Grinding wheel system
Claim Score by NHIP
Abstract
A grinding wheel system includes a grinding wheel with at least one embedded sensor. The system also includes an adapter disk containing electronics that process signals produced by each embedded sensor and that transmits sensor information to a data processing platform for further processing of the transmitted information.

Term
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Projected expiry passed 11 February 2020, 6.6 years ago.
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23 claims: 4 independent, 19 dependent
- 1A grinding wheel system, comprising:a grinding wheel including at least one embedded sensor, each sensor having a lead;an adapter disk containing electronics that process signals produced by each embedded sensor, the adapter disk constructed to attach to the grinding wheel and connect to each sensor lead, the electronics including a transmitter that transmits sensor information;and a data processing platform comprising: a processor;a receiver that receives sensor information transmitted by the adapter disk electronics;and instructions that cause the processor to process the received sensor information.
- 12A grinding wheel system, comprising:a grinding wheel including at least one piezoceramic sensor embedded near the wheel periphery that detects wheel forces and at least three piezoceramic sensors positioned near the grinding wheel rim that detect acoustic emissions, each sensor having a lead;an adapter disk containing electronics that process signals produced by the sensors, the adapter disk constructed to attach to the grinding wheel and connect to each sensor lead, the electronics comprising: a multiplexer fed by the sensor leads;an analog to digital converter fed by the multiplexer;a digital signal processor fed by the analog to digital converter;and a radio frequency transmitter fed by the digital signal processor that transmits sensor information;and a data processing platform comprising: a processor;a radio frequency receiver that receives sensor information transmitted by the adapter disk electronics;and instructions that cause the processor to process the received sensor information.
- 13Broadest claimClaim Score 87, broad(NHIP)An adapter disk that processes signals produced by at least one sensor embedded in a grinding wheel, the adapter disk comprising a disk configured for attachment to the grinding wheel, the disk including:at least one lead that connects to each embedded sensor;and electronics that process sensor signals.
- 16A computer program, disposed on a computer readable medium, that analyzes data acquired via sensors embedded in a grinding wheel, the computer program comprising instructions that cause a processor to:receive sensor data representing force sensed by each sensor;and analyze the received data.
Independent claims4
116 paragraphs in 6 sections, as filed
STATEMENT AS TO FEDERALLY SPONSORED RESEARCH
[0001] This invention was made with Government support under DE-FG05-96OR22524 awarded by the U.S. Department of Energy. The Government may have certain rights in the invention.
FIELD OF THE INVENTION
P-0002[0002] The invention relates to grinding wheels.
BACKGROUND
P-0003[0003] Grinding is a widely used precision machining process, accounting for over 20% of all machining processes in the manufacturing industry. Referring to FIG. 1, one type of grinding process employs a rapidly spinning grinding wheel <b>10</b> bonded with abrasive materials <b>12</b> (e.g., diamond abrasive particles in a resin, vitreous, or metallic bond). The wheel <b>10</b> grinds workpiece <b>14</b> moving slowly underneath the wheel <b>10</b>.
P-0004[0004] Ceramic materials such as silicon nitride, silicon carbide, aluminum oxide, and zirconia are hard, low density materials with high wear resistance and the ability to withstand high temperatures. Grinding is often used to machine ceramic workpieces and workpieces made of other materials into their final shape. Costs associated with grinding include the cost of preparing a wheel (e.g., wheel truing and dressing).
P-0005[0005] Truing typically rounds a wheel by machining excess abrasive material off its periphery as the wheel rotates. Initially, a truing tool engages the rotating out-of-round wheel intermittently, removing material from protruding areas and progressively engaging more of the periphery as the wheel is rounded.
P-0006[0006] Dressing conditions the wheel surface topography to achieve a desirable grinding behavior. Typically, a bonded abrasive dressing stick is passed over the wheel periphery to expose the abrasive grains by eroding away binder and possibly removing and/or fracturing diamond grains. Re-dressing is periodically needed during grinding to recondition or resharpen a worn wheel surface. Severe and/or frequent dressing can result in excessive wheel consumption, whereas too gentle or insufficient dressing can result in a dull wheel. Dressing frequently can be time consuming and reduce the life of expensive abrasive materials. On the other hand, grinding with a dull wheel causes increased grinding forces which can lead to chatter vibration and damage to the workpiece.
P-0007[0007] For precision grinding operations, the wheel depth of cut may be comparable to or smaller than the wheel out-of-roundness. Therefore, wheel engagement with the workpiece can vary considerably during a single rotation. The wheel may even completely lose contact with the workpiece during part of each rotation. This unsteady behavior can have a deleterious effect on the wheel surface and the quality of the ground workpiece.
P-0008[0008] Material removal during grinding occurs when abrasive grains interact with the workpiece. This interaction generally involves both ductile flow and brittle fracture. As an abrasive grain engages the workpiece, initial cutting by ductile flow is followed by localized fracture if the grain depth of cut and the resulting force on the grain becomes sufficiently large. By analogy with indentation fracture mechanics, two principal types of cracks have been identified: lateral cracks which cause material removal and radial cracks which cause strength degradation. The implication of this observation is that strength degradation may be minimized by promoting ductile flow instead of fracture at the ground surface. For finish grinding operations, this would usually require extremely slow removal rates in order to achieve a small enough grain depth of cut and small enough force per grain. However, as a wheel is used and the abrasive material becomes duller, force levels increase, making it necessary to periodically re-dress the wheel. Periodic truing may also be necessary to restore the macroscopic shape of the wheel.
P-0009[0009] Typically, operators monitor the grinding and preparation processes to determine when the wheel is rounded and when the wheel needs to be dressed. Because of the practical difficulty in assessing the condition of a rapidly rotating wheel, operators typically manage wheel usage based on observation and experience. For example, an operator may periodically stop a grinding process to examine wheel characteristics (e.g., roundness and dullness) at intervals determined by the type of workpiece being ground.
SUMMARY OF THE INVENTION
P-0010[0010] Embedded force and acoustic emission sensors and on-wheel electronics enable an operator to continuously monitor wheel conditions using sophisticated real-time techniques without interrupting the grinding process. Processing electronics can be attached to the wheel using a modular adapter disk that enables operators to easily reuse, maintain, and modify the electronics.
P-0011[0011] In general, in one aspect, the invention features a grinding wheel system that includes a grinding wheel with at least one embedded sensor and an adapter disk containing electronics that processes signals produced by each embedded sensor. The adapter disk is constructed to attach to the grinding wheel and to connect to each sensor lead when attached. The electronics include a transmitter that transmits sensor information to a data processing platform. The data processing platform includes a processor, a receiver that receives sensor information transmitted by the electronics, and instructions that cause the processor to process the received sensor information.
P-0012[0012] Different embodiments can include one or more of the following features. The grinding wheel may include at least one force sensor which may be positioned near the grinding wheel periphery. The grinding wheel may include at least one acoustic emission sensor which may be positioned near the grinding wheel rim. The sensors may be piezoceramic sensors.
P-0013[0013] The electronics can include an analog to digital converter connected to a sensor and a digital signal processor fed by the analog to digital converter. The electronics can include a multiplexer connected to the embedded sensors.
P-0014[0014] The data processing platform instructions can compare sensor information collected from different sensors at substantially the same time and/or compare sensor information collected from a single sensor at different times. The instructions can cause the processor to process sensor information using at least one neuro-fuzzy network.
P-0015[0015] In another aspect, a grinding wheel system includes a grinding wheel with at least one piezoceramic sensor embedded near the wheel periphery for detecting wheel forces and at least three piezoceramic sensors positioned near the grinding wheel rim. An adapter disk containing electronics that processes signals produced by the sensors attaches to the grinding wheel and connects to each sensor lead. The electronics include a multiplexer fed by the sensor leads, an analog to digital converter fed by the multiplexer, a digital signal processor fed by the analog to digital converter, and a radio frequency transmitter fed by the digital signal processor. The data processing platform includes a processor, a radio frequency receiver that receives sensor information transmitted by the adapter disk electronics, and instructions that cause the processor to process the received sensor information.
