US11345993B2

Method for enhancing the adhesion of a layer for the protection of silver against tarnishing on a substrate comprising a silver surface

Summary by NHIP

Protected Silver Surface Method

The method deposits a silver-copper alloy on an initial silver surface, then applies one or two metal oxide or nitride layers. The alloy contains 0.1 wt % to 10 wt % copper, while the protective layers range from 1 nm to 200 nm in thickness.

Claim Score by NHIP

Read claim 1, the broadest

Abstract

A method is described for protecting a silver surface against tarnishing. This involves depositing a layer of a silver-copper alloy on a substrate, which may be a silver substrate. The alloy comprises between 0.1 wt % and 10 wt % of copper relative to the total weight of the alloy. At least one layer of a metal oxide or a nitride having a thickness in a range of 1 nm to 200 nm is deposited on the alloy to protect against tarnishing. The presence of copper in the silver-copper alloy enhances the alloy's adhesion without altering the silver color.

US11345993B2, drawing sheet 1
Sheet 1 of 1

Term

13.2 yearsleft in the term

Expires 14 December 2039, including 89 days of term adjustment.

  1. Priority
  2. Filed
  3. Granted
  4. Today
  5. Expires

28 claims: 1 independent, 27 dependent

  1. 1
    Broadest claimClaim Score 50, average(NHIP)A method for making a final silver surface that is protected against tarnishing, the method comprising:depositing a layer comprising a silver-copper alloy on an initial silver surface, obtaining the final silver surface;and depositing a first layer of a metal oxide or a nitride and optionally a second layer of a metal oxide or a nitride different than the first layer on at least one part of the final silver surface to protect the final silver surface against tarnishing, wherein the initial silver surface is formed by depositing an intermediate layer of silver on a non-silver substrate, wherein the intermediate layer of silver has a thickness in the range of 200 nm to 3,000 nm, wherein the silver-copper alloy comprises between 0.1 wt % and 10 wt % copper relative to the total weight of the alloy, wherein the first layer has a thickness in the range of 1 nm to 200 nm, and wherein the second layer, if present, has a thickness in the range of 1 nm to 200 nm.