Metal-Free Monolithic Epitaxial Graphene-On-Diamond PWB With Optical Waveguide

TECHNICAL FIELD OF THB INVENTION

This invention relates generally to three-dimensional (3-D) printing and in particular to 3-D printing a printed wiring board (PWB) using a diamond forming pre-ceramic polymer.

BACKGROUND

Three-dimensional (3-D) printing is an additive manufacturing process that allows tor the manufacture of objects by “building up” an object. In contrast to subtractive techniques, such as machining, in which material is removed from a bulk material in order to form the shape of an object, 3-D printing lays clown successive layers of material to form the shape of an object. Typical materials used for 3-D printing may include plastics, ceramics, and metals.

Printed wiring boards (PWBs) or circuit boards, are commonly used, to connect electronic devices such, as computer chips. PWBs are typically composed of layers of plastic and layers of metal, such as copper.

SUMMARY

According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by thermolysis of layers of a preceramic polymer, A plurality of tubes are formed within the circuit board and comprise a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of grapheme that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius, The apparatus also includes a plurality of optical waveguides formed within the circuit board. Each optical waveguide comprises a core of polycrystalline diamond surrounded by silicon carbide. The polycrystalline diamond is formed by thermolysis of poly(hydridocarbyne) and the silicon carbide is formed by thermolysis of poly(methylsilyne).

Technical advantages of certain embodiments may include using a diamond forming pre-ceramic polymer in a 3-D printer to form a diamond object. Some embodiments may provide methods of forming an object by depositing layers of multiple types of pre-ceramic polymers. Additional technical advantages of some embodiments may include formation of a circuit hoard composed primarily of polycrystalline diamond. Further technical advantages of some embodiments may include formation of optical waveguides within a polycrystalline diamond circuit board. Other technical advantages will be readily apparent to one skilled in the art from the following figures, descriptions, and claims. Moreover, while specific advantages have been enumerated above, various embodiments may include all, some, or none of the enumerated advantages.

BRIEF DESCRIPTION OF THE DRAWINGS

To provide a more complete understanding of the present invention and the features and advantages thereof, reference is made to the following description taken in conjunction with the accompanying drawings, in which:

<figref idref="DRAWINGS">FIG. 1</figref> illustrates an example of a 3-D printer, according to certain embodiments;

<figref idref="DRAWINGS">FIG. 2</figref> illustrates an object printed by the 3-D printer of <figref idref="DRAWINGS">FIG. 1</figref> within ceramic powder, according to certain embodiments;

<figref idref="DRAWINGS">FIG. 3</figref> illustrates a vertical cross section of the 3-D printed object illustrated in <figref idref="DRAWINGS">FIG. 2</figref>, according to cert a in embodiments;

<figref idref="DRAWINGS">FIGS. 4A and 4B</figref> illustrate horizontal cross sections of the 3-D printed object illustrated in <figref idref="DRAWINGS">FIG. 2</figref>, according to certain embodiments;

<figref idref="DRAWINGS">FIG. 5A</figref> illustrates the chemical structure of the pre-ceramic polymer poly(hydridocarbyne);

<figref idref="DRAWINGS">FIG. 5E</figref> illustrates the chemical structure of the pre-ceramic polymer poly(methylsilyne);

<figref idref="DRAWINGS">FIG. 6</figref> illustrates a method of printing a 3-D object in a ceramic powder using a pre-ceramic polymer, according to certain embodiments;

<figref idref="DRAWINGS">FIG. 7</figref> illustrates an example embodiment of a polycrystalline diamond printed wiring board (PWB) that may be printed, using a 3-D printer, according to certain embodiments;

<figref idref="DRAWINGS">FIG. 8</figref> illustrates an example cross section of the polycrystalline diamond PWB of <figref idref="DRAWINGS">FIG. 7</figref>, according to certain embodiments;

<figref idref="DRAWINGS">FIG. 9</figref> illustrates example geometries of electrically conducting interconnects of the PWB of <figref idref="DRAWINGS">FIG. 7</figref>, according to certain embodiments;

<figref idref="DRAWINGS">FIG. 10</figref> illustrates an example method <b>1000</b> for printing the PWB of <figref idref="DRAWINGS">FIG. 7</figref>, according to certain embodiments;

<figref idref="DRAWINGS">FIGS. 11A</figref>, <b>11</b>B, and <b>11</b>C illustrate example cross sections of an optical wave guide, according to certain embodiments;

<figref idref="DRAWINGS">FIGS. 12A and 12B</figref> illustrate example methods for printing an optical save guide within a polycrystalline diamond PWB, according to certain embodiments; and

<figref idref="DRAWINGS">FIG. 13</figref> illustrates an example computer system that may be used to control the 3-D printer of <figref idref="DRAWINGS">FIG. 1</figref>, according to certain embodiments.

DETAILED DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention and its advantages are best understood by referring to <figref idref="DRAWINGS">FIGS. 1 through 13</figref> of the drawings, like numerals being used for like and corresponding parts of the various drawings.

Diamond is a form of the element carbon that has many unique properties. Diamond, is among the hardest known materials, has a high melting and boiling point, and is an excellent thermal conductor as well as electrical insulator. Objects made out of diamond may be able to take advantage of these properties. For example, tools made out of diamond, such as drill bits, saws, or knives, may be more durable than tools made of conventional materials due to the hardness of diamond. Diamond can be produced in a variety of ways including as a powder in the form of diamond nanoparticles and from the pyrolysis of a pre-ceramic polymer.

The teachings of the disclosure recognize that, using three-dimensional (3-D) printing techniques with a pre-ceramic polymer and nanoparticle powder may allow for the creation of objects made of a variety of ceramics in a variety of useful shapes. In particular, using 3-D printing techniques with a diamond forming pre-ceramic polymer end a diamond nanoparticle powder may allow for the creation of diamond objects in a variety of shapes. For example, using 3-D printing with a diamond forming pre-ceramic polymer and a diamond nanoparticle powder, a diamond drill bit having almost any geometry could be printed. As other examples, 3-D printing with a diamond forming pre-ceramic polymer and a diamond nanoparticle powder may be used to print brake pad inserts, avionics boxes, lightweight armor, diamond dialysis filters, vacuum micro-electronics, or any other appropriate object. Furthermore, by using different pre-ceramic polymers and nanoparticle powders separately or in addition to diamond forming pre-ceramic polymer and diamond nanoparticle powder, the properties of a printed object could be varied to meet, various design objectives. Further, the teachings of this disclosure recognize that a nanoparticle powder that does not sinter may be used to support an object during the 3-D printing process. The following describes methods and systems of 3-D printing using a pre-ceramic polymer with a nanoparticle filler.

The teaching of the disclosure further recognize that using 3-D printing techniques with a pre-ceramic polymer may allow for the creation of a diamond printed wiring board (PWB). A diamond PWB may have numerous technical advantages due to the high thermal conductivity and low density of diamond, compared to metals commonly used in PWBs. Additionally, the broad optical and infrared transparency of diamond may be used to facilitate optical and infrared data paths within the PWB (i.e. a waveguide).

<figref idref="DRAWINGS">FIG. 1</figref> illustrates an example embodiment of a 3-D printer <b>100</b>, 3-D printer <b>100</b> includes a print head <b>110</b> and a roller <b>120</b>. Roller <b>120</b> deposits layers of a ceramic powder <b>125</b> into a container <b>160</b>. Print head <b>110</b> deposits a pre-ceramic polymer <b>115</b> dissolved in a solvent onto the layers of ceramic powder <b>125</b>. In some embodiments, 3-D printer <b>100</b> may include a computer system <b>150</b> that controls the printing of an object by providing instructions to 3-D printer <b>100</b>, Computer system <b>150</b> may be either external to 3-D printer <b>100</b> or incorporated into 3-D printer <b>100</b>. Certain embodiments of computer system are discussed in more detail below with respect to <figref idref="DRAWINGS">FIG. 7</figref>.

