpose, it has a thickness of for example 10 μm.

0048Metal-containing layers such as the silver layer can advantageously be applied for example by applying a suitable metal-containing paste or by sputtering. Metal layers can also in principle be vapor-deposited additionally or as an alternative.

0049The baffle layer <b>3</b> can also additionally or alternatively contain an absorptive material. This material can be, for example, another metallic material that has primarily absorptive properties with regard to a given spectral region. Here again, it is important not to apply the absorptive material in too thin a layer if electromagnetic radiation generated inside the housing is to be screened to the greatest possible extent. The baffle layer has for example a total transmittance of 0.05 or less in a wavelength range to be screened. Lacquers or plastics, for example, may also be contemplated for use as the absorptive material.

0050According to a further exemplary embodiment, the baffle layer <b>3</b> comprises a reflective layer which is applied to the appropriate outer surface <b>24</b> and outer side surface <b>23</b> and to which, in turn, an absorptive layer is applied. The absorptive layer is for example a black lacquer or a black plastic. These are absorptive particularly of visible electromagnetic radiation. The baffle layer <b>3</b> can alternatively be composed for example of only one sufficiently thick layer of black lacquer or black plastic.

0051In the housing <b>2</b> illustrated in <figref idref="DRAWINGS">FIGS. 4 and 5</figref>, in contrast to the housing described above with reference to <figref idref="DRAWINGS">FIGS. 1 to 3</figref>, the baffle layer <b>3</b> is applied to the emission-side outer surface <b>24</b> adjoining cavity <b>50</b> in such fashion as to be spaced away from the cavity. In other words, baffle layer <b>3</b> does not completely cover the outer surface <b>24</b> adjoining the cavity, but only a portion of that outer surface that is at a distance from the cavity <b>50</b>. This can be advantageous if the radiation characteristic to be obtained with the housing is supposed to have a well-defined bright-dark border on at least one side of the emitted beam cone. An overly sharp segment of such a bright-dark border can be attenuated by pulling the baffle layer back from the cavity.

0052The outer side surface <b>23</b> adjoining this outer surface is also covered only partially by a baffle layer <b>3</b>. The outer side surface <b>23</b> partially covered by baffle layer <b>3</b> has a first and a second portion. Both portions are for example flatly configured. The first portion extends for example perpendicularly to a mounting plane of the housing <b>2</b>. The second portion is inclined with respect to the first portion, for example by 55°. This second portion is for example completely covered by baffle layer <b>3</b>. The first portion is free of the baffle layer. Alternatively, the first portion can also be covered by the baffle layer.

0053In other respects, the housing <b>2</b> depicted in <figref idref="DRAWINGS">FIGS. 4 and 5</figref> can be configured in the same way as the housing described previously in connection with <figref idref="DRAWINGS">FIGS. 1 to 3</figref>. The same applies to possible compositions, materials and superstructures of baffle layer <b>3</b>.

0054The components illustrated in <figref idref="DRAWINGS">FIGS. 6 and 7</figref> comprise a housing <b>2</b> with a carrier <b>21</b>, and, disposed on said carrier <b>21</b>, a frame <b>22</b>. Frame <b>22</b> comprises inner walls <b>5</b> bounding a cavity <b>50</b>. A plurality of semiconductor chips <b>4</b> is disposed in a linear arrangement in the trench-like cavity <b>50</b>.

0055The inner walls <b>5</b> of the cavity <b>50</b> are a relatively small distance away from the luminescent diode chip <b>4</b>. The distance is, for example, smaller than or equal to a lateral edge length of the luminescent diode chip <b>4</b>. By the same token, the floor of the cavity <b>50</b> has a relatively small area.

0056The luminescent diode chips <b>4</b> are electrically mounted in the housing <b>2</b>, for example connected to one another in series. To this end, the floor of the cavity <b>50</b> comprises a plurality of inner electrical contact surfaces <b>12</b>, the luminescent diode chips being electrically conductively connected, for example by soldering or conductive glue, for example on their sides facing the floor <b>54</b> of cavity <b>50</b>, to the appropriate inner contact surfaces <b>12</b> and resting on a portion of the contact surface <b>12</b> concerned. A side of the luminescent diode chip <b>4</b> facing away from the inner contact surfaces <b>12</b> is electrically conductively connected to the appropriate contact surface, for example by means of a bonding wire <b>46</b>.