P-0016[0016] In another aspect, an adapter disk that processes signals produced by at least one sensor embedded in a grinding wheel includes at least one lead for connecting to each embedded sensor and electronics for processing sensor signals.
P-0017[0017] In another aspect, a computer program, disposed on a computer readable medium, that analyzes data acquired via sensors embedded in a grinding wheel includes instructions that cause a processor to receive sensor data representing force sensed by each sensor and analyzing the received data.
P-0018[0018] The computer program may determine, for example, wheel dullness, grinding mode, roundness, and/or roughness. The computer program can implement at least one neuro-fuzzy network.
P-0019[0019] The invention provides several advantages. The grinding wheel system permits sophisticated real-time analysis of grinding wheel conditions. The positioning of the force and acoustic emission sensors prevents the sensors from producing responses to normal wheel events (e.g., vibrations routinely produced during grinding). By housing electronics in an adapter disk, operators can easily reuse, maintain, and modify the electronics. The system's data processing capabilities provide a wide variety of information regarding wheel characteristics.
P-0020[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention, suitable methods and materials are described below. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety. In case of conflict, the present specification, including definitions, will control. In addition, the materials, methods, and examples are illustrative only and not intended to be limiting.
P-0021[0021] Other features and advantages of the invention will be apparent from the following detailed description, and from the claims.
BRIEF DESCRIPTION OF THE DRAWINGS
P-0022[0022]FIG. 1 is a diagram of a grinding wheel.
P-0023[0023]FIG. 2 is a diagram of a grinding wheel system.
P-0024[0024]FIG. 3 is a diagram of sensor placement on a grinding wheel.
P-0025[0025]FIG. 4 is a diagram of a sensor.
P-0026[0026]FIG. 5 is a diagram of a force sensor.
P-0027[0027]FIG. 6 is a graph of force sensor response.
P-0028[0028] FIGS. <b>7</b>A-<b>7</b>D are diagrams of vibrational patterns routinely experienced by a wheel.
P-0029[0029]FIG. 8 is a diagram of an adapter disk and a dummy disk attached to a wheel.
P-0030[0030]FIG. 9 is a diagram of adapter disk electronics.
P-0031[0031]FIG. 10 is a diagram of printed circuit board layers used to provide the adapter disk electronics.
P-0032[0032]FIG. 11 is a flow-chart of processing performed by the adapter disk electronics and a data processing platform.
P-0033[0033]FIG. 12 is a flow-chart of a sensor calibration process.
P-0034[0034]FIG. 13 is a flow-chart of adapter disk electronics data processing.
P-0035[0035]FIG. 14 is a flow-chart of a process for determining a normal force based on a sensor response.
P-0036[0036]FIG. 15 is a diagram of a data processing platform.
P-0037[0037]FIG. 16 is a flowchart of data processing performed by the data processing platform.
P-0038[0038]FIG. 17 is a flowchart of a process for determining wheel roundness.
P-0039[0039]FIG. 18 is a flowchart of a process for determining wheel surface roughness.
P-0040[0040]FIG. 19 is a flowchart of a process for determining wheel dullness.
P-0041[0041]FIG. 20 is a flowchart of a process for determining a wheel grinding mode.
P-0042[0042]FIG. 21 is a flowchart of a process for determining wheel chatter.
P-0043[0043]FIG. 22 is a diagram illustrating tangential forces that act on a wheel.
P-0044[0044]FIG. 23 is a flowchart of a process for determining tangential wheel forces.
P-0045[0045]FIG. 24 is a diagram of an multiple adaptive neuro-fuzzy inference system (MANFIS).
P-0046[0046]FIG. 25 is a diagram of an adaptive neuro-fuzzy inference system (ANFIS).
P-0047[0047] FIGS. <b>26</b>A-<b>25</b>C are screenshots of a graphical user interface used to display wheel characteristics.
DETAILED DESCRIPTION
P-0048[0048] Referring to FIG. 2, a grinding wheel system <b>16</b> includes a grinding wheel core <b>18</b> (e.g., a reusable aluminum core) coated by an abrasive material <b>12</b>. The wheel core <b>18</b> includes embedded sensors (see e.g., FIG. 3) such as force and/or acoustic emission (AE) sensors. A removable adapter disk <b>24</b> attached to the wheel core <b>18</b> houses electronics that process sensor signals and transmit (e.g., via wireless transmission) the processed signals to the data processing platform <b>25</b> for analysis. A removable dummy disk <b>26</b> balances the weight of adapter disk <b>24</b>. As shown, shaft <b>32</b> supported by fork <b>30</b> rotates grinding wheel <b>18</b>. Rotation of wheel <b>18</b> may be electronically controlled by adapter disk <b>24</b> or data processing platform <b>25</b>. Other systems of shafts and forks can be used.
P-0049[0049] Aspects of this system are described in S. Pathare, R. Gao, B. Varghese, C. Guo, and S. Malkin, “A DSP-Based Telemetric Data Acquisition System for In-Process Monitoring of Grinding Operation,” I.E.E.E. Instrumentation and Measurement Technology Conference, May 1998; S. Malkin, R. Gao, C. Guo, B. Varghese, and S. Pathare, “Development of an Intelligent Grinding Wheel for In-Process Monitoring of Ceramic Grinding”, Semi-Annual Report #1, May 1997, available on-line at http://www.doe.gov/bridge.
P-0050[0050] Sensor Construction and Placement
P-0051[0051] Referring to FIG. 3, the wheel core <b>18</b> includes sensors such as force detection sensors <b>20</b><i>a</i>-<b>20</b><i>k </i>(force sensors) and acoustic emission (AE) sensors <b>22</b><i>a</i>-<b>22</b><i>d. </i>As shown, the core <b>18</b> includes eleven force sensors <b>20</b><i>a</i>-<b>20</b><i>k </i>and four AE sensors <b>22</b><i>a</i>-<b>22</b><i>d </i>symmetrically positioned about the core <b>18</b>. As shown, the wheel core <b>18</b> also includes bolt <b>44</b><i>a</i>-<b>44</b><i>k </i>and dowel pin <b>46</b><i>a</i>-<b>46</b><i>b </i>openings to permit the adapter disk <b>24</b> and the dummy disk <b>26</b> to sandwich the wheel core <b>18</b>.
P-0052[0052] A core <b>18</b> may have different numbers of force and AE sensors than the number shown. Additionally, the sensors need not have a symmetrical configuration, although a symmetrical configuration offers certain advantages discussed below. The use of both force <b>20</b><i>a</i>-<b>20</b><i>k </i>and AE sensors <b>22</b><i>a</i>-<b>22</b><i>d </i>permit data processing platform <b>25</b> to monitor a wide variety of wheel characteristics.
P-0053[0053] Referring to FIG. 4, glue can be used to hold each sensor (e.g., force sensor <b>20</b>) in a pre-machined slot in the core <b>18</b>. A sensor <b>20</b> terminal connects to metal foil <b>32</b> which may be mounted flush against the core <b>18</b> surface. An insulating seal <b>34</b> provides a conductive strip <b>36</b> that electrically transmits a charge developed on sensor <b>20</b> in response to forces or acoustic emissions to adapter disk <b>24</b> electronics. A wide variety of other methods of embedding or affixing sensors can be used. Other sensors such as strain gages and/or magnetoelastic sensors can also be used.
