Electrical connector assembly with low crosstalk

BACKGROUND OF THE INVENTION

00011. Field of the Invention

0002The present invention relates to electrical connectors and more particularly, to a multi-port electrical connector assembly having a plurality of plug-receiving cavities for receiving a plurality of mating plugs.

00032. Description of the Related Art

0004Modular jacks are well known used in two broad categories of signal transmission: analog (voice) and digital (data) transmission. These categories can overlap somewhat since digital systems are used for voice transmission as well. Nevertheless, there is a significant difference in the amount of data transmitted by a system per second. A low speed system would ordinarily transmit from about 10 to 16 megabites per second (Mbps), while a high-speed system should be able to handle 155 Mbps or even higher data transfer speeds. Often, high speed installations are based on asynchronous transfer mode transmission and utilize shielded and unshielded twisted pair cables.

0005With recent increases in the speed of data transmission, requirements have become important for electrical connectors, in particular, with regard to the reduction or elimination of crosstalk. Crosstalk is a phenomenon in which a part of the electromagnetic energy transmitted through one of multiple conductors in a connector causes electrical currents in the other conductors.

0006Another factor which must be considered is that the telecommunications industry has reached a high degree of standardization in modular jack design, and modular jacks are quite small or miniaturized. Various approaches have been made to eliminate or reduce the crosstalk, such as providing different configuration of adjacent contacts of modular jacks, coupling various types of filters, such as a three-terminal capacitor or a common mode choke coil, to reduce or eliminate noise. U.S. Pat. Nos. 5,399,107, 5,674,093 and 5,779,503 are examples of various connectors including jacks and plugs which attempt to address the problem of crosstalk between the contacts in telecommunications connectors. Outlines and contact areas are essentially fixed and have to be interchangeable with other designs. It is, therefore, important that any novel modular jack allow with only minor modification, the use of conventional parts or tooling in its production.

0007It is desired to improve performance of the modular jacks where crosstalk problems increase as higher frequencies are transmitted through the connector and which may be manufactured using conventional parts and tooling.

BRIEF SUMMARY OF THE INVENTION

0008A main object of the present invention is to provide a modular jack with low crosstalk electrical signal transmission.

0009Another object of the present invention is to provide a modular jack having simplified structure and lower cost.

0010An electrical connector is mounted on a motherboard and includes an insulative housing having at least at least two receiving cavities and an insert module secured to the housing. The insert module includes an insulator, a first and a second terminal modules received in the insulator and a ground plate secured between the first and the second terminal modules.

0011Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

0012<figref idref="DRAWINGS">FIG. 1</figref> is a perspective view of an electrical connector assembly according to the present invention.

0013<figref idref="DRAWINGS">FIG. 2</figref> is another perspective view of <figref idref="DRAWINGS">FIG. 1</figref> from a rear aspect.

0014<figref idref="DRAWINGS">FIG. 3</figref> is an exploded view of <figref idref="DRAWINGS">FIG. 1</figref>.

0015<figref idref="DRAWINGS">FIG. 4</figref> is another exploded view of <figref idref="DRAWINGS">FIG. 1</figref> from a rear aspect.

0016<figref idref="DRAWINGS">FIG. 5</figref> is a partially assembled view of <figref idref="DRAWINGS">FIG. 2</figref> taken from a front aspect, wherein an insert module is assembled.

0017<figref idref="DRAWINGS">FIG. 6</figref> is another assembled view of <figref idref="DRAWINGS">FIG. 5</figref> taken from a rear aspect.

DETAILED DESCRIPTION OF THE INVENTION

0018Referring to <figref idref="DRAWINGS">FIGS. 1 and 2</figref>, an electrical connector assembly <b>100</b> of the present invention, mounted on a motherboard (not shown), includes a molded insulative housing <b>1</b> and an insert module <b>200</b> disposed in the housing <b>1</b>.

