Physical quantity sensor, method for manufacturing physical quantity sensor, physical quantity sensor device, electronic apparatus, and vehicle

BACKGROUND

1. Technical Field

The present invention relates to a physical quantity sensor, a method for manufacturing the physical quantity sensor, a physical quantity sensor device, an electronic apparatus, and a vehicle.

2. Related Art

A known gyro sensor (angular velocity sensor) configuration is described in JP-T-2002-540406. The gyro sensor described in JP-T-2002-540406 includes a frame that can vibrate in an X-axis direction, a proof mass disposed inside the frame, a single spring structure that links the proof mass and the frame to each other so that the proof mass is displaceable relative to the frame in a Y-axis direction, and a sense electrode disposed so as to face the proof mass.

When angular velocity around a Z axis (axis perpendicular to both X axis and Y axis) acts on the thus configured gyro sensor in a state in which the frame vibrates along with the proof mass in the X-axis direction (the state is hereinafter referred to as a “drive vibration mode”), a Coriolis force displaces the proof mass in the Y-axis direction, and the capacitance between the proof mass and the sense electrode changes.

The angular velocity can therefore be detected based on the change in the capacitance.

In the gyro sensor described in JP-T-2002-540406, if the cross-sectional shape of the spring structure deviates from a rectangular shape, for example, if the spring structure has a parallelogrammatic cross-sectional shape, the frame and the proof mass undesirably vibrate not only in the X-axis direction but also in the Y-axis direction in the drive vibration mode (that is, unnecessary vibration (quadrature) in Y-direction occurs). JP-T-2002-540406 points out that the unnecessary vibration undesirably degrades the angular velocity detection characteristic.

JP-T-2002-540406 proposes to reduce the unnecessary vibration (quadrature) by irradiating a surface of the spring structure with laser light so that the surface undergoes laser ablation (removal) or by depositing a material on the spring structure.

However, the laser ablation performed on a surface of the spring structure or the deposition of a material on the spring structure undesirably reduces the unnecessary vibration (quadrature) by an insufficient amount.

SUMMARY

An advantage of some aspects of the invention is to provide a physical quantity sensor that allows reduction in unnecessary vibration, a method for manufacturing the physical quantity sensor, a physical quantity sensor device, an electronic apparatus, and a vehicle.

The advantage can be achieved by the following configurations.

A physical quantity sensor according to an aspect of the invention includes a driven section and a spring that supports the driven section. The driven section and the spring are arranged in a first direction. The spring includes a plurality of spring structures having a longitudinal direction extending along a second direction perpendicular to the first direction and folding sections that each connect same-one-side ends of adjacent two spring structures of the plurality of spring structures. At least any of the plurality of spring structures includes a thin section thinner than other spring structures along a third direction perpendicular to the first and second directions.

Providing the drive spring with the thin section as described above allows reduction in a third-direction vibration component of the drive spring and reduction in displacement of the driven section in a direction other than the first axial direction.

That is, unnecessary vibration (quadrature) of the driven section can be reduced.

In the physical quantity sensor according to the aspect of the invention, it is preferable that the thin section is provided by forming a recess in the at least any of the spring structures and on one side in the third direction.

The thin section can therefore be readily formed.

In the physical quantity sensor according to the aspect of the invention, it is preferable that the plurality of spring structures each have an elongated cross-sectional shape in a plan view in the second direction, and that long sides of the elongated shape incline with respect to the third direction.

The cross-sectional shape is a shape that tends to be formed due to processing errors, the characteristics of a processing apparatus, and other factors.

Since the drive spring having the cross-sectional shape tends to have a third-direction vibration component, the effect of the aspect of the invention is provided in a more noticeable manner.

In the physical quantity sensor according to the aspect of the invention, it is preferable that the at least any of the spring structures is a spring structure located on a front end side in a direction in which the long sides incline.

The third-direction vibration component of the drive spring can therefore be effectively reduced, whereby the unnecessary vibration (quadrature) of the driven section can be reduced.

In the physical quantity sensor according to the aspect of the invention, it is preferable that at least two of the plurality of spring structures are each provided with the thin section.

The third-direction vibration component of the drive spring can therefore be more effectively reduced.

Further, since the amounts of reduction in the third-direction vibration component of the drive spring per unit length of the thin section differ from one another among the plurality of spring structures, separately providing the plurality of spring structures with the thin sections allows coarse and fine adjustments of the third-direction vibration component of the drive spring.

The third-direction vibration component of the drive spring can therefore be reduced with increased accuracy.

In the physical quantity sensor according to the aspect of the invention, it is preferable that the thin sections provided in the at least two spring structures have the same thickness.