P-0054[0054] Although a wide variety of sensors can be used, sensors that respond to the piezoelectric effect (e.g., sensors having piezoceramic chips) respond to both wheel forces and acoustic emissions. Sensor responses in the MHz range correspond to acoustic emissions. Responses in the ten to hundred kHz range represent dynamic forces. By using electronic filters, a sensor's response can be easily divided into force and acoustic emission components.
P-0055[0055] Referring to FIG. 5, a force sensor <b>20</b> produces a charge proportional to the impulsive stress waves generated when abrasive <b>12</b> grains interact with the workpiece <b>14</b>. Referring also to FIG. 6, sensor response <b>20</b> rapidly diminishes as the sensor rotates away from the point <b>38</b> where the abrasive <b>12</b> and workpiece <b>14</b> meet. That is, the amplitude of the force signal measured depends on the angle θ formed between a vertical line at the point <b>38</b> the abrasive material <b>12</b> and the workpiece <b>14</b> meet and a normal line determined by the outer curvature of the core <b>18</b> where the sensor <b>20</b> resides.
P-0056[0056] Referring again to FIG. 3, the wheel core <b>18</b> includes eleven force sensors <b>20</b><i>a</i>-<b>20</b><i>k </i>symmetrically positioned around the wheel periphery to detect surface forces. As described below, the number and position of the sensors can be determined based on different factors. The proximity of these peripheral force sensors <b>20</b><i>a</i>-<b>20</b><i>k </i>to the grinding surface increases their sensitivity to forces produced by the interaction between the wheel <b>18</b> and workpiece <b>14</b>.
P-0057[0057] The number of force sensors <b>20</b><i>a</i>-<b>20</b><i>k </i>included in a wheel core <b>18</b> depends on a variety of factors such as wheel dimensions, rotational speed, the configuration of the abrasive material, sensor dimensions, the complexity of data processing electronics, and space restrictions. For example, abrasive materials <b>12</b> can be glued to the wheel core <b>18</b> in twenty-two adjoining sections. The number of force sensors <b>20</b><i>a</i>-<b>20</b><i>k </i>may be a multiple or fraction of the sections to maintain symmetrical sensor arrangement and avoid discontinuity between sections.
P-0058[0058] The position of force sensors <b>20</b><i>a</i>-<b>20</b><i>k </i>depends on sensitivity requirements, sensor overload protection, and angular coverage. For increased sensitivity, the force sensors <b>20</b><i>a</i>-<b>20</b><i>k </i>are sandwiched between the wheel core <b>18</b> and the abrasive material <b>12</b>. Due to the high rigidity of the wheel core <b>18</b>, the orientation of a force sensor <b>20</b><i>a</i>-<b>20</b><i>k </i>with respect to the wheel periphery does not have any measurable effect on the sensor's <b>20</b><i>a</i>-<b>20</b><i>k </i>angular range of coverage. To protect the force sensors <b>20</b><i>a</i>-<b>20</b><i>k</i>, a two-component epoxy (e.g., Araldite AV1258 with hardener HV1258) can be used to attach the abrasive material <b>12</b> to the core <b>34</b>.
P-0059[0059] As shown in FIG. 3, the wheel core <b>18</b> includes AE sensors <b>22</b><i>a</i>-<b>22</b><i>d </i>positioned near the wheel inner rim <b>40</b>. Acoustic emission sensors <b>22</b><i>a</i>-<b>22</b><i>d </i>can be used to triangulate acoustic emissions produced by structural imperfections (e.g., microscopic cracks) in a wheel core <b>18</b>. Triangulation requires a minimum of three AE sensors, e.g., <b>22</b><i>a</i>-<b>22</b><i>c</i>, to pinpoint a source of an acoustic emission. As shown, the core <b>18</b> includes a fourth AE sensor <b>22</b><i>d </i>for redundancy and increased measurement accuracy.
P-0060[0060] Referring to FIGS. <b>7</b>A-<b>7</b>D, locating AE sensors <b>22</b><i>a</i>-<b>22</b><i>d </i>near the wheel rim <b>40</b> minimizes noise caused by the normal vibrational behavior of the wheel core <b>18</b>. FIGS. <b>7</b>A-<b>7</b>D, show four modes (i.e., harmonic vibration response) of a wheel core <b>18</b> in normal operation. The modes produce acoustic pressure maxima and minima <b>42</b><i>a</i>-<b>42</b><i>d </i>near the center of the wheel core <b>18</b> annular region. These shapes <b>42</b><i>a</i>-<b>42</b><i>d </i>represent areas where AE sensors <b>22</b><i>a</i>-<b>22</b><i>d </i>function poorly. Thus, AE sensors <b>22</b><i>a</i>-<b>22</b><i>d </i>are located near the wheel rim <b>40</b> as shown in FIG. 3.
P-0061[0061] Wheel Electronics
P-0062[0062] Referring to FIG. 8, a removable adapter disk <b>24</b> and removable dummy disk <b>26</b> fit around the wheel core's inner rim <b>40</b>. Bolts (e.g., bolt <b>44</b>) and dowel pins <b>46</b><i>a</i>-<b>46</b><i>b </i>secure adapter disk <b>24</b> and dummy disk <b>26</b> to the wheel core <b>18</b>. The adapter disk <b>24</b> holds electronics (e.g., transmitter, power supply, and a Digital Signal Processor (DSP)) that process sensor <b>20</b><i>a</i>-<b>20</b><i>k</i>, <b>22</b><i>a</i>-<b>22</b><i>d </i>information in a disk cavity <b>48</b>. The dummy disk <b>26</b> offers an identical mass distribution as the adapter disk <b>24</b> to maintain wheel symmetry and balance. The adapter disk <b>24</b> enables sensor signal processing to occur at the wheel core <b>18</b> with minimal structural modification of the wheel core <b>18</b>. The adapter disk <b>24</b> also facilitates easy access and maintenance of the electronics. That is, an operator can modify and/or update the electronics to measure other wheel-related parameters without dismounting the wheel <b>18</b>. Additionally, during maintenance or modification of the electronics, an operator can continue to use the wheel core <b>18</b> for conventional grinding. The modular design also offers operators the flexibility of using the same measurement electronics for a variety of wheels using different abrasives or having different thickness and/or widths.
P-0063[0063] Referring to FIG. 9, electronics <b>50</b> process signals (e.g. electrical charges) produced by the force <b>20</b><i>a</i>-<b>20</b><i>n </i>and AE sensors <b>22</b><i>a</i>-<b>22</b><i>n</i>. The electronics <b>50</b> can be embedded in the wheel core <b>18</b> or housed in adapter disk <b>24</b>. As shown, the electronics <b>50</b> include an analog multiplexer <b>56</b> that selects between different sensors <b>20</b><i>a</i>-<b>20</b><i>k</i>, <b>22</b><i>a</i>-<b>22</b><i>d, </i>a charge amplifier <b>58</b> that transforms a sensor charge into a voltage, an anti-aliasing filter <b>60</b>, an analog-to-digital (A/D) converter <b>62</b>, a DSP <b>64</b> that performs filtering and other data processing tasks, and a transmitter/receiver <b>62</b>. Other implementations use different architectures. For example, a very basic implementation does not use a DSP <b>64</b> at all, but instead directly transmits the analog signal of each sensor <b>20</b><i>a</i>-<b>20</b><i>k, </i><b>22</b><i>a</i>-<b>22</b><i>d </i>to the data processing platform <b>25</b>. Such a system can place a heavy burden on the data processing platform <b>25</b> by transmitting such a large volume of information. The use of a DSP <b>64</b>, as shown, permits real-time signal processing at the wheel in addition to selective transmission of gathered information.
P-0064[0064] The electronics' <b>50</b> architecture shown offers an efficient system powered by a compact, lightweight J size 6-V battery <b>52</b>. Diode protective circuitry <b>54</b><i>a</i>-<b>54</b><i>f </i>connected to the input of each multiplexer <b>56</b> prevent damage due to high voltages from the piezoceramic sensors. The diodes <b>54</b><i>a</i>-<b>54</b><i>f </i>offer high speeds and low reverse leakage currents. In addition, their low parasitic capacitance helps preserve signal quality.
