Multimode planar spectrographs for wavelength demultiplexing and methods of fabrication

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to multimode planar spectrographs and methods for their fabrication, and more particularly to planar spectrographs for demultiplexing coarse wavelength division multiplexed (CWDM) optical signals, and methods for fabrication of such spectrographs employing silicon-based processing.

[0003] 2. Description of the Related Art

[0004] Emerging applications of wavelength-division-multiplexing (WDM) in local-area networks require wavelength demultiplexers that are compact, low-cost, manufacturable in high volumes, and most of all compatible with multimode fiber input. Multimode operation precludes the many single-mode waveguide demultiplexers used in dense WDM systems for telecommunications purposes.

[0005] A planar spectrograph demultiplexer is a two-dimensional grating spectrometer comprised of a slab waveguide which confines the light in the vertical direction and a concave reflection grating which simultaneously diffracts and images the input light, separating different wavelengths in an output image plane.

[0006] Referring to FIG. 1, formation of a planar spectrograph <b>10</b> within a layered dielectric slab waveguide for single-mode fiber applications is illustratively shown. spectrograph <b>10</b> is formed by depositing a plurality of glass layers <b>17</b> to form slab waveguide <b>16</b> having a numerical aperture and a thickness of a center core layer <b>17</b><i>b </i>closely matched to single-mode fiber. Upper and lower cladding layers <b>17</b><i>a </i>and <b>17</b><i>c </i>are also provided. In FIG. 1, a concave trench <b>12</b> is lithographically patterned and then etched into the slab waveguide <b>16</b> with a grating structure <b>14</b> formed on a near face. The grating facets are then metallized by access through the open trench <b>12</b>.

[0007] To enable the highest performance within the smallest possible footprint of spectrograph <b>10</b>, aberrations in the diffracted images are reduced by means of an acircular grating curve with variable grating facet pitch (i.e. , chirp) . Manipulating the two degrees of grating freedom, curvature and pitch, allows for two stigmatic wavelengths. Grating resolution is optimized by varying the two stigmatic wavelengths to minimize aberrations over the full wavelength range of operation. The grating theory and design procedure have been developed along the lines described in the art.

[0008] In addition, for maximum diffraction efficiency, grating facets <b>28</b> are blazed (i.e., angled) to spectrally reflect the incident light to the diffracted image of a wavelength (the blaze wavelength) central to the wavelength range of operation. A saw-toothed echelette grating facet <b>28</b> may be employed. This optimum blaze angle will vary with facet position along the curved grating.

[0009] By allowing for arbitrary lateral profiles, the lithographic patterning and etching of grating <b>14</b> in spectrograph <b>10</b> facilitate the realization of such acircular, chirped gratings having continuously variable blazing.

[0010] For local area network (LAN) WDM applications, a critical demultiplexer feature is compatibility with input from multimode fiber (MMF). In particular, this would require a thick core layer (e.g., ≧62.5 microns) for the spectrograph slab waveguide <b>16</b>. Depositing and etching glass layers <b>17</b> to form a MNF-compatible planar spectrograph in a manner similar to that for the single-mode device are no longer practically or technically feasible for glass slab waveguide layers of these thicknesses. Past efforts at realizing MMF-compatible spectrographs fabricated thick-core glass slab waveguides by stacking thin glass sheets or by performing ion-exchange. Gratings were formed on an end face of the slab waveguide by replication of a ruled master grating, by holography, or by epoxying a separately ruled or etched grating. These approaches suffer from several drawbacks and difficulties with respect to their ultimate levels of performance and their ability to be packaged.

[0011] Referring to FIG. 2, a multimode planar spectrograph <b>29</b> representative of the prior art is illustrated where a reflective grating <b>24</b> is affixed to a slab waveguide glass stack <b>22</b> on an end that has been ground and polished into a concave surface. Stack <b>22</b> includes cladding layers <b>21</b> and a core layer <b>19</b>. Grating <b>24</b> is pre-processed to form an echelette grating <b>26</b> before being attached to slab waveguide <b>22</b>. Fabrication of an optimized chirped, acircular grating complete with continuously variable blazing similar to that for the single-mode spectrograph is non-trivial by traditional means. Control over one of the grating design parameters, chirp or curvature, must often be sacrificed, affording the possibility for only one stigmatic wavelength versus two for the grating patterned lithographically in spectrograph <b>10</b> (FIG. 1). Grating <b>24</b> will typically be formed through a grating ruling process or a holographic printing process. Grating ruling employs mechanical scribing with a diamond tip to create facets <b>28</b>. To chirp the grating and/or vary the blazing, it is necessary to adjust the diamond tip between scribes. Since continual adjustment between successive scribes would be laborious, time-consuming, and expensive, the grating pitch and blaze are normally changed step-wise for only a few segments of the length of a ruled grating. Holographic grating definition can provide continuous chirping for aberration correction but with only one resultant stigmatic wavelength. Furthermore, blazing of holographic grating facets is limited.

[0012] Since grating, input fiber <b>27</b>, and output array <b>31</b> are attached to slab waveguide <b>22</b> in separate steps, costly low throughput active alignment of either the grating or the input/output elements is required when using a corrected grating. Relative misalignments may occur and are an additional source of concern for aberrations in the output images.

