Power module
Summary by NHIP
Modular Power Module
The power module connects parallel circuit units via a strap with separate connection elements and a connecting element. Each connection element exhibits 5 to 100 nH inductance, links to a single terminal contact independently of the connecting element, and maintains a section with less than 10 nH inductance between adjacent units.
Claim Score by NHIP
Abstract
A power module has several circuit units (20, 21) that are electrically connected in parallel and are provided with terminal contacts (5, 5′) which are electrically and mechanically interconnected via at least one current-conducting saddle (26). In order to create a power module which is easy to produce and in which the current-conducting saddle (26) requires little space, the saddle (26) is embodied in several parts while encompassing a terminal element (12) that can be connected in a fixed manner to a terminal contact (5) of a circuit unit (20) independently of a connecting element (25) of the saddle (26). The connecting element (25) of the saddle (26) extends on a plane that is spaced apart from the circuit unit (20) while being electrically connected to the terminal element (12).

Term
Term ended
Expired 30 October 2025, 0.9 years ago.
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7 claims: 1 independent, 6 dependent
- 1Broadest claimClaim Score 30, narrow(NHIP)A power module comprising a plurality of circuit units, each of the circuit units comprising a half bridge with two power semiconductor components connected in series, and wherein the half bridges are connected in parallel, and a current-carrying strap, each circuit unit having a substrate with a terminal contact with which contact is to be made and which is electrically connected in a parallel manner to the corresponding terminal contact of another circuit unit via the current-carrying strap, wherein the current-carrying strap has a plurality of separate connection elements and a connecting element, the connection elements of two adjacent circuit units are connected by a section of the connecting element, said section having an inductance of less than 10 nH, each connection element has an inductance between 5 nH and 100 nH and is assigned to the terminal contact of only a single one of the circuit units, in a connecting direction, each connection element can be permanently connected to the terminal contact assigned to it independently of the connecting element and the further connection elements of the power module, and the connecting element connects the circuit units in parallel by means of a connection to the separate connection elements, each power semiconductor component is electrically connected with a conductor track of the corresponding substrate having an inductance of less than 5 nH, the connection element comprises a connection lug for externally connecting the module, the connection lug being arranged above one of the circuit units, a section of the connection element, which section is arranged above one of the circuit units, is not equipped with a connection lug.
56 paragraphs in 7 sections, as filed
CROSS-REFERENCE TO RELATED APPLICATION
0001This application is a continuation of co-pending International Application No. PCT/EP2004/012810 filed Nov. 11, 2004, which designates the United States, and claims priority to German application number DE 103 52 671.4 filed Nov. 11, 2003.
TECHNICAL FIELD
0002The invention lies in the field of power electronics, particularly power semiconductor electronics, and relates to a power module having a plurality of circuit units with terminal contacts which are electrically connected to one another via at least one current-carrying strap.
BACKGROUND
0003Power modules of this type frequently have a plurality of parallel-connected circuit units in order to realize a high current-carrying capacity. The circuit units may be implemented, for example, on substrates on which power components are arranged, it being possible to make electrical contact with said power components via conductor tracks and terminal contact points (so-called contact pads). In order to connect the circuit units in parallel, the latter are connected to one another via current-carrying straps.
0004DE 197 21 061 A1 reveals a power module having a housing for holding a plurality of electronic components and having a plurality of terminal contacts for internal and/or external electrical connection. The module comprises a plurality of ceramic substrates on which semiconductor components are respectively arranged and connected so as to form circuit units. Contact can be externally made with the circuit units via a connection block which also connects the circuit units to one another. The connection block is comparatively expensive and has a high construction. Detailed information as regards the connection of the circuit units cannot be gathered from DE 197 21 061 A1.
SUMMARY
0005It is an object of the present invention to specify a power module and a method for producing the latter, in which the current-carrying strap requires only a small amount of space and can be easily connected to the circuit unit using common connecting techniques and without impairing the remaining components of the module.
0006According to the invention, this object can be achieved by a power module comprising a plurality of circuit units, which are connected in parallel, and a current-carrying strap, each circuit unit having a terminal contact with which contact is to be made and which is electrically connected in a parallel manner to the corresponding terminal contact of another circuit unit via the current-carrying strap, wherein the strap has a plurality of separate connection elements and a connecting element, each connection element is assigned to the terminal contact of only a single one of the circuit units, each connection element can be permanently connected to the terminal contact assigned to it independently of the connecting element and the further connection elements of the power module, and the connecting element connects the circuit units in parallel by means of a connection to the separate connection elements.
0007At least one of the connection elements can be L-shaped. At least one of the connection elements may have a foot region which is connected to the terminal contact of the circuit unit. At least one of the connection elements can be connected to a terminal contact of a circuit unit by means of bonding, soldering or laser welding. The connecting element may have a continuous section which electrically connects the separate connection elements to one another. A power module may further comprise a housing, the continuous section of the connecting element being arranged inside the housing. The continuous section can be arranged on that side of the connecting element which faces the common carrier.
0008The object can also be achieved by a method for connecting at least two circuit units of a power module, in which each circuit unit has a terminal contact which is to be connected to a terminal contact of another circuit unit, each terminal contact first of all being permanently electrically connected to a separate connection element, which is assigned to only the respective circuit unit, independently of the further parts of the power module, the circuit units being arranged on a common carrier, and the separate connection elements then being connected to a connecting element, with the terminal contacts of the circuit units being connected in parallel.
