US20140327432A1

Micro inductive sensor

Claim Score by NHIP

Abstract

An inductive sensor includes a sensor package and a coupler package. The sensor package includes a signal processor, an integrated capacitor, a ferrite layer, a transmitter coil, a two part receiving coil, and a plurality of discrete components. The coupler package includes an integrated capacitor, a ferrite layer, and a coupler coil. The transmitter coil in the sensor package is energized by an external power source which in turn energizes the coupler coil in the coupler package. The sensor then measures the rotational position of the coupler package relative to the sensor package by detecting and measuring, with the two part receiving coil, the signal returned by the coupler coil. The signal processor calculates the position of the coupler package relative to the sensor package by comparing the coupling factors between the coupler package and the sensor package.

US20140327432A1, drawing sheet 1 — Sheet 1 of 4

Term

Projected expiry 7 May 2037.

20 claims: 2 independent, 18 dependent

1
Broadest claimClaim Score 67, broad(NHIP)An inductive sensor assembly comprising:a sensor package having a transmitter coil and a two part receiving coil, the two part receiving coil having a first receiving coil and a second receiving coil;and a coupler packing having a coupler coil, wherein the first receiving coil has a plurality of first receiving loops wound in a first direction and the second receiving coil has a plurality of second receiving loops wound in a second direction opposite the first direction.
13
An inductive sensor assembly comprising:a sensor package having a transmitter coil and a two part receiving coil on a top side of the sensor package and a first ferrite disc on an opposite bottom side of the sensor package;and a coupler packing having a coupler coil on a bottom side of the coupler package, the bottom side of the coupler package facing the top side of the sensor package, wherein a first receiving coil of the two part receiving coil has a plurality of first receiving loops wound in a first direction and a second receiving coil of the two part receiving coil has a plurality of second receiving loops wound in a second direction opposite the first direction.

Independent claims2

29 paragraphs in 6 sections, as filed

0001This application claims priority of U.S. Provisional Application 61/819,118 filed May 3, 2013, the contents of which are included herein by reference.

FIELD OF THE INVENTION

0002This invention relates generally to position sensors. More particularly, this invention relates to inductive position sensors.

BACKGROUND OF THE INVENTION

0003Position sensors are often used in various mechanical control systems. Common position sensors include capacitive sensors, potentiometer sensors, and magnetic position sensors. However, inductive sensors are one of the most commonly used position sensors in vehicles. Inductive sensors detect the position of a target by measuring the mutual inductance between the target and the sensing coil. Compared to other magnetic position sensors, inductive sensors are more cost effective because they do not need a magnet and instead use an electromagnetic coil.

0004Inductive sensors are also desirable to use in vehicles instead of magnetic type sensors because inductive sensors are generally more reliable. Magnetic sensors can suffer performance loss as the magnet degrades and are more sensitive to magnetic disturbances from the surrounding environment. In contrast, inductive sensors are not dependent upon magnets and are more tolerant of interference from common automotive devices such as electric motors and alternators. However, to ensure adequate signal strength, inductive sensors are generally larger than traditional magnetic sensors. Consequently, inductive sensors also produce greater amounts of magnetic emissions due to their larger antenna area.

SUMMARY OF THE INVENTION

0005Embodiments of the present invention include a sensor package and a coupler package. The sensor package includes a plurality of pins, a signal processor, an integrated capacitor, a ferrite layer, a transmitter coil, a two part receiving coil, and a plurality of discrete components. The coupler package includes an integrated capacitor, a ferrite layer, and a coupler coil.

0006The transmitter coil in the sensor package is energized by an external power source which in turn energizes the coupler coil in the coupler package. The sensor then measures the rotational position of the coupler package relative to the sensor package by detecting and measuring with the two part receiving coil the signal returned by the coupler coil. The signal processor calculates the position of the coupler package relative to the sensor package by comparing the coupling factors between the coupler package and the sensor package.

0007In sharp contrast to conventional inductive sensors which use a metal piece as the fabricated coupler, the present invention uses a resonator as the coupler. Using a resonator as the coupler allows the transmitter coil and the coupler to become an oscillator system with a much higher quality factor (Q factor) than a conventional inductive sensor. Furthermore, the ferrite layer of the sensor package and the coupler package allows the size of the coils to be significantly reduced relative to conventional inductive sensors.

0008The eddy current on the coupler is the direct source of the signal on the two part receiving coil. When subjected to the same magnetic field as a conventional coupler, the resonator coupler will generate more eddy current. Therefore, using the same driving power, an inductive sensor using a resonator as the coupler can generate a much stronger electromagnetic field on the receiving coil than a conventional inductive sensor.

