US20200375203A1

Determining the thickness profile of work products

Claim Score by NHIP

Read claim 1, the broadest

Abstract

A processing system (10) and a corresponding method are provided for processing work products (WP), including food items, to locate and quantify voids, undercuts and similar anomalies in the work products. The work products are conveyed past an X-ray scanner (14) by a conveyance device (12). Data from the X-ray scanning is transmitted to control system (18). Simultaneously with the X-ray scanning of the work product, the work product is optically scanned at the same location on the work product where X-ray scanning is occurring. The data from the optical scanner is also transmitted to the control system. Such data is analyzed to develop or generate the thickness profile of the work product. From the differences in the thickness profiles generated from the X-ray scanning data versus the optical scanning data, the location of voids, undercuts and similar anomalies can be determined by the control system. This information is used by the processing system (10) to process the work product as desired, including adjusting for the locations and sizes of voids, undercuts and similar anomalies present in the work product.

US20200375203A1, drawing sheet 1
Sheet 1 of 12

Term

14.8 yearsto projected expiry

Projected expiry 1 July 2041, counted from filing; an application has no term until it is granted.

  1. Priority and filed
  2. Published
  3. Today
  4. Projected expiry

20 claims: 2 independent, 18 dependent

  1. 1
    Broadest claimClaim Score 68, broad(NHIP)A method for determining the thickness profile of a work product, comprising:a. scanning a work product with an X-ray scanner, b. analyzing the data from the X-ray scanner with a computer processor to develop a thickness profile of the work product, c. scanning the work product with an optical scanner, d. analyzing the data from the optical scanner with a computer processor to develop a thickness profile of the work product based on the optical scanning data, e. comparing the thickness profiles from the X-ray scanning data and the optical scanning data and determining (quantifying) the differences between the thickness profiles from the X-ray scanning data and the optical scanning data, and f. mapping the location(s) on the work product where a difference exists between the thickness profiles from the X-ray scanning data and the optical scanning data.
  2. 11
    A system for determining the thickness profile of a work product, comprising:a conveyance device for conveying the work product;an X-ray scanner for scanning the work product being conveyed on the conveyance device and generating a first data set regarding the physical characteristics of the work product, including a thickness profile of the work product;an optical scanner for scanning the work product being conveyed on the conveyance device for generating a second data set regarding the physical characteristics of the work product, including the thickness profile of the work product;and a control system configured to: generating thickness profiles of the work product from the X-ray scanning data and the optical scanning data;quantifying the differences between the thickness profiles of the work product from the X-ray scanning data and the optical scanning data;and mapping the location(s) on the work product where differences exist between the thickness profiles from the X-ray scanning data and the optical scanning data.