Nova Patents
US6391663B1

Methods of semiconductor processing

Summary by NHIP

Semiconductor Temperature Sensing

The method forms a cavity via isotropic etching, places a sensor inside, and creates a conductive trace on the surface to couple with the device. Wire bonding connects the trace and sensor, while external circuitry links to the trace or the sensor connects to an edge.

Claim Score by NHIP

Read claim 1, the broadest

Abstract

The present invention includes electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece. In one aspect, the invention provides an electronic device workpiece including: a substrate having a surface; a temperature sensing device borne by the substrate; and an electrical interconnect formed upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device. In another aspect, a method of sensing temperature of an electronic device workpiece includes: providing an electronic device workpiece; supporting a temperature sensing device using the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; electrically coupling the electrical interconnect with the temperature sensing device; and sensing temperature of the electronic device workpiece using the temperature sensing device.

Term

Term ended

Expired 3 September 2019, 7.1 years ago.

  1. Priority
  2. Filed
  3. Granted
  4. Expired
  5. Today

9 claims: 9 independent, 0 dependent

  1. 1
    Broadest claimClaim Score 79, broad(NHIP)A method of sensing temperature of an electronic device workpiece comprising:providing an electronic device workpiece;forming a cavity in the electronic device workpiece comprising isotropically etching the electronic device workpiece;providing a temperature sensing device within the cavity;supporting the temperature sensing device using the electronic device workpiece;providing an electrical interconnect upon a surface of the electronic device workpiece;electrically coupling the electrical interconnect with the temperature sensing device;and sensing temperature of the electronic device workpiece using the temperature sensing device.
  2. 2
    The method according to claim 1 further comprising wire bonding the electrical interconnect and the temperature sensing device.
  3. 3
    The method according to claim 1 further comprising forming the temperature sensing device.
  4. 4
    The method according to claim 3 wherein the forming the temperature sensing device comprises forming a resistance temperature device.
  5. 5
    The method according to claim 1 further comprising electrically coupling the electrical interconnect with external circuitry.
  6. 6
    The method according to claim 1 further comprising electrically coupling the temperature sensing device with an edge of the electronic device workpiece using the electrical interconnect.
  7. 7
    The method according to claim 1 wherein the providing the electrical interconnect comprises forming a conductive trace.
  8. 8
    The method according to claim 1 further comprising contacting the electrical interconnect with the temperature sensing device.
  9. 9
    The method according to claim 1 wherein the method comprises a method of sensing temperature of semiconductor wafers.
Independent claims9