P-0065[0065] Sensor input signals feed an analog multiplexer <b>56</b> (e.g., an ADG608). Channel selection is achieved by using a data latch configured as an output port of the DSP <b>64</b>. The multiplexer <b>56</b> shown requires a supply current of 0.1 uA with a channel switching time of 100 ns.
P-0066[0066] Multiplexing the sensor signals makes it possible to use a single charge amplifier <b>58</b>, anti-aliasing filter <b>60</b>, and A/D converter <b>62</b> to process the force <b>20</b><i>a</i>-<b>20</b><i>n </i>and AE sensors <b>22</b><i>a</i>-<b>22</b><i>n</i>. The use of a single set of electronic components minimizes the influence of component variations (e.g., amplifier gain) on signals.
P-0067[0067] Charge amplifier <b>58</b> converts a sensor's electrical charge to a voltage signal proportional to either the amplitude of the applied forces or the acoustic emission. A high-speed operational amplifier (e.g., an AD-822) is configured as a charge amplifier <b>58</b>. The lower cut-off frequency (f<sub>L</sub>) of the charge amplifier <b>58</b> is set to 25 Hz by proper choice of the feed-back resistor (R<b>1</b>) and capacitor (C<b>1</b>), as given by:
<i>f</i><sub>L</sub>=1/(2<i>πR</i><sub>1</sub><i>C</i><sub>1</sub>) [1]
P-0068[0068] Considering a time constant of the charge amplifier that is ten times as long, the lowest wheel rotational speed required for distortion-free force measurement is approximately 50 revolutions per minute (RPM). This number is much lower than that typically required for wheel preparation and/or grinding. Therefore, the charge amplifier <b>58</b> can accurately measure force and AE signals at the low frequency end.
P-0069[0069] The charge amplifier <b>58</b> also needs to respond fast enough to capture sensor signals. For this purpose, the highest frequency component of force signals is calculated by considering that as the point of contact <b>38</b> sweeps past a force sensor, a force impulse (T) is generated whose duration is related to the peripheral wheel velocity v<sub>s </sub>by:
<i>T=w/v</i><sub>s</sub> [2]
P-0070[0070] where w is the width of the sensor and v<sub>s </sub>is the velocity of the wheel perimeter. Thus, a wheel velocity of 60 m/s and sensor width of 3 mm, T=50 us. This corresponds to a signal frequency of about 20 kHz. Because AE signals are typically an order of magnitude higher, the highest signal frequency that needs to be processed by the charge amplifier is expected to be 500 kHz. The AD-822's bandwidth of 1.8 MHz can easily handle this range of frequencies. For input signal attenuation, the charge amplifier <b>58</b> is preceded by a capacitive charge attenuator. The transfer function of the charge attenuator-charge amplifier block is given by: <maths id="MATH-US-00001" num="1"><math overflow="scroll"><mtable><mtr><mtd><mrow><mrow><mi>V</mi><mo></mo><mrow><mo>(</mo><mi>s</mi><mo>)</mo></mrow></mrow><mo>=</mo><mrow><mrow><mi>Q</mi><mo></mo><mrow><mo>(</mo><mi>s</mi><mo>)</mo></mrow></mrow><mo>·</mo><mfrac><mrow><mi>A</mi><mo></mo><mrow><mo>(</mo><mi>s</mi><mo>)</mo></mrow></mrow><mrow><mo>[</mo><mrow><mrow><mi>A</mi><mo></mo><mrow><mo>(</mo><mi>s</mi><mo>)</mo></mrow></mrow><mo>+</mo><mn>1</mn></mrow><mo>]</mo></mrow></mfrac><mo>·</mo><mfrac><msub><mi>sR</mi><mn>1</mn></msub><mrow><mo>[</mo><mrow><mrow><msub><mi>sR</mi><mn>1</mn></msub><mo></mo><msub><mi>C</mi><mn>1</mn></msub></mrow><mo>+</mo><mn>1</mn></mrow><mo>]</mo></mrow></mfrac><mo>·</mo><mfrac><msub><mi>C</mi><mn>2</mn></msub><mrow><mo>[</mo><mrow><msub><mi>C</mi><mn>2</mn></msub><mo>+</mo><msub><mi>C</mi><mn>3</mn></msub></mrow><mo>]</mo></mrow></mfrac></mrow></mrow></mtd><mtd><mrow><mo>(</mo><mn>3</mn><mo>)</mo></mrow></mtd></mtr></mtable></math><img file="US20030194946A1-20031016-M00001.TIF" id="EMI-M00001" he="18.96615" wi="216.027" img-format="tif" img-content="mf" /><attachments><attachment idref="MATHEMATICA-00001" attachment-type="nb" file="US20030194946A1-20031016-M00001.NB" /></attachments></maths>
P-0071[0071] The charge, amplifier <b>58</b> is followed by a four-pole anti-aliasing filter <b>60</b>. The anti-aliasing filter <b>60</b> is designed using a high-precision, high band-width (300 MHz), current feedback amplifier AD-8011 <b>60</b> having a cut-off frequency of 1 MHz. Compared to voltage feedback amplifiers, current feedback amplifiers do not suffer from speed limitations due to stray capacitance and internal transistor cut-off frequencies, and, hence, are inherently faster and cover a larger bandwidth.
P-0072[0072] The anti-aliasing filter <b>60</b> feeds an A/D converter <b>62</b>. The A/D converter <b>62</b> (e.g., AD-9223) has a resolution of 12 bits and can make three millions samples per second. The sampling rate was chosen to meet the Nyquist criterion for sampling signals with a bandwidth of 1 MHz. The A/D converter <b>62</b> has an on-chip voltage reference and separate power supply pins for the analog and digital sections. The analog and digital power supplies are decoupled using high value capacitors mounted near the supply input pins (not shown) A tri-state buffer and latch buffer the digitized output of the A/D converter <b>62</b>. A separate clock chip clocks the A/D converter <b>62</b> and communicates with the DSP <b>64</b> in interrupt mode. A flat ribbon connector (FRC) connects the output of the A/D <b>62</b> to the DSP <b>64</b>.
P-0073[0073] The DSP <b>64</b> analyzes the digitized sensor signals to remove noise and identify force and acoustic emission information. The DSP <b>64</b> analyzes the spectral characteristics of the signals in addition to their time domain behavior by performing wavelet analysis of the signals. Wavelet analysis preserves both the frequency and time domain information of a signal and allows simultaneous extraction of high and low frequency signals with different frequency resolutions. A conventional FFT (Fast Fourier Transformation) may also be used to analyze a signal.
P-0074[0074] As shown, the DSP <b>64</b> may be a TMS320C52, manufactured by Texas Instruments. The algorithms that implement wavelet analysis and other transforms are often computationally demanding. The RISC-based architecture (Reduced Instruction Set Computer) of a DSP <b>64</b> enables efficient computation of large amount of data for the multiple sensors. The DSP <b>64</b> shown includes multiple internal data buses and DARAM (dual access RAM) which enables simultaneous addition and multiplication operations. The DSP <b>64</b> shown is a sixteen-bit, fixed-point digital signal processor offering a low supply voltage requirement (3 V), multiple on-chip serial ports (3 ports), high speed calculation capability (100 MIPS), and a small package size compared to other floating-point DSPs. The DSP <b>64</b> also offers a large amount of on-chip RAM (32 kBytes), eliminating the need for external RAM and reducing the amount of space used,by the electronics. Other implementations may use a microcontroller or microprocessor to perform the functions of DSP <b>64</b>.