In general, certain embodiments of 3-D printer <b>100</b> print 3-D diamond objects using roller <b>120</b> and print head <b>110</b>. For example, 3-D printer <b>100</b> may print the 3-D object <b>200</b> illustrated in <figref idref="DRAWINGS">FIG. 2</figref> by depositing successive layers of pre-ceramic polymer <b>115</b> through print head <b>110</b> onto layers of ceramic powder <b>125</b> that were deposited by roller <b>120</b> into container <b>160</b>. Specifically, roller <b>120</b> may initially deposit a first layer of ceramic powder <b>125</b> into container <b>160</b>. Print head <b>110</b> may then deposit a first layer of pre-ceramic polymer <b>115</b> onto the first layer of ceramic powder <b>125</b> in the shape of a first cross section or “slice” of the desired 3-D object. After a certain amount of time, roller <b>120</b> may then deposit a. second layer of ceramic powder <b>125</b> on top of the first layer of ceramic powder <b>125</b> and first layer of pre-ceramic polymer <b>115</b>, In some embodiments, the certain amount of time may be sufficient to allow for solvent to evaporate. Print head <b>110</b> may then deposit a second layer of pre-ceramic polymer <b>115</b> onto the second layer of ceramic powder <b>125</b> in the shape of a cross section of the object that is adjacent to and above the first cross section. Subsequent layers of ceramic powder <b>125</b> and pre-ceramic polymer <b>115</b> may be deposited in alternating fashion until, the layers of pre-ceramic polymer <b>115</b> form the shape of the desired 3-D object.

Once all layers of pre-ceramic polymer <b>115</b> and ceramic powder <b>125</b> have been deposited in container <b>160</b> to form the shape of the desired 3-D object within ceramic powder <b>125</b>, container <b>160</b> may then be placed into a furnace for baking. In some embodiments, baking may take place in an inert atmosphere. Unlike other methods in which excess powder may be removed prior to baking, excess ceramic powder <b>125</b> (i.e., ceramic powder <b>125</b> that was not sprayed with any pre-ceramic polymer <b>115</b>) is not removed prior to baking but instead remains within container <b>160</b> during the baking process. This may provide additional advantages to prior processes by providing support for the 3-D object during baking. Once the baking is complete and after cooling, excess ceramic powder <b>125</b> is removed in order to reveal the desired 3-D diamond object. The excess ceramic powder <b>125</b> may then be recycled and reused or discarded.

Print head <b>110</b> may be any commercially-available print head such as any ink jet or any aerosol jet print head. Depending on the type of print, head <b>110</b> used, different feature sizes may be printed for an object. For example, an aerosol jet print head <b>110</b> may allow features as small as <b>10</b> microns to be printed. Print head <b>110</b> may be able to precisely control the volume of pre-ceramic polymer <b>115</b> deposited to ensure that pre-ceramic polymer <b>115</b> does not “soak through” the most recent layer of ceramic powder <b>125</b> into previously deposited layers of ceramic powder <b>125</b>. While specific embodiments of print head <b>110</b> have been described, any appropriate system or method of depositing pre-ceramic polymer <b>115</b> onto ceramic powder <b>125</b> may be utilized. For example, certain embodiments of 3-D printer <b>100</b> may utilize techniques to deposit pre-ceramic polymer <b>115</b> onto ceramic powder <b>125</b> that do not involve any form of print head <b>110</b>.

Roller <b>120</b> may be any device operable to deposit layers of ceramic powder <b>125</b>. For example, roller <b>120</b> may be a roller that is fed by a hopper of ceramic powder <b>125</b>. In alternative embodiments, roller <b>120</b> may be a nozzle that is able to uniformly deposit layers of ceramic powder <b>125</b>. While specific systems of depositing ceramic powder <b>125</b> have been described, any appropriate system or method of depositing layers of ceramic powder <b>125</b> may be utilized. For example, certain embodiments of 3-D printer <b>100</b> may utilize techniques to deposit layers of ceramic; powder <b>125</b> that do not involve any form of roller <b>120</b>.

In some embodiments, pre-ceramic polymer <b>115</b> may be poly(hydridocarbyne) (“PMC”), poly(methylsilyne) (“PMS”), or any sp3-hybridized polymer. Pre-ceramic polymer lib may react with itself (e.g. pyrolyze, thermolyze, or decompose) to form a ceramic above a certain temperature known as a decomposition, or pyrolysis, temperature of pre-ceramic polymer <b>115</b>. In some embodiments, pre-ceramic polymer <b>115</b> may be dissolved in a solvent such as acetone, tetrahydrofuran, toluene, acetonitrile, an aprotic solvent, a mixture of any two or more of these solvents, and the like. In some embodiments, after depositing a layer of pre-ceramic polymer <b>115</b> dissolved in a solvent, 3-D printer <b>100</b> may pause for a predetermined amount of time to allow the solvent to evaporate before depositing another layer of ceramic powder <b>125</b>, Because layers of pre-ceramic polymer <b>115</b> may be relatively thin in certain embodiments, a pause of several seconds or less may be sufficient to allow the solvent to evaporate. Allowing the solvent to evaporate after each layer of pre-ceramic polymer <b>115</b> is deposited may prevent the solvent from becoming entrained in ceramic powder <b>125</b> as subsequent, layers of ceramic powder <b>125</b> and pre-ceramic polymer <b>115</b> are deposited. This may prevent any graphitic contaminate from forming within any 3-D printed object.

Ceramic powder <b>125</b> may be any appropriate nanoparticle filler. In some embodiments, ceramic powder <b>125</b> may be any one or a mixture of the following: detonation nanodiamond (“DND”) powdery silicon carbide powder, graphene nano-platlet powder, graphene oxide nano-platelet powder, carbon nanotube powder, various fullerenes (such as Buckminsterfullerenes), boron nitride nano-platelet powder, a carbide forming metal powder, or any other powder that will not sinter at the decomposition temperature of pre-ceramic polymer <b>115</b>. Examples of carbide forming metals include, but are not limited to, titanium, hafnium, and tungsten. In some embodiments, an average particle diameter of ceramic powder <b>125</b> may be less than a colloidal particle diameter of pre-ceramic polymer <b>115</b>. In some embodiments, the average particle diameter of ceramic powder <b>125</b> may be less than 30 nanometers. One example of a possible ceramic powder <b>125</b>, DND, may be formed by the detonation of explosives in an enclosed chamber in an inert atmosphere. The resulting nanodiamonds may have a diameter between 2 and 20 nanometers. Through processing, a powder of nanodiamonds having diameters of 4 to 5 nanometers may be created. Detonation nanodiamonds have a cubic crystal structure, like that of most, naturally occurring diamond.

In some embodiments, 3-D printer <b>100</b> may be controlled by computer system <b>150</b>. Computer system <b>150</b> may be any suitable computer system in any suitable physical form. In general, computer system <b>150</b> may store a digital representation of a 3-D object and provide 3-D printer <b>100</b> with information to print the 3-D object. For example, computer system <b>150</b> may store a 3-D computer aided design (CAD) model of an object and provide the model to 3-D printer <b>100</b> when printing the object.

Computer system. <b>150</b> may be integrated into 3-D printer <b>100</b>, connected to 3-D printer <b>100</b>, or be multiple computer systems both integrated into 3-D printer <b>100</b> and separate from 3-D printer <b>100</b>. As an example and not by way of limitation, computer system. <b>150</b> may be a virtual machine (VM), an embedded computer system, a system-on-chip (SOC), a single-board computer system (SBC) (e.g., a computer-on-module (COM or a system-on-module (SOM)), a desktop; computer system, a laptop or notebook computer system, a mainframe, a mesh of computer systems, a server, an application server, or a combination of two or more of these. Where appropriate, computer system <b>150</b> may include one or more computer systems <b>150</b>; be unitary or distributed; span multiple locations; span multiple machines; or reside in a cloud, which may include one or more cloud components in one or more networks. Where appropriate, one or more computer systems <b>150</b> may perform without substantial spatial or temporal limitation one or more steps of one or more methods described or illustrated herein. As an example and not by way of limitation, one or more computer systems <b>150</b> may perform in real time or in batch, mode one or more steps of one or more methods described or illustrated herein. One or more computer systems <b>150</b> may perform at different times or at different locations one or more steps of one or more methods described or illustrated herein, where appropriate. A particular embodiment of computer system <b>150</b> is described in more detail below in reference to <figref idref="DRAWINGS">FIG. 7</figref>.