0009A plurality of circuit units first of all can be respectively connected to at least one connection element of current-carrying straps, and the respective connection elements then can be connected, using connecting elements, so as to form current-carrying straps. A plurality of current-carrying straps can be provided for the purpose of connecting a circuit unit. At least one of the connecting elements of the current-carrying straps essentially can be arranged parallel to the circuit unit. A continuous section of the connecting element, which section is provided for the purpose of electrically connecting the separate connection elements, can be arranged on that side of the connecting element which faces the common carrier. A continuous section of the connecting element, which section is provided for the purpose of electrically connecting the separate connection elements, can be arranged in a housing of the power module.
0010The present invention is based on the basic concept of configuring the current-carrying strap in a plurality of parts, a first part being permanently electrically connected, separately and independently from the remaining parts, to the circuit unit or to conductor tracks or pads (generally referred to as terminal contacts) which are provided on said circuit unit.
0011The first part has a foot region, which is connected to the terminal contact, and a neck region, which preferably extends essentially perpendicular to the circuit unit and, at its end, enables simple mounting or electrical connection to a second part of the current-carrying strap. In this connection, a preferred development of the invention provides for the first part to be L-shaped and for its foot region to be connected to the terminal contact of the circuit unit.
0012The second part is preferably in the form of a low-inductance conductor track or a strip conductor and runs essentially parallel to the plane of the circuit units. The second part preferably connects two or more circuit units in parallel by virtue of the fact that respective first parts of a plurality of circuit units are connected to it. The second part may also lead to an external connection.
0013This results in the fundamental advantage of the invention that the first part of the current-carrying strap can be connected in advance to the terminal contact provided, independently of the remaining components of the power module. This fabrication step can be carried out as a premounting step, to be precise at a point in time at which the terminal contact or the corresponding (foot) region of the first part is still readily accessible on all sides. This makes it possible to use inexpensive, proven and reliable connecting technologies, for example bonding, soldering or laser welding.
0014Another advantage of the invention resides in the fact that the electrical connection between the first part and the terminal contact can be tested before further mounting.
0015Arranging the second part of the current-carrying strap essentially parallel to the plane of the circuit units results in a very space-saving, compact configuration of the power module.
0016One refinement of the method according to the invention, which is preferred in terms of production engineering, provides for a plurality of circuit units to first of all be respectively connected to the first part of their current-carrying strap, for the circuit units to be arranged on a common carrier and for the respective first parts to then be connected to a common second part so as to form current-carrying straps.
0017The circuit units may be connected, for example, by being soldered to a common base plate. In this case, they are advantageously positioned using a mounting template which, during mounting, is arranged in the plane of the second part of the strap and has, for example, openings for the passage of the free ends of the first parts.
BRIEF DESCRIPTION OF THE DRAWINGS
0018The invention will be explained in more detail below with reference to the exemplary embodiments which are shown in the figures, in which:
0019<figref idref="DRAWINGS">FIG. 1</figref> shows the premounting of a circuit unit in a first mounting sequence,
0020<figref idref="DRAWINGS">FIG. 2</figref> shows the premounting of a circuit unit in a varied mounting sequence,
0021<figref idref="DRAWINGS">FIG. 3</figref> shows the mounting of a plurality of circuit units so as to form a power module according to the invention,
0022<figref idref="DRAWINGS">FIG. 4</figref> shows a circuit diagram having two half-bridges which are of identical design and are provided for the purpose of parallel connection in a power module according to the invention,
0023<figref idref="DRAWINGS">FIG. 5</figref> shows a circuit diagram of a half-bridge module having three half-bridges which are of identical design and are electrically connected in parallel with one another,
0024<figref idref="DRAWINGS">FIGS. 6</figref><i>a</i>-<i>b </i>show a perspective view of a power module which is in the form of a half-bridge module and has a plurality of circuit units which are electrically connected in parallel using current-carrying straps, with the housing removed, and
0025<figref idref="DRAWINGS">FIG. 7</figref> shows a side view of a cross section through the half-bridge module shown in <figref idref="DRAWINGS">FIG. 6</figref>.
DETAILED DESCRIPTION
0026The premounting (shown in three mounting steps a), b), c) in <figref idref="DRAWINGS">FIG. 1</figref>) of a circuit unit begins with the application of a power component <b>1</b>, for example a power semiconductor, to a conductor track <b>2</b> of a substrate <b>3</b> preferably by means of soldering (mounting step a)). Further conductor tracks or terminal contacts <b>4</b>, <b>5</b>, <b>6</b> are provided on the substrate. In a subsequent mounting step b), contact is made with the power semiconductor <b>1</b> using bonding wires <b>7</b>, <b>8</b>.
0027The terminal contacts <b>4</b>, <b>5</b> are then electrically connected (mounting step c)) to the foot <b>10</b>, <b>11</b> of a respective first part <b>12</b>, <b>14</b> by means of soldering, laser welding or ultrasonic welding. The parts <b>12</b>, <b>14</b> are L-shaped and their free end region of the L (neck region) <b>16</b>, <b>17</b> projects upward essentially perpendicular to the plane <b>18</b> of the circuit unit. The first parts <b>12</b>, <b>14</b> are connected before further mounting and independently of further parts <b>25</b>, <b>27</b> (<figref idref="DRAWINGS">FIG. 3</figref>) which will form a respective current-carrying strap together with the parts <b>12</b>, <b>14</b>. The connection between the parts <b>12</b>, <b>14</b> and the terminal contacts <b>4</b>, <b>5</b> can be pretested at this stage, thus making it possible to considerably increase the fabrication quality and reliability.