[0013] By means of the LIGA process, multimode planar spectrographs have been made in polymer material systems using deep-etch x-ray lithography with parallel synchrotron radiation. Polymers, however, are generally frowned upon for use in LAN datacom transceivers due to their uptake of moisture in non-hermetic packaging, high sensitivity to operating temperature changes, and/or inability to survive elevated temperatures during transceiver solder reflow processing.

[0014] Meanwhile, grating spectrometers constitute a platform that will scale to higher WDM channel counts and tighter channel spacings with less added cost and more consistent performance than will presently competing serial-processing multimode demultiplexers that use dielectric interference filters.

[0015] Therefore, a need exists for multimode spectrographs, and a method for fabrication thereof, which are inexpensive, easy to manufacture, environmentally rugged, and unrestricted in terms of their grating design.

SUMMARY OF THE INVENTION

[0016] The present invention provides for multimode-fiber compatible spectrographs which are fabricated employing planar, batch processing of silicon wafers. By means of silicon deep reactive-ion etching, high-quality, aberration-corrected gratings defined lithographically and capable of realizing minimum device dimensions are etched into a silicon substrate. The diffraction grating is integrally formed in the substrate so as to be in operative relationship with input light to diffract and image the wavelength components of the input light to an output detector, fiber, or integrated waveguide array. Input/output coupling and passive alignment features can be integrated directly into the silicon substrate to facilitate low-cost, high-volume packaging. The thick-core slab waveguide responsible for coupling input light to and diffracted light from the etched grating may be formed in a plurality of ways, for example, as the top silicon layer in a thick-film silicon-on-insulator (SOI) wafer or as a hybrid thin glass element dimensioned and configured to fit within a recess formed within the silicon substrate.

[0017] A planar spectrograph for demultiplexing optical wavelength signals of the present invention includes a monolithic substrate. The substrate includes a diffraction grating etched therein, and the diffraction grating is integrally formed in the substrate to be in operative relationship with input light to diffract and reflect the input light to a detector. A recess is formed in the substrate, and a slab waveguide is dimensioned and configured to fit within the recess. The waveguide guides the input light to and from the diffraction grating.

[0018] In other embodiments, the substrate preferably includes silicon. The substrate defines a plane and the diffraction grating preferably includes a thickness perpendicular to the plane which is greater than or equal to a core diameter of multimode fiber. The substrate may include a feature integrally formed therein to accept an optical fiber. The substrate may include a feature integrally formed therein to accept a lens in operative relationship with the optical fiber. The optical fiber may include a single mode fiber or a multimode fiber. The slab waveguide may include glass. The diffraction grating may include an echelette grating profile. The diffraction grating may include a metallized grating to promote reflection. An index matching fluid is preferably disposed in a gap formed between the diffraction grating and the slab waveguide. The detector may include at least one of output fibers, photodetectors and a waveguide array. The detector may include an array of photosensitive panels which are selectively activated when the light diffracted from the diffraction grating falls thereon.

[0019] A planar spectrograph for demultiplexing optical wavelength signals in accordance with the present invention includes a silicon-on-insulator (SOI) structure including a monolithic first silicon layer forming a slab waveguide core, a second substrate layer and a waveguide cladding layer disposed therebetween. The SOI substrate includes a diffraction grating etched in the first silicon layer of silicon down to the waveguide cladding layer. The diffraction grating is integrally formed in the first silicon layer to be in operative relationship with an input light source to diffract and reflect input light to a detector.

[0020] In other embodiments, a thickness of the first silicon layer is greater than or equal to a core diameter of multimode fiber. The SOI substrate may include a feature integrally formed therein to accept an optical fiber. The SOI substrate may include a feature integrally formed therein to accept a lens in operative relationship with an optical fiber. The input light source may include one of a single mode fiber and a multimode fiber. The diffraction grating may include an echelette grating profile. The diffraction grating may include a metallized grating to promote reflection. The spectrograph may include a detector positioned to receive light diffracted from the diffraction grating. The detector may include an array of photosensitive panels which are selectively activated when the light diffracted from the diffraction grating falls thereon. The detector may include at least one of output fibers, photodetectors and a waveguide array.

[0021] A method for fabricating a planar spectrograph includes the steps of providing a monolithic substrate, lithographically patterning the substrate, deep etching the substrate in accordance with the lithographic pattern to integrally form a diffraction grating and a recess in the substrate, and securing a slab waveguide in the recess for directing light onto the diffraction grating and directing diffracted light from the diffraction grating.

[0022] In other methods, the deep etching preferably includes etching by reactive ion etching. The deep etching is preferably performed to a depth equal to or greater than a core diameter of a multimode fiber. The method may include the step of coating the diffraction grating to promote reflection. The method may include the step of applying an index matching fluid between the diffraction grating and the slab waveguide. The method may include the step of forming a groove in the substrate for an optical fiber. The method may include the step of forming a socket in the substrate for a lens.

[0023] Another method for fabricating a planar spectrograph includes the steps of providing a silicon-on-insulator substrate, lithographically patterning a first silicon layer of the substrate, and deep etching the first silicon layer in accordance with the lithographic pattern to integrally to form a diffraction grating in the first silicon layer.

[0024] In other methods, the deep etching preferably includes reactive ion etching. The deep etching is preferably performed to a depth equal to or greater than a core diameter of multimode fiber. The method may include the step of coating the diffraction grating to promote reflections. The method may include the step of coating edge surfaces of the first silicon layer with an anti-reflection coating (ARC). The method may include the step of forming a groove in the silicon-on-insulator substrate for an optical fiber. The method may include the step of forming a socket in the silicon-on-insulator substrate for a lens.

