Semiconductor device and method of manufacturing the semiconductor device

CROSS-REFERENCE TO RELATED APPLICATIONS

0001This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2004-142765, filed on May 12, 2004, the entire contents of which are herein incorporated by reference.

BACKGROUND OF THE INVENTION

00021. Field of the Invention

0003The present invention generally relates to a semiconductor device and method of manufacture thereof, and more particularly to a semiconductor device and method of manufacture thereof, which includes a column electrode having one end connected to a wiring layer on a semiconductor chip and having the other end connected to an external connection terminal.

00042. Description of the Related Art

0005In recent years, the CSP (chip size package) has come to be increasingly used as a semiconductor device mounted on a small-sized electronic device represented by a portable digital electronic device, such as a cellular phone.

0006Miniaturization and high density can be attained with the CSP type semiconductor device. However, in recent years, the pitch between the external connection terminals is in the tendency that it becomes narrower with the demand for further miniaturization of the semiconductor device.

0007Thus, since the bonding area of the electrode formed in the mounting substrate and the external connection terminal of the semiconductor device becomes small as the external connection terminal pitch becomes narrow, the mounting reliability of the semiconductor device on the mounting substrate will decline.

0008In order to avoid the problem, a semiconductor device in which the column electrode is formed between the semiconductor chip and the external connection terminal is devised (for example, see Japanese Laid-Open Patent Application No. 2002-270721 and Japanese Laid-Open Patent Application No. 2001-291733).

0009It is known that, in the semiconductor device having the column electrode, the stress present in the column electrode and the surrounding resin layer at the time of mounting can be relaxed or absorbed, and the mounting reliability is excellent when compared with the semiconductor device having no column electrode.

0010<figref idref="DRAWINGS">FIG. 1</figref> and <figref idref="DRAWINGS">FIG. 2</figref> show examples of the conventional semiconductor device having the column electrode.

0011The semiconductor device <b>1</b>A shown in <figref idref="DRAWINGS">FIG. 1</figref> includes the insulating film <b>3</b>, such as polyimide, which is formed on the circuit formation surface of the semiconductor chip <b>2</b>A, and the wiring layer <b>4</b> (re-wiring layer) which is formed on the insulating film <b>3</b>.

0012The wiring layer <b>4</b> is electrically connected with the semiconductor chip <b>2</b>A through the hole formed in the insulating film <b>3</b>. The column electrode <b>5</b> is formed in the state where it is set on the wiring layer <b>4</b>.

0013The column electrode <b>5</b> has the cylindrical configuration. In the composition of <figref idref="DRAWINGS">FIG. 1</figref>, the upper end of the column electrode <b>5</b> is bonded to the wiring layer <b>4</b>, and the solder ball <b>7</b> which serves as the external connection terminal is arranged at the lower end through the barrier metal <b>6</b> (for example, Ni and Au plating).

0014Moreover, the encapsulation resin <b>8</b> is formed on the bottom of the semiconductor chip <b>2</b>A. The encapsulation resin <b>8</b> functions to protect the wiring layer <b>4</b> and the column electrode <b>5</b>, and is formed, in the composition of <figref idref="DRAWINGS">FIG. 1</figref>, to have a thickness that is large enough to encapsulate the whole column electrode <b>5</b> except for the lower end where the barrier metal <b>6</b> is formed.

0015For this reason, in the structure of the conventional semiconductor device <b>1</b>A, the end of the column electrode <b>5</b> where the barrier metal <b>6</b> is formed is flush with the surface of the encapsulation resin <b>8</b>, and it is the structure in which the solder ball <b>7</b> and the encapsulation resin <b>8</b> are not separate from each other.

0016On the other hand, the semiconductor device <b>1</b>B shown in <figref idref="DRAWINGS">FIG. 2</figref> is the semiconductor device which receives or outputs the high frequency signal.

0017In <figref idref="DRAWINGS">FIG. 2</figref>, the elements that are essentially the same as corresponding elements in <figref idref="DRAWINGS">FIG. 1</figref> are designated by the same reference numerals and a description thereof will be omitted.

0018Moreover, shown in <figref idref="DRAWINGS">FIG. 2</figref> is the condition in which the semiconductor device <b>1</b>B is mounted on the mounting substrate <b>10</b>, and, the column electrodes <b>5</b> and <b>5</b>A are bonded to the connection electrodes <b>11</b> and <b>11</b>A of the mounting substrate <b>10</b> through the solder balls <b>7</b>.

0019As mentioned above, the semiconductor device <b>1</b>B is provided for the high-frequency signal transmission, and the column electrode <b>5</b>A and the connection electrode <b>11</b>A with which the high-frequency signal is exchanged are smaller in size than the column electrode <b>5</b> and the connection electrode <b>11</b> for the parasitic-capacitance reduction between the semiconductor chip <b>2</b>B and the wiring layer <b>4</b> (re-wiring). In <figref idref="DRAWINGS">FIG. 2</figref>, reference numeral <b>9</b> indicates the passivation film.

0020In the semiconductor devices <b>1</b>A and <b>1</b>B of <figref idref="DRAWINGS">FIG. 1</figref> and <figref idref="DRAWINGS">FIG. 2</figref>, the stress present at the time of mounting can be relaxed or absorbed by the column electrodes <b>5</b> and <b>5</b>A and the surrounding encapsulation resin <b>8</b>, and the improvement in the mounting reliability can be aimed at.

0021However, in this connection, if the further miniaturization and high density of the semiconductor devices <b>1</b>A and <b>1</b>B progress and the adoption of smaller pitch of the solder balls <b>7</b> (external connection terminals) progresses further, the decline of the mounting reliability will be produced similarly even with the semiconductor devices <b>1</b>A and <b>1</b>B using the column electrodes <b>5</b> and <b>5</b>A.

0022Moreover, the problem arises in that the reduction of the distance of the adjoining column electrodes <b>5</b> and <b>5</b>A by the adoption of smaller pitch will easily cause the occurrence of the short circuiting (bridging) between the adjoining solder balls <b>7</b> at the time of arranging the solder balls <b>7</b> in the column electrodes <b>5</b> and <b>5</b>A and at the time of bonding the column electrodes <b>5</b> and <b>5</b>A to the connection electrodes <b>11</b> and <b>11</b>A of the mounting substrate <b>10</b>.

0023Especially when the solder is used as a material of the external connection terminal as shown in <figref idref="DRAWINGS">FIG. 1</figref> and <figref idref="DRAWINGS">FIG. 2</figref>, in the composition in which the tips of the column electrodes <b>5</b> and <b>5</b>A and the surface of the encapsulation resin <b>8</b> are almost flush with each other, the solvent component in the solder flows on the surface of the encapsulation resin <b>8</b> at the time of heating, and it is easily in contact with the adjacent column electrodes <b>5</b> and <b>5</b>A. Since the solvent component have good wettability to the solder, the short circuiting of the adjoining column electrodes <b>5</b> and <b>5</b>A with the solder balls <b>7</b> will be caused by the contact of the solvent component as a result.

0024Furthermore, in the composition in which the encapsulation resin <b>8</b> encapsulates the whole column electrodes <b>5</b> and <b>5</b>A (except for the tips thereof), the thickness of the semiconductor devices <b>1</b>A and <b>1</b>B of <figref idref="DRAWINGS">FIG. 1</figref> and <figref idref="DRAWINGS">FIG. 2</figref> is comparatively large.

0025For this reason, there is the problem in that the difference of the thermal expansion occurs between the silicon of the semiconductor chips <b>2</b>A and <b>2</b>B and the encapsulation resin <b>8</b> having a coefficient of thermal expansion different from that of the silicon, and the occurrence of the curvature will be easily produced in the semiconductor devices <b>1</b>A and <b>1</b>B.

SUMMARY OF THE INVENTION

0026An object of the present invention is to provide an improved semiconductor device in which the above-mentioned problems are eliminated.

0027Another object of the present invention is to provide a semiconductor device in which the short circuiting of the adjoining external connection terminals can be inhibited and the occurrence of the curvature can be inhibited.