<figref idref="DRAWINGS">FIG. 2</figref> illustrates an example of a 3-D printed object <b>200</b> printed by 3-D printer <b>100</b> within excess ceramic powder <b>125</b>. When, all layers of ceramic powder <b>125</b> and pre-ceramic polymer <b>115</b> nave been deposited, the volume of ceramic powder <b>125</b> onto which pre-ceramic polymer <b>115</b> was deposited will be in the shape of object <b>200</b> within ceramic powder <b>125</b>. Pre-ceramic polymer <b>115</b> may act as a binder, binding ceramic powder <b>125</b> together in the areas where print head <b>110</b> deposited pre-ceramic polymer <b>115</b>. The remaining excess ceramic powder <b>125</b> may act as a support for the object. For example, the excess ceramic powder <b>125</b> may keep thin sections of object <b>200</b> from collapsing.

<figref idref="DRAWINGS">FIG. 3</figref> illustrates an example of a vertical cross section <b>300</b> of 3-D printed object <b>200</b> illustrated in <figref idref="DRAWINGS">FIG. 2</figref>. Vertical cross section <b>300</b> illustrates how a pattern of pre-ceramic polymer <b>115</b>, when deposited onto subsequent layers of ceramic powder <b>125</b>, forms the shape of object <b>200</b>. <figref idref="DRAWINGS">FIG. 3</figref> also includes horizontal cross sections <b>310</b> and <b>320</b>, which are illustrated in. FIGURES and <b>4</b>B, Horizontal cross section <b>310</b> corresponds to a horizontal cross section of pre-ceramic polymer <b>115</b> that may be deposited near the bottom of object <b>200</b> illustrated in <figref idref="DRAWINGS">FIG. 2</figref>. Horizontal cross section <b>320</b> corresponds to a horizontal cross section of pre-ceramic polymer <b>115</b> that may be deposited near the top of object <b>200</b> illustrated in <figref idref="DRAWINGS">FIG. 2</figref>.

<figref idref="DRAWINGS">FIG. 5A</figref> illustrates the chemical structure of Poly(hydridocarbyne), which may be used, for pre-ceramic polymer <b>115</b> in some embodiments. Poly(hydridocarbyne) may pyrolyze to form diamond-like carbon or polycrystalline diamond when heated to a decomposition temperature such as between about 100 degrees Celsius and 800 degrees Celsius in an inert atmosphere. Upon sustained heating at or above the decomposition temperature for a predetermined amount of time (e.g., 12 to 21 hours), diamond-like carbon may anneal to form polycrystalline diamond. Diamond formed by pyrolysis of poly(hydridocarbyne) may have a hexagonal crystal structure. Diamond having a hexagonal crystal structure is also known as lonsdaleite. At its pyrolysis temperature, poly(hydridocarbyne) may react with the surface of ceramic powder <b>125</b> and bond to it. For example, if ceramic powder <b>125</b> is comprised of DND, poly(hydridocarbyne) may react to form polycrystalline diamond bonded to the DND. As a result, after heating, the 3-D printed object will be composed of polycrystalline diamond. More specifically the object may be composed of cubic crystal structure DND bonded within polycrystalline hexagonal diamond. By 3-D printing using DND and poly(hydridocarbyne), objects comprised entirely of solid diamond may be printed in almost any shape. For example, drill heads used for boring through the earth, such as drill heads with complex geometries that are used in the oil industry, could be printed using DND and poly(hydridocarbyne) to form a polycrystalline diamond drill head.

If a carbide-forming metal powder is used as ceramic powder <b>125</b>, the poly(hydridocarbyne) may react with the surface of the metal particles to form metal carbide bonds. For example, if tungsten powder is used as ceramic powder <b>125</b>, the 3-D printed object after heating may comprise tungsten particles suspended in a polycrystalline diamond matrix, with the polycrystalline diamond bonded to the surface of the tungsten particles by tungsten carbide bonds. In particular embodiments, the metal particles may completely react with the poly(hydridocarbyne) to form a homogenous metal carbide,

<figref idref="DRAWINGS">FIG. 5B</figref> illustrates the chemical structure of poly(methylsilyne), which may be used for pre-ceramic polymer <b>115</b> in some embodiments. Poly(methylsilyne) may pyrolyze to form silicon carbide when heated to a decomposition temperature such as between about 100 degrees Celsius and 800 degrees Celsius. At its pyrolysis temperature, poly(methylsilyne) may react with the surface of ceramic powder <b>125</b> and bond to it. For example, if ceramic powder <b>125</b> is comprised of DND, poly(methylsilyne) may react to form silicon carbide bonded to the DUD. As a result, after heating, the 3-D printed, object may be composed of cubic crystal structure detonation nanodiamonds within a silicon carbide matrix, with the silicon carbide bonded to the surface of the detonation nanodiamonds. If the ceramic powder comprises silicon carbide powder, poly(methylsilyne) will react to form silicon carbide bonded to the silicon carbide powder, forming a 3-D object, of polycrystalline silicon carbide.

In operation of example embodiments, 3-D printer <b>100</b> may print object <b>200</b> by depositing alternating layers of ceramic powder <b>125</b> and pre-ceramic polymer <b>115</b>. 3-D printer <b>100</b> may deposit pre-ceramic polymer <b>115</b> in the shape of cross sections of the object being printed, such as those illustrated in <figref idref="DRAWINGS">FIGS. 4A and 4B</figref>. In some embodiments, the 3-D printing of object <b>200</b> using pre-ceramic polymer <b>115</b> and ceramic powder <b>125</b> may take place in an inert atmosphere. Examples of inert gases include, but are not limited to, argon, nitrogen, neon, xenon, and the like. Depositing layers of pre-ceramic polymer <b>115</b> and ceramic powder <b>125</b> in an inert atmosphere prevents oxygen from becoming entrained in object <b>200</b> and in excess ceramic powder <b>125</b> in which print head <b>110</b> did not deposit pre-ceramic polymer <b>115</b> and also may prevent oxidation of pre-ceramic polymer <b>115</b>. after 3-D printer <b>100</b> deposits ail layers of ceramic powder <b>125</b> and pre-ceramic polymer <b>115</b>, object <b>200</b> and excess ceramic powder <b>125</b> may be baked to a temperature at or above the decomposition temperature of pre-ceramic polymer <b>115</b> and below the sintering temperature of ceramic powder <b>125</b>. In some embodiments, this temperature range may be between about 100 degrees Celsius and 800 degrees Celsius. In certain embodiments, 3-D printer <b>100</b> may incorporate a heater or oven to bake the printed layers of pre-ceramic polymer <b>115</b> and ceramic powder <b>125</b>. In an alternative embodiment, the printed layers of pre-ceramic polymer <b>115</b> and ceramic powder <b>125</b> may be moved to an oven for baking after printing. For example, the layers of pre-ceramic polymer <b>115</b> and ceramic powder <b>125</b> may be deposited in container <b>160</b> in some embodiments and container <b>160</b> may be moved to an oven for baking after printing. In an alternative embodiment, optical photo-pyrolysis may also be used to “expose” or pyrolize each entire printed layer of pre-ceramic polymer <b>115</b>. In such an embodiment, there may be no need to bake the final item as it is converted layer-by-layer to diamond like carbon and/or diamond during each photo-pyrolysis exposure.

In some embodiments, the baking occurs at any temperature in which ceramic powder <b>125</b> may remain a powder and pre-ceramic polymer <b>115</b> decomposes. For example, the baking may occur at a decomposition temperature that is between about 100 degrees Celsius and about 800 degrees Celsius. For example, the baking may occur at a temperature that is at least 100 degrees Celsius, plus or minus 0%-1%, 1%-5%, 5%-10%, or 10%-20%, but is less than 800 degrees Celsius, plus or minus 0%-1%, 1%-5%, 5%-10%, or 10%-20%. While specific baking temperatures have been disclosed, it should be noted that any appropriate temperature in which ceramic powder <b>125</b> remains a powder (i.e. any temperature at which ceramic powder <b>125</b> does not sinter to itself) while pre-ceramic polymer <b>115</b> decomposes may be utilized.