[0025] These and other objects, features, and advantages of the present invention will become apparent from the following detailed description of illustrative embodiments thereof, as well as, of fabrication processes for manufacturing these spectrographs.

BRIEF DESCRIPTION OF DRAWINGS

[0026] The invention will be described in detail in the following description of preferred embodiments with reference to the following figures wherein:

[0027]FIG. 1 is a perspective view of a conventional single-mode planar spectrograph with a dielectric slab waveguide fabricated by depositing and etching a plurality of individual glass layers on a substrate;

[0028]FIG. 2 is a perspective view of a conventional multimode spectrograph where a separate grating block is affixed to a stack of thin glass sheets forming a multimode slab waveguide;

[0029]FIG. 3 is a top view of a spectrograph of the present invention having a diffraction grating and a recess formed by deep etching a substrate;

[0030]FIG. 4 is a side cross-sectional view of the spectrograph of FIG. 3 having a diffraction grating and a recess formed by deep etching the substrate, wherein the recess accepts a slab waveguide;

[0031]FIG. 5 is a flow chart showing an illustrative method for manufacturing a spectrograph in accordance with the present invention;

[0032]FIG. 6 is a top view of a spectrograph of the present invention having a diffraction grating formed by deep etching the top silicon layer of a silicon-on-insulator (SOI) substrate;

[0033]FIG. 7 is a side cross-sectional view of the spectrograph of FIG. 6 showing the SOI layers in accordance with the present invention;

[0034]FIG. 8 is a flow chart showing an illustrative method for manufacturing a SOI spectrograph in accordance with the present invention;

[0035]FIG. 9 is a schematic layout of one embodiment of a glass slab waveguide spectrograph in accordance with the present invention;

[0036]FIG. 10 is a schematic layout of one embodiment of a SOI spectrograph in accordance with the present invention; and

[0037]FIG. 11 is a schematic diagram of a “smart” detector array in accordance with the present invention for accommodating wavelength variations.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0038] The present invention provides planar spectrographs capable of demultiplexing optical wavelength signals on multimode optical fibers. The present invention provides silicon processing methods to deep etch aberration-corrected concave gratings to realize minimum spectrograph dimensions. Advantageously, the gratings are integrally formed in a substrate, eliminating alignment issues and promoting less expensive fabrication processes. Both glass and silicon-on-insulator slab waveguide schemes are presented, and embodiments satisfying coarse wavelength division multiplexed (CWDM) requirements for 10 Gigabit Ethernet are illustratively presented for understanding the present invention.

[0039] Considered in preferred embodiments of the present invention are flat-field spectrographs in which the positions I of the input and Di (i=1, 2, . . . ) of the diffracted images are designed to lay along a common line, such as, on a straight edge of a chip or substrate so as to facilitate coupling to an output fiber/detector array.

[0040] Referring now in detail to the figures in which like numerals represent the same or similar elements and initially to FIGS. 3 and 4, a slab waveguide spectrograph <b>100</b> is shown for one embodiment of the present invention. Spectrograph <b>100</b> includes a substrate <b>102</b>, preferably a silicon substrate, although other substrate materials may be employed if adequate etching processes exist. Substrate <b>102</b> is lithographically processed to pattern a photoresist layer on substrate <b>102</b>. Then, substrate <b>102</b> is anisotropically etched through the photoresist mask to transfer the pattern to substrate <b>102</b>. This process may be performed with multiple mask materials or multiple layers of resist. A recess <b>108</b> is formed in substrate <b>102</b> to receive a slab waveguide element <b>106</b> therein. Recess <b>108</b> has precise dimensional tolerances since lithographic processing provides dimensional precision on the order of sub-micron sizes. This precision is also employed to integrally form a concave diffraction grating <b>110</b>, for example, an echelette grating on a perimeter of recess <b>108</b>. Grating <b>110</b> may include features which are customized dimensionally and may be formed to include different geometries as a function of position along grating <b>110</b>. Other features may also be formed in substrate <b>102</b> during the same or different etching processes, for example, a socket <b>107</b> for a collimating input ball lens <b>109</b> and/or an input fiber groove <b>132</b>.

[0041] Slab waveguide <b>106</b> couples light between input fiber <b>112</b>, grating <b>110</b> and an output array <b>114</b>. Slab waveguide <b>106</b> is inserted of fit into recess <b>108</b>. Waveguide <b>106</b> preferably includes a transmissive materials selected for a given application. Gaps between facets of grating <b>110</b> and slab waveguide <b>106</b> are filled with index-matching fluid <b>118</b>.

[0042] Advantageously, because grating <b>110</b> and input/output alignment features ate integrally formed in a common substrate <b>102</b> with lithographic precision, spectrograph alignment is automatic and complete is inserted into recess <b>108</b>, eliminating costly separate alignment procedures and reducing misalignment aberrations.

[0043] In a preferred embodiment, spectrograph <b>100</b> is a MMF-compatible planar spectrograph incorporating a silicon substrate <b>102</b> and a thick slab waveguide <b>106</b>. Waveguide <b>106</b> may include glass, quartz or other transmissive materials for guiding light between a fiber <b>112</b> and a detector array <b>114</b>. Waveguide <b>106</b> may be processed by employing a grind and polish process. Silicon substrate <b>102</b> enables a high etch rate reactive ion etching (RIE) process to be used to deep etch recess <b>108</b> and grating <b>110</b> with vertical sidewalls to depths sufficient to accommodate a multimode fiber core of fiber <b>112</b>. Silicon deep-RIE can etch depths as great as 500 microns at rates of between about 2 microns/min and about 6 microns/min. Prior art glass etching processes do not provide the same combination of rapid etching and vertical, high aspect ratio sidewalls with accuracy.