0028Another object of the present invention is to provide a method of manufacturing a semiconductor device in which the short circuiting of the adjoining external connection terminals can be inhibited and the occurrence of the curvature can be inhibited.

0029The above-mentioned objects of the present invention are achieved by a semiconductor device comprising: a semiconductor chip; a wiring layer formed on the semiconductor chip; a column electrode connected at a first end to the wiring layer; and an encapsulation resin formed on the semiconductor chip; wherein the column electrode is provided with a second end, opposite to the first end, projecting from the encapsulation resin, and an external connection member is connected to the column electrode at the second end so that the external connection member is separate from a surface of the encapsulation resin.

0030According to the semiconductor device of the present invention, the external connection terminal and the encapsulation resin surface is made separate from each other, and the short circuiting (bridging) of the adjoining external connection terminals at the time of formation of the external connection terminals and at the time of mounting of the semiconductor device can be prevented. Moreover, by making the external connection terminal and the encapsulation resin separate, the thickness of the encapsulation resin can be made small, and the amount of the curvature present in the semiconductor device can be reduced.

0031The above-mentioned semiconductor device may be provided so that a clearance between the encapsulation resin surface and the external connection member is above 10 micrometers and below 80 micrometers.

0032According to the present invention, the clearance between the encapsulation resin and the external connection member is set in a range of between 10 micrometers and 80 micrometers, and the prevention of the short circuiting of the adjoining external connection terminals and the prevention of the curvature present in the semiconductor device are effectively realizable.

0033The above-mentioned semiconductor device may be provided so that a barrier metal is provided between the column electrode and the external connection member.

0034According to the present invention, the junction reliability of the column electrode and the external connection member can be raised with the use of the barrier metal.

0035The above-mentioned semiconductor device may be provided so that a cross-sectional area of the column electrode in contact at the second end with the external connection member is larger than a cross-sectional area of the column electrode in contact at the first end with the wiring layer.

0036According to the present invention, the cross-sectional area of the column electrode in the portion where the column electrode and the wiring layer touch can be made small, and the improvement in the characteristics is realizable with the reduction of the parasitic capacitance between the column electrode and the semiconductor chip. Moreover, the cross-sectional area of the column electrode in the portion which the column electrode and the external connection member touch can be enlarged, and it is possible to raise the junction strength of the column electrode and the external connection member, and the decline of the mounting reliability can be prevented.

0037The above-mentioned semiconductor device may be provided so that the cross-sectional area of the column electrode increases continuously from at the first end to at the second end according to a distance from the wiring layer.

0038Moreover, the above-mentioned semiconductor device may be provided so that the cross-sectional area of the column electrode has a stepwise increase from at the first end to at the second end according to a distance from the wiring layer.

0039According to the present invention, the diameter of the column electrode in the portion where the column electrode and the wiring layer touch can be made small, and the improvement in the characteristics is realizable with the reduction of the parasitic capacitance between the column electrode and the semiconductor chip. Moreover, the diameter of the column electrode in the portion where the column electrode and the external connection member touch can be enlarged, and it is possible to raise the junction strength of the column electrode and the external connection member, and the decline of the mounting reliability can be prevented.

0040Moreover, the above-mentioned objects of the present invention are achieved by a method of manufacturing a semiconductor device, the method comprising the steps of: forming a wiring layer on a semiconductor substrate; forming a resist having an opening which is used for forming a column electrode on the wiring layer, and forming a conductive metal in the opening using the resist so that a thickness of the conductive metal exceeds a thickness of the resist; forming an encapsulation resin on the semiconductor substrate after the resist is removed; and performing processing to make a thickness of the formed encapsulation resin small.

0041According to the present invention, the end of the column electrode is separated from the surface of the encapsulation resin by performing the processing to make the thickness of the encapsulation resin small, and it is possible to simply and certainly separate the end of the column electrode from the encapsulation resin surface.

0042The above-mentioned manufacturing method may be provided so that the processing to make the thickness of the formed encapsulation resin small is performed by using etching.

0043According to the present invention, the thickness of the encapsulation resin is made small by performing the etching after the encapsulation resin is formed, and at the time of the etching, the unnecessary encapsulation resin adhering to the surface of the column electrode etc. can be removed completely, and, therefore, the improvement in the yield at the time of external terminal formation can be aimed at.

0044The above-mentioned manufacturing method may be provided to further comprise the step of forming, after the processing to make the thickness of the formed encapsulation resin small is performed, an external connection member at an end of the column electrode separate from a surface of the encapsulation resin.

0045According to the present invention, after the end of the column electrode is separated from the surface of the encapsulation resin by making the thickness of the encapsulation resin small, the external connection member is formed at the end of the column electrode. Even if the solvent component flows from the external connection member at the time of the formation of the external connection member, the solvent component is present to the end of the column electrode projecting from the surface of the encapsulation resin. The short circuiting of the adjoining external connection members due to the solvent component as in the conventional semiconductor device can be prevented.

0046The above-mentioned manufacturing method may be provided so that the encapsulation resin is formed using a transfer molding method.

0047According to the present invention, when the transfer molding method is used, the encapsulation of resin can be carried out regardless of the height of the column electrode. The coefficient of linear expansion or the like can be freely chosen because the size or amount of filler in the encapsulation resin can be freely changed.

0048According to the present invention, the short circuiting (bridging) of the adjoining external connection terminals at the time of formation of the external connection terminals and at the time of mounting of the semiconductor device can be prevented. Moreover, the encapsulation resin can be made thin by separating the external connection terminal and the encapsulation resin from each other, and the amount of the curvature present in the semiconductor device can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

0049Other objects, features and advantages of the present invention will be apparent from the following detailed description when read in conjunction with the accompanying drawings.

0050<figref idref="DRAWINGS">FIG. 1</figref> is a cross-sectional diagram showing the composition of a conventional semiconductor device.

0051<figref idref="DRAWINGS">FIG. 2</figref> is a cross-sectional diagram showing the composition of a conventional semiconductor device.

0052<figref idref="DRAWINGS">FIG. 3</figref> is a cross-sectional diagram showing the composition of a semiconductor device in the first preferred embodiment of the invention.

0053<figref idref="DRAWINGS">FIG. 4</figref> is a cross-sectional diagram showing the condition in which the structure of the semiconductor device of the first preferred embodiment is mounted on the mounting substrate.

0054<figref idref="DRAWINGS">FIG. 5A</figref> and <figref idref="DRAWINGS">FIG. 5B</figref> are diagrams for explaining the structure of the semiconductor device of the first preferred embodiment in comparison with the conventional semiconductor device.

0055<figref idref="DRAWINGS">FIG. 6A</figref> and <figref idref="DRAWINGS">FIG. 6B</figref> are diagrams for explaining the structure of the semiconductor device of the first preferred embodiment in comparison with the conventional semiconductor device.

0056<figref idref="DRAWINGS">FIG. 7A</figref> through <figref idref="DRAWINGS">FIG. 7F</figref> are diagrams for explaining the method of manufacturing the semiconductor device in the first preferred embodiment of the invention.

0057<figref idref="DRAWINGS">FIG. 8</figref> is a cross-sectional diagram showing the composition of a semiconductor device in the second preferred embodiment of the invention.

0058<figref idref="DRAWINGS">FIG. 9</figref> is a cross-sectional diagram showing the composition of a semiconductor device in the third preferred embodiment of the invention.

0059<figref idref="DRAWINGS">FIG. 10</figref> is a cross-sectional diagram showing the composition of a semiconductor device in the fourth preferred embodiment of the invention.

0060<figref idref="DRAWINGS">FIG. 11A</figref> through <figref idref="DRAWINGS">FIG. 11F</figref> are diagrams for explaining the method of manufacturing the semiconductor device in the second preferred embodiment of the invention.

0061<figref idref="DRAWINGS">FIG. 12A</figref> and <figref idref="DRAWINGS">FIG. 12B</figref> are diagrams for explaining how to form unevenness at the tip of the column electrode in the method of manufacturing the semiconductor device in the second preferred embodiment of the invention.