In some embodiments, the baking occurs in an inert atmosphere such as nitrogen, argon, xenon, neon, and the like. Baking in an inert atmosphere may prevent the printed pre-ceramic polymer <b>115</b> and ceramic powder <b>125</b> from reacting with any oxygen in the air. In some embodiments, if 3-D printer <b>100</b> printed an object in the presence of oxygen, the oxygen may additionally or alternatively be purged, from the printed pre-ceramic polymer <b>115</b> and ceramic powder <b>125</b> before baking. To remove entrained oxygen before baking, the printed pre-ceramic polymer <b>115</b> and ceramic powder <b>125</b> may be placed in a vacuum or inert atmosphere to allow the oxygen to diffuse out. Removal of entrained oxygen may take an extended period of time (e.g., up to twenty four hours). Given the amount of time required to purge oxygen from the printed pre-ceramic polymer <b>115</b> and ceramic powder <b>125</b>, 3-D printing in an inert atmosphere may be desirable in order to expedite the 3-D printing process.

As mentioned above, the decomposition temperature may be between about 100 degrees Celsius and about 800 degrees Celsius. Pre-ceramic polymer <b>115</b> may react with itself and with the surface of particles of ceramic powder <b>125</b> at this temperature. In this temperature range, particles of ceramic powder <b>125</b> will not sinter, meaning they will not react with, or bind to, other particles of ceramic powder <b>125</b>. Therefore, ceramic powder <b>125</b> may remain a powder at the temperatures at which pre-ceramic polymer <b>115</b> decomposes. The excess ceramic powder <b>125</b> that is not in contact with pre-ceramic polymer <b>115</b> may act as a support tor the printed object during heating.

After heating the ceramic powder <b>125</b> containing pre-ceramic polymer <b>115</b>, excess ceramic powder may be removed from the object. The excess ceramic powder may be recycled and used to print another 3-D object. 3-D printer <b>100</b> may remove excess ceramic powder <b>125</b> from the 3-D diamond object using a brush, vacuum, compressed air, or any other appropriate tool. Excess ceramic powder <b>125</b> may also be removed manually after heating.

In some embodiments, 3-D printer <b>100</b> may be able to print a layer of ceramic powder <b>123</b> and a layer of pre-ceramic polymer <b>115</b> continuously. In such an embodiment, 3-D printer <b>100</b> may have multiple rollers <b>120</b> and print heads <b>110</b> in order to print multiple layers continuously. Multiple rollers <b>120</b> and print heads <b>110</b> may be arranged sequentially on a moving line which feeds directly into a heater or oven, to heat the printed layers. In such an embodiment, the printed object may be a thin continuous object, such as a printed cloth that can be rolled upon exit from the oven.

In some embodiments, 3-D printer <b>100</b> may print object <b>200</b> using multiple ceramic powders <b>125</b> and pre-ceramic polymers <b>115</b>. The use of different ceramic powders <b>125</b> may produce objects having different properties. Properties that may depend on the choice of ceramic powders <b>125</b> include toughness, hardness, yield strength, density, friction, electrical conductivity, thermal conductivity, thermal expansion coefficient, optical transparence, index of refraction, or other physical properties, in a printed object. For example, printing an object using carbon nanotube powder may result in an object that is tougher than one printed using DND, while objects printed using DND may be harder than, those printed using carbon nanotube powder.

In some embodiments, certain ceramic powders <b>125</b> may also be mixed to tune the desired properties of object <b>200</b>. For example, a mixture of carbon nanotubes and DND may be used as ceramic powder <b>125</b> to create an object <b>200</b> having desired levels of toughness and hardness. Additionally, roller <b>120</b> may deposit layers of different, ceramic powders <b>125</b>. For example, roller <b>120</b> may deposit a first layer of DND, followed by a layer of Buckminsterfullerenes. Depositing layers of different ceramic powers <b>125</b> allows the printing of an object with desirable properties. For example, printing an object with layers that alternate between being hard and being tough may allow for the creation of an object, with properties desirable as an armor. As one example, an armor having alternating layers of diamond and metal carbide may be printed.

In some embodiments, print head <b>110</b> may deposit both poly(hydridocarbyne) and poly(methylsilyne) to print object <b>200</b>. For example, poly(hydridocarbyne) could be used to print some layers of an object and poly(methylsilyne) could be used to print other layers of the object. Similarly, poly(hydridocarbyne) could be used to print a section of an object and poly(methylsilyne) could be used to print another section. For example, poly(hydridocarbyne) could be used to print the handle portion of object <b>200</b> illustrated in <figref idref="DRAWINGS">FIG. 2</figref> and poly(methylsilyne) could be used to print the cup portion of object <b>200</b>. In some embodiments, poly(hydridocarbyne) could, be printed onto a layer of a first type of ceramic powder <b>125</b> and poly(methylsilyne) could be printed onto a layer of a second type of ceramic powder <b>125</b>. Printing objects <b>200</b> using multiple types of ceramic powders <b>125</b> and both poly(methylsilyne) and poly(hydridocarbyne) may allow for the creation of objects that would be otherwise difficult to manufacture. For example, an object having both structural elements and integral electronic elements may be printed. For example, a missile radome could be printed out of diamond with a silicon carbide outer coating to prevent oxidation of the diamond at high temperatures. Such a radome may incorporate elements of a printed wiring board (PWB), as illustrated in <figref idref="DRAWINGS">FIG. 7</figref>. For example, a radome may have interconnects such as internal graphene-coated tubes to act as integral radio frequency antennae and other internal grapheme tubes with data processing chips placed directly onto the internal radome surface. Such an object may be printed by using layers of DND and poly(hydridocarbyne) to form the structure of the radome, and using silicon carbide powder and poly(methylsilyne) to form the outer surface of the radome.

<figref idref="DRAWINGS">FIG. 6</figref> illustrates a method <b>600</b> for printing a 3-D object such as object <b>200</b> in a ceramic powder using a pre-ceramic polymer. Method <b>600</b> may be implemented by 3-D printer <b>100</b>. Method <b>600</b> begins at step <b>605</b> where a layer of ceramic powder is deposited. In some embodiments, the layer of ceramic powder is deposited by an apparatus such as roller <b>120</b> or any other suitable method. In some embodiments, the ceramic powder deposited in step <b>605</b> may be ceramic powder <b>125</b> discussed above. In some embodiments, the ceramic powder may be deposited into a container such as container <b>160</b> above. At step <b>610</b>, a layer of pre-ceramic polymer is deposited in the shape of a cross section of the desired object onto the layer of ceramic powder deposited in step <b>605</b>. In some embodiments, the pre-ceramic polymer is deposited in step <b>610</b> by print head <b>110</b> or any other appropriate apparatus. In some embodiments, the pre-ceramic polymer is pre-ceramic polymer <b>115</b> above. After depositing the pre-ceramic polymer in step <b>610</b>, some embodiments of method <b>600</b> may pause to allow any solvent within the pre-ceramic polymer to evaporate.

At step <b>620</b>, all layers of pre-ceramic polymer needed to form the object have not been deposited, 3-D printer <b>100</b> will select the next cross section to be printed and move back to step <b>605</b> where a new layer of ceramic powder is deposited. At step <b>610</b>, pre-ceramic polymer <b>115</b> is deposited in the shape of the next cross section of the object. When all cross sections have been printed, method <b>600</b> proceeds to step <b>640</b>.

At step <b>640</b>, the printed ceramic powder and pre-ceramic polymer is heated at or above the pre-ceramic polymer's decomposition temperature. At this temperature, the pre-ceramic polymer may react to form a ceramic and may bind to the ceramic powder. In some embodiments, step <b>640</b> occurs in an inert atmosphere as described above. In particular embodiments, optical photo-pyrolysis may also be used to “expose” or pyrolize each entire printed layer of pre-ceramic polymer. In such an embodiment, there may be no need to bake the final item as it is converted layer-by-layer to diamond like carbon and/or diamond during each photo-pyrolysis exposure.

After heating in step <b>640</b>, some embodiments of method <b>600</b> proceed to step <b>650</b> where excess ceramic powder that is not in contact with the reacted pre-ceramic polymer is removed. In some embodiments, the excess powder may be either removed mechanically (e.g., by 3-D printer <b>100</b>) or manually removed. In some embodiments, the excess ceramic powder is recycled or discarded.

After printing, heating, and removal of excess ceramic powder, the object may be subjected to additional processing steps to prepare the object for use. Examples of post-printing processing may include: painting the object, polishing the object, treating the surface of the object to render it chemically inert or to make it chemically active, and assembly of another object or device from multiple printed objects.