[0044] A MMF-compatible waveguide <b>106</b> may include, for example, thin glass used for display devices. This glass may be used to realize the thick (e.g., greater than 62.5 microns) core of the MMF-compatible glass slab waveguide without going through a long, expensive deposition process. The lower-index cladding may be formed by several methods. For example, a silicon dioxide layer <b>122</b> deposited on at least one side of a core glass sheet <b>124</b>. Alternately, silicon oxynitride may be deposited if a precisely tailored index step is needed. Spinning on a polymer, or depositing a sol-gel glass may also be possible.

[0045] To pattern slab waveguide <b>106</b> into the proper shape for inserting into the etched recess <b>108</b> in substrate <b>102</b>, a combination of laser glass cutting and standard grinding-and-polishing may be employed. Laser glass cutting (e.g., ±25 microns tolerance) is first used to cut the slab waveguide into rectangles, three sides of which constitute the straight edges of the final element. The thin rectangular slab waveguides are then arranged in a stack for grinding and polishing (e.g., ±10 microns tolerance) a curved end portion <b>130</b> that will be interfaced with concave grating <b>110</b>. Compared to a scribing-breaking process, laser cutting provides a cut free of chipping and micro-cracks and should therefore yield an input facet that will not scatter the input light into unwanted higher-order slab waveguide modes. Otherwise, polishing would be necessary on the straight input edges of waveguide <b>106</b> as well as curved portion <b>130</b>.

[0046] The size of any the gaps between the cut-and-polished slab waveguide <b>106</b> and grating <b>110</b> determines how closely the index-matching fluid <b>118</b> matches the waveguide core index, because the difference in path length as compared to design (i.e., with no gap) from double traversing the gap will appear as an added grating aberration. Considering 1300 nm operation, for a λ/10 maximum added aberration, the worst-case gap of 20 microns within grinding and polishing tolerances needs index matching to within 0.003 (0.2%) of the core index, which is well within known capabilities.

[0047] Since the preferred substrate <b>102</b> is implemented in silicon, features to aid in coupling the input to the spectrograph (e.g., a v-groove <b>132</b> for holding an input fiber and a socket <b>107</b> for holding input lens <b>109</b>) may be etched in the silicon using known etch processes, and features may also be provided for coupling the output of the spectrograph to photodetectors, fibers or light waveguide array <b>134</b>.

[0048] Referring to FIG. 5, a flow chart for fabricating a slab waveguide spectrograph <b>100</b> is illustratively shown for one embodiment of the present invention. In block <b>202</b>, a starting material is provided for fabricating a slab waveguide. The material may include glass. In block <b>204</b>, cladding layers, e.g., silicon dioxide, are deposited. Other methods may also be employed to form the slab waveguide, as described above, e.g., spun on polymers, etc. Rectangular slabs are cut from the starting material with deposited cladding layers in block <b>206</b>. The rectangles may be stacked to process multiple slabs simultaneously, in block <b>208</b>. Now, the slab waveguide is ground and polished to form a curved edge on one side of the slab waveguide for interfacing with a concave spectrograph grating, in block <b>210</b>. In block <b>212</b>, the slab waveguides temporarily stacked are separated. A plurality of slab waveguides are available for integration with a grating structure, in block <b>310</b>.

[0049] In block <b>302</b>, a substrate material is provided, e.g., silicon. In block <b>304</b>, the substrate is patterned by developing a resist layer on the substrate and etching the substrate in accordance with the resist pattern. The substrate is etched by a deep reactive ion etch process (e.g., over 62.5 microns) to form a diffraction grating, such as an echelette grating, along a concave acircular curve. Also, a recess is formed, adapted to receive a slab waveguide. The recess is dimensioned and configured to align the slab waveguide to avoid aberrations due to misalignment. In a same or subsequent step, a coupling lens recess and input fiber V-groove are formed by etching the substrate, in block <b>306</b>. In block <b>308</b>, the grating formed by etching is metallized to reflect and diffract incident

[0050] In block <b>310</b>, a slab waveguide from block <b>212</b> is positioned in the recess of the substrate. The recess and the slab waveguide are dimensioned and configured to provide an automatic alignment so that light propagating through slab waveguide is aligned between the input and the grating of substrate to prevent output image aberrations. In block <b>312</b>, index-matching fluid is injected into any gaps between the slab waveguide and the grating. In block <b>314</b>, assembly is completed by positioning a photodetector on the spectrograph or by fixing lenses or other accessories on the device.

[0051] Referring to FIGS. 6 and 7, a layout for a MMF-compatible silicon-on-insulator (SQI) planar spectrograph is illustratively shown in accordance with another embodiment of the present invention. A multimode slab waveguide <b>400</b> is formed in SOI layers <b>402</b>, <b>404</b> and <b>406</b>. A top silicon layer <b>406</b> includes the waveguide core, a buried oxide <b>404</b> includes the lower cladding. Air or a doped portion of layer <b>406</b> may be employed as the upper cladding as illustratively shown in FIG. 7. Substrate <b>402</b> preferably includes silicon. A metallized grating portion <b>403</b> etched into waveguide core layer <b>406</b> is illustratively shown in FIG. 7.