P-0075[0075] A transmitter/receiver <b>66</b> handles data transmission between the DSP <b>64</b> and the data processing platform <b>25</b>. As shown, the transmitter/receiver <b>66</b> is an RF transmitter. RF transmission may be carried out in the 900 MHz FCC license-free ISM (Industrial, Scientific and Medical) band. In one implementation, the RF transmitter <b>66</b> is a single-chip hybrid IC that uses amplitude modulation in an on-off keying mode and is capable of operating at 3V. The antenna of the RF transmitter can be mounted flush on the outer surface of the adapter disk <b>24</b>.
P-0076[0076] The data can be compressed and can be transmitted in digital or analog form. Compression can be configured to keep dominant frequencies while suppressing lesser ones. Digital transmission makes efficient use of the bandwidth, since the RF bandwidth for signal transmission has little relation with that of the base band. Additionally, error correction mechanisms of digital transmission permit optimum utilization of transmission power, making low power transmission possible. Further, digital transmission allows for easy time multiplexing to accommodate input signals from multiple sensors. Digital transmission also makes it possible to use multiple transmitters and receivers within the same frequency band by means of TDMA (Time Division Multiple Access) without introducing much complexity in the transmitter/receiver hardware.
P-0077[0077] The electronics <b>50</b> are fitted (of FIG. 9) into an adapter disk <b>24</b> or into the wheel core <b>18</b> using a multi-layer design to reduce system noise and save space. As shown, in FIG. 10 a six-layered PCB board (Printed Circuit Board) <b>68</b> holds electronics <b>50</b> in a shape constructed to fit within adapter disk <b>24</b>. Four layers (e.g., <b>68</b><i>b</i>-<b>68</b><i>e</i>) are used as signal processing layers and two layers hold power supply rails for Vcc and Ground (e.g., <b>68</b><i>a</i>, <b>68</b><i>f</i>). Separating the processing layers <b>68</b><i>b</i>-<b>68</b><i>e </i>from the power supply layers <b>68</b><i>a</i>, <b>68</b><i>f </i>significantly reduces the length of connection tracks between individual layers. The two dedicated power supply layers <b>68</b><i>a</i>, <b>68</b><i>f </i>also provide a ripple-free voltage supply to the circuitry. The design reduces cross-talk and other electronic interference. Appendix A includes detailed schematics of one possible implementation. A wide variety of other techniques may be used to shield the electronics from interference and noise (e.g., foil shielding).
P-0078[0078] Referring to FIG. 11, sensor responses <b>72</b> are processed by wheel electronics (e.g., electronics <b>50</b> in adapter disk <b>24</b>) (step <b>74</b>) before transmission (step <b>76</b>) to the data processing platform for further processing (step <b>78</b>). Although in this description computational processes areas performed by the wheel electronics <b>50</b> (step <b>74</b>) or by the data processing platform <b>25</b> (step <b>78</b>), other implementations can be used to distribute data processing functions differently.
P-0079[0079] For example, referring to FIG. 12, due to potential variations in construction, different sensors may produce different responses to the same force. For example, a first force sensor may report a different peak charge in response to a 100 lb. load than a second force sensor bearing the same load. A calibration process <b>100</b> calibrates the different sensors to prevent differences from distorting subsequent analyses. This calibration process can be performed either by the electronics <b>50</b> in adapter disk <b>24</b> or by the data processing platform <b>25</b>. Calibration may include applying a known load (e.g., 100 lbs) to a wheel (step <b>102</b>) and determining and storing the response of each sensor to the load (step <b>104</b>). Such calibration can be repeated using different loads to determine a characteristic response curve. Thereafter, each sensor signal processed can be normalized based on the stored calibration data.
P-0080[0080] Referring to FIG. 13, as shown, the electronics <b>50</b> process <b>74</b> signals (x<sub>1</sub>(t), x<sub>2</sub>(t), x<sub>3</sub>(t)) from sensors <b>20</b><i>a</i>-<b>20</b><i>k </i>and <b>22</b><i>a</i>-<b>22</b><i>d </i>prior to transmission to the data processing platform <b>25</b> (step <b>76</b>). The DSP <b>64</b> first selects a channel (i.e., a sensor) to process (step <b>106</b>). A signal (e.g, a charge) of the selected sensor is digitized (step <b>108</b>) (e.g., by the charge amplifier <b>58</b> and A/D converter <b>62</b>) prior to DSP <b>64</b> analysis.
P-0081[0081] The DSP <b>64</b> continually determines the wheel's rotational speed (step <b>110</b>). This value is needed in subsequent computations to accurately determine the force represented by a sensor signal. One method of determining wheel speed uses a low-pass filter to measure the duration between peak sensor pulses. This duration corresponds to the time it takes a sensor to make one full rotation about the wheel. Another method analyzes a signal in the frequency domain to find the most dominant frequency which corresponds to the RPM. Both methods can be used together to double-check RPM calculations.
P-0082[0082] As shown in FIG. 13, the wheel's rotational speed (i.e., RPM) is used to determine the signal amplitude produced by a force sensor (steps <b>112</b><i>a, </i><b>112</b><i>b, </i><b>114</b>) (x<sub>low</sub>[n]). Referring also to FIG. 14, once the RPM is known (step <b>110</b>), the signal from the force sensor of interest is recorded over a predefined period of time (e.g., a few seconds). The signal is then windowed such that only the portion which occurs when the sensor passes over the contact point <b>38</b> is kept. The windowed signal is then band-limited to 30 kHz (step <b>112</b><i>a</i>) and passed through a bandpass filter (step <b>112</b><i>b</i>). The bandpass filter used for this purpose is tuned by the wheel RPM data (e.g., the filter's output is made proportional to the measured force amplitude). Calculation errors are reduced by averaging the force value for the number of rotations of the wheel. The maximum measured force value is determined (step <b>114</b>). The normal force for the each force sensor is obtained (nf[i]) and a normal force vector (nf) is formed and included in a formatted transmission message (step <b>122</b>) along with the measured RPM value.
P-0083[0083] The DSP <b>64</b> processes AE sensor signals using a high-pass filter (step <b>116</b>) to identify the high-frequency AE components. The DSP <b>64</b> may then use wavelet analysis, FFT, or other transforms to determine the frequency-domain response of a sensor (step <b>118</b>) (X<sub>high</sub>[n]). The DSP <b>64</b> compresses (e.g., zips) the sensor data (step <b>120</b>) (X<sub>comp</sub>) for inclusion in the formatted transmission message (step <b>122</b>).
P-0084[0084] The Data Processing Platform
P-0085[0085] Referring to FIG. 15, a data processing platform <b>25</b> (e.g., a standard PC or PC-compatible computer) includes a display <b>130</b>, a keyboard <b>132</b>, a pointing device <b>134</b> such as a mouse, and a digital computer <b>138</b>. The digital computer <b>138</b> includes memory <b>140</b>, a processor <b>142</b>, a mass storage device <b>144</b><i>a, </i>and other customary components such as a memory bus and peripheral bus (not shown). The platform <b>25</b> further includes a transmitter/receiver <b>136</b>. The transmitter/receiver <b>136</b> may be a single-chip hybrid RF device interfaced to the serial port of the platform <b>25</b>.
P-0086[0086] Mass storage device <b>144</b><i>a </i>can include operating system (e.g., Microsoft Windows 95™) instructions <b>146</b> and data processing instructions <b>78</b>. Data processing instructions <b>78</b> can be transferred to memory <b>140</b> and processor <b>142</b> in the course of operation. The data processing instructions <b>78</b> can cause the display <b>130</b> and input devices <b>132</b> and <b>134</b> to provide a user interface such as a graphical user interface <b>150</b> (FIGS. <b>26</b>A-<b>26</b>C). Data processing instructions <b>78</b> can be stored on a variety of mass storage devices such as a floppy disk <b>144</b><i>b, </i>CD-ROM <b>144</b><i>c, </i>or PROM (not shown).