0028<figref idref="DRAWINGS">FIG. 2</figref> shows another exemplary embodiment of the premounting operation when producing a power module according to the invention in three mounting steps a′), b′), c′), the same reference symbols as in <figref idref="DRAWINGS">FIG. 1</figref> being used to denote the same elements. In this case, the parts <b>12</b>, <b>14</b> are first of all connected to the terminal contacts <b>4</b>, <b>5</b> on the substrate <b>3</b> by means of laser welding, for example. Only then is the power semiconductor <b>1</b> placed on the substrate <b>3</b> and contacted by means of soldering and bonding wires <b>7</b>, <b>8</b>. This has the advantage that the power semiconductor <b>1</b> cannot be impaired by laser welding the parts <b>12</b>, <b>14</b>, and the movement space for laser welding is not restricted.
0029<figref idref="DRAWINGS">FIG. 3</figref> shows two circuit units <b>20</b>, <b>21</b> which have been premounted as shown in <figref idref="DRAWINGS">FIG. 1</figref> or <b>2</b>. Said circuit units are arranged on a common base plate <b>24</b>. The free end regions <b>16</b>, <b>16</b>′ of the respective first parts <b>12</b>, <b>12</b>′ are connected to a second part <b>25</b>, for example by means of pressing-in, compression, squeezing, bonding, crimping, riveting, soldering, particularly inductive hard soldering, welding, particularly cold welding, ultrasonic welding, laser welding, inductive welding or resistance welding, so as to form a current-carrying strap <b>26</b>. The free end regions <b>17</b>, <b>17</b>′ of the respective first parts <b>14</b>, <b>14</b>′ are equally connected to a second part <b>27</b> so as to form a current-carrying strap <b>28</b>.
0030After being mounted separately, the parts <b>12</b>, <b>12</b>′ and <b>14</b>, <b>14</b>′ and <b>25</b>, <b>27</b> thus complement one another to form a respective current-carrying strap <b>26</b>, <b>28</b> which connects the corresponding terminal contacts (for example <b>5</b> and <b>5</b>′) of the circuit units <b>20</b> and <b>21</b> in parallel. The second parts <b>25</b> and <b>27</b> are arranged at a distance from one another in a parallel or else plane-parallel manner. The module formed in this manner may be introduced and, if appropriate, potted into a housing in a known manner.
0031When mounting the circuit units <b>20</b>, <b>21</b> on the common base plate <b>24</b>, a mounting template may first of all be used for precise positioning, said template having openings precisely where the end regions <b>16</b>, <b>16</b>′; <b>17</b>, <b>17</b>′ of the first parts are intended to be arranged later and are intended to penetrate the second part. The circuit units are thus aligned according to the template.
0032Mounting of the module according to the invention is thus considerably simplified. The ability to test the connection between the first parts <b>12</b>, <b>14</b> and the assigned terminal contacts at an early stage improves quality assurance. The configuration of the current-carrying strap enables the module to have a very compact and space-saving design.
0033According to one preferred embodiment of the invention, a power module according to the invention is in the form of a half-bridge module. Such a half-bridge module preferably comprises a plurality of half-bridges which are each arranged on a substrate. Each half-bridge forms a circuit unit.
0034<figref idref="DRAWINGS">FIG. 4</figref> shows a circuit diagram having two circuit units <b>31</b>, <b>32</b> of this type. Each of the circuit units <b>31</b>, <b>32</b> comprises two power semiconductors <b>1</b>, <b>1</b>′ whose load paths are connected in series. The power semiconductors <b>1</b>, <b>1</b>′ may be in the form of, for example, transistors, thyristors, triacs, FETS, MOSFETs or IGBTs. A freewheeling diode <b>9</b>, <b>9</b>′ is also reverse-connected in parallel with each load path of a power semiconductor <b>1</b>, <b>1</b>′.
0035Each of the circuit units <b>31</b>, <b>32</b> is implemented on a substrate. The power semiconductors <b>1</b>, <b>1</b>′ and the freewheeling diodes <b>9</b>, <b>9</b>′ of a circuit unit <b>31</b>, <b>32</b> are connected to one another and to terminal contacts in the plane of the respective substrate by means of conductor tracks. Each of these conductor tracks has an inductance. <figref idref="DRAWINGS">FIG. 4</figref> illustrates equivalent inductances L<b>1</b> to L<b>5</b> corresponding to the inductances of the conductor tracks.
0036In order to increase the switching capacity of a power module according to the invention, two or more circuit units <b>31</b>, <b>32</b> may be connected in parallel. To this end, mutually corresponding terminal contacts <b>4</b>, <b>5</b>, <b>6</b> of the circuit units <b>31</b>, <b>32</b> are electrically conductively connected to one another. In the case of the terminal contacts <b>6</b> and <b>4</b> for the negative and positive supply voltages and the terminal contacts <b>5</b> for the phase output, use is preferably made, for this purpose, of a respective multipart current-carrying strap corresponding to the current-carrying straps <b>26</b>, <b>28</b> shown in <figref idref="DRAWINGS">FIG. 3</figref>.