[0052] The thick waveguide core <b>406</b> is realized through SOI wafer bonding and etchback process. Thick core <b>406</b> preferably includes a thickness “A”, for example, of at least 62.5 microns, for example about 70 microns, for MMF compatibility. Two silicon wafers <b>402</b> and <b>406</b>, one or both of which have been oxidized, are bonded to create a buried oxide layer <b>404</b> therebetween. The top device wafer <b>406</b> is then etched back to the desired waveguide core thickness. Deep silicon RIE is preferably employed to etch a high-quality grating <b>410</b> into the top silicon layer <b>406</b>, which forms the slab waveguide core. Grating <b>410</b> enjoys the high precision and arbitrary lateral patterning afforded by lithographic patterning and etching. Grating <b>410</b> is metallized to further increase reflective properties of grating <b>410</b>. An anti-reflection coating is applied to the input/output facet <b>416</b> of slab waveguide <b>400</b> to suppress Fresnel reflection, which could otherwise be about 30%. Dopants may be implanted at the surface of core layer <b>406</b> to form a lower-index upper cladding layer (e.g., instead of air) and realize a lower numerical aperture (NA) for the slab waveguide.

[0053] Formation of a fiber groove within substrate <b>402</b> may be employed to support and align an input fiber <b>412</b>. A photodetector array <b>414</b> may be provided to detect reflected and diffracted light from grating <b>410</b>. Alternately, an array of output fibers (<b>414</b>) may be employed with fiber grooves formed within substrate <b>402</b> to provide alignment.

[0054] Referring to FIG. 8, a process flow chart for the fabrication of a SOI spectrograph is illustratively shown. In block <b>502</b>, two oxidized silicon wafers or an oxidized silicon wafer and a bare silicon wafer are provided. In block <b>504</b>, the wafers are bonded to form a silicon, oxide (or other dielectric layer) , silicon (or other substrate material) (SOI) structure. In block <b>506</b>, one silicon wafer is etched back to the desired waveguide core thickness. In block <b>508</b>, a grating, such as, an echelette grating is etched by a separate deep reactive ion etch process into the slab waveguide core layer formed in block <b>506</b>. Echelette facets are patterned by lithography, which includes depositing a resist, selectively exposing the resist to light (or electrons), in accordance with a photomask, and developing the resist. The underlying silicon is then etched in accordance with the patterned resist. In block <b>510</b>, a V-groove for an input fiber is etched, and in block <b>512</b>, the grating facets are metallized. In block <b>514</b>, an anti-reflection coating is deposited on input and output facets, e.g., where light enters and exits silicon slab material. In block <b>516</b>, photodetectors and other accessories are attached or positioned on the spectrograph.

[0055] Performance Factors

[0056] The WDM channel resolution, i.e., Δλ_Resolutionof a spectrograph is governed by the following expression: <maths id="MATH-US-00001" num="1"><math overflow="scroll"><mtable><mtr><mtd><mtable><mtr><mtd><mrow><mrow><mfrac><mrow><mo></mo><mi>x</mi></mrow><mrow><mo></mo><mi>λ</mi></mrow></mfrac><mo></mo><mi>Δ</mi><mo></mo><mstyle><mtext> </mtext></mstyle><mo></mo><msub><mi>λ</mi><mi>Resolution</mi></msub></mrow><mo>=</mo><mrow><mi>ImageSpotSize</mi><mo>+</mo><mrow><mfrac><mrow><mo></mo><mi>x</mi></mrow><mrow><mo></mo><mi>λ</mi></mrow></mfrac><mo></mo><mi>Δλ</mi></mrow></mrow></mrow></mtd></mtr><mtr><mtd><mrow><msub><mi>Δλ</mi><mi>Resolution</mi></msub><mo>=</mo><mrow><mfrac><mi>ImageSpotSize</mi><mrow><mrow><mo></mo><mi>x</mi></mrow><mo>/</mo><mrow><mo></mo><mi>λ</mi></mrow></mrow></mfrac><mo>+</mo><mrow><mi>Δλ</mi><mo>.</mo></mrow></mrow></mrow></mtd></mtr></mtable></mtd><mtd><mrow><mo>(</mo><mn>1</mn><mo>)</mo></mrow></mtd></mtr></mtable></math><img file="US20030197862A1-20031023-M00001.TIF" id="EMI-M00001" he="37.9323" wi="216.027" img-format="tif" img-content="mf" /><attachments><attachment idref="MATHEMATICA-00001" attachment-type="nb" file="US20030197862A1-20031023-M00001.NB" /></attachments></maths>

[0057] Here dx/dλ is the wavelength linear dispersion in the spectrograph output plane, and Δλ accounts for shifting plus broadening of the diffracted output spots, which are otherwise images of the input. Contributions to Δλ include:

[0058] (1) Δλ_{laser drift}=Wavelength variation of the laser light source with temperature and processing,

[0059] (2) Δλ_spec.drift=Wavelength variation of the spectrograph with temperature,

[0060] (3) Δλ_launch=Bandwidth of effective modal wavelengths excited by the launch into the spectrograph slab waveguide (a function of the input NA),

[0061] (4) Δλ_{facet tilt}=Equivalent broadening of the diffracted image due to mode mixing by reflection from tilted grating facets,

[0062] (5) Δλ_scattering=Equivalent broadening of the diffracted image due to coupling into higher-order slab waveguide modes by scattering events.