BRIEF DESCRIPTION OF THE DRAWINGS

0009<figref idref="DRAWINGS">FIG. 1</figref> illustrates a perspective view of the inductive sensor including the sensor package and the coupler package;

0010<figref idref="DRAWINGS">FIG. 2</figref> illustrates a bottom side view of the sensor package;

0011<figref idref="DRAWINGS">FIG. 3</figref> illustrates a top side view of the sensor package and the two part transmitter coil according to a first embodiment;

0012<figref idref="DRAWINGS">FIG. 4</figref> illustrates a top side view of the sensor package and the two part transmitter coil according to a second embodiment;

0013<figref idref="DRAWINGS">FIG. 5</figref> illustrates a bottom side view of the coupler package; and

0014<figref idref="DRAWINGS">FIG. 6</figref> illustrates a top side view of the coupler package.

DETAILED DESCRIPTION OF THE INVENTION

0015Embodiments of the present invention include a sensor package 10 and a coupler package 50. The sensor package 10 includes a plurality of pins 12, a signal processor 14, an integrated capacitor 16, a ferrite layer 20, a transmitter coil 22, a two part receiving coil 30, and a plurality of discrete components 48. The coupler package 50 includes an integrated capacitor 56, a ferrite layer 60, and a coupler coil 70. The transmitter coil 22 in the sensor package 10 is energized by an external power source (not shown) which in turn energizes the coupler coil 70 in the coupler package 50. The sensor 10 then measures the rotational position of the coupler package 50 relative to the sensor package 10 by detecting and measuring with the two part receiving coil 30 the signal returned by the coupler coil 70. The signal processor 14 calculates the position of the coupler package 50 relative to the sensor package 10 by comparing the coupling factors between the coupler package 50 and the sensor package 10.

0016The sensor assembly of the present invention including the sensor package 10 and the coupler package 50 are generally shown in <figref idref="DRAWINGS">FIG. 1</figref>. The inductive sensor and sensor package 10 of the present invention features a miniaturized design that can be fit into a single package due to enhanced signal strength. The sensor package 10 has a top side 42, which faces a bottom side 92 of the coupler package 50, and an opposite bottom side 44. A ferrite layer 20 extends substantially throughout the sensor package 10 and has a generally circular shape, although other shapes according to the sensor package 10 and coils 22, 30 are also possible.

0017On the bottom side 22 of the ferrite layer 20 there is an integrated capacitor 16 having a plurality of discrete components 48. These discrete components 48 can include capacitors, resistors, or other basic electronic components known in the art. A signal processor 14 is also found on the bottom 22 of the ferrite layer 20. The signal processor 14 measures and processes the signals produced and received by the sensor package 10. The signal processor 14 is also connected to the pins 12 which transmit the various signals of the sensor package 10.

0018The transmitter coil 22 and the two part receiving coil 30 are on the top side 42 of the sensor package 10. The transmitter coils 22 shown in <figref idref="DRAWINGS">FIGS. 3 and 4</figref> are generally circular and concentric with the ferrite layer 20 about an axis of the transmitter coil 22. The transmitter coil 22 has a plurality of windings which may be adjusted as necessary according to design parameters. The transmitter coil 22 is shown having a circular shape, although other embodiments are possible without departing from the scope of the invention.

0019The two part receiving coil 30 is shown in <figref idref="DRAWINGS">FIGS. 3 and 4</figref> residing inside an inner diameter of the transmitter coil 22 on the top side of the sensor package 10. The two part receiving coil 30 of the sensor package 10 has a first receiver coil 32 and a second receiver coil 36. The first receiver coil 32 has N loops wound in a first direction. In a first preferred embodiment shown in <figref idref="DRAWINGS">FIG. 3</figref>, the first receiver coil loops 32a-d are arranged about the central axis of the transmitter coil 22 and within the inner diameter of the transmitter coil 22. The first receiver coil loops 32a-d are spaced about the transmitter coil 22 axis by 360/N degrees. For example, as shown in <figref idref="DRAWINGS">FIG. 3</figref> there are N=4 first receiver coil loops 32a-d and therefore each loop 32a-d of first receiver coil 32 is spaced apart from the adjacent first receiver coil 32 loop 32a-d by 90 degrees.

0020The second receiver coil 36 also has N loops 36a-d which are wound in a direction opposite to the first receiver coil 32. Each of the second receiver coil loops 36a-d are angularly spaced by 360/N degrees about the transmitter coil 22 axis relative to the adjacent second receiver coil loop 36a-d. The second receiver coil loops 36a-d are also angularly offset from adjacent first receiver coil loops 32a-d by 180/N degrees and vice versa.