The plurality of thin sections can therefore be formed in the same step.

The number of steps of manufacturing the physical quantity sensor can therefore be reduced.

The physical quantity sensor can therefore be manufactured in a shorter period at lower cost.

In the physical quantity sensor according to the aspect of the invention, it is preferable that a width of each of the spring structures along the first direction is smaller than a distance by which adjacent two of the spring structures are separate from each other.

As a result, spring structures adjacent to each other are sufficiently separate from each other. Therefore, for example, when the thin section is formed in a certain spring structure, the possibility of damage of an adjacent spring structure can be effectively lowered.

A method for manufacturing a physical quantity sensor according to another aspect of the invention includes patterning a substrate by using dry etching to form an element including a driven section, and a spring that supports the driven section. The driven section and the spring arranged in a first direction. The spring includes a plurality of spring structures having a longitudinal direction extending along a second direction perpendicular to the first direction, and folding sections that each connect same-one-side ends of adjacent two spring structures of the plurality of spring structures. The method further includes forming, in at least any of the plurality of spring structures, a thin section thinner than other spring structures along a third direction perpendicular to the first and second directions.

Forming the thin section in the drive spring as described above allows reduction in a third-direction vibration component of the drive spring and reduction in unnecessary vibration (quadrature) of the driven section.

A physical quantity sensor having an excellent physical quantity detection characteristic is therefore provided.

In the method for manufacturing a physical quantity sensor according to the aspect of the invention, it is preferable that the formation of the thin section includes forming the thin section by processing the spring via a mask by using the dry etching.

The thin section can therefore be formed with increased precision.

A physical quantity sensor device according to another aspect of the invention includes the physical quantity sensor according to the aspect of the invention, and a circuit element electrically connected to the physical quantity sensor.

A reliable physical quantity sensor device that can benefit from the effects of the physical quantity sensor described above is therefore provided.

An electronic apparatus according to another aspect of the invention includes the physical quantity sensor according to the aspect of the invention.

A reliable electronic apparatus that can benefit from the effects of the physical quantity sensor described above is therefore provided.

A vehicle according to another aspect of the invention includes the physical quantity sensor according to the aspect of the invention, and an attitude controller that controls an attitude of the vehicle based on a detection signal outputted from the physical quantity sensor.

A reliable vehicle that can benefit from the effects of the physical quantity sensor described above is therefore provided.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention will be described with reference to the accompanying drawings, wherein like numbers reference like elements.

<figref idref="DRAWINGS">FIG. 1</figref> is a plan view showing a physical quantity sensor according to a first embodiment of the invention.

<figref idref="DRAWINGS">FIG. 2</figref> is a cross-sectional view taken along the line A-A in <figref idref="DRAWINGS">FIG. 1</figref>.

<figref idref="DRAWINGS">FIG. 3</figref> is a perspective cross-sectional view of a drive spring.

<figref idref="DRAWINGS">FIG. 4</figref> is a perspective cross-sectional view of another drive spring.

<figref idref="DRAWINGS">FIG. 5</figref> is a perspective view of a drive spring provided in the physical quantity sensor shown in <figref idref="DRAWINGS">FIG. 1</figref>.

<figref idref="DRAWINGS">FIG. 6</figref> is a cross-sectional view taken along the line B-B in <figref idref="DRAWINGS">FIG. 5</figref>.

<figref idref="DRAWINGS">FIG. 7</figref> is a cross-sectional view showing that a plurality of spring structures provided in the drive spring are integrated with one another into a single spring structure.

<figref idref="DRAWINGS">FIG. 8</figref> is a plan view showing a variation of the drive spring shown in <figref idref="DRAWINGS">FIG. 5</figref>.

<figref idref="DRAWINGS">FIG. 9</figref> is a plan view showing another variation of the drive spring shown in <figref idref="DRAWINGS">FIG. 5</figref>.

<figref idref="DRAWINGS">FIG. 10</figref> is a flowchart showing the steps of manufacturing the physical quantity sensor shown in <figref idref="DRAWINGS">FIG. 1</figref>.

<figref idref="DRAWINGS">FIG. 11</figref> is a cross-sectional view for describing the method for manufacturing the physical quantity sensor shown in <figref idref="DRAWINGS">FIG. 1</figref>.

<figref idref="DRAWINGS">FIG. 12</figref> is a cross-sectional view for describing the method for manufacturing the physical quantity sensor shown in <figref idref="DRAWINGS">FIG. 1</figref>.

<figref idref="DRAWINGS">FIG. 13</figref> is a cross-sectional view for describing the method for manufacturing the physical quantity sensor shown in <figref idref="DRAWINGS">FIG. 1</figref>.