0062<figref idref="DRAWINGS">FIG. 13A</figref> through <figref idref="DRAWINGS">FIG. 13C</figref> are diagrams for explaining the method of manufacturing the semiconductor device in the fourth preferred embodiment of the invention.

0063<figref idref="DRAWINGS">FIG. 14</figref> is a cross-sectional diagram showing the composition of a semiconductor device in the fifth preferred embodiment of the invention.

0064<figref idref="DRAWINGS">FIG. 15A</figref> through <figref idref="DRAWINGS">FIG. 15F</figref> are diagrams for explaining the method of manufacturing the semiconductor device in the fifth preferred embodiment of the invention.

0065<figref idref="DRAWINGS">FIG. 16</figref> is a cross-sectional diagram showing the composition of a semiconductor device in the sixth preferred embodiment of the invention.

0066<figref idref="DRAWINGS">FIG. 17A</figref> through <figref idref="DRAWINGS">FIG. 17G</figref> are diagrams for explaining the method of manufacturing the semiconductor device in the sixth preferred embodiment of the invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

0067A description will now be given of the preferred embodiments of the present invention with reference to the accompanying drawings.

0068<figref idref="DRAWINGS">FIG. 3</figref> shows a semiconductor device <b>20</b>A in the first preferred embodiment of the present invention.

0069The semiconductor device <b>20</b>A is the CSP (chip size package) with which miniaturization and high density of the semiconductor device can be attained. For example, this semiconductor device <b>20</b>A is mounted on a portable digital electronic device, such as a cellular phone.

0070The semiconductor device <b>20</b>A generally comprises the semiconductor chip <b>22</b>, the wiring layer <b>24</b>, the column electrode <b>25</b>A, the solder ball <b>27</b>, and the encapsulation resin <b>28</b>.

0071The semiconductor chip <b>22</b> is the silicon substrate on which an electronic circuit is formed, and the undersurface of the semiconductor chip <b>22</b> in <figref idref="DRAWINGS">FIG. 3</figref> is the circuit-formation surface.

0072The insulating film <b>23</b> is formed on the circuit-formation surface of the semiconductor chip <b>22</b>. For example, as a material of the insulating film <b>23</b>, polyimide can be used.

0073The wiring layer <b>24</b> is formed on the insulating film <b>23</b>. The wiring layer <b>24</b> functions as the so-called re-wiring layer, and the end of the wiring layer <b>24</b> is connected to the electrode part (not shown) of the semiconductor chip <b>22</b> through the hole formed in the insulating film <b>23</b>.

0074Moreover, the other end of the wiring layer <b>24</b> is extended to the predetermined position where the electrode pad <b>38</b> is formed integrally with the wiring layer <b>24</b>. For example, the wiring layer <b>24</b> is formed of copper.

0075The column electrode <b>25</b>A comprises the post part <b>35</b>A in the cylindrical form, and the tip <b>36</b>A having the diameter R<b>2</b> larger than the diameter R<b>1</b> of the post part <b>35</b>A.

0076The post part <b>35</b>A and the tip <b>36</b>A are formed integrally through the plating method which will be mentioned later. Moreover, the whole column electrode <b>25</b>A is configured in a mushroom-like formation.

0077The upper end of the post part <b>35</b>A (on the side where the tip <b>36</b>A is not formed) is bonded to the wiring layer <b>24</b> (the electrode pad <b>38</b>) integrally. Moreover, the solder ball <b>27</b> is arranged at the tip <b>36</b>A, which is formed at the other end of the post part <b>35</b>A, through the barrier metal <b>26</b>. For example, the barrier metal <b>26</b> is formed through the metal plating of Au and Ni.

0078In the composition of <figref idref="DRAWINGS">FIG. 3</figref>, the junction reliability of the column electrode <b>25</b>A and the solder ball <b>27</b> can be raised by forming the barrier metal <b>26</b> between the column electrode <b>25</b>A and the solder ball <b>27</b>.

0079Moreover, the diameter R<b>2</b> of the tip <b>36</b>A in which the solder ball <b>27</b> is arranged as mentioned above is larger than the diameter R<b>1</b> of the post part <b>35</b>A (R<b>1</b>&lt;R<b>2</b>), and the bonding area of the solder ball <b>27</b> and the tip <b>36</b>A is larger than that of the column electrode of the cylinder form as in the conventional semiconductor device, and it is possible to raise the junction reliability of the solder ball <b>27</b> and the tip <b>36</b>A.

0080The encapsulation resin <b>28</b> is formed on the circuit formation surface of the semiconductor chip <b>22</b>. The encapsulation resin <b>28</b> is formed in order to protect the wiring layer <b>24</b> and the column electrode <b>25</b>A. For example, an epoxy resin can be used as a material of the encapsulation resin <b>28</b>.

0081A description will now be given of the column electrode <b>25</b>A and the encapsulation resin <b>28</b> which constitute the semiconductor device <b>20</b>A.

0082In the present embodiment, the semiconductor device <b>20</b>A is provided so that the column electrode <b>25</b>A projects from the encapsulation resin <b>28</b>, and the solder ball <b>27</b> which is used as the external connection member is arranged at the end (namely, the tip <b>36</b>A) of the column electrode <b>25</b>A projecting from the encapsulation resin <b>28</b>. Hence, the solder ball <b>27</b> is separated from the surface of the encapsulation resin <b>28</b>.

0083In the above embodiment, the height amount H<b>2</b> of the column electrode <b>25</b>A from the surface of the encapsulation resin <b>28</b> (which is the clearance between the surface of the encapsulation resin <b>28</b> and the interface of the post part <b>35</b>A and the tip <b>36</b>A) is set in a range of between 10 micrometers and 80 micrometers. This clearance is equivalent to about ½–⅓ of the height of the column electrode <b>25</b>A.

0084In addition, the clearance H<b>1</b> between the surface (circuit formation surface) of the semiconductor chip <b>22</b> and the interface of the post part <b>35</b>A and the tip <b>36</b>A is about 100 micrometers.

0085<figref idref="DRAWINGS">FIG. 4</figref> shows the condition in which the above-mentioned structure of the semiconductor device <b>20</b>A (wherein the column electrode <b>25</b>A projects from the surface of the encapsulation resin <b>28</b>) is mounted on the mounting substrate <b>30</b>.

0086In the composition of <figref idref="DRAWINGS">FIG. 4</figref>, the column electrode <b>25</b>A is made to project from the surface of the encapsulation resin <b>28</b>, and the solder ball <b>27</b> arranged in the tip <b>36</b>A of the column electrode <b>25</b>A is also separated from the surface of the encapsulation resin <b>28</b>.

0087In addition, the connection electrode <b>31</b> corresponding to the forming position of the column electrode <b>25</b>A in the mounting substrate <b>30</b> is formed, and the region other than the forming position of the connection electrode <b>31</b> is protected by the solder resist <b>32</b>.

0088In the present embodiment, by separating the solder ball <b>27</b> and the encapsulation resin <b>28</b> from each other, it is possible to prevent the bridging (shorting) of the adjoining solder balls <b>27</b> at the time of the mounting shown in <figref idref="DRAWINGS">FIG. 4</figref>.

0089The semiconductor chip <b>22</b> is pressed by the mounting substrate <b>30</b> at the time of the mounting, and the compressive force tends to act on the solder ball <b>27</b>, and the deformation is caused thereby.

0090In the composition of the conventional semiconductor device (<figref idref="DRAWINGS">FIG. 1</figref>), the solder ball <b>7</b> is in contact with the encapsulation resin <b>8</b>, and the solder ball <b>7</b> tends to deform in the transverse direction (which is the direction to approach the adjoining solder ball <b>7</b>) by the compressive force, and this will cause the occurrence of the short circuiting.

0091However, the semiconductor device <b>20</b>A of the present embodiment is configured so that the solder ball <b>27</b> and the encapsulation resin <b>28</b> are separated from each other, and the column electrode <b>25</b>A (the post part <b>35</b>A) is located between the solder ball <b>27</b> and the encapsulation resin <b>28</b>.