[0063] These factors all add to yield the total Δλ.

Δλ=Δλ_laserdrift+Δλ_spec.drift+Δλ_launch+Δλ_{facet tilt}+Δλ_scattering  (2)

[0064] For example, in 10 Gigabit Ethernet (GbE) applications, uncooled operation and fabrication variances of the distributed feedback (DFB) lasers cause Δλ_{laser drift}of nominally 10 nm, while Δλ_spec.driftis approximately 0.7 nm and approximately 5 nm for glass and SOI slab waveguide spectrographs, respectively. Laser and spectrograph temperature drifts are additive since distant lasers and spectrographs can be subjected to uncorrelated temperature environments. Deep silicon PIE provides negligible Δλ_{facet tilt}. Δλ_scatteringis related to the quality of the spectrograph fabrication process and can be assessed only through testing actual devices.

[0065] Examples of CWDM Spectrograph Demultiplexers

[0066] Some operating specifications for a coarse WDM (CWDM) demultiplexer for 10 Gigabit Ethernet (10 GbE) are illustratively listed in Table 1. <tables id="TABLE-US-00001" num="1"><table frame="none" colsep="0" rowsep="0"><tgroup align="left" colsep="0" rowsep="0" cols="1"><colspec colname="1" colwidth="217PT" align="center" /><thead><row><entry namest="1" nameend="1" align="center">TABLE 1</entry></row><row><entry /></row><row><entry namest="1" nameend="1" align="center" rowsep="1" /></row><row><entry>10 GbE CWDM Specifications</entry></row><row><entry namest="1" nameend="1" align="center" rowsep="1" /></row></thead><tbody valign="top"><row><entry /></row></tbody></tgroup><tgroup align="left" colsep="0" rowsep="0" cols="1"><colspec colname="1" colwidth="217PT" align="left" /><tbody valign="top"><row><entry>3. Δλ_channel= 25 nm (1275, 1300, 1325, 1350 nm)</entry></row><row><entry>2. 0-70° C. operating range</entry></row><row><entry>3. No. temperature control</entry></row><row><entry>4. Channel passbands of approximately 10 nm (Δλ_{laser drift}of</entry></row><row><entry>uncooled DFB's)</entry></row><row><entry>5. MMF compatibility</entry></row><row><entry namest="1" nameend="1" align="center" rowsep="1" /></row></tbody></tgroup></table></tables>

[0067] Some examples of spectrograph embodiments satisfying 10 GbE CWDM operating specifications are illustratively described below, selected as those with the smallest footprints having (1) an output channel pitch sufficient to accommodate the anticipated Δλ and (2) grating facets deemed sufficiently large to be within deep RIE resolution capabilities. A 62.5 micron MMF input (NA=0.275) and 1:1 spectrograph imaging are considered exclusively for simplicity.

[0068] Referring to FIG. 9, a schematic layout of an illustrative spectrograph substrate <b>600</b> is shown in accordance with one embodiment of the present invention (see also, FIGS. 3 and 4). The layout and dimensions illustratively shown in FIG. 9 are those of an etched recess, for a preferred 10 GbE CWDM spectrograph design incorporating a slab waveguide. These dimensions are illustrative and may be varied or modified by those skilled in the art to achieve desired results. In FIG. 9, I denotes the input point and Di (where i=1, 2, 3, 4) denotes the diffracted channel output points (Recess dimensions in etched region <b>602</b> are in mm to accept a separate glass slab waveguide element; grating facet dimensions within the inset region <b>604</b> are in microns). Echelette grating facets <b>606</b> are illustratively shown for an echelette grating <b>608</b> formed in accordance with the invention. Table II summarizes the corresponding spectrograph parameters. <tables id="TABLE-US-00002" num="2"><table frame="none" colsep="0" rowsep="0"><tgroup align="left" colsep="0" rowsep="0" cols="2"><colspec colname="1" colwidth="119PT" align="left" /><colspec colname="2" colwidth="98PT" align="left" /><thead><row><entry namest="1" nameend="2" align="center">TABLE II</entry></row><row><entry /></row><row><entry namest="1" nameend="2" align="center" rowsep="1" /></row><row><entry>Spectrograph Parameter</entry><entry>Value in Example</entry></row><row><entry namest="1" nameend="2" align="center" rowsep="1" /></row></thead><tbody valign="top"><row><entry>Input distance R_I</entry><entry>20 nm</entry></row><row><entry>Output channel pitch</entry><entry>500 microns</entry></row><row><entry>Angle of incidence θ_I</entry><entry>37.87°</entry></row><row><entry>Stigmatic wavelengths</entry><entry>1280, 1345 nm</entry></row><row><entry>Expansion coefficients of</entry></row><row><entry>concave Grating curve g(x)</entry></row><row><entry>for a Taylor series</entry></row><row><entry>expansion:</entry></row><row><entry>g″ (x = 0)</entry><entry>0.050839 mm⁻¹</entry></row><row><entry>g′″ (x = 0)</entry><entry>4.6783 × 10⁻⁴mm⁻²</entry></row><row><entry>g⁽⁴⁾(x = 0)</entry><entry>2.9545 × 10⁻⁴mm⁻³</entry></row><row><entry>Expansion coefficients of</entry></row><row><entry>Facet number nP(x) for a</entry></row><row><entry>Taylor series expansion:</entry></row><row><entry>n_P′ (x = 0)</entry><entry>0.25643 mm⁻¹</entry></row><row><entry>n_P″ (x = 0)</entry><entry>0.0036575 microns⁻¹mm⁻¹</entry></row><row><entry>n_P′″ (x = 0)</entry><entry>4.8708 × 10⁻⁴microns⁻¹mm⁻²</entry></row><row><entry>m_P⁽⁴⁾(x = 0)</entry><entry>3.2297 × 10⁻⁵microns⁻¹mm⁻³</entry></row><row><entry>Avg. facet paitch (1/n_P′ (x '2 0)</entry><entry>3.90 microns</entry></row><row><entry>Diffraction order m</entry><entry>5</entry></row><row><entry>Maximum vertical component</entry><entry>0.2</entry></row><row><entry>of input launch NA (This</entry></row><row><entry>maximum vertical Nalaunch value</entry></row><row><entry>presumes Δλ_scattering= 0. Scattering</entry></row><row><entry>at the input facet will otherwise excite</entry></row><row><entry>higher-order slab waveguide modes, in-</entry></row><row><entry>creasing Δλ_launchand de-</entry></row><row><entry>creasing resolution. Similarly,</entry></row><row><entry>scattering within the slab</entry></row><row><entry>waveguide and from the grating</entry></row><row><entry>will increase background channel</entry></row><row><entry>crosstalk.)</entry></row><row><entry>Minimum magnification of MMF</entry><entry>1.5 x</entry></row><row><entry>input by a spherical lens</entry></row><row><entry namest="1" nameend="2" align="center" rowsep="1" /></row></tbody></tgroup></table></tables>