0037To this end, each of the circuit units <b>31</b>, <b>32</b> has first parts <b>121</b>, <b>131</b>, <b>141</b> which are connected to the terminal contacts for the negative supply voltage, the phase output and the positive supply voltage. The first parts <b>121</b>, <b>131</b>, <b>141</b> are preferably formed in accordance with the first parts <b>12</b>, <b>12</b>′, <b>14</b>, <b>14</b>′ shown in <figref idref="DRAWINGS">FIGS. 1 to 3</figref>.
0038Each of the first parts <b>121</b>, <b>131</b>, <b>141</b> has an inductance which is presented in <figref idref="DRAWINGS">FIG. 4</figref> using equivalent inductances L<b>6</b>, L<b>8</b>, L<b>7</b>. The inductances L<b>6</b>, L<b>8</b>, L<b>7</b> of the first parts <b>121</b>, <b>131</b>, <b>141</b> are preferably between 5 nH and 100 nH, particularly preferably approximately 20 nH, while, in comparison to this, the inductances L<b>1</b> to L<b>5</b> are considerably lower, preferably respectively less than 5 nH.
0039<figref idref="DRAWINGS">FIG. 5</figref> shows a number of circuit units <b>31</b>, <b>32</b>, <b>33</b> which preferably have a structure in accordance with the circuit units <b>31</b>, <b>32</b> shown in <figref idref="DRAWINGS">FIG. 4</figref> and are of identical design. The mutually corresponding first parts of the circuit units <b>31</b>, <b>32</b>, <b>33</b> are electrically conductively connected using second parts <b>29</b>, <b>27</b>, <b>25</b>. The mutually corresponding first parts of the circuit units <b>31</b>, <b>32</b>, <b>33</b> respectively form a current-carrying strap together with the second part <b>29</b>, <b>27</b> or <b>25</b> that connects them.
0040In this case, the associated second parts <b>29</b>, <b>27</b> and <b>25</b> which connect the first parts of two adjacent circuit units <b>31</b>, <b>32</b>, <b>33</b> have sections <b>290</b>, <b>270</b>, <b>250</b> having inductances which are illustrated in <figref idref="DRAWINGS">FIG. 5</figref> in the form of equivalent inductances L<b>9</b>, L<b>10</b> and L<b>11</b>. The value of these equivalent inductances L<b>9</b>, L<b>10</b>, L<b>11</b> is preferably less than 10 nH, particularly preferably less than 5 nH.
0041<figref idref="DRAWINGS">FIG. 6</figref><i>a </i>shows a perspective view of a power module <b>40</b> having six circuit units <b>20</b> which each have a half-bridge and comprise a substrate as well as power elements and conductor tracks <b>2</b>. The circuit units <b>20</b> are arranged on a base plate <b>24</b> and are electrically connected in parallel using current-carrying straps <b>25</b>, <b>27</b>, <b>29</b> according to the invention. The circuit units <b>20</b> are preferably of identical design and are arranged in succession, in a connecting direction r, at an equal distance from one another. The substrates <b>3</b> may advantageously be arranged according to the designs in German patent application DE 10 2004 042 367.
0042According to one preferred embodiment of the invention, each of the circuit units <b>20</b> comprises a half-bridge corresponding to the half-bridges <b>31</b>, <b>32</b>, <b>33</b> shown in <figref idref="DRAWINGS">FIGS. 4 and 5</figref>.
0043Each of the circuit units <b>20</b> has first parts <b>121</b> for connecting the negative supply voltage, <b>141</b> for connecting the positive supply voltage and <b>131</b> for the phase output. The first parts <b>131</b>, <b>141</b> and <b>121</b> which are connected to one another using a second part <b>25</b>, <b>27</b>, <b>29</b> are preferably arranged behind one another in a row in the connecting direction r. According to one particularly preferred embodiment of the invention, the first parts <b>121</b>, <b>141</b> are arranged in a row and are arranged in succession with alternating polarity in the connecting direction r in order to supply the negative and positive supply voltages.
0044The second parts <b>25</b>, <b>27</b>, <b>29</b> are preferably essentially flat and are arranged parallel to the plane of the circuit units <b>25</b> and the base plate <b>24</b>.
0045The second parts <b>25</b>, <b>27</b>, <b>29</b> optionally have connection lugs <b>251</b>, <b>271</b> and <b>291</b> which are preferably integrally formed with the respective second parts <b>25</b>, <b>27</b>, <b>29</b>. The connection lugs <b>251</b>, <b>271</b>, <b>291</b> may thus be punched in a simple manner from flat sheet metal using a punching tool and bent into the desired shape. The connection lugs <b>251</b>, <b>271</b>, <b>291</b> are preferably arranged on that side of the relevant second part <b>25</b>, <b>29</b>, <b>27</b> which faces away from the base plate <b>24</b>. According to one preferred embodiment, two connection lugs <b>251</b>, <b>271</b>, <b>291</b> having the same electrical potential are respectively arranged in pairs and opposite one another in a direction transverse to the connecting direction r. In this case, it is advantageous if the connection lugs <b>271</b>, <b>291</b> are alternately arranged in succession with different polarity +/− in the connecting direction r.
0046The first parts have feet <b>122</b>, <b>142</b> and feet <b>132</b> (see <figref idref="DRAWINGS">FIG. 6</figref><i>b</i>) which are connected to corresponding terminal contacts <b>6</b>, <b>4</b> and <b>5</b> (see <figref idref="DRAWINGS">FIG. 6</figref><i>b</i>). The feet can advantageously be arranged one below the other according to the designs in DE 10 2004 027 185.