<figref idref="DRAWINGS">FIG. 14</figref> is a schematic configuration diagram of an etcher.

<figref idref="DRAWINGS">FIG. 15</figref> is a cross-sectional view for describing the method for manufacturing the physical quantity sensor shown in <figref idref="DRAWINGS">FIG. 1</figref>.

<figref idref="DRAWINGS">FIG. 16</figref> is a cross-sectional view for describing the method for manufacturing the physical quantity sensor shown in <figref idref="DRAWINGS">FIG. 1</figref>.

<figref idref="DRAWINGS">FIG. 17</figref> is a cross-sectional view of a drive spring provided in a physical quantity sensor according to a second embodiment of the invention.

<figref idref="DRAWINGS">FIG. 18</figref> is a plan view showing a physical quantity sensor according to a third embodiment of the invention.

<figref idref="DRAWINGS">FIG. 19</figref> is a cross-sectional view of a drive spring provided in a physical quantity sensor according to a fourth embodiment of the invention.

<figref idref="DRAWINGS">FIG. 20</figref> is a cross-sectional view of a drive spring provided in a physical quantity sensor according to a fifth embodiment of the invention.

<figref idref="DRAWINGS">FIG. 21</figref> is a cross-sectional view of a drive spring provided in a physical quantity sensor according to a sixth embodiment of the invention.

<figref idref="DRAWINGS">FIG. 22</figref> is a cross-sectional view showing a physical quantity sensor device according to a seventh embodiment of the invention.

<figref idref="DRAWINGS">FIG. 23</figref> is a perspective view showing an electronic apparatus according to an eighth embodiment of the invention.

<figref idref="DRAWINGS">FIG. 24</figref> is a perspective view showing an electronic apparatus according to a ninth embodiment of the invention.

<figref idref="DRAWINGS">FIG. 25</figref> is a perspective view showing an electronic apparatus according to a tenth embodiment of the invention.

<figref idref="DRAWINGS">FIG. 26</figref> is a perspective view showing a vehicle according to an eleventh embodiment of the invention.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

A physical quantity sensor, a method for manufacturing the physical quantity sensor, a physical quantity sensor device, an electronic apparatus, and a vehicle according to embodiments of the invention will be described below in detail with reference to the accompanying drawings.

First Embodiment

A physical quantity sensor according to a first embodiment of the invention will be described first.

<figref idref="DRAWINGS">FIG. 1</figref> is a plan view showing the physical quantity sensor according to the first embodiment of the invention. <figref idref="DRAWINGS">FIG. 2</figref> is a cross-sectional view taken along the line A-A in <figref idref="DRAWINGS">FIG. 1</figref>. <figref idref="DRAWINGS">FIGS. 3 and 4</figref> are perspective cross-sectional views of a drive spring. <figref idref="DRAWINGS">FIG. 5</figref> is a perspective view of the drive spring provided in the physical quantity sensor shown in <figref idref="DRAWINGS">FIG. 1</figref>. <figref idref="DRAWINGS">FIG. 6</figref> is a cross-sectional view taken along the line B-B in <figref idref="DRAWINGS">FIG. 5</figref>. <figref idref="DRAWINGS">FIG. 7</figref> is a cross-sectional view showing that a plurality of spring structures that form the drive spring are integrated with one another into a single spring structure. <figref idref="DRAWINGS">FIGS. 8 and 9</figref> are each a plan view showing a variation of the drive spring shown in <figref idref="DRAWINGS">FIG. 5</figref>. <figref idref="DRAWINGS">FIG. 10</figref> is a flowchart showing the steps of manufacturing the physical quantity sensor shown in <figref idref="DRAWINGS">FIG. 1</figref>. <figref idref="DRAWINGS">FIGS. 11 to 13</figref> are cross-sectional views for describing a method for manufacturing the physical quantity sensor shown in <figref idref="DRAWINGS">FIG. 1</figref>. <figref idref="DRAWINGS">FIG. 14</figref> is a schematic configuration diagram of an etcher. <figref idref="DRAWINGS">FIGS. 15 and 16</figref> are cross-sectional views for describing the method for manufacturing the physical quantity sensor shown in <figref idref="DRAWINGS">FIG. 1</figref>.

In the following description, the side toward the reader with respect to the plane of view of <figref idref="DRAWINGS">FIG. 1</figref> and the upper side in <figref idref="DRAWINGS">FIG. 2</figref> is also called “upper,” and the side away from the reader with respect to the plane of view of <figref idref="DRAWINGS">FIG. 1</figref> and the lower side in <figref idref="DRAWINGS">FIG. 2</figref> is also called “lower” for convenience of description. In the drawings, axes X, Y, and Z are shown as three axes perpendicular to one another. In the following description, the direction parallel to the axis X is also called an “X-axis direction,” the direction parallel to the axis Y is also called an “Y-axis direction,” and the direction parallel to the axis Z is also called an “Z-axis direction.” The side facing the front end of the arrow of each of the axes is also called a “positive side,” and the side opposite the positive side is also called a “negative side.”