0092For this reason, even when the solder ball <b>27</b> is compressed, the solder ball <b>27</b> transfers along the column electrode <b>25</b>A to the portion where the solder ball <b>27</b> and the encapsulation resin <b>28</b> are separated. Therefore, it is possible to prevent the occurrence of bridging (short circuiting) between the adjoining solder balls <b>27</b>, and the mounting reliability can be raised.

0093<figref idref="DRAWINGS">FIG. 5A</figref> and <figref idref="DRAWINGS">FIG. 5B</figref> are diagrams for explaining the structure of the semiconductor device of the present embodiment in comparison with the conventional semiconductor device with respect to the ability to prevent the short circuiting (bridging) between the adjoining solder balls <b>27</b>. <figref idref="DRAWINGS">FIG. 5A</figref> shows the conventional semiconductor device and <figref idref="DRAWINGS">FIG. 5B</figref> shows the semiconductor device of the present embodiment.

0094The solder ball <b>27</b> is arranged in the column electrode <b>25</b>A through the printing method which generally uses the solder paste.

0095As is well known, in the solder paste, the solvent component is mixed with the solder powder, and a material of the solvent component with good wettability to the solder is selected.

0096When forming the solder balls <b>7</b> and <b>27</b> using the solder paste, the solder paste is printed to the column electrodes and <b>25</b>A, and the reflow processing is carried out.

0097By heating at the time of the reflow processing, the liquid-like solvent components <b>14</b> and <b>34</b> are present from the solder paste.

0098When the tip of the column electrode <b>5</b> is almost flush with the surface of the encapsulation resin <b>8</b> as in the conventional semiconductor device shown in <figref idref="DRAWINGS">FIG. 5A</figref>, the solvent component <b>14</b> spreads over the surface of the encapsulation resin <b>8</b>, and easily reaches the position (or the position where the solder ball <b>7</b> is formed) of the adjoining column electrode <b>5</b>.

0099Since the solvent component <b>14</b> has good wettability to the solder as described above, the molten solder spreads along with the solvent component <b>14</b>. Therefore, the short circuiting (bridging) between the adjoining solder balls <b>7</b> may easily occur.

0100If the adoption of smaller pitch progresses, the spreading range of the solvent component <b>14</b> is restricted, and the tendency becomes remarkable.

0101On the other hand, in the present embodiment, it is configured so that the solder ball <b>27</b> and the surface of the encapsulation resin <b>28</b> are separated from each other. As shown in <figref idref="DRAWINGS">FIG. 5B</figref>, the solvent component <b>34</b> stops with the surface tension between the tip <b>36</b>A of the column electrode <b>25</b>A and the surface of the encapsulation resin <b>28</b>, and it does not spread on the surface of the encapsulation resin <b>28</b>. Therefore, it is possible to prevent the occurrence of the short circuiting between the adjoining solder balls <b>27</b>.

0102Moreover, the solder ball <b>27</b> and the surface of the encapsulation resin <b>28</b> are separated from each other in the present embodiment, and it is possible to prevent the separation of the solder ball <b>27</b> from the column electrode <b>25</b>A due to the stress concentration.

0103<figref idref="DRAWINGS">FIG. 6A</figref> and <figref idref="DRAWINGS">FIG. 6B</figref> are diagrams for explaining the structure of the semiconductor device of the present embodiment in comparison with the conventional semiconductor device with respect to the ability to prevent the separation of the solder ball <b>27</b> from the column electrode <b>25</b>A. <figref idref="DRAWINGS">FIG. 6A</figref> shows the conventional example and <figref idref="DRAWINGS">FIG. 6B</figref> shows the semiconductor device of the present embodiment.

0104In the conventional semiconductor device <b>1</b>A of <figref idref="DRAWINGS">FIG. 6A</figref>, the tip of the column electrode <b>5</b> is almost flush with the surface of the encapsulation resin <b>8</b>, and the time of mounting the conventional semiconductor device <b>1</b>A, the stress concentration occurs at the interface of the column electrode <b>5</b> and the solder ball <b>7</b> (the position of the interface will be called the stress raiser <b>13</b>).

0105Thus, in the conventional semiconductor device <b>1</b>A, the stress is concentrated at the stress raiser <b>13</b>, and the separation of the solder ball <b>7</b> from the column electrode <b>5</b> may occur frequently.

0106On the other hand, in the semiconductor device <b>20</b>A of the present embodiment shown in <figref idref="DRAWINGS">FIG. 6B</figref>, the mounting reliability can be raised with the enlarged diameter of the tip <b>36</b>A and the increased bonding area of the solder ball <b>27</b> and the column electrode <b>25</b>A.

0107Furthermore, in the present embodiment, the solder ball <b>27</b> and the encapsulation resin <b>28</b> are separated from each other, and the place where the stress is impressed at the time of mounting can be made to disperse to the interface (the first stress raiser <b>33</b>A) of the column electrode <b>25</b>A and the solder ball <b>27</b> and the interface (the second stress raiser <b>33</b>B) of the surface of the encapsulation resin <b>28</b> and the side surface of the column electrode <b>25</b>A. Thus, by dispersing the stress, it is possible to prevent the separation of the solder ball <b>27</b> from the column electrode <b>25</b>A, and the further improvement in the mounting reliability can be realized.

0108Moreover, by making the encapsulation resin <b>28</b> thin in order to separate the solder ball <b>27</b> and the encapsulation resin <b>28</b> from each other, the curvature that may be present in the semiconductor device <b>20</b>A can be prevented.

0109That is, there is a large difference in the coefficient of thermal expansion between the resin (such as an epoxy resin) of the encapsulation resin <b>28</b> and the silicon of the semiconductor chip <b>22</b>. In the conventional semiconductor device, the height of the column electrode is the same as the thickness of the encapsulation resin, and it is impossible to set up the thickness of the encapsulation resin arbitrarily.

0110If the encapsulation resin is thick, the influence of the heat deformation of the encapsulation resin will be significant, and the curvature of the semiconductor device will easily occur due to the thermal expansion difference of the semiconductor chip and the encapsulation resin.

0111On the other hand, in the present embodiment, the thickness of the encapsulation resin <b>28</b> can be set up irrespective of the height of the column electrode <b>25</b>A, and the encapsulation resin <b>28</b> can be made thin. Thereby, the influence of the thermal expansion of the encapsulation resin <b>28</b> in the semiconductor device <b>20</b>A can be made small, and the amount of the curvature present in the semiconductor device <b>20</b>A can be reduced.

0112As described above, it is desirable that the clearance between the surface of the encapsulation resin <b>28</b> and the solder ball <b>27</b> is in a range of between 10 micrometers and 80 micrometers. If the clearance is set to be smaller than 10 micrometers, the possibility that the short circuiting of the adjoining solder balls <b>27</b> occurs is increased. If the clearance is set to be larger than 80 micrometers, it becomes difficult to ensure the protection of the wiring layer <b>24</b> and the column electrode <b>25</b>A which is the original function of the encapsulation resin <b>28</b>.

0113Since the stress concerning the stress raiser itself declines by the reduction of the curvature, the improvement in the further mounting reliability is realizable.

0114Next, the manufacture method of the semiconductor device <b>20</b>A in the first preferred embodiment will now be explained.

0115<figref idref="DRAWINGS">FIG. 7A</figref> through <figref idref="DRAWINGS">FIG. 7F</figref> show the manufacture method of the semiconductor device <b>20</b>A in the present embodiment.

0116In order to manufacture the semiconductor device <b>20</b>A, the insulating film <b>23</b>, such as polyimide, is formed through the spin coating method etc. on the surface of the semiconductor substrate <b>21</b> (the dicing is carried out subsequently and it becomes the semiconductor chip <b>22</b>) on which the circuit formation is performed in advance, and the hole <b>23</b><i>a </i>in the insulating film <b>23</b> is formed at the position corresponding to the position of the electrode part of the semiconductor substrate <b>21</b>.