0021More simply, as shown in <figref idref="DRAWINGS">FIG. 3</figref>, the circular area inside the transmitter coil 22 is divided angularly into 2N sections. Proceeding angularly about the transmitter coil 22 axis, the two part receiving coil 30 sections alternate between loops 32a-d of the first receiver coil 32 and loops 36a-d of the second receiver coil 36. The loops 32a-d of the first receiver coil 32 are wound in a first direction while the loops 36a-d of the second receiver coil 36 are wound in an opposite second direction. In this way, loops 32a-d of the first receiver coil 32 are only adjacent to loops 36a-d of the second receiver coil 36 and loops of the first 32 and second receiver coils 36 are angularly offset from one another by 180/N degrees.

0022In a second preferred embodiment shown in <figref idref="DRAWINGS">FIG. 4</figref>, 3 there are N=6 first receiver coil loops 32a-f and therefore each loop 32a-f of first receiver coil 32 is spaced apart from the adjacent first receiver coil 32 loop 32a-f by 60 degrees. One skilled in the art will appreciate that the number of N loops of the first receiver coil 32 and second receiver coil 36 can be similarly adjusted to include different numbers of N sections..

0023The coupler package 50 has a ferrite layer 60 having a top side 62 and a bottom side 66. The ferrite layer 60 has an integrated capacitor 56 on the top side 62 and a noncircular coupler coil 70 on the bottom side 66. The bottom side 66 of the ferrite layer 60 of the coupler package 50 faces the top side 42 of the sensor package 10. The integrated capacitor 56 of the coupler package 50 shown in <figref idref="DRAWINGS">FIG. 6</figref> is circular; however, this shape is exemplary and other arrangements are possible. The noncircular coupler coil 70 is made from a plurality of windings and dimensioned so that when aligned about the axis of the transmitter coil 22 of the sensor package 10, the coupler coil 70 overlies at least a portion of both the first 32 and second receiver coil 36 loops 32a-d, 36a-d.

0024The coupler coil 70 shown in <figref idref="DRAWINGS">FIG. 5</figref> has a generally oval shape; however, the coupler coil 70 is not limited to this shape alone. When the coupler coil 70 of the coupler package 50 is aligned about the axis of the transmitter coil 22 and the sensor package 10, the coupler coil 70 will overlie at least a portion of both the first and second receiver coil loops 32a-d, 36a-d.

0025As the coupler package 50 rotates about the axis of the transmitter coil 22, the portion of the coupler coil 70 overlapping the first and second receiver coil loops 32a-d, 36a-d changes. This in turn changes the amount of coupling factor between the coupler package 50 and each of the first receiver coil 32 and second receiver coil 36. Using the signals measured by the two part receiving coil 30, the processor 14 generates an output signal representative of the rotational position of the coupler package 50 relative to the sensor package 10.

0026Using ferrite layers 20, 60 in both the sensor 10 and coupler packages 50 focuses the electromagnetic fields and keeps the energy in local space. The electromagnetic energy is therefore used more efficiently by the sensor 10 to generate the signal. Furthermore, the combination of the ferrite layers 20, 60 and the integrated capacitors 16, 56 provide electromagnetic shielding to the sensor 10 and coupler packages 50 which reduces the negative effects of electromagnetic interference from other components. In this way, the overall size of the sensor package 10 and the coupler package 50 can be minimized.

0027In another preferred embodiment, printed circuit boards (PCBs) are used in the fabrication of the sensor package 10 and coupler package 50. The transmitter coil 22 and two part receiving coil are fabricated on a first PCB as is known to those skilled in the art. Similarly, the coupler coil 70 is fabricated on a second PCB. A first ferrite disc 20 is arranged on a bottom side of the first PCB and a second ferrite disc is arranged on a top side of the second PCB. The ferrite discs, PCBs, and additional components are then disposed within a housing. In this way, PCBs and ferrite discs are used to form the sensor package 10 and the coupler package 50.

0028From the preceding, it can be seen that the present invention provides a micro inductive rotary position sensor able to generate an output signal representative of the rotational position of the coupler package relative to the sensor package. Furthermore, both the sensor package and coupler package can be individually over molded in a plastic package. The coils may be fabricated by micro fabrication technology which includes, but is not limited to, sputtering, chemical vapor deposition, and electrodeposition. Using micro fabrication technology allows more coil turns to be built on a small area. The transmitter coil of the sensor package is shown concentrically wound around the first and second receiver loops; however, the present invention is not limited to this exemplary arrangement.