A physical quantity sensor <b>1</b> shown in <figref idref="DRAWINGS">FIGS. 1</figref> and <b>2</b> is a gyro sensor capable of detecting angular velocity ωy around the axis Y. The physical quantity sensor <b>1</b> includes a substrate <b>2</b>, a lid <b>3</b>, and an element <b>4</b>.

The substrate <b>2</b> is formed as a plate having a rectangular shape in a plan view, as shown in <figref idref="DRAWINGS">FIG. 1</figref>. The substrate <b>2</b> has a recess <b>21</b> that opens toward the upper surface of the substrate <b>2</b>. In the plan view along the Z-axis direction, the recess <b>21</b> is formed so as to be greater than the element <b>4</b> and enclose the element <b>4</b>. The thus configured recess <b>21</b> functions as a clearance for preventing (avoiding) contact between the element <b>4</b> and the substrate <b>2</b>. The element <b>4</b> is bonded to the upper surface of the thus configured substrate <b>2</b>.

The substrate <b>2</b> has grooves <b>22</b>, <b>23</b>, <b>24</b>, <b>25</b>, <b>26</b>, <b>27</b>, and <b>28</b>, which each open toward the upper surface of the substrate <b>2</b>.

The thus configured substrate <b>2</b> can, for example, be a glass substrate made of a glass material containing an alkali metal ion (movable ion, such as Na⁺) (for example, borosilicate glass, such as Pyrex glass (registered trademark)). The substrate <b>2</b> and the element <b>4</b> can therefore be bonded to each other, for example, in an anode bonding process, as will be described later, whereby the substrate <b>2</b> and the element <b>4</b> can be securely bonded to each other. Further, since the substrate <b>2</b> can be a light transmissive substrate, the state of the element <b>4</b> can be visually recognized through the substrate <b>2</b> from the exterior of the physical quantity sensor <b>1</b>.

The substrate <b>2</b> is, however, not particularly limited to the substrate described above and may, for example, be a silicon substrate or a ceramic substrate. In the case where a silicon substrate is used as the substrate <b>2</b>, it is preferable from the viewpoint of preventing short circuit to use a high-resistance silicon substrate or a silicon substrate on which a silicon oxide film (insulative oxide) is formed, for example, in a thermal oxidation process.

Wiring lines <b>72</b>, <b>73</b>, <b>74</b>, <b>75</b>, <b>76</b>, <b>77</b>, and <b>78</b> are provided in the grooves <b>22</b>, <b>23</b>, <b>24</b>, <b>25</b>, <b>26</b>, <b>27</b>, and <b>28</b>, respectively, as shown in <figref idref="DRAWINGS">FIG. 1</figref>. One end of each of the wiring lines <b>72</b>, <b>73</b>, <b>74</b>, <b>75</b>, <b>76</b>, <b>77</b>, and <b>78</b> is exposed at a position outside the lid <b>3</b> and functions as an electrode pad P for electrical connection with an external apparatus.

Four fixed detection electrodes <b>5</b> are provided on the bottom surface of the recess <b>21</b>, and capacitance C is created between each of the fixed detection electrodes <b>5</b> and the element <b>4</b>.

The material of which the wiring lines <b>72</b>, <b>73</b>, <b>74</b>, <b>75</b>, <b>76</b>, <b>77</b>, and <b>78</b> and the fixed detection electrodes <b>5</b> are made is not limited to a specific material and may, for example, be gold (Au), silver (Ag), platinum (Pt), palladium (Pd), iridium (Ir), copper (Cu), aluminum (Al), nickel (Ni), titanium (Ti), tungsten (W), or any other metallic material, an alloy containing any of the metallic materials, or ITO (indium tin Oxide), IZO (indium zinc oxide), ZnO, IGZO, or any other oxide-based transparent electrically conductive material. One of the materials described above or a combination of two or more thereof (laminate having two or more layers, for example) can be used to form the wiring lines and the fixed detection electrodes.

The lid <b>3</b> is formed as a plate having a rectangular shape in the plan view, as shown in <figref idref="DRAWINGS">FIG. 1</figref>. The lid <b>3</b> has a recess <b>31</b> that opens toward the lower surface of the lid <b>3</b> (the surface facing substrate <b>2</b>), as shown in <figref idref="DRAWINGS">FIG. 2</figref>. The thus configured lid <b>3</b> is bonded to the upper surface of the substrate <b>2</b> so that the element <b>4</b> is accommodated in the recess <b>31</b>. The lid <b>3</b> and the substrate <b>2</b> forms an accommodation space S, which is an internal space and accommodates the element <b>4</b>.

