Nova Patents
US7189435B2

Nanofabrication

Summary by NHIP

Electrical Interface for Nanostructures

The method interfaces an electrical connection with a multilayer nanostructure by patterning a diblock copolymer layer containing a matrix and core component. Oriented nanoscopic cylinders form parallel arrays within the layer, which are then selectively removed to create nanopores in a first region while leaving a second region intact before filling the pores with material.

Claim Score by NHIP

Read claim 1, the broadest

Abstract

Pathways to rapid and reliable fabrication of three-dimensional nanostructures are provided. Simple methods are described for the production of well-ordered, multilevel nanostructures. This is accomplished by patterning block copolymer templates with selective exposure to a radiation source. The resulting multi-scale lithographic template can be treated with post-fabrication steps to produce multilevel, three-dimensional, integrated nanoscale media, devices, and systems.

US7189435B2, drawing sheet 1
Sheet 1 of 22

Term

Term ended

Expired 8 October 2023, 3 years ago.

  1. Priority
  2. Filed
  3. Granted
  4. Expired
  5. Today

28 claims: 1 independent, 27 dependent

  1. 1
    Broadest claimClaim Score 54, average(NHIP)A method of interfacing an electrical connection with a multilayer nanostructure, the method comprising:preparing a diblock copolymer layer on a substrate surface, wherein the diblock copolymer layer comprises a matrix component and a core component, and at least a portion of the substrate surface is conductive or semiconductive;depositing a metal layer on at least a portion of the diblock copolymer layer;orienting the core component of the diblock copolymer layer to form a plurality of nanoscopic cylinders parallel to each other within the diblock copolymer layer and oriented with respect to the substrate surface;removing at least a portion of the oriented core component from the diblock copolymer layer to form a patterned array of nanopores in the diblock copolymer layer, wherein the diblock copolymer layer comprises a first region comprising nanopores and a second region comprising no nanopores to form the patterned array of nanopores;and at least partially filling at least some of the nanopores with a material.