<figref idref="DRAWINGS">FIG. 7</figref> illustrates an example embodiment of a circuit board <b>700</b>, sometimes referred to as a printed wiring board (PWB), that may be printed using 3-D printer <b>100</b>, according to certain embodiments. Circuit board <b>700</b> includes attachment pad <b>720</b>, interconnects <b>721</b> (“tubes”), interconnect terminations <b>722</b>, tube openings <b>731</b>, fins <b>740</b>, and capacitor <b>751</b>. Attachment pad <b>720</b> may contain a pattern of one or more interconnect terminations <b>722</b> and serve as an attachment point for any electronic device such as a capacitor, resistor, computer chip, processor, memory chip, or other appropriate device coupled to circuit board <b>700</b>.

Interconnects <b>721</b> may conduct signals between electronic devices attached to interconnect terminations <b>722</b>. In particular embodiments, interconnects <b>721</b> may conduct electrical signals or electrical power. In other embodiments, interconnects <b>721</b> may be optical or infrared waveguides that carry signals transmitted by light, as discussed in more detail below in reference to <figref idref="DRAWINGS">FIGS. 11A-11C</figref>. Interconnect terminations <b>722</b> may provide an attachment point for contacts of computer chips that may be mounted to circuit board <b>700</b>. Tube openings <b>731</b> may be open to the atmosphere to allow the pressure within interconnects <b>721</b> to be equalized to the surrounding environment. In some embodiments, some interconnects <b>721</b> say have tube openings <b>731</b> and some interconnects <b>721</b> may not have tube openings <b>731</b>. Fins <b>740</b> may serve to conduct heat away from circuit board <b>700</b> and transfer heat generated by circuit board <b>700</b> or any components attached to circuit board <b>700</b> to the surrounding environment. Capacitor <b>751</b> may be a capacitor formed within circuit board <b>700</b> during production of circuit board <b>700</b>. Capacitor <b>751</b> may take advantage of she high dielectric constant of diamond of 7,000 V/micron.

In general, circuit board <b>700</b> may be a computer circuit board to which electronic devices such as computer chips are attached. Circuit board <b>700</b> may be substantially composed of polycrystalline diamond. In some embodiments, the polycrystalline diamond may be hexagonal polycrystalline diamond. Circuit board <b>700</b> may be printed by 3-D printer <b>100</b> according to the method described above with respect to <figref idref="DRAWINGS">FIG. 6</figref>. In certain embodiments, 3-D printer <b>100</b> may print circuit board <b>700</b> by depositing layers of pre-ceramic polymer <b>115</b> without the use of a nanoparticle filler.

<figref idref="DRAWINGS">FIG. 8</figref> illustrates an example cross section <b>800</b> of circuit board <b>700</b>, according to certain embodiments. Cross section <b>800</b> may be representative of a layer printed by 3-D printer <b>100</b> in the printing of circuit board <b>700</b>.

In particular embodiments, interconnects <b>721</b> may be able ho conduct electricity. Electricity conducting interconnects <b>721</b> may be tubes of any shape, such as those illustrated in <figref idref="DRAWINGS">FIG. 9</figref>. These tubes may be substantially hollow and may nave a variety of interior geometries including internal support structures. The inner surface of electricity conducting interconnects <b>721</b> may be composed of a layer of graphene. In some embodiments, the inner surface of electricity conducting interconnects <b>721</b> may be composed of a layer of polycrystalline diamond covering a layer of grapheme, such that the layer of graphene is “sandwiched” between two polycrystalline diamond layers. The graphene layer may conduct electricity through interconnects <b>721</b>. In certain embodiments, the graphene may more efficiently conduct electricity if it is “sandwiched” between two polycrystalline diamond layers. The polycrystalline diamond layers may serve to constraint phonons in the graphene layer.

In particular embodiments, interconnects <b>721</b> may have one or more tube openings <b>731</b>. Tube openings <b>731</b> may be open to the atmosphere, or any other environment in which circuit board <b>700</b> is used (for example, in space or under water). Tube openings <b>731</b> may allow the pressure within interconnects <b>721</b> to equalize to the outside environment. Equalization of pressure may prevent damage to circuit board <b>700</b> if the circuit board is used in environments where the pressure may vary. For example, if circuit board <b>700</b> is used onboard an aircraft, tube openings <b>731</b> may allow the pressure inside of interconnects <b>721</b> to equalize to the pressure of the altitude of the aircraft. In particular embodiments, interconnects <b>721</b> may not connect to any electrical devices, and instead serve as cooling passages through which a cooling fluid may be circulated. In these embodiments, tube openings <b>731</b> may provide points through which a cooling fluid may enter and exit circuit board <b>700</b>.

Interconnects <b>721</b> may terminate at the surface of circuit board <b>700</b> at terminations <b>722</b>. Terminations <b>722</b> may be arranged into an attachment pad <b>720</b>. Attachment pad <b>720</b> may serve as the attachment point for electronic devices to circuit board <b>700</b>. In particular embodiments, for example, attachment pad <b>720</b> may be in the shape of a ball grid array, which may allow for attachment of electronic devices using a standard ball grid array interface. In other embodiments, attachment pad <b>720</b> may be made of interconnect terminations <b>722</b> able to receive a connection from electronic devices having graphene connection points (e.g. electrically conductive setae) able to directly interface with interconnect terminations <b>722</b>.

In some embodiments, attachment pad <b>720</b> may be countersunk into the surface of circuit board <b>700</b> such that electronic devices attached to attachment pad <b>720</b> may be mounted flush to the surface of circuit board <b>700</b>. Countersunk attachment pads <b>720</b> may allow multiple circuit boards <b>700</b> to be stacked adjacent to one another. Adjacently stacked circuit boards <b>700</b> may be connected by interconnects <b>721</b> that may be arranged to pass vertically through circuit boards <b>700</b>.

In some embodiments, interconnects <b>721</b> may include one or more capacitors <b>751</b>, which may be formed by two adjacent interconnects <b>721</b> that terminate within circuit board <b>700</b> and are separated by a layer of polycrystalline diamond. The layer of polycrystalline diamond may act as a dielectric layer between layers of graphene that make up the inner surface of tubes <b>721</b>. Interconnects <b>721</b> may terminate within circuit board <b>700</b> in a variety of geometries, thereby having an effect on the area of the polycrystalline diamond between interconnects <b>721</b>. The area of the polycrystalline diamond dielectric between the layers of graphene may at least partially determine the capacitance of capacitor <b>751</b>.

In certain embodiments, fins <b>740</b> may be formed on the surface of circuit board <b>700</b>. In particular embodiments, fins <b>740</b> may be part of the polycrystalline diamond structure of circuit board <b>700</b>. Fins <b>740</b> may conduct heat generated by circuit board <b>700</b> or by electronic devices attached to circuit board <b>700</b> away from circuit board <b>700</b>. Fins <b>740</b> may be arranged in a variety of geometries over any surface of circuit board <b>700</b> as appropriate to attain a desired neat transfer from circuit board <b>700</b>.

<figref idref="DRAWINGS">FIG. 9</figref> illustrates example geometries of interconnects <b>721</b>, according to certain embodiments. Possible geometries of interconnects <b>721</b> may include a circular geometry <b>910</b> (e.g., a circle or an oval), a polygonal geometry <b>920</b> (e.g., any n-sided polygon such as a triangle, square, rectangle, pentagon, hexagon, heptagon, octagon, and the like), a star geometry <b>930</b>, a fractal geometry (not illustrated), or a geometry <b>940</b> having internal support structures <b>945</b>. Support structures <b>945</b> may be utilized in any geometry of interconnects <b>721</b> and may comprise polycrystalline diamond that may act to support interconnects <b>721</b>. Support structures <b>945</b> may also increase the inner surface area of interconnects <b>721</b>. Support structures <b>945</b> may be printed from poly(hydridocarbyne) during printing of circuit board <b>700</b> by 3-D printer <b>100</b> and may support inter connects <b>721</b> during the printing process. The surface of interconnects <b>721</b> may by composed of a layer of graphene <b>912</b>. In certain, embodiments, a layer of graphene <b>912</b> may also be present on the surface of support structures <b>945</b>. Although <figref idref="DRAWINGS">FIG. 9</figref> illustrates example geometries of interconnects <b>721</b> and support structures <b>945</b>, any appropriate geometry may be used.