0117Next, the semiconductor substrate <b>21</b> in which the insulating film <b>23</b> is formed is mounted on the sputtering device, and the sputtering film <b>40</b>, used as the seed layer of the electrolysis metal plating which will be mentioned later, is formed. <figref idref="DRAWINGS">FIG. 7A</figref> shows the condition in which the sputtering film <b>40</b> is formed. The material of the sputtering film <b>40</b> may be any metal from among those such as titanium (Ti), chromium (Cr) and copper (Cu) if the metal has the barrier metal effect.

0118Next, the wiring resist <b>42</b> having the opening (pattern) corresponding to the form of the wiring layer <b>24</b> is formed on the upper part of the sputtering film <b>40</b>. And the electrolysis metal plating of copper is performed by using the above mentioned sputtering film <b>40</b> as the seed layer. As shown in <figref idref="DRAWINGS">FIG. 7B</figref>, the metal-plating layer <b>41</b> is formed.

0119After removing the wiring resist <b>42</b>, the electrode resist <b>43</b> having the opening (pattern) corresponding to the column electrode <b>25</b>A is arranged on the upper part of the metal-plating layer <b>41</b>. For example, the dry film resist (DFR) can be used as the material of the electrode resist <b>43</b>.

0120And the electrolysis metal plating of copper is performed by using the sputtering film <b>40</b> and the metal-plating layer <b>41</b> as the power supply layer. As shown in <figref idref="DRAWINGS">FIG. 7C</figref>, the column electrode <b>25</b>A is formed.

0121In addition, copper (Cu) is used in the present embodiment as the material of the metal-plating layer <b>41</b> (wiring layer <b>24</b>) and the column electrode <b>25</b>A. However, as long as it is the metal with which the metal plating growth is possible, it is possible to use any other metal instead of copper.

0122When the electrolysis metal plating is completed, as shown in <figref idref="DRAWINGS">FIG. 7C</figref>, the column electrode <b>25</b>A is formed with the tip <b>36</b>A, and the tip <b>36</b>B which has the diameter larger than the diameter of the tip <b>36</b>A.

0123In order to form the column electrode <b>25</b>A having the above configuration, the copper-plating processing to form the column electrode <b>25</b>A is performed until it exceeds the thickness of the electrode resist <b>43</b>. Thereby, the tip <b>36</b>A having the diameter and area larger than the diameter and area of the post part <b>35</b>A is formed on the upper surface of the electrode resist <b>43</b>.

0124In the present embodiment, after the column electrode <b>25</b>A is formed in this manner, the barrier metal <b>26</b> is formed on the surface of the tip <b>36</b>A by performing the metal plating of golden (Au) and nickel (Ni).

0125When the column electrode <b>25</b>A and the barrier metal <b>26</b> are formed as mentioned above, the removal of the electrode resist <b>43</b> is performed.

0126Next, the unnecessary portion of the metal-plating layer <b>41</b> is removed by etching, and thereby the wiring layer <b>24</b> of a predetermined form which has the electrode pad <b>38</b> is formed. Moreover, in this condition, the column electrode <b>25</b>A is set up on the electrode pad <b>38</b> (not shown).

0127Next, the transfer-mold processing (for example, about 175 degrees C.) is performed with the semiconductor substrate <b>21</b> in which the column electrode <b>25</b>A is formed being arranged in the mold, in order for forming the encapsulation resin <b>28</b>. At this time, the resin film is infixed to the portion where the tip <b>36</b>A of the column electrode <b>25</b>A contacts the mold cavity of the mold. Thereby it is prevented that the resin adheres to the column electrode <b>25</b>A, and the deformation of the tip <b>36</b>A is prevented.

0128Thus, the encapsulation resin <b>28</b> is formed using the transfer molding method, and it is possible to carry out the encapsulation of the column electrode <b>25</b>A with the encapsulation resin <b>28</b> regardless of the height of the column electrode <b>25</b>A. It is also possible to choose the coefficient of linear expansion etc. freely since the amount of filler and the size in the encapsulation resin <b>28</b> can be freely changed.

0129<figref idref="DRAWINGS">FIG. 7D</figref> shows the condition in which the encapsulation resin <b>28</b> is formed on the semiconductor substrate <b>21</b>. As shown in <figref idref="DRAWINGS">FIG. 7E</figref>, the surface of the encapsulation resin <b>28</b> is located, immediately after the transfer molding is performed, at the boundary portion of the post part <b>35</b>A and the tip <b>36</b>A.

0130After the formation of the encapsulation resin <b>28</b> is completed as mentioned above, the processing to make the thickness of the encapsulation resin <b>28</b> small is carried out.

0131In the present embodiment, etching processing is used as the method of making the thickness of the encapsulation resin <b>28</b> small thin.

0132After the etching processing is performed, the tip (tip <b>36</b>A) of the column electrode <b>25</b>A and the surface of the encapsulation resin <b>28</b> are separated from each other by the distance H<b>2</b> as shown in <figref idref="DRAWINGS">FIG. 7E</figref>.

0133The etching device is the device which is generally used for the resist removal. Therefore, by using the etching device, the encapsulation resin <b>28</b> can be made thin with ease and low cost with no need to introduce a new device.

0134Moreover, even if the unnecessary resin adheres to the surface of the column electrode <b>25</b>A at the time of the formation of the encapsulation resin <b>28</b>, the unnecessary resin can be removed by using the etching device. Thereby, the solder ball <b>27</b> can be certainly arranged to the column electrode <b>25</b>A, and improvement in the yield at the time of the formation of the solder ball <b>27</b> can be aimed at.

0135At the end of the etching processing, the processing which forms the solder ball <b>27</b> in the column electrode <b>25</b>A is continuously performed. The method of forming the solder ball <b>27</b> may include: the transferring method in which the solder balls formed, in advance, in another process are mounted on the column electrode <b>25</b>A; and the reflow method (also called the printing method) in which, after printing the solder to the column electrode <b>25</b>A, the solder ball is formed through reflow processing.

0136In the case of the adoption of small pitch with the diameter of the solder ball <b>27</b> smaller than 0.5 mm, the jig for ball loading becomes expensive, and the printing method is more advantageous than the transferring method.

0137Moreover, the material of the solder ball <b>27</b> may be the eutectic solder or the so-called lead-free solder. It is not limited to a specific material, and either of such solder materials may be used.

0138Then, the semiconductor device <b>20</b>A shown in <figref idref="DRAWINGS">FIG. 7F</figref> is manufactured by carrying out the dicing of the semiconductor substrate <b>21</b> to cut the same into pieces corresponding to the semiconductor chip <b>22</b>.

0139In the manufacture method of the semiconductor device <b>20</b>A of the present embodiment, after making the end (tip <b>36</b>A) of the column electrode <b>25</b>A separate from the surface of the encapsulation resin <b>28</b> by making the encapsulation resin <b>28</b> thin, in order to form the solder ball <b>27</b> in the end of the column electrode <b>25</b>A.

0140As previously explained using <figref idref="DRAWINGS">FIG. 5</figref>, even if the solvent component <b>34</b> is present at the time of the reflow of the solder ball <b>27</b>, it is possible to prevent the occurrence of the short circuiting (bridging) between the adjoining solder balls <b>27</b>.

0141Next, the semiconductor devices <b>20</b>B–<b>20</b>D in the second to fourth preferred embodiments of the invention will be explained using <figref idref="DRAWINGS">FIG. 8</figref> to <figref idref="DRAWINGS">FIG. 10</figref>.

0142In addition, in <figref idref="DRAWINGS">FIG. 8</figref> through <figref idref="DRAWINGS">FIG. 10</figref>, the elements that are the same as corresponding elements in <figref idref="DRAWINGS">FIG. 2</figref> through <figref idref="DRAWINGS">FIG. 7</figref> are designated by the same reference numerals, and a description thereof will be omitted.

0143Similar to the first preferred embodiment, the column electrodes <b>25</b>B–<b>25</b>D in the semiconductor devices <b>20</b>B–<b>20</b>D in the second to fourth preferred embodiments shown in <figref idref="DRAWINGS">FIG. 8</figref> to <figref idref="DRAWINGS">FIG. 10</figref> comprise the post parts <b>35</b>B–<b>35</b>D and the tips <b>36</b>B–<b>36</b>D, respectively.