P-0087[0087] Referring to FIG. 16, after receiving data (step <b>76</b>), the instructions <b>78</b> unformat (step <b>154</b>) and decompress (step <b>156</b>) (e.g., unzip) a received message into its components (e.g., RPM, normal force vector nf, and frequency information X<sub>comp</sub>) Multi-resolution analysis (step <b>158</b>) studies the signal at different frequency and time resolutions to recognize distinct patterns in the input signal. The data processing instructions <b>78</b> may use the data to monitor a variety of grinding phenomenon (step <b>160</b>), such as roundness (step <b>162</b>), wheel dullness (step <b>164</b>), grinding mode (step <b>170</b>), and/or chatter (step <b>172</b>). Instructions <b>160</b> may also produce estimations of tangential force (step <b>166</b>), surface roughness (step <b>168</b>), and/or other grinding parameters (step <b>174</b>) such as temperature.
P-0088[0088] Many wheel characteristics can be determined by comparing the output of different sensors collected at substantially the same time. For example, referring to FIG. 17, instructions <b>162</b> may determine wheel roundness by collecting nearly contemporaneous force measurements from different force sensors (step <b>176</b>). If not performed by the DSP <b>64</b> prior to transmission, the instructions <b>162</b> may normalize the collected measurements based on sensor calibration data (step <b>178</b>). In a round wheel, each sensor should report nearly equal normalized force measurements. The instructions <b>162</b> compare the different normalized measurements using a configurable threshold (step <b>180</b>). Based on the comparison, the instructions <b>162</b> can determine whether the wheel is round (step <b>184</b>) or misshapened (i.e., “out-of-round”) (step <b>182</b>). The instructions <b>162</b> can also produce a value indicating a degree of roundness (step <b>183</b>) instead of simply producing a binary round/not-round determination.
P-0089[0089] Referring to FIG. 18, instructions <b>168</b> can use a similar technique to determine wheel surface roughness. When a wheel becomes rough, different force sensors produce different-normalized force values. Again, by comparing substantially contemporaneously collected force values for different sensors (step <b>186</b>), normalizing these values (step <b>188</b>), and comparing the normalized values (step <b>190</b>), the instructions <b>168</b> can determine whether a wheel is smooth (step <b>192</b>) or exhibits varying degrees of roughness (steps <b>193</b>, <b>194</b>).
P-0090[0090] Referring to FIG. 19, a variety of wheel characteristics can also be determined by comparing the measurements of a sensor or sensors at different times. For example, as shown in FIG. 19, instructions <b>164</b> determine whether a wheel has dulled by comparing (step <b>200</b>) a sensor's force measurement at a first time (step <b>196</b>) with a force measurement of the same sensor at a second time (step <b>198</b>). As a wheel dulls, the forces exerted on each sensor tend to increase due to greater friction. Thus, if, over time, a sensor reports an increase in force, the instructions <b>164</b> may determine the wheel is becoming increasingly dull (steps <b>203</b>, <b>204</b>).
P-0091[0091] One characteristic of a wheel is its grinding mode. For example, a wheel may be grinding a workpiece <b>14</b> in a continuous manner (e.g., ductile grinding) and/or by displacing discrete chunks at non-periodic intervals (e.g., brittle grinding). As shown in FIG. 20, by collecting force values produced by different sensors at different time periods (step <b>206</b>) and determining the rate of change in these values (step <b>208</b>), the instructions <b>170</b> can determine whether a wheel is grinding workpiece <b>14</b> in a ductile (step <b>210</b>) or brittle (step <b>212</b>) manner or some combination thereof (step <b>211</b>).
P-0092[0092] Referring to FIG. 21, instructions <b>172</b> may also determine the degree of chatter a wheel experiences by comparing sensor responses collected at different time periods. In one technique, the responses of an AE sensor (or sensors) are collected at different time periods (step <b>214</b>) and the signals are analyzed in the frequency domain (step <b>216</b>). In the frequency domain, chatter appears as a strong frequency outside the bandwidth typically produced by a non-chattering wheel. By comparing the AE signals from different time periods in the frequency domain (step <b>216</b>), frequencies corresponding to chattering can be detected (steps <b>219</b>, <b>220</b>).
P-0093[0093] Referring to FIG. 22, grinding produces a tangential force upon a wheel's surface <b>12</b>. As shown, a sensor <b>20</b> at point a on the wheel surface <b>12</b> experiences a tangential force <b>224</b>. An angle, α, is formed from a normal <b>221</b> formed by the curvature of the wheel at point a and a normal <b>222</b> formed by the curvature of the wheel at point b (<b>38</b>). The tangential force at point a equals (sine(α)×the force reported by sensor <b>20</b> at point b).
P-0094[0094] Referring to FIG. 23, the relationship described above is only one method of determining the tangential force. Instructions <b>166</b> can use one of these methods to compute the tangential force experienced by a portion of the wheel surface <b>12</b>. The instructions <b>166</b> may use depth of cut <b>226</b>, RPM <b>228</b>, and wheel geometry <b>230</b> (e.g., diameter) information to compute the tangential force (step <b>234</b>) based on collected force sensor values (step <b>232</b>).
P-0095[0095] Referring to FIG. 24, a Multiple Adaptive Neuro-Fuzzy Inference System (MANFIS) <b>160</b><i>a </i>can be employed to efficiently analyze sensor data. A MANFIS <b>160</b><i>a </i>is a collection of several Adaptive Neuro-Fuzzy Inference System (ANFISs) software networks <b>238</b><i>a</i>-<b>238</b><i>n</i>, each of which is trained to recognize a particular feature (e.g., roundness, grinding mode, estimated tangential force, surface roughness, and grinding temperature). Typically, each ANFIS <b>238</b><i>a</i>-<b>238</b><i>n </i>will have three inputs, which include the normal force X, acoustic emission information Y, and the grinding conditions Z (e.g., previously determined information).
P-0096[0096] Referring to FIG. 25, an ANFIS <b>238</b> includes a network of different communicating software layers <b>240</b>-<b>248</b>. In a first layer <b>240</b>, each input is spanned by a set of membership functions <b>250</b><i>a</i>-<b>250</b><i>f</i>. A set of weights in layers <b>242</b> and <b>244</b> and node functions in layer <b>246</b> link the membership functions <b>250</b><i>a</i>-<b>250</b><i>f </i>to an output layer <b>248</b>. A particularly suitable membership function for the ANFIS architecture is the generalized bell membership function described by three parameters: <maths id="MATH-US-00002" num="2"><math overflow="scroll"><mtable><mtr><mtd><mrow><mrow><mi>μ</mi><mo></mo><mstyle><mtext> </mtext></mstyle><mo></mo><mi>Ai</mi></mrow><mo>=</mo><mfrac><mn>1</mn><mrow><mn>1</mn><mo>+</mo><msup><mrow><mo></mo><mfrac><mrow><mi>x</mi><mo>-</mo><mi>c</mi></mrow><mi>a</mi></mfrac><mo></mo></mrow><mrow><mn>2</mn><mo></mo><mi>b</mi></mrow></msup></mrow></mfrac></mrow></mtd><mtd><mrow><mo>[</mo><mn>4</mn><mo>]</mo></mrow></mtd></mtr></mtable></math><img file="US20030194946A1-20031016-M00002.TIF" id="EMI-M00002" he="27.13095" wi="216.027" img-format="tif" img-content="mf" /><attachments><attachment idref="MATHEMATICA-00002" attachment-type="nb" file="US20030194946A1-20031016-M00002.NB" /></attachments></maths>
P-0097[0097] where μAi is the membership function value computed for an input value x, for particular values of parameters a, b and c (called premise parameters). The input (e.g., force x) is spanned by a set of these membership functions. For example, as shown, a set of two membership functions <b>250</b><i>a</i>-<b>250</b><i>b </i>span the force input. Thus, layer <b>240</b> has two outputs for force which are fed further into the network. Similar layer <b>240</b> outputs are obtained for other inputs.