The lid <b>3</b> has a communication hole <b>32</b>, which allows the interior and exterior of the accommodation space S to communicate with each other, as shown in <figref idref="DRAWINGS">FIG. 2</figref>. The atmosphere of the accommodation space S can be replaced with a desired atmosphere via the communication hole <b>32</b>. A sealing member <b>33</b> is disposed in the communication hole <b>32</b> and hermetically closes the communication hole <b>32</b>. The pressure in the accommodation space S is preferably lowered (preferably to a pressure lower than or equal to about 10 Pa). As a result, the viscous resistance decreases, whereby the element <b>4</b> is allowed to efficiently vibrate (be driven).

The sealing member <b>33</b> does not necessarily need to be made of a specific material and can be made of any material that can close the communication hole <b>32</b>, for example, an alloy based on gold (Au) and tin (Sn), an alloy based on gold (Au) and germanium (Ge), an alloy based on gold (Au) and aluminum (Al), or any of a variety of other alloys, or a low-melting glass or any other glass material.

The thus configured lid <b>3</b> can, for example, be a silicon substrate. The lid <b>3</b>, however, is not limited to a silicon substrate and may instead be a glass substrate or a ceramic substrate. The method for bonding the substrate <b>2</b> and the lid <b>3</b> to each other is not limited to a specific method and may be selected as desired in accordance with the materials of the substrate <b>2</b> and the lid <b>3</b>. Examples of the bonding method may include anode bonding, activated bonding in which bonding surfaces activated by plasma irradiation are bonded to each other, bonding using glass frit or any other bonding material, and diffusion bonding in which metal films deposited on the upper surface of the substrate <b>2</b> and the lower surface of the lid <b>3</b> are bonded to each other.

In the present embodiment, the substrate <b>2</b> and the lid <b>3</b> are bonded to each other via glass frit <b>39</b> (low-melting glass), which is an example of the bonding material, as shown in <figref idref="DRAWINGS">FIG. 2</figref>. In the state in which the substrate <b>2</b> and the lid <b>3</b> are layered on each other, the interior and exterior of the accommodation space S undesirably communicate with each other via the grooves <b>22</b>, <b>23</b>, <b>24</b>, <b>25</b>, <b>26</b>, <b>27</b>, and <b>28</b>, but use of the glass frit <b>39</b> allows not only the substrate <b>2</b> and the lid <b>3</b> to be bonded to each other but the grooves <b>22</b>, <b>23</b>, <b>24</b>, <b>25</b>, <b>26</b>, <b>27</b>, and <b>28</b> to be closed. The accommodation space S can therefore be more readily hermetically sealed. In the case where the substrate <b>2</b> and the lid <b>3</b> are bonded to each other, for example, in an anode bonding process (bonding method that cannot close grooves <b>22</b>, <b>23</b>, <b>24</b>, <b>25</b>, <b>26</b>, <b>27</b>, and <b>28</b>), the grooves <b>22</b>, <b>23</b>, <b>24</b>, <b>25</b>, <b>26</b>, <b>27</b>, and <b>28</b> can be closed with an SiO₂film formed, for example, by using a TEOS-based (tetraethoxysilane-based) CVD method.

The element <b>4</b> is disposed in the accommodation space S and bonded to the upper surface of the substrate <b>2</b>, as shown in <figref idref="DRAWINGS">FIG. 1</figref>. The element <b>4</b> includes two structures <b>40</b> (<b>40</b><i>a </i>and <b>40</b><i>b</i>) and a linkage spring <b>401</b>, which links the structures <b>40</b><i>a </i>and <b>40</b><i>b </i>to each other. The thus configured element <b>4</b> can be monolithically formed, for example, by using a dry etching method (Bosch method, in particular) for patterning an electrically conductive silicon substrate into which phosphor, boron, or any other impurity is doped.

The two structures <b>40</b><i>a </i>and <b>40</b><i>b </i>are provided side by side in the X-axis direction and are symmetrical with respect to an imaginary straight line α along the axis Y. The linkage spring <b>401</b> is provided between the structures <b>40</b><i>a </i>and <b>40</b><i>b </i>and links driven sections <b>41</b>, which are provided in the structures <b>40</b><i>a </i>and <b>40</b><i>b </i>and will be described later, to each other.