0144Moreover, in the semiconductor devices <b>20</b>B–<b>20</b>D, the tips <b>36</b>B–<b>36</b>D of the column electrodes <b>25</b>B–<b>25</b>D project from the surface of the encapsulation resin <b>28</b>, and, therefore, the solder ball <b>27</b> is separated from the surface of the encapsulation resin <b>28</b>.

0145The semiconductor device <b>20</b>B of the second preferred embodiment is provided so that the contact area of the solder ball <b>27</b> and the column electrode <b>25</b>B is increased by forming the sawtooth unevenness on the tip <b>36</b>B.

0146Moreover, the semiconductor device <b>20</b>C of the third preferred embodiment is provided so that the contact area of the solder ball <b>27</b> and the column electrode <b>25</b>C is increased by forming the wavelike unevenness on the tip <b>36</b>C.

0147Furthermore, the semiconductor device <b>20</b>D of the fourth preferred embodiment is provided so that the contact area of the solder ball <b>27</b> and the column electrode <b>25</b>D is increased and the solder ball <b>27</b> can also touch the side surface of the tip <b>36</b>D by forming the barrier metal <b>26</b> to the side part of the tip <b>36</b>D.

0148With respect to each of the semiconductor devices <b>20</b>B–<b>20</b>D in the second to fourth preferred embodiments, the tips <b>36</b>B–<b>36</b>D of the column electrodes <b>25</b>B–<b>25</b>D project from the surface of the encapsulation resin <b>28</b>, and an increase of the contact area of the solder ball <b>27</b> and the tips <b>36</b>B–<b>36</b>D from that in the first preferred embodiment mentioned above is achieved. Therefore, the same effect as the above-described semiconductor device <b>20</b>A of the first preferred embodiment is realizable.

0149<figref idref="DRAWINGS">FIGS. 11A to 11F</figref> and <figref idref="DRAWINGS">FIGS. 12A and 12B</figref> show the manufacture method of the semiconductor device <b>20</b>B in the second preferred embodiment.

0150In addition, a description of the processing which is the same as in the manufacture method of the semiconductor device <b>20</b>A of the first preferred embodiment will be omitted.

0151The processing shown in <figref idref="DRAWINGS">FIG. 11A</figref> and <figref idref="DRAWINGS">FIG. 11B</figref> is the same as that of the manufacture method of the semiconductor device <b>20</b>A described above using <figref idref="DRAWINGS">FIG. 7A</figref> through <figref idref="DRAWINGS">FIG. 7F</figref>.

0152After the metal-plating layer <b>41</b> is formed as shown in <figref idref="DRAWINGS">FIG. 11B</figref>, the same processing as described above using <figref idref="DRAWINGS">FIG. 7C</figref> is carried out, and the column electrode <b>25</b>B is formed in the resist <b>43</b> for the electrodes.

0153In the first preferred embodiment shown in <figref idref="DRAWINGS">FIG. 7C</figref>, the tip <b>36</b>A is formed in the upper part of the resist <b>43</b> for the electrodes. However, in the present embodiment, before the tip <b>36</b>A is formed, the electrolysis metal plating is suspended. Thereby, in the present embodiment, the column electrode <b>25</b>B (refer to <figref idref="DRAWINGS">FIG. 12A</figref>) is formed through the electrolysis metal plating.

0154After the column electrode <b>25</b>B of the cylindrical configuration is formed in this way, the processing which forms the tip <b>36</b>B with sawtooth unevenness in the column electrode <b>25</b>B is performed.

0155<figref idref="DRAWINGS">FIG. 12A</figref> and <figref idref="DRAWINGS">FIG. 12B</figref> show the method of forming the tip <b>36</b>B with sawtooth unevenness.

0156In the method of <figref idref="DRAWINGS">FIG. 12A</figref>, the sawtooth unevenness is formed in the tip <b>36</b> of the column electrode <b>25</b>B by pressing the jig <b>44</b> in which the sawtooth unevenness part <b>46</b> is formed onto the column electrode <b>25</b>B (the barrier metal <b>26</b> being formed).

0157In this method, the forming of the column electrode <b>25</b>B can be performed by the stamping using the press, and the productivity of the semiconductor device <b>20</b>B can be raised.

0158In the method of <figref idref="DRAWINGS">FIG. 12B</figref>, before the sputtering film <b>40</b> shown in <figref idref="DRAWINGS">FIG. 11A</figref> is formed, the convex part <b>47</b> is formed, in advance, in the portion of the insulating film <b>23</b> where the column electrode <b>25</b>B is formed. The convex part <b>47</b> is formed integrally with the insulating film <b>23</b>.

0159Thus, the form of the convex part <b>47</b> will remain in the surface of the sputtering film <b>40</b>, the surface of the metal-plating layer <b>41</b>, and the tip of the column electrode <b>25</b>B after metal plating by carrying out the metal-plating formation of the sputtering film <b>40</b>, the metal-plating layer <b>41</b>, and the column electrode <b>25</b>B on the insulating film <b>23</b> in which the convex part <b>47</b> is formed. Thereby, the sawtooth unevenness is formed in the tip <b>36</b>B of the column electrode <b>25</b>B.

0160Since the jig <b>44</b> is not used unlike the composition of <figref idref="DRAWINGS">FIG. 12A</figref> when this method is used, the simplification of the manufacturing process can be attained.

0161Moreover, the form of the tip <b>36</b>B can be arbitrarily set up by changing the form of the convex part <b>47</b> suitably. For example, it is also possible form the semiconductor device <b>20</b>C in the third preferred embodiment of <figref idref="DRAWINGS">FIG. 9</figref> by setting the form of the convex part <b>47</b> into a wave-like shape.

0162Referring back to <figref idref="DRAWINGS">FIG. 11C</figref>, a description of the manufacturing method will be continued. <figref idref="DRAWINGS">FIG. 11C</figref> shows the state where the sawtooth unevenness is formed in the tip <b>36</b>B of the column electrode <b>25</b>B as mentioned above.

0163Moreover, the unnecessary portion of the metal-plating layer <b>41</b> is removed by etching, and thereby the wiring layer <b>24</b> in the predetermined form which has the electrode pad <b>38</b> is formed.

0164Moreover, the column electrode <b>25</b>A in this state is raised up on the electrode pad <b>38</b> formed in the wiring layer <b>24</b>.

0165Next, the semiconductor substrate <b>21</b> in which the column electrode <b>25</b>B is formed is placed into the mold, and the transfer molding processing for forming the encapsulation resin <b>28</b> is carried out.

0166Immediately after the end of the transfer molding, the surface of the encapsulation resin <b>28</b> is located to the boundary between the post part <b>35</b>B and the tip <b>36</b>B as shown in <figref idref="DRAWINGS">FIG. 11D</figref>.

0167After the processing of formation of the encapsulation resin <b>28</b> is completed as mentioned above, the etching processing which makes the thickness of the encapsulation resin <b>28</b> small is carried out.

0168By carrying out the etching processing, as shown in <figref idref="DRAWINGS">FIG. 11E</figref>, the tip (the tip <b>36</b>B) of the surface of the encapsulation resin <b>28</b> and the column electrode <b>25</b>B are separated by the distance H<b>2</b>.

0169After the end of the etching processing, the processing which forms the solder ball <b>27</b> in the column electrode <b>25</b>A is performed continuously.

0170After the end of the above process, the semiconductor device <b>20</b>B shown in <figref idref="DRAWINGS">FIG. 11F</figref> is manufactured.

0171<figref idref="DRAWINGS">FIGS. 13A to 13C</figref> show the manufacture method of the semiconductor device <b>20</b>D in the fourth preferred embodiment.

0172In addition, in the following explanation, a description of the processing which is the same as in the manufacture method of the semiconductor device <b>20</b>A in the first preferred embodiment will be omitted suitably.