0057Two of the inner contact surfaces <b>12</b> extend across the carrier <b>21</b> to a region of the carrier <b>21</b> that is offset laterally with respect to the frame <b>22</b>, and in which they are electrically conductively connected to external contacts <b>14</b> of component <b>1</b> by means of which the component <b>1</b> can be electrically connected to the outside.

0058When operating, the luminescent diode chips <b>4</b> emit for example an electromagnetic radiation in a blue or ultraviolet wavelength range.

0059The frame for example contains or is made of aluminum oxide. It is also possible alternatively for the frame to contain or be made of a less reflective material, such as for example aluminum nitride or a liquid crystal polymer (LCP). The use of LCP as a material for the frame <b>22</b> has the advantage that the material can be thermally matched to the carrier <b>21</b>. The carrier <b>21</b> contains as material for example aluminum nitride, which is inexpensive and has a high thermal conductivity. Silicon or silicon carbide, for example, can also be used as alternative or additional materials for the carrier.

0060In the component illustrated in <figref idref="DRAWINGS">FIG. 6</figref>, the luminescent diode chips <b>4</b> are arranged in a straight line. By contrast, the luminescent diode chips <b>4</b> of the component depicted in <figref idref="DRAWINGS">FIG. 7</figref> are arranged partly along a first straight line and partly along a second straight line, said first and second straight lines forming an angle with each other of for example 15°. The arrangement of the luminescent diode chips <b>4</b> therefore comprises a bend.

0061The housing <b>2</b> of the components <b>1</b> depicted in <figref idref="DRAWINGS">FIGS. 6 and 7</figref> has on one side an inner wall bounding the cavity <b>50</b> and extending along the arrangement of the luminescent diode chips <b>4</b>, at least a portion of said inner wall being configured as a light stop wall <b>51</b>. Such a light stop wall serves to suppress the emission of the radiation in an undesired spatial region. To this end, the light stop wall <b>51</b> usefully extends substantially at an angle that is greater than or equal to 80° and less than or equal to 110° with respect to a mounting plane of the luminescent diode chip <b>4</b>. In particular, the light stop wall extends substantially perpendicularly to the mounting plane.

0062In the lateral direction, the path of the light stop wall corresponds to the arrangement of the luminescent diode chips. It can also be stated that the luminescent diode chips are arranged along the light stop wall <b>51</b>. In particular, the lateral path of light stop wall <b>51</b> in the exemplary embodiment depicted in <figref idref="DRAWINGS">FIG. 7</figref> comprises a bend, like the arrangement of the luminescent diode chips. The same is true of an edge of the light stop wall <b>50</b> disposed on the opening side of the cavity. “Lateral direction” should be understood as a direction running parallel to a mounting plane.

0063Illustrated in <figref idref="DRAWINGS">FIG. 8</figref> is a cross section of a component configured in substantially the same way as the components described previously with reference to <figref idref="DRAWINGS">FIGS. 6 and 7</figref>. The cavity's inner wall opposite from light stop wall <b>51</b> is configured as a reflector wall, which extends obliquely to the main plane of extension of the carrier <b>21</b>. It is inclined for example by 45° with respect to the main plane of extension of the carrier. Alternatively, this wall can also be configured as a light stop wall, which can be constituted in the same manner as light stop wall <b>51</b>. An exemplary cross-sectional shape is indicated in <figref idref="DRAWINGS">FIG. 8</figref> by broken lines.

0064The luminescent diode chips <b>4</b> are arranged at a distance <b>53</b> of for example 500 μm or less, preferably 150 μm or less, from light stop wall <b>51</b>. Alternatively, to obtain an effective light stop effect, the luminescent diode chip located at the marginal edge of light stop wall <b>51</b> that is disposed on the opening side of the cavity can be at a lateral distance of 500 μm or less, preferably of 150 μm or less, from the luminescent diode chips <b>4</b>, regardless of the path traced by the rest of the light stop wall. The lateral distance in this case is measured in the plane in which the luminescent diode chips are mounted.

0065Given such a small distance <b>53</b>, the light stop wall <b>51</b> is able to exert an effective light stop effect even if said light stop wall <b>51</b> is configured as relatively low. In addition, due to this very small distance, a portion of the electromagnetic radiation emitted by the luminescent diode chips <b>4</b> impinges on the light stop wall <b>51</b> with a high radiation intensity per unit area, thus largely making it possible to prevent radiation in an undesired solid angle and to emit the electromagnetic radiation in a desired, preferably narrow solid angle and with high emittance.