<figref idref="DRAWINGS">FIG. 10</figref> illustrates an example method <b>1000</b> for printing circuit board <b>700</b>, according to certain embodiments. Method <b>1000</b> begins at step <b>1010</b> in which layers of pre-ceramic polymer are deposited having the geometry of circuit board <b>700</b>. In some embodiments, the pre-ceramic polymer may be deposited according to the method illustrated in <figref idref="DRAWINGS">FIG. 6</figref>. However, in particular embodiments, pre-ceramic polymer may be deposited without the use of a ceramic powder. To form tubes that may act as electrically conducting interconnects or as coolant tubes, each layer of pre-ceramic polymer deposited may have areas in which no pre-ceramic polymer is deposited corresponding to the geometry of the tubes at that layer. To print a circuit board composed of polycrystalline diamond, poly(hydridocarbyne) may be used as the pre-ceramic polymer.

At step <b>1020</b>, the printed pre-ceramic polymer in the shape of circuit board <b>700</b> may be heated to the decomposition temperature of the pre-ceramic polymer. For example, the heating may occur at a decomposition temperature that is between about 100 degrees Celsius and about 800 degrees Celsius. For example, the heating may occur at a temperature that is at least 100 degrees Celsius, plus or minus 0%-1%, 1%-5%, 5%-10%, or 10%-20%, bur is less than 800 degrees Celsius, plus or minus 0%-1%, 1%-5%, 5%-10%, or 10%-20%, In an embodiment in which circuit board <b>700</b> is printed without the use of a ceramic powder, heating of circuit board <b>700</b> may be accomplished using a slow temperature ramp to prevent damage to circuit board <b>700</b>. For example, the temperature may be increased between 0.1 and 1.0 degrees Celsius per hour. In some embodiments, heating of the pre-ceramic polymer may occur in an inert atmosphere. Heating may cause the pre-ceramic polymer to decompose. Poly(hydridocarbyne) may decompose to form hexagonal polycrystalline diamond, and poly(methylsilyne) may decompose to form silicon carbide. In particular embodiments, optical photo-pyrolysis may also be used to “expose” or pyrolize each entire printed layer of pre-ceramic polymer. In such an embodiment, there may be no need to bake the final item as it is converted layer-by-layer to diamond like carbon and/or diamond during each photo-pyrolysis exposure.

At step <b>1030</b>, circuit board <b>700</b> may be heated to a second, temperature that is higher than the decomposition temperature of the pre-ceramic polymer. For example, the heating may occur at a temperature that is about 900 degrees Celsius. For example, the heating may occur at a temperature that is at least 900 degrees Celsius, plus or minus 0%-1%, 1%-5%, 5%-10%, or 10%-20%. At this temperature, the polycrystalline diamond may thermolyze and graphene may form epitaxially on the surfaces of any polycrystalline diamond or silicon carbide portions of circuit board <b>700</b> that had been formed at step <b>1020</b>. For example, graphene may form on the interior surfaces of any interconnects <b>721</b> printed in circuit board <b>700</b>. The graphene layer may allow interconnects <b>721</b> to conduct electricity.

In some embodiments, graphene may form on the outer surface of circuit board <b>700</b> in step <b>1030</b>. In such embodiments, the graphene on the outer surface of circuit board <b>700</b> may be polished away after step <b>1030</b>. In other embodiments, the outer surface of circuit board <b>700</b> may be coated in a carbide-forming metal before heating in step <b>1030</b>. The carbide-forming metal coating may form a metal carbide layer that inhibits the formation of graphene on the surface of circuit board <b>700</b>.

If it is desired to coat the graphene layer formed in step <b>1030</b> with polycrystalline diamond, then any interconnects <b>721</b> printed in circuit board <b>700</b> may be flushed with any appropriate substance such as poly(hydridocarbyne) at step <b>1040</b>. Coating the graphene layer with polycrystalline diamond may provide for phonon confinement and increase the electrical conductivity of the graphene layer. If it is not desired to coat the graphene layer with a layer of polycrystalline diamond, then method <b>1000</b> may end. Flushing interconnects <b>721</b> in circuit board <b>700</b> with poly(hydridocarbyne) at step <b>1040</b> may result in a coating of poly(hydridocarbyne) on the interior surface of the interconnects <b>721</b>. The poly(hydridocarbyne) may be converted to polycrystalline diamond at step <b>1050</b> by heating circuit board. <b>700</b> to a temperature approximately equal to the temperature used in step <b>1020</b>. For example, the heating may occur at a temperature that is at least 100 degrees Celsius, plus or minus 0%-1%, 1%-5%, 5%-10%, or 10%-20%, but is less than 800 degrees Celsius, plus or minus 0%-1%, 1%-5%, 5%-10%, or 10%-20%, In some embodiments, heating at step <b>1050</b> may occur in an inert atmosphere. The heating in step <b>1050</b> may cause the poly(hydridocarbyne) to decompose, thereby forming polycrystalline diamond that covers the graphene layer on the interior surface of interconnects <b>721</b> formed in circuit board <b>700</b>.

<figref idref="DRAWINGS">FIGS. 11A</figref>, <b>11</b>B, and <b>11</b>C illustrate example cross sections of an optical wave guide <b>1100</b>, according to certain embodiments. Optical wave guide <b>1100</b> may include one or more interconnects <b>721</b> and transmit light between terminations <b>722</b> on circuit board <b>700</b>. Optical wave guide <b>1100</b> may include a polycrystalline diamond core <b>1150</b> surrounded by silicon carbide <b>1160</b>. Polycrystalline diamond core <b>1150</b> may transmit light along the length of optical wave guide <b>1100</b>. In some embodiments, polycrystalline diamond core <b>1150</b> may have an index of refraction of approximately 2.419 and silicon carbide <b>1160</b> may have an index of refraction of approximately 2.69.

<figref idref="DRAWINGS">FIG. 11A</figref> illustrates an example cross section of optical wave guide <b>1100</b>, transverse to the direction in which optical wave guide <b>1100</b> transmits light, before and alter heating. 3-D printer <b>100</b> may print optical wave guide <b>1100</b> by depositing poly(hydridocarbyne) and poly(methylsilyne) to form a structure with a core of poly(hydridocarbyne) <b>550</b> surrounded by poly(methylsilyne) <b>560</b>. In some embodiments, 3-D printer <b>100</b> may deposit a layer of poly(methylsilyne) <b>560</b>, followed by a layer of poly(methylsilyne) <b>560</b> arranged adjacent to and to either side of poly(hydridocarbyne) <b>550</b>, and followed by a layer of poly(methylsilyne) <b>560</b> to encapsulate the printed, length of poly(hydridocarbyne) <b>550</b>. After printing, the circuit board <b>700</b> containing optical wave guide <b>1100</b> may be heated to a decomposition temperature of the poly(hydridocarbyne) <b>550</b> and poly(methylsilyne) <b>560</b> to convert, the poly(hydridocarbyne) <b>550</b> to polycrystalline diamond (i.e., polycrystalline diamond core <b>1150</b>) and the poly(methylsilyne) <b>560</b> to silicon carbide (i.e., silicon carbide <b>1160</b>). For example, the heating may occur at a decomposition temperature that is between about 100 degrees Celsius and about 800 degrees Celsius. For example, the heating may occur at a temperature that is at least <b>100</b> degrees Celsius, plus or minus 0%-1%, 1%-5%, 5%-10%, or 10%-20%, but is less than 800 degrees Celsius, plus or minus 0%-1%, 1%-5%, 5%-10%, or 10%-20%. In some embodiments, the heating may occur in an inert atmosphere.