0047In order to achieve a higher current-carrying capacity, the connection lugs <b>251</b> for connecting the phase output are preferably designed for a higher current-carrying capacity than the connection lugs <b>271</b>, <b>291</b> for the positive and negative supply voltages. This may be achieved, in particular, by selecting the dimensions of the connection lugs <b>251</b> for the phase output to be larger, in the connecting direction r, than the dimensions of the connection lugs <b>271</b>, <b>291</b> for connecting the positive and negative supply voltages.
0048According to another preferred embodiment of the invention, the half-bridge module has, in the connecting direction r, a section <b>45</b> in which none of the second parts <b>25</b>, <b>27</b>, <b>29</b> are provided with connection lugs <b>251</b>, <b>271</b> and <b>291</b>. This creates a region above the second parts <b>25</b>, <b>27</b>, <b>29</b>, said region being free of electrical main connections and being able to be used, for example, to hold drive circuits or sensors.
0049<figref idref="DRAWINGS">FIG. 6</figref><i>b </i>shows a view corresponding to <figref idref="DRAWINGS">FIG. 6</figref><i>a </i>but with a power module <b>40</b> that has been rotated through 180°. The first parts <b>131</b> which are connected to terminal contacts <b>5</b> for connecting the phase outputs can be seen in this view. The first parts <b>131</b> are arranged opposite the first parts <b>121</b>, <b>141</b> in a direction transverse to the connecting direction r.
0050<figref idref="DRAWINGS">FIG. 7</figref> illustrates a side view of a cross section through a power module <b>40</b> which corresponds to the power module <b>40</b> shown in <figref idref="DRAWINGS">FIGS. 6</figref><i>a </i>and <b>6</b><i>b </i>but also has a housing. The cross section runs transverse to the connecting direction r between a connection strap <b>271</b> and a connection strap <b>291</b> which is adjacent to the latter, with a view of the connection strap <b>271</b> counter to the connecting direction r.
0051The housing <b>40</b> comprises a housing body <b>41</b> and the base plate <b>24</b>. Connected to the base plate <b>24</b> is a substrate which comprises a circuit unit <b>20</b>. In addition to the power semiconductors which are not illustrated in any more detail, the circuit unit <b>20</b> has conductor tracks <b>2</b>.
0052A first part <b>121</b> connects the circuit unit <b>20</b> to a second part <b>27</b>. A further first part <b>131</b> correspondingly connects the circuit unit <b>20</b> to a second part <b>25</b>.
0053Overall, the arrangement comprises three second parts <b>25</b>, <b>27</b>, <b>29</b> which are routed parallel to one another and are electrically insulated from one another using insulating films <b>51</b>, <b>52</b>. As shown in <figref idref="DRAWINGS">FIGS. 6</figref><i>a </i>and <b>6</b><i>b</i>, the second parts <b>25</b>, <b>27</b>, <b>29</b> have connection lugs <b>251</b>, <b>271</b>, <b>291</b>, of which only connection lugs <b>271</b> can be seen in <figref idref="DRAWINGS">FIG. 7</figref>. The connection lugs <b>271</b> as well as the connection lugs <b>251</b>, <b>291</b> which cannot be seen are routed out of the housing body <b>41</b> through openings <b>44</b>. When mounting the power module, the connection lugs may first of all be inserted through the openings <b>44</b> and then bent around into their final position.
0054Each of the second parts <b>25</b>, <b>27</b>, <b>29</b> has a continuous, preferably lower section <b>252</b>, <b>272</b>, <b>292</b> which is at a distance from the circuit units <b>20</b> which are to be connected to one another. The continuous sections <b>252</b>, <b>272</b>, <b>292</b> are provided to connect mutually corresponding first parts of the circuit units <b>20</b>, which are to be electrically connected in parallel with one another, and preferably extend in the connecting direction r from the first to the last of the circuit units <b>20</b>. In this case, the continuous sections <b>252</b>, <b>272</b>, <b>292</b> preferably run in a plane-parallel manner to one another and in a plane-parallel manner to the plane of the base plate <b>24</b>. The continuous sections <b>252</b>, <b>272</b>, <b>292</b> of the second parts <b>25</b>, <b>27</b>, <b>29</b> are also arranged inside the housing, particularly preferably inside the housing body <b>41</b>.
0055The housing may be optionally potted using a potting compound which preferably extends from the base plate <b>24</b> to beyond the continuous section <b>252</b> the second part <b>25</b> which is furthest away from the base plate <b>24</b>. The continuous sections <b>252</b>, <b>272</b>, <b>292</b> are thus surrounded by the potting compound. In this case, the connection lugs of the second parts project from the potting compound.