P-0098[0098] Layer <b>242</b> sums the outputs from layer <b>240</b> and multiplies the sums by weights w<sub>i</sub>. Layer <b>244</b> sums the outputs of layer <b>242</b> and multiplies these outputs by normalized weights w<sub>i </sub>such that: <maths id="MATH-US-00003" num="3"><math overflow="scroll"><mtable><mtr><mtd><mrow><msub><mover><mi>W</mi><mi>_</mi></mover><mi>i</mi></msub><mo>=</mo><mfrac><msub><mi>W</mi><mi>i</mi></msub><mrow><mi>Σ</mi><mo></mo><mstyle><mtext> </mtext></mstyle><mo></mo><msub><mi>W</mi><mi>i</mi></msub></mrow></mfrac></mrow></mtd><mtd><mrow><mo>[</mo><mn>5</mn><mo>]</mo></mrow></mtd></mtr></mtable></math><img file="US20030194946A1-20031016-M00003.TIF" id="EMI-M00003" he="18.96615" wi="216.027" img-format="tif" img-content="mf" /><attachments><attachment idref="MATHEMATICA-00003" attachment-type="nb" file="US20030194946A1-20031016-M00003.NB" /></attachments></maths>
P-0099[0099] In layer <b>246</b> outputs from layer <b>244</b> are combined using linear models <b>264</b><i>a</i>-<b>264</b><i>b. </i>The output for each node <b>264</b><i>a</i>-<b>264</b><i>b </i>in layer <b>246</b> can be described as:
<i>f</i><sub>i</sub><i>=p</i><sub>i</sub><i>X+q</i><sub>i</sub><i>Y+r</i><sub>i</sub><i>Z+s</i><sub>i</sub> [6]
P-0100[0100] where f<sub>i </sub>is the node output for particular values of parameters p<sub>i</sub>, q<sub>i</sub>, r<sub>i </sub>and s<sub>i</sub>. These parameters are called consequent parameters and are determined by training as described below. Finally, ANFIS <b>238</b> output is obtained as a combination of each output as:
<i>f=w</i><sub>1</sub><i>f</i><sub>1</sub><i>+w</i><sub>2</sub><i>f</i><sub>2</sub><i>+w</i><sub>3</sub><i>f</i><sub>3</sub> [7]
P-0101[0101] Thus, if normal force vector (X), high frequency content (Y) and machining condition (Z) are given, the above network can produce an output for specified values of weights, premise and consequent parameters.
P-0102[0102] The procedure of finding the optimized parameters and weights is called ANFIS <b>238</b> training. This training involves determining a number of membership functions, values for weights, premise and consequent parameters such that the network can predict the outputs accurately. In other words, training enables the ANFIS <b>238</b> to recognize certain patterns in the input signal and accordingly predicts the most appropriate output.
P-0103[0103] Training can be performed by presenting the network <b>238</b> with a set of inputs having known outputs. The parameters and weights can then be adjusted so that output predicted by the ANFIS <b>238</b> matches the known output values. The set of known input-output values used to train the ANFIS <b>238</b> is called the training data set. The training data set can be formed from data collected by the grinding wheel system <b>16</b> in parallel with a calibrated, wired data acquisition system on the grinding machine. The data collected by the grinding wheel system <b>16</b> forms the input set for training, while the data collected from the calibrated, wired system forms the known output. The calibrated, wired system includes a force dynamometer to determine normal and tangential forces, a power transducer and thermocouples, together with measurements of geometric wheel form (wheel roundness, waviness etc.), and wheel surface topology. The training data can be used to train each individual ANFIS <b>238</b> of the inference system <b>236</b>. The optimized values of both the premise and consequent parameters obtained after training the MANFIS <b>236</b> in this manner is used for real-time monitoring of wheel preparation and the grinding process.
P-0104[0104] The instructions <b>160</b> may be used to implement a MANFIS <b>236</b> which collects different inference systems <b>238</b><i>a</i>-<b>238</b><i>n </i>trained to recognize different wheel characteristics. The system <b>236</b> combines the power of neural networks capable of recognizing patterns with fuzzy logic which facilitates easy description of inputs and outputs. The system <b>236</b> can be trained both on-line and off-line. On-line training enables the system to recognize a new grinding phenomenon in any “new” environment (e.g, a new workpiece material, a new grinding wheel core, or a new grinding wheel abrasive). Further, the individual inference systems <b>238</b><i>a</i>-<b>238</b><i>n </i>may share information with each other making them co-active adaptive inference systems.
P-0105[0105] Referring to FIGS. <b>26</b>A-<b>26</b>C, a graphical user interface <b>150</b><i>a</i>-<b>150</b><i>c </i>provides operators with graphic representations of grinding wheel characteristics. The interface <b>150</b><i>a</i>-<b>150</b><i>c </i>screens shown are merely exemplary. As shown in FIG. 23A, the interface <b>150</b><i>a </i>may display wheel specifications <b>284</b> (e.g., the type of abrasive material, wheel diameter, and width) and grinding conditions <b>282</b> (e.g., the workpiece material). The interface <b>150</b><i>a </i>may also display other wheel characteristics such as wheel speed <b>270</b>, dullness <b>272</b>, roundness <b>274</b>, and the grinding mode <b>278</b>. The interface <b>150</b><i>a </i>also permits an operator to specify a file <b>280</b> to store data collected during a grinding session for further analysis.
P-0106[0106] Referring to FIG. 26B, the interface <b>150</b><i>b </i>may also display the force <b>288</b> or acoustic emission <b>286</b> measurements made by different wheel sensors. Referring to FIG. 26C, the interface <b>150</b><i>c </i>may also indicate wheel characteristics such as tangential force <b>294</b>, temperature <b>296</b>, spindle power <b>292</b>, and surface roughness <b>290</b>.
P-0107[0107] Implementation
P-0108[0108] The invention can be implemented in hardware or software, or a combination of both. The programs should be designed to execute on programmable computers each comprising a processor, a data storage system (including memory and/or storage elements), at least one input device, and at least one output device, such as a CRT or printer. Program code is applied to input data to perform the functions described herein and generate output information. The output information is applied to one or more output devices such as a CRT, as described herein.
P-0109[0109] Each program is preferably implemented in a high level procedural or object oriented programming language to communicate with a computer system. However, the programs can be implemented in assembly or machine language, if desired. In any case, the language can be a compiled or interpreted language.
P-0110[0110] Each such computer program is preferably stored on a storage medium or device (e.g., ROM or magnetic diskette) readable by a general or special purpose programmable computer, for configuring and operating the computer when the storage media or device is read by the computer to perform the procedures described herein. The system can also be considered to be implemented as a computer-readable storage medium, configured with a computer program, where the storage medium so configured causes a computer to operate in a specific and predefined manner to perform the functions described herein.
P-0111[0111] Other Embodiments
P-0112[0112] It is to be understood that while the invention has been described in conjunction with the detailed description thereof, the foregoing description is intended to illustrate and not limit the scope of the invention, which is defined by the scope of the appended claims. Other aspects, advantages, and modifications are within the scope of the following claims.