0019With reference to <figref idref="DRAWINGS">FIGS. 3 and 4</figref>, the housing <b>1</b> includes a mating face <b>10</b>, a base portion <b>11</b> and an extending portion <b>12</b> extending rearwardly from the base portion <b>11</b>. The base portion <b>11</b> defines an upper and lower receiving cavities <b>110</b>, <b>111</b> exposed in the mating face <b>10</b>. The upper and lower receiving cavities <b>110</b>, <b>111</b> share a panel <b>112</b> which defines a slot <b>1121</b> therethrough. The base portion <b>11</b> includes a first and a second openings <b>114</b>, <b>115</b> communicating with upper and lower receiving cavities <b>110</b>, <b>111</b> respectively on upper and bottom portions thereof. The base portion <b>11</b> further includes upper and lower recesses <b>116</b>, <b>117</b> extending forwardly and communicating with the respective upper and lower receiving cavities <b>110</b>, <b>111</b>. A pair of posts <b>118</b> projects downwardly from a bottom surface of the housing <b>1</b> for securing the electrical connector assembly <b>100</b> to the motherboard. The extending portion <b>12</b> includes an upper wall <b>121</b> and two opposite extending arms <b>122</b> extending rearwardly.

0020The insert module <b>200</b> includes an insulator <b>2</b>, a ground plate <b>3</b> and a plurality of first and second terminal modules <b>4</b>, <b>5</b> attached to the insulator <b>2</b>. The insulator <b>2</b> includes a front section <b>21</b>, a rear section <b>22</b> and a groove <b>23</b> between upper portions of the front and rear portions <b>21</b>, <b>22</b>. The front section <b>21</b> defines a plurality of front mounting holes <b>211</b> extending through upper and lower surfaces of the front section <b>21</b> and a chamber <b>24</b> exposed in a front face thereof. The front section <b>21</b> also has a ladderlike fixing portion <b>25</b> extending upwardly from opposite sides of the front section <b>21</b> for securing the first and the second terminal modules <b>4</b>, <b>5</b> thereto, as will be discussed hereinafter further. The fixing portion <b>25</b> includes a step surface <b>252</b>, an arcuate guiding surface <b>251</b> below the step surface <b>252</b>, an embossment <b>253</b> projecting from the guiding surface <b>251</b> and a protrusion <b>254</b> extending upwardly from top surface of the fixing portion <b>25</b>. The rear section <b>22</b> defines a plurality of rear mounting holes <b>221</b> extending through an upper and a lower surface thereof.

0021The ground plate <b>3</b> is stamped from one metal sheet and includes a vertical portion <b>32</b>, a horizontal portion <b>31</b> extending forwardly from a top end of the vertical portion <b>32</b> and a pair of flaps <b>33</b>, <b>34</b> extending forwardly from opposite sides of the vertical portion <b>32</b>. Each flap <b>33</b>, <b>34</b> forms a grounding tail <b>331</b>, <b>341</b> projecting downwardly for electrically connecting with the motherboard.

0022The first terminal module <b>4</b> comprises a first internal PCB <b>42</b>, a plurality of first mating terminals <b>41</b> and first mounting terminals <b>43</b>. Each first mating terminal <b>41</b> includes a horizontal retention portion <b>412</b> soldered on the first internal PCB <b>42</b> and a contact portion <b>411</b> extending upwardly from the retention portion <b>412</b> and being angled inwardly toward the first internal PCB <b>42</b>. The first internal PCB <b>42</b> defines a pair of locking hole <b>421</b> on opposite sides therein for engaging with the protrusions <b>254</b> of the fixing portion <b>25</b> and a plurality of first soldering holes <b>422</b> for soldering the first mounting terminals <b>43</b> therein. It should be noted that the first internal PCB <b>42</b> may include one or more signal conditioning components (not shown) mounted thereon for signal conditioning, and thus reducing the interference between transmitting signals.