LIST OF REFERENCE SYMBOLS
0000<ul id="ul0001" list-style="none"><li id="ul0001-0001" num="0056">a), b), c) Mounting step</li><li id="ul0001-0002" num="0057">a′), b′), c′) Mounting step</li><li id="ul0001-0003" num="0058"><b>1</b>, <b>1</b>′ Power semiconductor</li><li id="ul0001-0004" num="0059"><b>2</b> Conductor track</li><li id="ul0001-0005" num="0060"><b>3</b> Substrate</li><li id="ul0001-0006" num="0061"><b>4</b>, <b>5</b>, <b>5</b>′, <b>6</b> Terminal contact</li><li id="ul0001-0007" num="0062"><b>7</b>, <b>8</b> Bonding wires</li><li id="ul0001-0008" num="0063"><b>9</b>, <b>9</b>′ Freewheeling diode</li><li id="ul0001-0009" num="0064"><b>10</b>, <b>11</b> Foot</li><li id="ul0001-0010" num="0065"><b>12</b>, <b>12</b>′ First part</li><li id="ul0001-0011" num="0066"><b>14</b>, <b>14</b>′ First part</li><li id="ul0001-0012" num="0067"><b>16</b>, <b>16</b>′ End region</li><li id="ul0001-0013" num="0068"><b>17</b>, <b>17</b>′ End region</li><li id="ul0001-0014" num="0069"><b>18</b> Plane</li><li id="ul0001-0015" num="0070"><b>20</b>, <b>21</b> Circuit units</li><li id="ul0001-0016" num="0071"><b>24</b> Base plate</li><li id="ul0001-0017" num="0072"><b>25</b> Second part (phase output)</li><li id="ul0001-0018" num="0073"><b>26</b> Current-carrying strap</li><li id="ul0001-0019" num="0074"><b>27</b> Second part (positive supply voltage)</li><li id="ul0001-0020" num="0075"><b>28</b> Current-carrying strap</li><li id="ul0001-0021" num="0076"><b>29</b> Second part (negative supply voltage)</li><li id="ul0001-0022" num="0077"><b>31</b>, <b>32</b>, <b>33</b> Circuit unit</li><li id="ul0001-0023" num="0078"><b>40</b> Power module</li><li id="ul0001-0024" num="0079"><b>41</b> Housing body</li><li id="ul0001-0025" num="0080"><b>44</b> Opening</li><li id="ul0001-0026" num="0081"><b>45</b> Section of the power module</li><li id="ul0001-0027" num="0082"><b>51</b>, <b>52</b> Insulating film</li><li id="ul0001-0028" num="0083"><b>121</b> First part (negative supply voltage)</li><li id="ul0001-0029" num="0084"><b>122</b> Foot</li><li id="ul0001-0030" num="0085"><b>131</b> First part (phase output)</li><li id="ul0001-0031" num="0086"><b>122</b> Foot</li><li id="ul0001-0032" num="0087"><b>141</b> First part (positive supply voltage)</li><li id="ul0001-0033" num="0088"><b>142</b> Foot</li><li id="ul0001-0034" num="0089"><b>250</b> Section of the second part</li><li id="ul0001-0035" num="0090"><b>251</b> Connection lug (phase output)</li><li id="ul0001-0036" num="0091"><b>252</b> Continuous section</li><li id="ul0001-0037" num="0092"><b>270</b> Section of the second part</li><li id="ul0001-0038" num="0093"><b>271</b> Connection lug (positive supply voltage)</li><li id="ul0001-0039" num="0094"><b>272</b> Continuous section</li><li id="ul0001-0040" num="0095"><b>290</b> Section of the second part</li><li id="ul0001-0041" num="0096"><b>291</b> Connection lug (negative supply voltage)</li><li id="ul0001-0042" num="0097"><b>292</b> Continuous section</li><li id="ul0001-0043" num="0098">L<b>1</b> . . . L<b>11</b> Equivalent inductance</li><li id="ul0001-0044" num="0099">r Connecting direction</li></ul>
Contents7
10 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| US2022109376A1 | Cited by | United States of America | Search report |
| US12009758B2 | Cited by | United States of America | Search report |
| US8563364B2 | Cited by | United States of America | Applicant |
| US8659900B2 | Cited by | United States of America | Search report |
| US8564953B2 | Cited by | United States of America | Applicant |
| US2017263535A1 | Cited by | United States of America | Pre-grant |
| US2011188204A1 | Cited by | United States of America | Pre-grant |
| US10170395B2 | Cited by | United States of America | Search report |
| US2016029478A1 | Cited by | United States of America | Pre-grant |
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| US2011267781A1 | Cited by | United States of America | Pre-grant |
| DE102011003307B4 | Cited by | Germany | Applicant |
| US9622341B2 | Cited by | United States of America | Search report |
| EP0546731A1 | Cites | European Patent Office (EPO) | Applicant |
| EP0584668A1 | Cites | European Patent Office (EPO) | Applicant |
| EP0762496A2 | Cites | European Patent Office (EPO) | Applicant |
| EP0924845A2 | Cites | European Patent Office (EPO) | Applicant |
| DE10103084A1 | Cites | Germany | Applicant |
| DE102004027185A1 | Cites | Germany | Applicant |
| DE102004042367A1 | Cites | Germany | Applicant |
