Housing combination of electronic device and method

BACKGROUND

00011. Technical Field

0002The present disclosure relates to housings of electronic devices, especially to a housing combination having antenna modules formed thereon and a method for making the housing combination.

00032. Description of Related Art

0004Electronic devices, such as mobile phones, personal digital assistants (PDAs), and laptop computers are widely used. Most of these electronic devices have antenna modules for receiving and sending wireless signals. A typical antenna includes a thin metal radiating element mounted on a support member, and attached to a housing. However, the radiating element is usually exposed from the housing, and may be easily damaged and having a limited receiving effect. In addition, the radiating element and the support member occupy precious space.

0005Therefore, there is room for improvement within the art.

BRIEF DESCRIPTION OF THE DRAWINGS

0006Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the exemplary housing combination having antenna modules formed thereon. Moreover, in the drawings like reference numerals designate corresponding parts throughout the several views. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like elements of an embodiment.

0007<figref idref="DRAWINGS">FIG. 1</figref> is a schematic view of an exemplary embodiment of a housing combination applied in an electronic device.

0008<figref idref="DRAWINGS">FIG. 2</figref> is a schematic view of an exemplary embodiment of the housing combination including antenna modules shown in <figref idref="DRAWINGS">FIG. 1</figref>.

0009<figref idref="DRAWINGS">FIG. 3</figref> is a schematic view of one of the antenna modules shown in <figref idref="DRAWINGS">FIG. 2</figref>.

0010<figref idref="DRAWINGS">FIG. 4</figref> is a schematic view of a carrier of <figref idref="DRAWINGS">FIG. 3</figref>.

0011<figref idref="DRAWINGS">FIG. 5</figref> is a cross-sectional view of the housing combination along line V-V of <figref idref="DRAWINGS">FIG. 2</figref>.

0012<figref idref="DRAWINGS">FIG. 6</figref> is a schematic view of a mold apparatus for making the housing combination of <figref idref="DRAWINGS">FIG. 2</figref>.

DETAILED DESCRIPTION

0013The disclosure is illustrated by way of example and not by way of limitation in the accompanying drawings. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references can include the meaning of “at least one” embodiment where the context permits.

0014<figref idref="DRAWINGS">FIG. 1</figref> shows an exemplary embodiment of a housing combination <b>10</b> for an electronic device <b>100</b> where an antenna is desired, such as a mobile phone, or a PDA. The electronic device <b>100</b> includes a printed circuit board <b>20</b>.

0015Referring to <figref idref="DRAWINGS">FIG. 2</figref>, the housing combination <b>10</b> includes a housing <b>12</b> and at least two antenna modules <b>14</b> embedded in the housing <b>12</b>. In this exemplary embodiment, there are three antenna modules <b>14</b> on the housing <b>12</b>. The housing <b>12</b> includes two opposite sidewalls <b>122</b>, two opposite end walls <b>124</b> and a substantially rectangular base <b>126</b>, thereby cooperatively surrounding a receiving cavity <b>128</b> for receiving the printed circuit board <b>20</b>. The three antenna modules <b>14</b> are formed in the housing <b>12</b> by insert molding, and are positioned at three of four corners of the housing <b>12</b>. This arrangement of the three antenna modules <b>14</b> may effectively avoid the three antennas from interfering with each other so that the electronic device can more accurately receive signals from the antenna modules <b>14</b> or transmit signals by the antenna modules <b>14</b>.

0016Additionally, since the antenna modules <b>14</b> are electronically connected to the printed circuit board <b>20</b>, the edge space of the printed circuit board <b>20</b> may be effectively used.

0017Referring to <figref idref="DRAWINGS">FIGS. 3 to 5</figref>, each antenna module <b>14</b> includes an antenna carrier <b>142</b> and an antenna radiator <b>144</b>. The antenna carrier <b>142</b> defines a first receiving groove <b>1422</b> and a second receiving groove <b>1423</b>. The first receiving groove <b>1422</b> is defined in one surface of the antenna carrier <b>142</b>, and the second receiving groove <b>1423</b> is defined in an opposite surface of the antenna carrier <b>142</b>. The antenna radiator <b>144</b> includes a main portion <b>1442</b> and a conductive contact <b>1444</b>. The main portion <b>1442</b> is received in the first receiving groove <b>1422</b>. The conductive contact <b>1444</b> is received in the second receiving groove <b>1423</b>. The conductive contact <b>1444</b> is electrically connected to the printed circuit board <b>20</b>.

0018A method for making the housing combination <b>10</b> of the embodiment includes the following steps:

0019Firstly, three antenna carriers <b>142</b> are provided. Each antenna carrier <b>142</b> is engraved by a laser to define the first, second receiving grooves <b>1422</b>, <b>1423</b>. The antenna radiator <b>144</b> is formed in the first, second receiving grooves <b>1422</b>, <b>1423</b> using a plating process to form the antenna module <b>14</b>.

0020Secondly, referring to <figref idref="DRAWINGS">FIG. 6</figref>, an injection molding machine <b>200</b> is provided. The injection molding machine <b>200</b> includes a male mold <b>220</b>, and a female mold <b>240</b>. A mold chamber <b>260</b> is defined between the male mold <b>220</b> and the female mold <b>240</b>. The three antenna modules <b>14</b> are positioned in the mold chamber <b>260</b>. The main portions <b>1442</b> face the mold chamber <b>260</b>, and the conductive contacts <b>1444</b> abut against the male mold <b>220</b>. Then, molten plastic material is injected into the mold chamber <b>260</b>. The molten plastic material bonds to the carrier <b>142</b> and the antenna radiator <b>144</b> to form the housing combination <b>10</b>. The main portions <b>1442</b> are embedded in the plastic material, and the conductive contact <b>1444</b> are exposed from the housing <b>12</b> and the carrier <b>14</b>.

0021The antenna modules <b>14</b> are embedded in the housing <b>10</b> by insert-molding. The antenna modules <b>14</b> can be directly attached to the housing <b>12</b>, thus, the working efficiency is increased. In addition, the main portions <b>1442</b> of the antenna radiator <b>144</b> are sandwiched between the carrier <b>142</b> and the housing <b>12</b> so that the antenna radiator <b>144</b> is protected from being damaged.

0022It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.