0029The invention is not restricted to the illustrative examples described above. Examples are not intended as limitations on the scope of the invention. Methods, apparatus, compositions, and the like described herein are exemplary and not intended as limitations on the scope of the invention. Changes therein and other uses will occur to those skilled in the art.

Contents6

Every citation, both ways

Citations
Document	Relation	Office	Category	Cited during	Relevant claims
WO2019040095A1	Cited by	World Intellectual Property Organization (WIPO)	–	International search	–
WO2017184994A1	Cited by	World Intellectual Property Organization (WIPO)	–	International search	–
US9285386B2	Cited by	United States of America	–	Search report	–
US11703359B2	Cited by	United States of America	–	Applicant	–
US11353338B2	Cited by	United States of America	–	Applicant	–
US11921251B2	Cited by	United States of America	–	Search report	–
US11002568B2	Cited by	United States of America	–	Search report	–
US2024053171A1	Cited by	United States of America	–	Search report	–
US12013264B2	Cited by	United States of America	–	Applicant	–
US11519752B2	Cited by	United States of America	–	Search report	–
CN113013111A	Cited by	China	–	Search report	–
US2019252950A1	Cited by	United States of America	–	Search report	–
US11525701B2	Cited by	United States of America	–	Applicant	–
US2017307412A1	Cited by	United States of America	–	Pre-grant	–
US10278288B2	Cited by	United States of America	–	Search report	–
US10527457B2	Cited by	United States of America	–	Applicant	–
DE102019220393B4	Cited by	Germany	–	Search report	–
US2015160254A1	Cited by	United States of America	–	Pre-grant	–
US10247589B2	Cited by	United States of America	–	Search report	–
US11733318B2	Cited by	United States of America	–	Search report	–
KR20180134921A	Cited by	Republic of Korea	–	Search report	–
US2021373091A1	Cited by	United States of America	–	Search report	–
US2003137294A1	Cites	United States of America	A	Search report	–
US2006144166A1	Cites	United States of America	–	Pre-grant	–
US2006250128A1	Cites	United States of America	–	Pre-grant	–
US2008005488A1	Cites	United States of America	Y	Search report	1-12
US2008017430A1	Cites	United States of America	Y	Search report	2-3, 9-10, 12-20
US2008017430A1	Cites	United States of America	Y	Search report	2-3, 9-10, 12-20
US2008174302A1	Cites	United States of America	–	Pre-grant	–
US2009021245A1	Cites	United States of America	Y	Search report	1-20
US2009021245A1	Cites	United States of America	Y	Search report	1-20
US2009021245A1	Cites	United States of America	Y	Pre-grant	1-20
US2009025655A1	Cites	United States of America	–	Search report	–
US2009256555A1	Cites	United States of America	Y	Search report	1-20
US2009256555A1	Cites	United States of America	Y	Pre-grant	1-20
US2010001718A1	Cites	United States of America	–	Pre-grant	–
US2011018130A1	Cites	United States of America	Y	Search report	1-20

8 members in 6 offices

This recordMember, by publication datePriority claim

Priority claims6

Priority claims
Document	Office	Kind	Date
201361819118	United States of America	P	2013-05-03
201361819118	United States of America	P	2013-05-03
201414269871	United States of America	A	2014-05-05
61819118	–	–	–
US201361819118P	–	–	–
US201414269871	–	–	–

Members8

Family members, oldest first
Document	Office	Kind
US2014327432A1	United States of America	A1	2014-11-06
WO2014179803A1	World Intellectual Property Organization (WIPO)	A1	2014-11-06
CN105164502A	China	A	2015-12-16
KR20160004323A	Republic of Korea	A	2016-01-12
DE112014002264T5	Germany	T5	2016-02-18
JP2016518608A	Japan	A	2016-06-23
US10330499B2	United States of America	B2	2019-06-25
CN105164502B	China	B	2019-07-16

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2018-05-15	Date Forwarded to ExaminerFWDX	FWDX
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2018-02-26	Mail Final Rejection (PTOL - 326)Final rejectionMCTFR	MCTFR
2018-02-20	Final RejectionFinal rejectionCTFR	CTFR
2017-11-14	Date Forwarded to ExaminerFWDX	FWDX
2017-11-02	Response after Non-Final ActionA...	A...
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2015-08-31	Application ready for PDX access by participating foreign officesCCRDY	CCRDY
2015-07-14	Case Docketed to Examiner in GAUDOCK	DOCK
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2014-05-27	Application Dispatched from OIPEOIPE	OIPE
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2014-05-08	Cleared by OIPE CSRL194	L194
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Micro inductive sensor

Claim Score by NHIP

Abstract