| DE19721061A1 | Cites | Germany | Applicant |
| JP2000082772A | Cites | Japan | Applicant |
| US2003128526A1 | Cites | United States of America | Search report |
| US2003137980A1 | Cites | United States of America | Search report |
| US2005219827A1 | Cites | United States of America | Search report |
| US2006001146A1 | Cites | United States of America | Applicant |
| WO2006024330A1 | Cites | World Intellectual Property Organization (WIPO) | Applicant |
| WO2006024330A1 | Cites | World Intellectual Property Organization (WIPO) | Applicant |
| US5410450A | Cites | United States of America | Search report |
| US5705853A | Cites | United States of America | Applicant |
| US5767576A | Cites | United States of America | Applicant |
| US6078501A | Cites | United States of America | Applicant |
| US6359331B1 | Cites | United States of America | Search report |
| US6853088B2 | Cites | United States of America | Applicant |
| JPH0786498A | Cites | Japan | Applicant |
| JPH10200048A | Cites | Japan | Applicant |
| JPH11145377A | Cites | Japan | Applicant |
| JPH11214600A | Cites | Japan | Applicant |
| JPH11317496A | Cites | Japan | Applicant |
| JPS54161335A | Cites | Japan | Applicant |
| JPS59195857A | Cites | Japan | Applicant |
| US20030128526A1 | Cites | United States of America | Search report |
| US20030137980A1 | Cites | United States of America | Search report |
| US20050219827A1 | Cites | United States of America | Search report |
| US20060001146A1 | Cites | United States of America | Third party observation |
| EP546731A1 | Cites | European Patent Office (EPO) | Third party observation |
| EP546731 | Cites | European Patent Office (EPO) | Third party observation |
| EP584668A1 | Cites | European Patent Office (EPO) | Third party observation |
| EP762496A2 | Cites | European Patent Office (EPO) | Third party observation |
| EP762496 | Cites | European Patent Office (EPO) | Third party observation |
| EP924845A2 | Cites | European Patent Office (EPO) | Third party observation |
| EP924845 | Cites | European Patent Office (EPO) | Third party observation |
| JP54161335A | Cites | Japan | Third party observation |
| JP59195857A | Cites | Japan | Third party observation |
| JP7086498A | Cites | Japan | Third party observation |
| JP10200048A | Cites | Japan | Third party observation |
| JP11145377A | Cites | Japan | Third party observation |
| JP11214600 | Cites | Japan | Third party observation |
| JP11317496 | Cites | Japan | Third party observation |
| JP2000082772A | Cites | Japan | Third party observation |
| WO2006024330A1 | Cites | World Intellectual Property Organization (WIPO) | Third party observation |
| WO2006024330A1 | Cites | World Intellectual Property Organization (WIPO) | Third party observation |
| Liu, C., et al.; “Power Hybrid Module”; IBM Technical Disclosure Bulletin; Vo. 16, No. 5; pp. 1610-1611, Oct. 1973. | Non-patent | – | Third party observation |
| Liu, C., et al.; “Power Hybrid Module”; IBM Technical Disclosure Bulletin; vol. 16, No. 11; pp. 3826- 327, Apr. 1974. | Non-patent | – | Third party observation |
| International Preliminary Report Application No. PCT/EP2004/012810 filed Nov. 11, 2004, 7 pages, May 15, 2006. | Non-patent | – | Third party observation |
| Liu, C., et al.; "Power Hybrid Module"; IBM Technical Disclosure Bulletin; Vo. 16, No. 5; pp. 1610-1611, Oct. 1973. | Non-patent | – | Applicant |
| Liu, C., et al.; "Power Hybrid Module"; IBM Technical Disclosure Bulletin; vol. 16, No. 11; pp. 3826- 327, Apr. 1974. | Non-patent | – | Applicant |
| International Preliminary Report Application No. PCT/EP2004/012810 filed Nov. 11, 2004, 7 pages, May 15, 2006. | Non-patent | – | Applicant |
7 members in 5 offices
Priority claims3
| Document | Office | Kind | Date |
|---|---|---|---|
| 10352671 | Germany | – | |
| 10352671 | Germany | A | |
| 2004012810 | European Patent Office (EPO) | W |
Members7
| Document | Office | Kind | |
|---|---|---|---|
| WO2005048347A2 | World Intellectual Property Organization (WIPO) | A2 | |
| DE10352671A1 | Germany | A1 | |
| WO2005048347A3 | World Intellectual Property Organization (WIPO) | A3 | |
| EP1683197A2 | European Patent Office (EPO) | A2 | |
| JP2007511083A | Japan | A | |
| US2007119820A1 | United States of America | A1 | |
| US7656672B2This record | United States of America | B2 |
85 transactions on the USPTO file
Allowed after 2 non-final rejections, 1 final rejection, 1 RCE and 1 appeal.