0066These properties are desirable particularly in the case of floodlights, for example automobile headlights, which are intended to illuminate a specific solid angle as brightly as possible. In the case of automobile headlights, for example the route being driven, i.e. particularly the road, must be lit as brightly as possible but without blinding oncoming vehicles; consequently, the emission of light in the upper solid angle is undesirable and largely avoided. This is precisely what can be achieved with a component comprising a light stop wall <b>51</b>. In addition, the stretched-out arrangement of the luminescent diode chips <b>4</b> makes it possible to obtain bright and expansive, uniform illumination of the route or road across the entire width of the roadway.

0067In each of the components <b>1</b> depicted in <figref idref="DRAWINGS">FIGS. 6 to 8</figref>, the outer surface <b>24</b> of frame <b>21</b> that adjoins light stop wall <b>51</b> is provided with a baffle layer <b>3</b>. This can be configured as described earlier hereinabove. The baffle layer <b>3</b> is able to more thoroughly prevent radiation emission in an undesired solid angle.

0068The described housing <b>2</b> and components <b>1</b> can be used in particular for a floodlight module, particularly for. automotive applications. They can also be suitable for projection applications.

0069The components <b>1</b> emit for example white light, for which purpose they comprise for example a luminescence conversion element that converts the radiation of a first wavelength range emitted by the luminescent diode chips <b>4</b> partially into radiation of a second wavelength range different from the first. White light can either be generated by mixing the radiation emitted by the luminescent diode chip with the converted radiation or by having the converted radiation contain color components that yield white light when blended.

0070The luminescence conversion material can contain at least one phosphor. All converters known for use in LEDs are theoretically suitable. Examples of such phosphors and phosphor mixtures suitable for use as converters are: <ul id="ul0001" list-style="none"><li id="ul0001-0001" num="0000"><ul id="ul0002" list-style="none"><li id="ul0002-0001" num="0071">chlorosilicates, as disclosed for example in DE 10036940 and the prior art described therein,</li><li id="ul0002-0002" num="0072">orthosilicates, sulfides, metal thiols and vanadates, as disclosed for example in WO 2000/33390 and the prior art described therein,</li><li id="ul0002-0003" num="0073">aluminates, oxides, halophosphates, as disclosed for example in U.S. Pat. No. 6,616,862 and the prior art described therein,</li><li id="ul0002-0004" num="0074">nitrides, sions and sialons, as disclosed for example in DE 10147040 and the prior art described therein, and</li><li id="ul0002-0005" num="0075">rare-earth garnets, such as YAG:Ce and the alkaline earth elements, as disclosed for example in US 2004-062699 and the prior art described therein.</li></ul></li></ul>

0076The luminescent diode chips <b>4</b> can either be potted with a potting compound <b>9</b> as illustrated in <figref idref="DRAWINGS">FIG. 8</figref>, for example a silicone-based potting compound, or they can be covered with a radiation-permeable cover plate to protect them against external influences (not illustrated in the figures).

0077The structure of the housing <b>2</b> comprising a carrier <b>21</b> and a frame <b>22</b> and comprising contact surfaces <b>12</b>, <b>14</b> disposed on the carrier <b>21</b> allows the component <b>1</b> to be produced in a simple manner, for example with no need for the onerous production of through-connections. Alternatively, however, the housing body can be configured as one piece, for example by overmolding a leadframe that includes respective contacts for the luminescent diode chips <b>4</b> and the component <b>1</b>.

0078The luminescent diode chips <b>4</b> are for example light-emitting diode (LED) chips, and are preferably thin-film LED chips.

0079A thin-film LED chip is distinguished in particular by the following characteristic features: applied to or formed on a first main surface of a radiation-generating epitaxial layer sequence, which surface faces a carrier element, is a reflecting layer that reflects back into the epitaxial layer sequence at least some of the electromagnetic radiation generated therein; the epitaxial layer sequence has a thickness in the range of 20 μm or less, particularly in the range of 10 μm; and the epitaxial layer sequence comprises at least one semiconductor layer that has at least one surface with an intermixed structure, which in the ideal case brings about a nearly ergodic distribution of the light in the epitaxially grown epitaxial layer sequence, i.e., said layer has a scattering behavior that is as ergodic as possible.