[0069] As seen in Table II, reduction in the vertical component of the NA of an input 62.5 micron MMF (NA=0.275) is needed for the class slab waveguide CWDM spectrograph to suppress excitation of higher order slab waveguide modes. An uncompensated launch from 62.5 micron MMF would otherwise couple into a Δλ_launchtoo large to maintain the CWDM 25 nm channel resolution. The input magnification factor given in Table II is the minimum magnification needed of a spherical ball coupling lens to adequately reduce the launch NA into the spectrograph from a 62.5 micron MMF.

[0070] Referring to FIG. 10, a schematic layout of an illustrative SOI slab waveguide spectrograph <b>700</b> is shown in accordance with one embodiment of the present invention (see also FIGS. 6 and 7). The layout and dimensions are illustratively shown in FIG. 10 are for a preferred 10 GbE CWDM design of the SOI slab waveguide spectrograph. These dimensions are illustrative and may be varied or modified by those skilled in the art to achieve desired results. In FIG. 10, I denotes the input point and Di (where i=1, 2, 3, 4) denotes the diffracted channel output points (dimensions are in mm in slab waveguide region <b>702</b>; grating facet dimensions within the inset region <b>704</b> are in microns) Inset region <b>704</b> shows a trench <b>706</b> etched in accordance with the present invention to form grating <b>708</b> by a silicon deep RIE process. Trench <b>706</b> in this embodiment includes a width of about 10 microns. Table III summarizes the corresponding spectrograph parameters <tables id="TABLE-US-00003" num="3"><table frame="none" colsep="0" rowsep="0"><tgroup align="left" colsep="0" rowsep="0" cols="2"><colspec colname="1" colwidth="119PT" align="left" /><colspec colname="2" colwidth="98PT" align="left" /><thead><row><entry namest="1" nameend="2" align="center">TABLE III</entry></row><row><entry /></row><row><entry namest="1" nameend="2" align="center" rowsep="1" /></row><row><entry>Spectrograph Parameter</entry><entry>Value in Example</entry></row><row><entry namest="1" nameend="2" align="center" rowsep="1" /></row></thead><tbody valign="top"><row><entry>Input distance R_I</entry><entry>30 mm</entry></row><row><entry>Output channel pitch</entry><entry>500 microns</entry></row><row><entry>Angle of incidence θ_I</entry><entry>26.49°</entry></row><row><entry>Stigmatic wavelengths</entry><entry>1280, 1345 nm</entry></row><row><entry>Expansion coefficients of</entry></row><row><entry>concave Grating curve g(x)</entry></row><row><entry>for a Taylor series</entry></row><row><entry>expansion:</entry></row><row><entry>g″ (x = 0)</entry><entry>0.033939 mm⁻¹</entry></row><row><entry>g′″ (x = 0)</entry><entry>9.4646 × 10⁻⁵mm⁻²</entry></row><row><entry>g⁽⁴⁾(x = 0)</entry><entry>1.1235 × 10⁻⁴mm⁻³</entry></row><row><entry>Expansion coefficients of</entry></row><row><entry>Facet number n_P′ (x) for a</entry></row><row><entry>Taylor series expansion:</entry></row><row><entry>n_P′ (x = 0)</entry><entry>0.35933 mm−1</entry></row><row><entry>n_P″ (x = 0)</entry><entry>0.0028823 microns⁻¹mm⁻¹</entry></row><row><entry>n_P′″ (x = 0)</entry><entry>1.9492 × 10−4 microns⁻¹mm⁻²</entry></row><row><entry>n_P⁽⁴⁾(x = 0)</entry><entry>6.4758 × 10−7 microns⁻¹mm⁻³</entry></row><row><entry>Avg. facet pitch (1/n_P′ (x = 0)</entry><entry>2.78 microns</entry></row><row><entry>Diffraction order m</entry><entry>6</entry></row><row><entry>Maximum vertical component</entry><entry>0.36</entry></row><row><entry>of input launch NA. (This</entry></row><row><entry>maximum vertical NAlaunch value</entry></row><row><entry>presumes Δλ_scattering= 0. Scattering</entry></row><row><entry>at the input facet will otherwise</entry></row><row><entry>excite hogher-order slab waveguide</entry></row><row><entry>modes, increasing Δλ_launchand</entry></row><row><entry>decreasing resolution. Similarity,</entry></row><row><entry>scattering within the slab</entry></row><row><entry>waveguide and from the grating</entry></row><row><entry>will increasing background channel</entry></row><row><entry>crosstalk.)</entry></row><row><entry>Magnification of MMF input</entry><entry>N/A</entry></row><row><entry>by spherical lens</entry></row><row><entry namest="1" nameend="2" align="center" rowsep="1" /></row></tbody></tgroup></table></tables>