The structures <b>40</b> each include the driven section <b>41</b>, drive springs <b>42</b>, fixers <b>43</b> (anchors), movable drive electrodes <b>44</b>, fixed drive electrode <b>45</b> and <b>46</b>, a detection flap plate <b>47</b>, a spring structure <b>48</b>, and drive monitor electrodes <b>49</b>. The detection flap plate <b>47</b> includes a first flap plate <b>471</b> and a second flap plate <b>472</b>, and the spring structure <b>48</b> includes a first spring structure <b>481</b> and a second spring structure <b>482</b>.

The driven sections <b>41</b> are each a rectangular frame. One-side end (an anchor end) of each of the drive springs <b>42</b> is respectively connected to the four corners of the driven sections <b>41</b>. The drive springs <b>42</b> have elasticity in the X-axis direction and support the driven sections <b>41</b> so that the driven sections <b>41</b> are displaceable in the X-axis direction. The thus configured drive springs <b>42</b> each have a serpentine shape and extend in the X-axis direction while extendedly meandering back and forth in the Y-axis direction. The other-side end (a frame end) of each of the drive springs <b>42</b> is connected to the fixers <b>43</b>, and the fixers <b>43</b> are bonded to the upper surface of the substrate <b>2</b>.

The driven sections <b>41</b> and the drive springs <b>42</b> are therefore supported so as to float above (be spaced apart from) the substrate <b>2</b>. The method for bonding the fixers <b>43</b> to the substrate <b>2</b> is not limited to a specific method and can, for example, be anode bonding. At least one of the plurality of fixers <b>43</b> is electrically connected to the wiring line <b>78</b> via an electrically conductive bump (not shown).

The movable drive electrodes <b>44</b> are provided as part of each of the driven sections <b>41</b> and four of them are formed in total with two on the Y-axis-direction positive side of the driven sections <b>41</b> and two on the Y-axis-direction negative side thereof in the present embodiment. The movable drive electrodes <b>44</b> each have a comb-tooth-like shape having a support extending from the driven section <b>41</b> in the Y-axis direction and a plurality of electrode fingers extending from the support toward opposite sides in the X-axis direction. The arrangement or number of the movable drive electrodes <b>44</b> is not limited to a specific arrangement or a specific number.

The fixed drive electrodes <b>45</b> and <b>46</b> are bonded (fixed) to the substrate <b>2</b>. One movable drive electrode <b>44</b> is located between one set of fixed drive electrodes <b>45</b> and <b>46</b>. The fixed drive electrodes <b>45</b> and <b>46</b> each have a comb-tooth-like shape having a support extending in the Y-axis direction and a plurality of electrode fingers extending from the support toward one side in the X-axis direction (side facing movable drive electrode <b>44</b>).

The fixed drive electrodes <b>45</b> are each electrically connected to the wiring line <b>75</b> via an electrically conductive bump B (see <figref idref="DRAWINGS">FIG. 2</figref>), and the fixed drive electrodes <b>46</b> are each electrically connected to the wiring line <b>74</b> via an electrically conductive bump (not shown).

In the configuration described above, a drive voltage is applied to the space between the movable drive electrodes <b>44</b> and the fixed drive electrodes <b>45</b>, <b>46</b> to alternately create a state in which electrostatic attraction occurs between the movable drive electrodes <b>44</b> and the fixed drive electrodes <b>45</b> and a state in which electrostatic attraction occurs between the movable drive electrodes <b>44</b> and the fixed drive electrodes <b>46</b>, whereby the driven sections <b>41</b> can vibrate in the X-axis direction with the drive springs <b>42</b> expanding and contracting (elastically deforming) in the X-axis direction. In the following description, the vibration mode described above is also referred to as a “drive vibration mode.” The fixed drive electrodes <b>45</b> and <b>46</b> in the structure <b>40</b><i>a </i>and the fixed drive electrodes <b>45</b> and <b>46</b> in the structure <b>40</b><i>b </i>are symmetrically arranged. The two driven sections <b>41</b> therefore vibrate in opposite phases in the X-axis direction so that they approach each other and move away from each other. The vibration of the two driven sections <b>41</b> can therefore be canceled out, whereby leakage of the vibration can be reduced.

The present embodiment employs the method for causing the driven sections <b>41</b> to vibrate in the X-axis direction based on electrostatic attraction (electrostatic drive method), as described above, but the method for causing the driven sections <b>41</b> in the X-axis direction is not particularly limited to the method described above and may instead be a piezoelectric drive method, an electromagnetic drive method using Lorentz force in a magnetic field, or any other method.