0173Moreover, the manufacturing method in the present embodiment is characterized by the method of arranging the barrier metal <b>26</b> in the column electrode <b>25</b>D, and only a description how to arrange the barrier metal <b>26</b> in the column electrode <b>25</b>D will be given.

0174<figref idref="DRAWINGS">FIG. 13A</figref> shows the state in which the column electrode <b>25</b>D is formed, in the opening <b>48</b> formed in the resist <b>43</b> for the electrodes (which includes the DFR), through the electrolysis metal plating.

0175After the end of the formation of the column electrode <b>25</b>D, the heat treatment to the resist <b>43</b> for the electrodes is performed.

0176The heat treatment varies depending on the material of the DFR used as the resist <b>43</b> for the electrodes. For example, as shown in <figref idref="DRAWINGS">FIG. 13B</figref>, the end of the opening <b>48</b> of the resist <b>43</b> for the electrodes can be spread by heating it at a temperature of 100–200 degrees C. for 5 to 60 minutes. By this heat treatment, the form of the end of the opening <b>48</b> is turned into a trumpet-like form.

0177Moreover, when the end of the opening <b>48</b> is spread in this way, the tip <b>36</b>D of the column electrode <b>25</b>D will be in the state where it is widely exposed to the outside.

0178Next, the processing which arranges the barrier metal <b>26</b> to the tip <b>36</b>D of the column electrode <b>25</b>D in this state is performed. Thereby, the barrier metal <b>26</b> is arranged to the side of the part <b>36</b>.

0179Therefore, since the barrier metal <b>26</b> is formed to the side part of the column electrode <b>25</b>D (the tip <b>36</b>D) when the solder ball <b>27</b> is arranged in the column electrode <b>25</b>D in the next process, the solder ball <b>27</b> can be formed to the side part of the column electrode <b>25</b>D (the tip <b>36</b>D).

0180Thereby, the contact area of the solder ball <b>27</b> and the column electrode <b>25</b>D can be increased.

0181Next, the semiconductor devices <b>20</b>E and <b>20</b>F which are the fifth and sixth preferred embodiments of the present invention will be explained.

0182<figref idref="DRAWINGS">FIG. 14</figref> shows the semiconductor device <b>20</b>E in the fifth preferred embodiment, and <figref idref="DRAWINGS">FIGS. 15A to 15F</figref> show the manufacture method of the semiconductor device <b>20</b>E.

0183Moreover, <figref idref="DRAWINGS">FIG. 16</figref> shows the semiconductor device <b>20</b>F in the sixth preferred embodiment, and <figref idref="DRAWINGS">FIGS. 17A to 17G</figref> show the manufacture method of the semiconductor device <b>20</b>F.

0184Each of the semiconductor device <b>20</b>E and the semiconductor device <b>20</b>F is the semiconductor device dealing with the signal of the high frequency (500 MHz or more).

0185As described above, in order to realize reduction of the parasitic capacitance, it is desirable that, in the semiconductor devices <b>20</b>E and <b>20</b>F dealing with the high frequency signal, the column electrodes dealing with the high frequency signal, in the junction position in contact with the semiconductor chip <b>22</b>, are made smaller in size than other column electrodes which do not deal with the high frequency signal.

0186However, in the composition of the conventional semiconductor device <b>1</b>B in which only the column electrode <b>5</b>A dealing with the high frequency signal is made small to improve the transmission characteristic of the high-frequency column electrode <b>5</b>A, the mounting reliability declines as described above.

0187To resolve the problem, the semiconductor device <b>20</b>E shown in <figref idref="DRAWINGS">FIG. 14</figref> is constituted so that the diameter (L<b>1</b>) of the portion which touches the solder ball <b>27</b> of the high-frequency column electrode <b>25</b>F which deals with the high frequency signal is larger than the diameter (L<b>2</b>) of the portion which touches the high-frequency electrode pad <b>45</b>A (the wiring layer <b>24</b>) (L<b>1</b>>L<b>2</b>).

0188Therefore, the area (S<b>1</b>) of the portion which touches the solder ball <b>27</b> of the high-frequency column electrode <b>25</b>F is larger than the area (S<b>2</b>) of the portion which touches the high-frequency-electrode-pad <b>45</b>A (wiring layer <b>24</b>) (S<b>1</b>>S<b>2</b>).

0189In addition, although the high-frequency electrode pad <b>45</b>A is formed integrally with the wiring layer <b>24</b> similar to the usual electrode pad <b>45</b>, it is connected with the connection pad dealing with the high frequency signal in the semiconductor chip <b>22</b>.

0190In the present embodiment, the high-frequency column electrode <b>25</b>F is formed so that the cross-section area thereof increases continuously according to its distance from the high-frequency electrode pad <b>45</b>A (the wiring layer <b>24</b>).

0191Specifically, the high-frequency column electrodes <b>25</b>F are configured in a truncated cone formation.

0192Moreover, in the semiconductor device <b>20</b>E of the present embodiment, because of the manufacturing processes, the usual column electrode <b>25</b>E which does not deal with the high frequency signal is also formed in the same form as the high-frequency column electrode <b>25</b>F.

0193As described above, since the semiconductor device <b>20</b>E of the present embodiment has the small area S<b>2</b> (diameter L<b>2</b>) of the high-frequency column electrode <b>25</b>F in the portion which touches the high-frequency electrode pad <b>45</b>A, it is possible to attain reduction of the parasitic capacitance between the high-frequency column electrode <b>25</b>F and the semiconductor chip <b>22</b>, and the transmission characteristic can be improved.

0194Moreover, since the area S<b>1</b> (diameter L<b>1</b>) of the high-frequency column electrode <b>25</b>F in the tip which touches the solder ball <b>27</b> can be enlarged, the junction of the high-frequency column electrode <b>25</b>F and the solder ball <b>27</b> can be raised, and the mounting reliability can be raised.

0195In addition, the tip of each of the column electrodes <b>25</b>E and <b>25</b>F projects from the surface of the encapsulation resin <b>28</b> similar to the above-mentioned embodiments.

0196Moreover, the solder ball <b>27</b> is arranged in the tip of each of the column electrodes <b>25</b>E and <b>25</b>F through the barrier metal <b>26</b>.

0197Therefore, the solder ball <b>27</b> and the surface of the encapsulation resin <b>28</b> are separated from each other, and the same effect as the above-mentioned embodiments can be realized.

0198Next, a description will be given of the manufacture method of the semiconductor device <b>20</b>E having the above-mentioned composition.

0199<figref idref="DRAWINGS">FIGS. 15A to 15F</figref> show the manufacture method of the semiconductor device <b>20</b>E along with the manufacture procedures.

0200In order to manufacture the semiconductor device <b>20</b>E, the insulating film <b>23</b> is formed on the semiconductor substrate <b>21</b> in which the passivation film <b>29</b> is formed, and the hole <b>49</b> is formed at the position which is opposed to the electrode part currently formed in the semiconductor substrate <b>21</b> of the insulating film <b>23</b> as shown in <figref idref="DRAWINGS">FIG. 15A</figref>.

0201Then, as shown in <figref idref="DRAWINGS">FIG. 15B</figref>, the resist <b>42</b> for wiring in which the predetermined pattern is formed is formed in the upper part of the insulating film <b>23</b>, and the wiring layer <b>24</b>, the electrode pad <b>45</b>, and the high-frequency electrode pad <b>45</b>A are formed using the resist <b>42</b> for wiring.

0202After the end of formation processing of the pads <b>24</b>, <b>45</b>, and <b>45</b>A, the resist <b>42</b> for wiring is removed as shown in <figref idref="DRAWINGS">FIG. 15C</figref>.

0203Next, the resist <b>43</b> for the electrodes is formed on the semiconductor substrates <b>21</b> in which the pads <b>24</b>, <b>45</b>, and <b>45</b>A are formed. In order to form the resist <b>43</b> for the electrodes on the semiconductor substrate <b>21</b>, the DFR which serves as the resist <b>43</b> for the electrodes is arranged on the semiconductor substrate <b>21</b>. The DFR is the photosensitive resin, and arbitrary opening patterns can be formed with the DFR by carrying out the exposure processing etc.