<figref idref="DRAWINGS">FIG. 11</figref><i>b </i>illustrates an example cross section of optical wave guide <b>1100</b>, transverse to the direction in which optical wave guide <b>1100</b> transmits light, within circuit board <b>700</b> composed, of polycrystalline diamond <b>1150</b>. Optical wave guide <b>1100</b> may be surrounded by polycrystalline diamond that forms circuit board <b>700</b>. <figref idref="DRAWINGS">FIG. 11</figref><i>b </i>illustrates layers of polycrystalline diamond <b>1150</b> and layers of silicon carbide <b>1160</b> which may correspond to printed layers or poly(hydridocarbyne) and poly(methylsilyne), respectively. In some embodiments, printed layers of poly(hydridocarbyne) and poly(methylsilyne) may become indistinguishable after conversion to polycrystalline diamond <b>1110</b> and silicon carbide <b>1160</b>, forming a contiguous structure of polycrystalline diamond <b>1150</b> and silicon carbide <b>1160</b> without apparent boundaries between printed layers. In some embodiments the cross-section of polycrystalline diamond core <b>1150</b> and silicon carbide may have any appropriate geometry such as a circular geometry (e.g., a circle or an oval), a polygonal geometry (e.g., any n-sided polygon such as a triangle, square, rectangle, pentagon, hexagon, heptagon, octagon, and the like), a star geometry, or a fractal geometry.

FIG. lie illustrates an example cross section of optical wave guide <b>1100</b>, along the direction in which optical wave guide <b>1100</b> transmits light, within circuit board <b>700</b> composed of polycrystalline diamond <b>1150</b>. Optical wave guide <b>1100</b> may include an interconnect termination <b>722</b>. In some embodiments, interconnect termination <b>722</b> may be a lens (e.g. a kinoform or diffractive lens) formed from polycrystalline diamond or silicon carbide. Termination <b>722</b> may serve to transmit light transmitted through optical wave guide <b>1100</b> to an electronic device mounted to circuit board <b>700</b>, such as a computer chip, or off of circuit board <b>700</b> to another PWB. In particular embodiments, termination <b>722</b> may transmit light from a circuit board <b>700</b> to another PWB through an array of stacked PWBs, forming an optical data bus between PWBs. In particular embodiments, multiple optical wave guides <b>1100</b> and multiple electrically conducting interconnects <b>721</b> may be arranged throughout circuit board <b>700</b>.

<figref idref="DRAWINGS">FIGS. 12</figref><i>a </i>and <b>12</b><i>b </i>illustrate example methods <b>1200</b> and <b>1210</b> for printing an optical wave guide within a polycrystalline diamond PWB, such as circuit board <b>700</b>, according to certain embodiments. Method <b>1200</b> begins at step <b>1210</b> where layers of poly(hydridocarbyne) and poly(methylsilyne) may be deposited so as to form the geometry of a core of poly(hydridocarbyne) surrounded by poly(methylsilyne). The layers of poly(hydridocarbyne) and poly(methylsilyne) may be deposited along with layers of poly(hydridocarbyne) that form the remainder of the circuit board during printing, such that the layers of poly(hydridocarbyne) and poly(methylsilyne) forming the optical wave guide may be “encased” within the layers poly(hydridocarbyne) forming the circuit board.

<figref idref="DRAWINGS">FIG. 12</figref><i>b </i>illustrates an example of step <b>1210</b> of method <b>1200</b>, for printing a horizontal length of an optical wave guide within a circuit board. The steps illustrated, by <figref idref="DRAWINGS">FIG. 12</figref><i>b </i>may be altered appropriately to accommodate printing other geometries of an optical wave guide, such as vertical lengths, angled lengths, or curved lengths. Step <b>1210</b> for printing a horizontal length of an optical wave guide begins at step <b>1211</b> where a layer of poly(methylsilyne) may be deposited along the horizontal length of the optical wave guide. Next at step <b>1212</b>, a layer of poly(hydridocarbyne) and poly(methylsilyne) is printed on top of the layer of poly(methylsilyne) that was deposited in step <b>1211</b>. The layer of poly(hydridocarbyne) and poly(methylsilyne) deposited, at step <b>1212</b> may be arranged so that the poly(methylsilyne) is deposited adjacent to and on. either side of the deposited poly(hydridocarbyne), At step <b>1213</b> a layer of poly(methylsilyne) may be deposited on top of the layer of poly(hydridocarbyne) and poly(methylsilyne) that was deposited in step <b>1212</b>. After step <b>1213</b>, additional layers of poly(hydridocarbyne) and poly(methylsilyne) may be deposited. For example, additional layers may be needed to terminate the optical wave guide at the surface of the circuit board. After depositing all layers necessary to form an optical wave guide within a printed circuit board, method <b>1200</b> may continue to step <b>1220</b>.

At step <b>1220</b>, layers of poly(hydridocarbyne) may be deposited, on the surface of the circuit board at the terminations of the optical wave guide. In particular embodiments, the layers of poly(hydridocarbyne) may be deposited in the shape of a lens. At step <b>1230</b> the circuit board may be heated to a decomposition temperature of the poly(hydridocarbyne) and poly(methylsilyne) to convert the poly(hydridocarbyne) and poly(methylsilyne) into polycrystalline diamond and silicon carbide, respectively. In particular embodiments, optical photo-pyrolysis may also be used to “expose” or pyrolize each entire printed layer of pre-ceramic polymer. In such an embodiment, there may be no need, to bake the final item as it is converted layer-by-layer to diamond like carbon and/or diamond during each photo-pyrolysis exposure.

<figref idref="DRAWINGS">FIG. 13</figref> illustrates an example computer system <b>1300</b>. Computer system <b>1300</b> may be utilized by computer system <b>150</b> of <figref idref="DRAWINGS">FIG. 1</figref>. In particular embodiments, one or more computer systems <b>1300</b> perform one or more steps of one or more methods described or illustrated herein. In particular embodiments, one or more computer systems <b>1300</b> provide functionality described or illustrated herein. In particular embodiments, software running on one or more computer systems <b>1300</b> performs one or more steps of one or more methods described or illustrated herein or provides functionality described or illustrated, herein. Particular embodiments include one or more portions of one or more computer systems <b>1300</b>. Herein, reference to a computer system may encompass a computing device, and vice versa, where appropriate. Moreover, reference to a computer system may encompass one or more computer systems, where appropriate.

This disclosure contemplates any suitable number of computer systems <b>1300</b>. This disclosure contemplates computer system <b>1300</b> taking any suitable physical form. As example and not by way of limitation, computer system <b>1300</b> may be an embedded computer system, a system-on-chip (SOC), a single-board computer system (SBC) (such as, for example, a computer-on-module (COM) or system-on-module (SOM)), a desktop computer system, a laptop or notebook computer system, an interactive kiosk, a mainframe, a mesh of computer systems, a mobile telephone, a personal digital assistant (PDA), a server, a tablet computer system, or a combination of two or more of these. Where appropriate, computer system <b>1300</b> may include one or more computer systems <b>1300</b>; be unitary or distributed; span multiple locations; span multiple machines; span multiple data centers; or reside in a cloud, which may include one or more cloud components in one or more networks. Where appropriate, one or more computer systems <b>1300</b> may perform without substantial spatial or temporal limitation one or more steps of one or more methods described or illustrated herein. As an example and not by way of limitation, one or more computer systems <b>700</b> may perform in real time or in batch mode one or more steps of one or more methods described or illustrated herein. One or more computer systems <b>1300</b> may perform at different times or at different locations one or more steps of one or more methods described or illustrated herein, where appropriate.

In particular embodiments, computer system <b>1300</b> includes a processor <b>1302</b>, memory <b>1304</b>, storage <b>1300</b>, an input/output (I/O) interface <b>1308</b>, a communication interface <b>1310</b>, and a bus <b>1312</b>. Although this disclosure describes and illustrates a particular computer system having a particular number of particular components in a particular arrangement, this disclosure contemplates any suitable computer system having any suitable number of any suitable components in any suitable arrangement.