Contents6
29 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10 Sheet 11 Sheet 12 Sheet 13 Sheet 14 Sheet 15 Sheet 16 Sheet 17 Sheet 18 Sheet 19 Sheet 20 Sheet 21 Sheet 22 Sheet 23 Sheet 24 Sheet 25 Sheet 26 Sheet 27 Sheet 28 Sheet 29
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| US2020316754A1 | Cited by | United States of America | Search report |
| US11486202B2 | Cited by | United States of America | Applicant |
| US12226876B2 | Cited by | United States of America | Search report |
| US2007149094A1 | Cited by | United States of America | Pre-grant |
| US2020030938A1 | Cited by | United States of America | Search report |
| US6932675B1 | Cited by | United States of America | Search report |
| US2019278252A1 | Cited by | United States of America | Search report |
| EP3296060A1 | Cited by | European Patent Office (EPO) | Search report |
| WO2021217046A1 | Cited by | World Intellectual Property Organization (WIPO) | International search |
| US10908585B2 | Cited by | United States of America | Search report |
| EP3843947A1 | Cited by | European Patent Office (EPO) | Examiner |
| US2004264581A1 | Cited by | United States of America | Pre-grant |
| US2015239094A1 | Cited by | United States of America | Search report |
| US11566988B2 | Cited by | United States of America | Applicant |
| US11680883B2 | Cited by | United States of America | Applicant |
| US7312615B2 | Cited by | United States of America | Search report |
| US12330265B2 | Cited by | United States of America | Applicant |
| WO2014052822A1 | Cited by | World Intellectual Property Organization (WIPO) | International search |
| EP1604782A1 | Cited by | European Patent Office (EPO) | Search report |
| CH705388B1 | Cited by | Switzerland | Search report |
| US11787011B1 | Cited by | United States of America | Search report |
| US10434626B2 | Cited by | United States of America | Search report |
| US2015239094A1 | Cited by | United States of America | Pre-grant |
| CN113767404A | Cited by | China | Search report |
| US2005170752A1 | Cited by | United States of America | Pre-grant |
| EP3843947B1 | Cited by | European Patent Office (EPO) | Examiner |
| US10144111B2 | Cited by | United States of America | Applicant |
| US4293913A | Cites | United States of America | Pre-grant |
| US4630214A | Cites | United States of America | Pre-grant |
| US4656590A | Cites | United States of America | Pre-grant |
| US5261768A | Cites | United States of America | Pre-grant |
| US5574646A | Cites | United States of America | Pre-grant |
| US5912821A | Cites | United States of America | Pre-grant |
| US6411861B1 | Cites | United States of America | Pre-grant |
| US6564111B1 | Cites | United States of America | Pre-grant |
| US6602109B1 | Cites | United States of America | Pre-grant |
6 members in 3 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 11245698 | United States of America | P | |
| 46534999 | United States of America | A |
Members6
| Document | Office | Kind | |
|---|---|---|---|
| WO0036543A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU2480300A | Australia | A | |
| WO0036543A8 | World Intellectual Property Organization (WIPO) | A8 | |
| US6602109B1 | United States of America | B1 | |
| US2003194946A1 | United States of America | A1 | |
| US6985791B2 | United States of America | B2 |
52 transactions on the USPTO file
Allowed after 1 non-final rejection and 2 final rejections.
- Non-final rejections
- 1
- Final rejections
- 2
- RCEs
- 0
- Appeals
- 0
Over time
Point at a mark for the transactionTransactions
| Event | Code | |
|---|---|---|
| Expire PatentEXP. | EXP. | |
| Post Issue Communication - Certificate of CorrectionN423 | N423 | |
| Mail-Record a Petition Decision of Granted for Patent Term Adjustment after IssueMP026 | MP026 | |
| Adjustment of PTA Calculation by PTOP028 | P028 | |
| Petition EnteredPET. | PET. | |
| Recordation of Patent Grant MailedPGM/ | PGM/ | |
| Patent Issue Date Used in PTA CalculationAllowedPTAC | PTAC | |
| Issue Notification MailedAllowedWPIR | WPIR | |
| Dispatch to FDCD1935 | D1935 | |
| Application Is Considered Ready for IssuePILS | PILS | |
| Issue Fee Payment VerifiedN084 | N084 | |
| Issue Fee Payment ReceivedIFEE | IFEE | |
| Letter to Applicant - No government Interest / Patent to IssueL186 | L186 | |
| Mail Notice of AllowanceAllowedMN/=. | MN/=. | |
| Notice of Allowance Data Verification CompletedAllowedN/=. | N/=. | |
| Case Docketed to Examiner in GAUDOCK | DOCK | |
| Date Forwarded to ExaminerFWDX | FWDX | |
| Response after Final ActionA.NE | A.NE | |
| Mail Final Rejection (PTOL - 326)Final rejectionMCTFR | MCTFR | |
| Final RejectionFinal rejectionCTFR | CTFR | |
| Date Forwarded to ExaminerFWDX | FWDX | |
| Response after Final ActionA.NE | A.NE | |
| Workflow incoming amendment IFWWAMD | WAMD | |
| Mail Final Rejection (PTOL - 326)Final rejectionMCTFR | MCTFR | |
| Final RejectionFinal rejectionCTFR | CTFR | |
| IFW TSS Processing by Tech Center CompleteTSSCOMP | TSSCOMP | |
| Date Forwarded to ExaminerFWDX | FWDX | |
| Response after Non-Final ActionA... | A... | |
| Workflow incoming amendment IFWWAMD | WAMD | |
| Mail Non-Final RejectionNon-final rejectionMCTNF | MCTNF | |
| Non-Final RejectionNon-final rejectionCTNF | CTNF | |
| Case Docketed to Examiner in GAUDOCK | DOCK | |
| Application Is Now CompleteCOMP | COMP | |
| Application Is Now CompleteCOMP | COMP | |
| Application Return from OIPEWROIPE | WROIPE | |
| Application Return TO OIPEROIPE | ROIPE | |
| Application Return from OIPEWROIPE | WROIPE | |
| Application Return TO OIPEROIPE | ROIPE | |
| Application Dispatched from OIPEOIPE | OIPE | |
| Application Is Now CompleteCOMP | COMP | |
| Receipt of all Acknowledgement LettersL130 | L130 | |
| Receipt of Acknowledgment LetterL197 | L197 | |
| Applicant response receivedL175 | L175 | |
| Request for Applicant Statement Regarding Potential DOE Interest (45-Day Letter) MailedML171 | ML171 | |
| Referred for DOE Property Rights review by L&R LARSL171 | L171 | |
| Applicant response receivedL175 | L175 | |
| Request for Applicant Statement Regarding Potential DOE Interest (45-Day Letter) MailedML171 | ML171 | |
| Referred by L&R for Third-Level Security Review. Agency Referral Letter GeneratedL196 | L196 | |
| Referred to Level 2 (LARS) by OIPE CSRL198 | L198 | |
| IFW Scan & PACR Auto Security ReviewSCAN | SCAN | |
| Reference capture on IDSRCAP | RCAP | |
| Initial Exam Team nnIEXX | IEXX |
9 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Lapsed due to failure to pay maintenance feeLapsedFP | FP | |
| Information on status: patent discontinuationPATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362STCH | STCH | |
| Information on status: patent discontinuationPATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362STCH | STCH | |
| Lapse for failure to pay maintenance feesLapsedLAPS | LAPS | |
| Maintenance fee reminder mailedREMI | REMI | |
| Fee paymentFPAY | FPAY | |
| Fee payment procedurePAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: SMALL ENTITYFEPP | FEPP | |
| Certificate of correctionCC | CC | |
| AssignmentAS | AS |
Numbers
- Application
- 44877203
Titles
- English
- Grinding wheel system
Patent term adjustment
- A delay
- +224 daysthe office missed an examination deadline
- Applicant delay
- −3 days
- Net adjustment
- 57 days
Classification
- CPC, 9
- G05B19/042
- B24B1/00
- B24B49/00
- B24D5/00
- G05B19/4061
- G05B2219/37027
- G05B2219/37355
- G05B2219/45161
- G05B2219/50347
- IPC, 5
- B24B1 00
- B24B49 00
- B24D5 00
- G05B19 042
- G05B19 4061