0204In the present embodiment, the opening pattern <b>50</b> of a truncated cone form is formed by optimizing the exposure conditions. <figref idref="DRAWINGS">FIG. 15D</figref> shows the state where the opening pattern <b>50</b> of a truncated cone form is formed. The opening is formed in the lower part of each of the opening pattern <b>50</b>, and therefore the composition is that the electrode pad <b>45</b> and the high-frequency electrode pad <b>45</b>A are exposed to the opening pattern <b>50</b>.

0205After the end of the formation of the resist <b>43</b> for the electrodes having the opening pattern <b>50</b>, the processing which forms the high-frequency column electrode <b>25</b>F and the column electrode <b>25</b>E in the opening pattern <b>50</b> using the resist <b>43</b> for the electrodes is performed as shown in <figref idref="DRAWINGS">FIG. 15D</figref>. In addition, after the end of the formation of the column electrodes <b>25</b>E and <b>25</b>F, the barrier metal <b>26</b> is formed in the tip.

0206After the resist <b>43</b> for the electrodes is removed, the encapsulation resin <b>28</b> is formed through the transfer molding.

0207By carrying out the dicing processing, the semiconductor substrate <b>21</b> is cut into pieces, and the semiconductor device <b>20</b>E shown in <figref idref="DRAWINGS">FIG. 15F</figref> is formed.

0208Moreover, the semiconductor device <b>20</b>F shown in <figref idref="DRAWINGS">FIG. 16</figref> is constituted so that the diameter (L<b>3</b>) of the portion which touches the solder ball <b>27</b> of the high-frequency column electrode <b>25</b>H is larger than the diameter (L<b>4</b>) of the portion which touches the high-frequency electrode pad <b>45</b>A (the wiring layer <b>24</b>) (L<b>3</b>>L<b>4</b>).

0209Therefore, the area (S<b>3</b>) of the portion which touches the solder ball <b>27</b> of the high-frequency column electrode <b>25</b>H is larger than the area (S<b>4</b>) of the portion which touches the high-frequency electrode pad <b>45</b>A (the wiring layer <b>24</b>) (S<b>3</b>>S<b>4</b>).

0210In the present embodiment, the high-frequency column electrode <b>25</b>H is provided so that it has a stepwise increase of the cross-section area thereof in accordance with a distance of the high-frequency column electrode <b>25</b>H separate from the high-frequency electrode pad <b>45</b>A (wiring layer <b>24</b>).

0211Specifically, the high-frequency column electrode <b>25</b>H is provided with the large-diameter part <b>51</b> located on the side of the solder ball <b>27</b>, and the small-diameter part <b>52</b> located on the side of the high-frequency electrode pad <b>45</b>A, and therefore it has the composition in which a stepwise increase of the cross-sectional area is provided between the large-diameter part <b>51</b> and the small-diameter part <b>52</b>.

0212In addition, in the present embodiment, the usual column electrode <b>25</b>G which is not the high-frequency column electrode also has the same composition as the high-frequency column electrode <b>25</b>H described above.

0213Similar to the semiconductor device <b>20</b>E of the fifth preferred embodiment of <figref idref="DRAWINGS">FIG. 14</figref>, the semiconductor device <b>20</b>F of the present embodiment has the small area S<b>4</b> (diameter L<b>4</b>) of the high-frequency column electrode <b>25</b>H in the portion which touches the high-frequency-electrode-pad <b>45</b>A. This allows reduction of the parasitic capacitance between the high-frequency column electrode <b>25</b>H and the semiconductor chip <b>22</b>, and the transmission characteristic can be improved.

0214Moreover, since the area S<b>1</b> (diameter L<b>1</b>) of the high-frequency column electrode <b>25</b>H in the tip which touches the solder ball <b>27</b> is large, the junction of the high-frequency column electrode <b>25</b>H and the solder ball <b>27</b> can be raised, and the mounting reliability can be raised.

0215In addition, in the semiconductor device <b>20</b>F of the present embodiment, the tip of each of the column electrodes <b>25</b>G and <b>25</b>H projects from the surface of the encapsulation resin <b>28</b> similar to the previously described embodiments.

0216Moreover, the solder ball <b>27</b> is arranged in the tip of each of the column electrodes <b>25</b>G and <b>25</b>H through the barrier metal <b>26</b>. Therefore, the solder ball <b>27</b> and the surface of the encapsulation resin <b>28</b> are separated from each other, and the same effect as the above-mentioned embodiments can be realized.

0217Next, a description will be given of the manufacture method of the semiconductor device <b>20</b>F having the above-mentioned composition.

0218<figref idref="DRAWINGS">FIGS. 17A to 17G</figref> show the manufacture method of the semiconductor device <b>20</b>F along with the manufacture procedures. In addition, a description of the processing which is the same as in the manufacture method of the semiconductor device <b>20</b>E of <figref idref="DRAWINGS">FIG. 15</figref> will be omitted suitably.

0219<figref idref="DRAWINGS">FIGS. 17A to 17C</figref> are the same as <figref idref="DRAWINGS">FIGS. 15A to 15C</figref>.

0220In the present embodiment, after the electrode pads <b>24</b>, <b>45</b>, and <b>45</b>A are formed as shown in <figref idref="DRAWINGS">FIG. 17C</figref>, the second insulating film <b>53</b> is formed as shown in <figref idref="DRAWINGS">FIG. 17D</figref>.

0221The small-diameter opening <b>54</b> is formed in the position where the second insulating film <b>53</b> is opposed to the electrode pads <b>45</b> and <b>45</b>A.

0222The diameter and area of the small-diameter opening <b>54</b> are the same as the diameter (L<b>4</b>) and area (S<b>4</b>) of the small-diameter part <b>52</b> of the high-frequency column electrode <b>25</b>H. In addition, it is desirable that the material of the second insulating film <b>53</b> is the same material as the insulating film <b>23</b> for the purpose of internal-stress prevention.

0223Next, the resist <b>43</b> for the electrodes is formed on the semiconductor substrate <b>21</b> in which the second insulating film <b>53</b> is formed.

0224In order to form the resist <b>43</b> for the electrodes on the semiconductor substrate <b>21</b>, the photosensitive DFR which serves as the resist <b>43</b> for the electrodes is arranged on the semiconductor substrate <b>21</b>, and the large-diameter opening <b>55</b> is formed by carrying out the exposure processing. The diameter and area of the large-diameter opening <b>55</b> are the same as the diameter (L<b>3</b>) and area (S<b>3</b>) of the large-diameter part <b>51</b> of the high-frequency column electrode <b>25</b>H.

0225<figref idref="DRAWINGS">FIG. 17E</figref> shows the state where the large-diameter opening <b>55</b> is formed. The small-diameter opening <b>54</b> formed in the second insulating film <b>53</b> is located in the lower part of each large-diameter opening <b>55</b>. Therefore, the composition is that the electrode pad <b>45</b> and the high-frequency-electrode-pad <b>45</b>A expose through the small-diameter opening <b>54</b> and the large-diameter opening <b>55</b>.

0226After the resist <b>43</b> for the electrodes having the large-diameter opening <b>55</b> is formed, the processing which forms the high-frequency column electrode <b>25</b>H and the column electrode <b>25</b>G in the large-diameter opening <b>55</b> and the small-diameter opening <b>54</b> is performed using the resist <b>43</b> for the electrodes as shown in <figref idref="DRAWINGS">FIG. 17F</figref>.

0227In addition, after the formation of the column electrodes <b>25</b>G and <b>25</b>H, the barrier metal <b>26</b> is formed in the tip.

0228After the resist <b>43</b> for the electrodes is removed, the encapsulation resin <b>28</b> is formed through the transfer molding.

0229Next, by carrying out the dicing processing, the semiconductor substrate <b>21</b> is cut into pieces, and the semiconductor device <b>20</b>F shown in <figref idref="DRAWINGS">FIG. 17G</figref> is formed.

0230The present invention is not limited to the above-described embodiments, and variations and modifications may be made without departing from the scope of the present invention.