0023The second terminal module <b>5</b> includes a second internal PCB <b>52</b>, a plurality of second mating terminals <b>51</b> and second mounting terminals <b>53</b>. The first and the second terminals <b>41</b>, <b>51</b> are identical in configuration and structure except that they are oriented on opposite directions of the first and second internal PCBs <b>42</b>, <b>52</b>. Each second mating terminal <b>51</b> includes a horizontal retention portion <b>512</b> mounted on the second internal PCB <b>52</b> and a contact portion <b>511</b> extending downwardly from the retention portion <b>512</b> at an angle relative to the second internal PCB <b>52</b>. The second internal PCB <b>52</b> defines a pair of cutouts <b>521</b> on opposite sides therein for engaging with the embossments <b>253</b> of the fixing portion <b>25</b> and a plurality of second soldering holes <b>522</b> for soldering the second mounting terminals <b>53</b> therein. As such, the second internal PCB <b>52</b> includes one or more signal conditioning components (not shown) mounted thereon for compensating the attenuation of signals.

0024Referring to <figref idref="DRAWINGS">FIGS. 3 through 6</figref>, in assembly, the first and the second mating terminals <b>41</b>, <b>51</b> are soldered on the first and the second internal PCBs <b>42</b>, <b>52</b> respectively. The second mounting terminals <b>53</b> are inserted into the appropriate front mounting holes <b>211</b>, respectively. The second internal PCB <b>52</b> having the second mating terminals <b>51</b> soldered thereon is pressed downwardly into the front section <b>21</b> of the insulator <b>2</b> along the guiding surface <b>251</b> thereafter. The embossments <b>253</b> of the insulator <b>2</b> are held in the cutouts <b>521</b> of the internal PCB <b>52</b> by a interference fit, thereby stabilizing the second mounting terminals <b>53</b> extending through respective one of the second soldering holes <b>522</b> and soldering on the second internal PCB <b>52</b>. It is important to note that a distal end of contact portion <b>511</b> of each second mating terminal <b>51</b> is received in the chamber <b>24</b> for minimizing whole dimension of the insert module <b>200</b>. The ground plate <b>3</b> is attached to the insulator <b>2</b>. The vertical portion <b>32</b> of the ground plate <b>3</b> is installed in the groove <b>23</b>, while the horizontal portion <b>31</b> is in juncture with the step surface <b>252</b> and extends forwardly beyond a front portion of the insert module <b>200</b> for avoiding connecting with the second mating terminals <b>52</b> therebetween. The flaps <b>33</b>, <b>34</b> of the ground plate <b>3</b> are pressed against to opposite sides of the insulator <b>2</b>. The first mounting terminals <b>43</b> are inserted into the appropriate rear mounting holes <b>221</b>. The first internal PCB <b>42</b> with the first mating terminals <b>41</b> soldered thereon is secured to the insulator <b>2</b>. The protrusions <b>254</b> are retained in the respective locking hole <b>421</b>. And thus, the first mounting terminals <b>43</b> extend through the first soldering holes <b>422</b> and soldered on the first internal PCB <b>42</b>, thereby forming the insert module <b>200</b>.

0025The insert module <b>200</b> is assembled to the housing <b>1</b> in a back-to-front direction. The horizontal portion <b>31</b> of the ground plate <b>3</b> is insert into the slot <b>1121</b> of the panel <b>112</b>. The first and the second terminal modules <b>4</b>, <b>5</b> extend into the respective upper and lower recesses <b>116</b>, <b>117</b> and extend forwardly where the contact portions <b>411</b>, <b>511</b> of the first and section terminal module <b>4</b>, <b>5</b> are exposed in the corresponding upper and lower receiving cavities <b>110</b>, <b>111</b> for being mated. It is noted that the first and the second terminal modules <b>4</b>, <b>5</b> can be shielded fully through the ground plate <b>3</b> secured therebetween, and the attenuation between the input and the output high-speed signals can be compensate by the first and the second internal PCBs <b>42</b>, <b>52</b>, and thus the crosstalk between the high-speed signals can be eliminated rapidly.

0026It is to be understood, however, that even though numerous, characteristics and advantages of the present invention have been set fourth in the foregoing description, together with details of the structure and function of the invention, the disclosed is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.