In particular embodiments, processor <b>1302</b> includes hardware for executing instructions, such as those making up a computer program. As an example and not by way of limitation, to execute instructions, processor <b>1302</b> may retrieve (or fetch) the instructions from an internal register, an internal cache, memory <b>1304</b>, or storage <b>1306</b>; decode and execute them; and then write one or more results to an internal register, an internal cache, memory <b>1304</b>, or storage <b>1306</b>. In particular embodiments, processor <b>1302</b> may include one or more internal caches for data, instructions, or addresses. This disclosure contemplates processor <b>1302</b> including any suitable number of any suitable internal caches, where appropriate. As an example and not by way of limitation, processor <b>1302</b> may include one or more instruction caches, one or more data caches, and one or more translation lookaside buffers (TLBs). Instructions in the instruction caches may be copies of instructions in memory <b>1304</b> or storage <b>1306</b>, and the instruction caches may speed up retrieved of those instructions by processor <b>1302</b>. Data in the data caches may be copies of data in memory <b>1304</b> or storage <b>1306</b> for instructions executing at processor <b>1302</b> to operate on; the results of previous instructions executed, at processor <b>1302</b> for access try subsequent instructions executing at processor <b>1302</b> or for writing to memory <b>1304</b> or storage <b>1306</b>; or other suitable data. The data caches may speed up read or write operations by processor <b>1302</b>. The TLBs may speed up virtual-address translation for processor <b>1302</b>. In particular embodiments, processor <b>1302</b> may include one or more internal registers for data, instructions, or addresses. This disclosure contemplates processor <b>1302</b> including any suitable number of any suitable internal registers, where appropriate. Where appropriate, processor <b>1302</b> may include one or more arithmetic logic units (ALUs); be a multi-core processor; or include one or more processors <b>1302</b>. Although this disclosure describes and illustrates a particular processor, this disclosure contemplates any suitable processor.

In particular embodiments, memory <b>1304</b> includes main memory for storing instructions for processor <b>1302</b> to execute or data for processor <b>1302</b> to operate on. As an example and not by way of limitation, computer system <b>1300</b> may load instructions from storage <b>1306</b> or another source (such as, for example, another computer system. <b>1300</b>) to memory <b>1304</b>. Processor <b>1302</b> may then load, the instructions from memory <b>1304</b> to air internal register or internal cache. To execute the instructions, processor <b>1302</b> may retrieve the instructions from she internal register or internal cache and decode them. During or after execution of the instructions, processor <b>1302</b> may write one or more results (which may be intermediate or final results) to the internal register or internal cache. Processor <b>1302</b> may then write one or more of those results to memory <b>1304</b>. In particular embodiments, processor <b>1302</b> executes only instructions in one or more internal registers or internal caches or in memory <b>1304</b> (as opposed to storage <b>1306</b> or elsewhere) and operates only on data in one or more internal registers or internal caches or in memory <b>1304</b> (as opposed to storage <b>1306</b> or elsewhere). One or more memory buses (which may each include an address bus and a data bus) may couple processor <b>1302</b> to memory <b>1304</b>. Bus <b>1312</b> may include one or more memory buses, as described below. In particular embodiments, one or more memory management units (MMUs) reside between processor <b>1302</b> and memory <b>1304</b> and facilitate accesses to memory <b>1304</b> requested by processor <b>1302</b>. In particular embodiments, memory <b>1304</b> includes random access memory (RAM). This RAM may be volatile memory, where appropriate. Where appropriate, this RAM may be dynamic RAM (DRAM) or static RAM (SRAM). Moreover, where appropriate, this RAM may be single-ported or multi-ported RAM. This disclosure contemplates any suitable RAM. Memory <b>1304</b> may include one or more memories <b>1304</b>, where appropriate. Although this disclosure describes and illustrates particular memory, this disclosure contemplates any suitable memory.

In particular embodiments, storage <b>1306</b> includes mass storage for data or instructions. As an example and not by way of limitation, storage <b>1306</b> may include a hard disk drive (HDD), a floppy disk drive, flash memory, an optical disc, a magneto-optical disc, magnetic tape, or a Universal Serial Bus (USB) drive or a combination of two or more of these. Storage <b>1306</b> may include removable or non-removable (or fixed) media, where appropriate. Storage <b>1306</b> may be internal or external to computer system <b>1300</b>, where appropriate. In particular embodiments, storage <b>1306</b> is non-volatile, solid-state memory. In particular embodiments, storage <b>1306</b> includes read-only memory (ROM). Where appropriate, this ROM may be mask-programmed ROM, programmable ROM (PROM), erasable PROM (EPROM), electrically erasable PROM (EEPROM), electrically alterable ROM (EAROM), or flash memory or a combination of two or more of these. This disclosure contemplates mass storage <b>1306</b> taking any suitable physical form. Storage <b>1306</b> may include one or more storage control units facilitating communication between processor <b>1302</b> and storage <b>1306</b>, where appropriate. Where appropriate, storage <b>1306</b> may include one or sore storages <b>1306</b>. Although this disclosure describes and illustrates particular storage, this disclosure contemplates any suitable storage.

In particular embodiments, I/O interface <b>1308</b> includes hardware, software, or both, providing one or more interfaces for communication between computer system <b>1300</b> and one or more I/O devices. Computer system <b>1300</b> may include one or more of these I/O devices, where appropriate. One or more of these I/O devices may enable communication between a person and computer system <b>1300</b>.

As an example and not by way of limitation, an I/O device may include a keyboard, keypad, microphone, monitor, mouse, printer, scanner, speaker, still camera, stylus, tablet, touch screen, trackball, video camera, another suitable I/O device or a combination of two or more of these. An I/O device may include one or more sensors. This disclosure contemplates any suitable I/O devices and any suitable I/O interfaces <b>1308</b> for them. Where appropriate, I/O interface <b>1303</b> may include one or more device or software drivers enabling processor <b>1302</b> to drive one or more of these I/O devices. I/O interface <b>1308</b> may include one or more I/O interfaces <b>1308</b>, where appropriate. Although this disclosure describes and illustrates a particular I/O interface, this disclosure contemplates any suitable I/O interface.

In particular embodiments, communication interface <b>1310</b> includes hardware, software, or both providing one or more interfaces for communication. (such as, for example, packet-based communication) between computer system <b>1300</b> and one or more other computer systems <b>1300</b> or one or more networks. As an example and not by way of limitation, communication interface <b>1310</b> may include a network interface controller (NIC) or network adapter for communicating with an Ethernet or other wire-based network or a wireless NIC (WNIC) or wireless adapter for communicating with a wireless network, such as a WI-FI network. This disclosure contemplates any suitable network and any suitable communication interface <b>1310</b> for it. As an example and not by way of limitation, computer system <b>1300</b> may communicate with an ad hoc network, a personal area network (PAN), a local area network (LAN), a wide area network (WAN), a metropolitan area network (MAN), or one or more portions of the Internet or a combination of two or more of these. One or more portions of one or more of these networks may be wired or wireless. As an example, computer system <b>1300</b> may communicate with a wireless PAN (WPAN) (such as, for example, a BLUETOOTH WPAN), a WI-FI network, a WI-MAX network, a cellular telephone network (such as, for example, a Global System for Mobile Communications (GSM) network), or other suitable wireless network or a combination of two or more of these. Computer system <b>1300</b> may include any suitable communication interface <b>1310</b> for any of these networks, where appropriate. Communication interface <b>1310</b> may include one or more communication interfaces <b>1310</b>, where appropriate. Although this disclosure describes and illustrates a particular communication interface, this disclosure contemplates any suitable communication interface.

In particular embodiments, bus <b>1312</b> includes hardware, software, or both coupling components of computer system <b>1300</b> to each other. As an example and not by way of limitation, bus <b>1312</b> may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a front-side bus (FSB), a HYPERTRANSPORT (HI) interconnect, an Industry Standard Architecture (ISA) bus, an INFINIBAND interconnect, a low-pin-count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCIe) bus, a serial advanced technology attachment (SATA) bus, a Video Electronics Standards Association local (VLB) bus, or another suitable bus or a combination of two or more of these. Bus <b>1312</b> may include one or more buses <b>1312</b>, where appropriate. Although this disclosure describes and illustrates a particular bus, this disclosure contemplates any suitable bus or interconnect.

The components of computer system <b>1300</b> may be integrated or separated. In some embodiments, components of computer system <b>1300</b> may each be housed within a. single chassis. The operations of computer system <b>1300</b> may be performed by more, fewer, or other components. Additionally, operations of computer system <b>1300</b> may be performed using any suitable logic that may comprise software, hardware, other logic, or any suitable combination of the preceding.

Modifications, additions, or omissions may be made to the methods described herein without departing from the scope of the invention. For example, the steps may be combined, modified, or deleted where appropriate, and additional steps may be added. Additionally, the steps may be performed in any suitable order without departing from the scope of the present disclosure.

Although the present invention has been described with several embodiments, a myriad of changes, variations, alterations, transformations, and modifications may be suggested, to one skilled in the art, and it is intended that the present invention, encompass such changes, variations, alterations, transformations, and modifications as fail within the scope of the appended claims.