0080A basic principle of a thin-film LED chip is described, for example, in I. Schnitzer et al., Appl. Phys. Lett. 63 (16), Oct. 18, 1993, 2174-2176, whose disclosure content in that regard is hereby incorporated by reference.

0081A thin-film LED chip is, as a good approximation, a Lambertian surface radiator, and is therefore particularly well suited for use in the component, particularly for a floodlight.

0082In the previously described exemplary embodiments, at least a portion of the baffle layer <b>3</b> or the entire baffle layer <b>3</b> can be applied by pad printing. Various method stages of an exemplary such method are depicted in <figref idref="DRAWINGS">FIGS. 9 to 11</figref>.

0083A pad <b>100</b> is provided with a baffle material <b>101</b>. To this end, the pad is for example pressed onto a device on which the baffle material is disposed. Such devices are known as a printing plate or cliche. The pad <b>100</b> is made of a highly elastic material that for example contains or consists of a rubber. Silicone rubber is particularly suitable.

0084<figref idref="DRAWINGS">FIG. 11</figref> shows a pad <b>100</b> moistened with a baffle material <b>101</b>, such as for example black dye. The pad <b>100</b> is conveyed downward onto the housing <b>2</b>, so that it comes into contact with an emission-side outer surface <b>24</b> and an obliquely extending outer side surface <b>23</b> of the housing <b>2</b>. The direction of movement of the pad <b>100</b>, which is indicated by an arrow in <figref idref="DRAWINGS">FIG. 11</figref>, extends perpendicularly to a mounting plane of the housing <b>2</b>. The outer side surface <b>23</b> to be imprinted is inclined by an angle of less than 90°, for example 45°, with respect to the direction along which the pad <b>100</b> is guided onto the housing <b>2</b>.

0085On being pressed against housing <b>2</b>, pad <b>100</b> deforms and molds itself to the external shape of the housing, thus making it possible to imprint outer surface <b>24</b> extending perpendicularly to the direction of movement of the pad and obliquely extending outer side surface <b>23</b> in one method step (see <figref idref="DRAWINGS">FIG. 12</figref>).

0086The pad <b>100</b> is then conveyed away from the housing <b>2</b>, as again indicated by an arrow in <figref idref="DRAWINGS">FIG. 13</figref>. The baffle material that comes into contact with the housing <b>2</b> when the pad is pressed against it remains adhering to the housing and forms at least part of a baffle layer <b>3</b> (see <figref idref="DRAWINGS">FIG. 13</figref>).

0087These method steps can be repeated as many times as necessary. Such method steps can also be used for example to apply various baffle materials consecutively to corresponding surfaces of the housing <b>2</b>.

0088Alternatively to or in addition to pad printing, the baffle layer can also be applied at least in part by screen printing. For this purpose, for example a screen or a mask is applied to the appropriate surfaces of the housing, and a baffle material is then applied to that. The baffle material has a suitable viscosity for screen printing. It can, for example, include a black lacquer or other black colorant. A doctor blade is used to distribute the baffle material present in openings in the screen or mask over the intended surfaces of the housing.

0089Inkjet printing is also suitable for use as another alternative or complementary method of applying baffle material. Absorptive colorants, in particular, for example black colorant, can be applied in this manner. A conventional CIJ (Continuous Ink Jet) printer can for example be used for this purpose. A DOD (Drop On Demand) printer can also be used.

0090In addition to or as an alternative to the previously described methods, metal layers, in particular, can be applied by vapor deposition, sputtering or gluing or by the application of a paste.

0091Plastic coating, for example, is also suitable for the application of baffle material.

0092Both metal layers and plastic layers can additionally or alternatively be applied for example by powder coating. An electrostatic powder coating or another type of powder coating can be used, for example. In this case the baffle material is applied in the form of a powder. This is then heated, causing it to bond to a for example integral layer and remain adhering to the surface to which it is applied.

0093The invention is not limited to the exemplary embodiments by the description of it with reference thereto. Rather, the invention encompasses any novel feature and any combination of features, including in particular any combination of features recited in the claims, even if that feature or combination itself is not explicitly mentioned in the claims or exemplary embodiments.