[0071] The high core refractive index of the SOI permits a higher input NA due to a reduction of Δλ_launch. In Table III, the amount by which the maximum input NA exceeds the NA of multimode fiber represents the level of immunity of the SOI spectrograph to scattering into higher order slab waveguide modes.

[0072] Input/Output Coupling

[0073] Special considerations may be given to both input and output coupling of the spectrograph.

[0074] The vertical component of the input NMF NA may be reduced to limit Δλ_launchto acceptable levels for achieving a particular spectrograph resolution. This may be accomplished by incorporating a ball lens (FIGS. 3 and 4) or a cylindrical rod lens in the space between the input fiber and the slab waveguide to provide the needed input magnification or collimation, respectively. Since silicon is preferably employed for the substrate of the spectrograph, sockets <b>108</b> (FIG. 4) for securing the lens can be etched into the substrate. A V-groove for anchoring the input fiber can also be fabricated using the same methods. Both the lens socket and fiber V-groove can be etched to micron-scale precision, and their positions may be keyed to those of the waveguide receptacle and grating, thus providing excellent mutual alignment.

[0075] The diffracted output images of the spectrograph will spatially drift due to Δλ_{laser drift}+Δλ_spec.driftand broaden due to Δλ_launch+Δλ_{facet tilt}+Δλ_scattering. Broadening from Δλ_launch+Δλ_{facet tilt}+Δλ_scatteringis minimized through proper spectrograph design and fabrication, as described above.

[0076] A lens array may be used to focus the drifting and broadened output images to individual output detectors or fibers. Alternately, a closely-spaced array <b>800</b> of rectangular shaped high-speed photodetectors <b>802</b> may be employed for each wavelength channel as illustrated in FIG. 11, wherein only those few array elements upon which a slowly drifting diffracted image <b>806</b> falls are activated through switches <b>804</b> at any one time. A transimpedence amplifier (TIA) is illustratively shown for amplifying photocurrents. The selective activation is carried out using thresholding circuitry <b>810</b>. Thresholding circuits known in the art may be employed for such applications. This “smart” distributed-detector arrangement represents a low-cost solution for output coupling for high-speed applications. Distributed-detector arrangement fabrication requires no more processing steps than required by a monolithic array of single photodiodes for each wavelength channel, which would be used in the absence of significant Δλ.

[0077] Aberration-corrected concave gratings make possible planar spectrograph demultiplexers of reduced dimensions suitable for packaging within datacom local area network (LAN) transceivers. To achieve multimode fiber compatibility and low cost, the acircular, chirped gratings are fabricated in a silicon substrate by photolithographic patterning and high-aspect ratio, high etch-rate deep RIE in accordance with the present invention. For the thick-core multimode slab waveguides interfaced with the gratings, both glass and SOI slab waveguide embodiments are possible.

[0078] Preferred spectrograph demultiplexer designs for 10 GbE CWDM have been presented. These spectrographs are designed to achieve the necessary CWDM channel resolution in the presence of wavelength drifts from uncooled operation and effects of multimode slab waveguide dispersion.

[0079] The output coupling is a challenge for 10 GbE CWDN operation. A large output aperture is demanded to accommodate spatial shifting of the spectrograph output images with temperature and broadening of the images from effects of multimode slab waveguide dispersion. To provide this large aperture, a distributed detector array may be used together with thresholding circuitry that maintains GHZ speeds by activating only those array elements receiving light.

[0080] It is noted that by significantly reducing Δλ_{laser drift}, use of wavelength-stable external cavity lasers or temperature controlled lasers would facilitate the overall design of planar spectrograph demultiplexers, either relaxing fabrication tolerances or enabling smaller footprints. It should be understood that the embodiments of the present invention may be employed for single mode fiber demultiplexing as well.

[0081] Having described preferred embodiments of multimode planar spectrographs for wavelength demultiplexing and methods of fabrication (which are intended to be illustrative and not limiting), it is noted that modifications and variations can be made by persons skilled in the art in light of the above teachings. It is therefore to be understood that changes may be made in the particular embodiments of the invention disclosed which are within the scope and spirit of the invention as outlined by the appended claims. Having thus described the invention with the details and particularity required by the patent laws, what is claimed and desired protected by Letters Patent is set forth in the appended claims.