The drive monitor electrodes <b>49</b> are each a pair of electrodes, a movable monitor electrode <b>491</b> and a fixed monitor electrode <b>492</b>, between which capacitance is created. The movable monitor electrodes <b>491</b> are provided as part of each of the driven sections <b>41</b> and four of them are formed in total with two on the X-axis-direction positive side of the driven section <b>41</b> and two on the X-axis-direction negative side thereof in the present embodiment. The movable monitor electrodes <b>491</b> each have a comb-tooth-like shape having a support extending from the driven section <b>41</b> in the Y-axis direction and a plurality of electrode fingers extending from the support toward one side in the X-axis direction (side facing fixed monitor electrode <b>492</b>). On the other hand, the fixed monitor electrodes <b>492</b> are fixed (bonded) to the substrate <b>2</b> and formed of a plurality of electrodes that face the movable monitor electrodes <b>491</b>. The fixed monitor electrodes <b>492</b> each have a comb-tooth-like shape having a support extending in the Y-axis direction and a plurality of electrode fingers extending from the support toward one side in the X-axis direction (side facing movable monitor electrode <b>491</b>).

Out of the four movable monitor electrodes <b>491</b> provided in the structure <b>40</b><i>a</i>, the two movable monitor electrodes <b>491</b> located on the positive side in the X-axis direction are electrically connected to the wiring line <b>73</b> via electrically conductive bumps (not shown), and the two movable monitor electrodes <b>491</b> located on the negative side in the X-axis direction are electrically connected to the wiring line <b>72</b> via electrically conductive bumps (not shown). Similarly, out of the four movable monitor electrodes <b>491</b> provided in the structure <b>40</b><i>b</i>, the two movable monitor electrodes <b>491</b> located on the negative side in the X-axis direction are electrically connected to the wiring line <b>73</b> via electrically conductive bumps (not shown), and the two movable monitor electrodes <b>491</b> located on the positive side in the X-axis direction are electrically connected to the wiring line <b>72</b> via electrically conductive bumps (not shown).

When the structures <b>40</b> are caused to vibrate in the drive vibration mode, as described above, the displacement of the driven sections <b>41</b> in the X-axis direction changes the gaps between the movable monitor electrodes <b>491</b> and the fixed monitor electrodes <b>492</b>, and the capacitance between the movable monitor electrodes <b>491</b> and the fixed monitor electrodes <b>492</b> changes accordingly. The state of the vibration of the driven sections <b>41</b> can therefore monitored based on the change in the capacitance.

The first and second flap plates <b>471</b>, <b>472</b> are located inside each of the driven sections <b>41</b> and arranged side by side in the Y-axis direction. The first and second flap plates <b>471</b>, <b>472</b> each have a rectangular-plate-like shape. The first flap plate <b>471</b> is linked to the driven section <b>41</b> via the first spring structure <b>481</b>, and the second flap plate <b>472</b> is linked to the driven section <b>41</b> via the second spring structure <b>482</b>. When the angular velocity ωy around the axis Y acts on the physical quantity sensor <b>1</b> in the state in which the driven sections <b>41</b> are driven in the drive vibration mode, the first and second flap plates <b>471</b>, <b>472</b> pivot (are displaced) around pivotal axes J<b>1</b> and J<b>2</b>, which are formed by the first and second spring structures <b>481</b>, <b>482</b>, with the first and second spring structures <b>481</b>, <b>482</b> twisted (elastically deformed) by a Coriolis force. In the following description, the vibration mode described above is also referred to as a “detection vibration mode.”

The first and second flap plates <b>471</b>, <b>472</b> do not necessarily have specific orientations and may, for example, be disposed so that the free ends thereof face each other or disposed so that the free ends thereof face the same side. One of the first and second flap plates <b>471</b>, <b>472</b> may be omitted.

The fixed detection electrodes <b>5</b> are provided in regions of the substrate <b>2</b> that face the first and second flap plates <b>471</b>, <b>472</b> (regions that coincide with first and second flap plates <b>471</b>, <b>472</b> in plan view viewed in Z-axis direction), and capacitance C is created between each of the first flap plates <b>471</b> and the corresponding fixed detection electrode <b>5</b> and between each of the second flap plates <b>472</b> and the corresponding fixed detection electrode <b>5</b>, as shown in <figref idref="DRAWINGS">FIG. 2</figref>.

The two fixed detection electrodes <b>5</b> that face the structure <b>40</b><i>a </i>are electrically connected to the wiring line <b>77</b>, and the two fixed detection electrodes <b>5</b> that face the structure <b>40</b><i>b </i>are electrically connected to the wiring line <b>76</b>, as shown in <figref idref="DRAWINGS">FIG. 1</figref>.