- Non-final rejections
- 2
- Final rejections
- 1
- RCEs
- 1
- Appeals
- 1
Over time
Point at a mark for the transactionTransactions
| Event | Code | |
|---|---|---|
| Payment of Maintenance Fee, 12th Year, Large EntityM1553 | M1553 | |
| Application Is Considered for C of CCOFC | COFC | |
| Mail Post CardPST_CRD | PST_CRD | |
| Email NotificationEML_NTF | EML_NTF | |
| Mail-Petition Decision - GrantedMP034 | MP034 | |
| Petition Decision - GrantedP034 | P034 | |
| Petition EnteredPET. | PET. | |
| Recordation of Patent Grant MailedPGM/ | PGM/ | |
| Patent Issue Date Used in PTA CalculationAllowedPTAC | PTAC | |
| Email NotificationEML_NTR | EML_NTR | |
| Issue Notification MailedAllowedWPIR | WPIR | |
| Dispatch to FDCD1935 | D1935 | |
| Application Is Considered Ready for IssuePILS | PILS | |
| Issue Fee Payment VerifiedN084 | N084 | |
| Electronic ReviewELC_RVW | ELC_RVW | |
| Issue Fee Payment ReceivedIFEE | IFEE | |
| Email NotificationEML_NTF | EML_NTF | |
| Mail Notice of AllowanceAllowedMN/=. | MN/=. | |
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| Case Docketed to Examiner in GAUDOCK | DOCK | |
| Mail Miscellaneous Communication to ApplicantMM327 | MM327 | |
| Miscellaneous Communication to Applicant - No Action CountM327 | M327 | |
| Date Forwarded to ExaminerFWDX | FWDX | |
| Disposal for a RCE / CPA / R129AbandonedABN9 | ABN9 | |
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| Information Disclosure Statement (IDS) FiledWIDS | WIDS | |
| Workflow - Request for RCE - BeginBRCE | BRCE | |
| Information Disclosure Statement (IDS) FiledM844 | M844 | |
| Request for Continued Examination (RCE)RCEX | RCEX | |
| Electronic ReviewELC_RVW | ELC_RVW | |
| Email NotificationEML_NTF | EML_NTF | |
| Mail Notice of AllowanceAllowedMN/=. | MN/=. | |
| Notice of Allowance Data Verification CompletedAllowedN/=. | N/=. | |
| Date Forwarded to ExaminerFWDX | FWDX | |
| Information Disclosure Statement consideredIDSC | IDSC | |
| Electronic Information Disclosure StatementEIDS. | EIDS. | |
| Response after Non-Final ActionA... | A... | |
| Information Disclosure Statement (IDS) FiledWIDS | WIDS | |
| Mail Non-Final RejectionNon-final rejectionMCTNF | MCTNF | |
| Non-Final RejectionNon-final rejectionCTNF | CTNF | |
| Date Forwarded to ExaminerFWDX | FWDX | |
| Mail Appeals conf. Reopen Prosec.MAPCR | MAPCR | |
| Pre-Appeals Conference Decision - Reopen ProsecutionAPCR | APCR | |
| Request for Pre-Appeal Conference FiledAP.C | AP.C | |
| Notice of Appeal FiledN/AP | N/AP | |
| Request for Extension of Time - GrantedXT/G | XT/G | |
| Mail Advisory Action (PTOL - 303)MCTAV | MCTAV | |
| Advisory Action (PTOL-303)CTAV | CTAV | |
| Date Forwarded to ExaminerFWDX | FWDX | |
| Response after Final ActionA.NE | A.NE | |
| Change in Power of Attorney (May Include Associate POA)PA.. | PA.. | |
| Correspondence Address ChangeC.AD | C.AD | |
| Mail Final Rejection (PTOL - 326)Final rejectionMCTFR | MCTFR | |
| Final RejectionFinal rejectionCTFR | CTFR | |
| Date Forwarded to ExaminerFWDX | FWDX | |
| Response after Non-Final ActionA... | A... | |
| Mail Non-Final RejectionNon-final rejectionMCTNF | MCTNF | |
| Non-Final RejectionNon-final rejectionCTNF | CTNF | |
| Date Forwarded to ExaminerFWDX | FWDX | |
| Response to Election / Restriction FiledELC. | ELC. | |
| Mail Restriction RequirementMCTRS | MCTRS | |
| Restriction/Election RequirementCTRS | CTRS | |
| Case Docketed to Examiner in GAUDOCK | DOCK | |
| Case Docketed to Examiner in GAUDOCK | DOCK | |
| Case Docketed to Examiner in GAUDOCK | DOCK | |
| Transfer Inquiry to GAUTI1050 | TI1050 | |
| PG-Pub Issue NotificationPG-ISSUE | PG-ISSUE | |
| IFW TSS Processing by Tech Center CompleteTSSCOMP | TSSCOMP | |
| Application Dispatched from OIPEOIPE | OIPE | |
| Application Is Now CompleteCOMP | COMP | |
| Request for Foreign Priority (Priority Papers May Be Included)RQPR | RQPR | |
| Information Disclosure Statement consideredIDSC | IDSC | |
| Information Disclosure Statement (IDS) FiledM844 | M844 | |
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| Additional Application Filing FeesADDFLFEE | ADDFLFEE | |
| A statement by one or more inventors satisfying the requirement under 35 USC 115, Oath of the ApplicOATHDECL | OATHDECL | |
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| Cleared by OIPE CSRL194 | L194 | |
| IFW Scan & PACR Auto Security ReviewSCAN | SCAN | |
| Information Disclosure Statement consideredIDSC | IDSC | |
| Reference capture on IDSRCAP | RCAP | |
| Information Disclosure Statement (IDS) FiledM844 | M844 | |
| Information Disclosure Statement (IDS) FiledWIDS | WIDS | |
| Initial Exam Team nnIEXX | IEXX |
13 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Maintenance fee paymentMAFP | MAFP | |
| Fee paymentFPAY | FPAY | |
| AssignmentAS | AS | |
| Fee paymentFPAY | FPAY | |
| Certificate of correctionCC | CC | |
| Information on status: patent grantGrantedPATENTED CASESTCF | STCF | |
| Fee payment procedurePAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITYFEPP | FEPP | |
| AssignmentAS | AS | |
| AssignmentAS | AS | |
| AssignmentAS | AS | |
| AssignmentAS | AS | |
| AssignmentAS | AS | |
| AssignmentAS | AS |
Numbers
- Publication
- 7656672
- Application
- 11381881
Titles
- English
- Power module
Patent term adjustment
- A delay
- +207 daysthe office missed an examination deadline
- B delay
- +146 dayspendency past three years
- Net adjustment
- 353 days
Classification
- CPC, 5
- H10W90/00
- H02M7/003
- H10W72/926
- H10W72/50
- H10W90/754
- IPC, 3
- H05K1 14
- H01L23 48
- H01L25 07