The action of the physical quantity sensor <b>1</b> will be described next. A drive voltage is first applied to the space between the movable drive electrodes <b>44</b> and the fixed drive electrodes <b>45</b>, <b>46</b> to cause the driven sections <b>41</b> to vibrate in the drive vibration mode. In this state, when the angular velocity ωy acts on the physical quantity sensor <b>1</b>, a Coriolis force acts on the physical quantity sensor <b>1</b> so that the detection vibration mode is activated, and the first and second flap plates <b>471</b>, <b>472</b> pivot around the pivotal axes J<b>1</b> and J<b>2</b>. The gaps between the first and second flap plates <b>471</b>, <b>472</b> and the fixed detection electrodes <b>5</b> therefore change, and the capacitance C changes accordingly. The angular velocity ωy can therefore be determined by detection of the amount of change in the capacitance C (difference signal).

In the drive vibration mode, ideally, it is preferable that the driven sections <b>41</b> translate in the X-axis direction. That is, in the drive vibration mode, it is preferable that the driven sections <b>41</b> are not displaced in the Z-axis direction. The reason for this is that displacement of the driven sections <b>41</b> in the Z-axis direction not only changes the gaps between the first and second flap plates <b>471</b>, <b>472</b> and the fixed detection electrodes <b>5</b> but causes the first and second flap plates <b>471</b>, <b>472</b> to pivot around the pivotal axes J<b>1</b> and J<b>2</b> in response to the displacement of the driven sections <b>41</b> in the Z-axis direction, so that the capacitance C undesirably changes although no angular velocity ωy acts on the physical quantity sensor <b>1</b>. A quadrature signal (noise) is therefore created and degrades the accuracy in the detection of the angular velocity ωy. In the following description, vibration of the driven sections <b>41</b> in directions other than the X-axis direction (vibration in Z-axis direction, in particular) in the drive vibration mode is also referred to as quadrature.

To suppress the quadrature, it is preferable to design the drive springs <b>42</b> to not have a vibration component in the Z-axis direction. Specifically, for example, it is preferable to design the drive springs <b>42</b> to have a rectangular lateral cross-sectional shape (oblong lateral cross-sectional shape elongated in Z-axis direction, in particular). In this case, the drive springs <b>42</b> have substantially no vibration component in the Z-axis direction, and the vibration direction F is parallel to the axis X, whereby the quadrature can be suppressed. However, the shape of the element <b>4</b> deviates in some cases from the rectangular shape due to processing errors, the characteristics of a processing apparatus, and other factors, so that the drive springs <b>42</b> have, for example, a parallelogrammatic lateral cross-sectional shape inclining with respect to the rectangular shape, as shown in <figref idref="DRAWINGS">FIG. 4</figref>. When the lateral cross-sectional shape of the drive springs <b>42</b> deviates from the rectangular shape (asymmetric with respect to axis Z), as described above, the drive springs <b>42</b> undesirably have a vibration component in the Z-axis direction as well as the vibration component in the X-axis direction, so that the vibration direction F′ inclines with respect to the axis X and the quadrature is likely to occur.

The problem described above is solved in the physical quantity sensor <b>1</b> according to the present embodiment by skillfully shaping the drive springs <b>42</b> so that the quadrature in the drive vibration mode is suppressed. The drive springs <b>42</b> will be described below in detail. In the present embodiment, in which the plurality of drive springs <b>42</b> have the same configuration, one of the drive springs <b>42</b> (drive spring <b>42</b>′ in <figref idref="DRAWINGS">FIG. 1</figref>) will be representatively described, and the other drive springs <b>42</b> will not be described.

The drive springs <b>42</b> each have a serpentine shape and meander in the X-axis direction (direction perpendicular to detection axis) side by side while extending or projecting back and forth in the Y-axis direction (direction of detection axis), as shown in <figref idref="DRAWINGS">FIG. 5</figref>. The drive springs <b>42</b> therefore each have four (multiple) span spring structures <b>421</b> extending in the Y-axis direction and intermittently arranged along the X-axis direction, a connector structure <b>422</b> that connects a spring structure <b>421</b>A to a spring structure <b>421</b>B, a connector structure <b>422</b> that connects the spring structure <b>421</b>B to a spring structure <b>421</b>C, and a connector structure <b>422</b> that connects the spring structure <b>421</b>C to a spring structure <b>421</b>D.

The connector structures <b>422</b>, which each serve as a folding section (a return), thus connect the same-one-side ends of adjacent spring structures <b>421</b> to each other. Each pair of spring structures <b>421</b>A-D interconnected by a connector structure <b>422</b> forms one meander of the drive spring <b>42</b>.

The spring structures <b>421</b> viewed in the Y-axis direction each have an elongated, roughly parallelogrammatic lateral cross-sectional shape, and the major axis L of the lateral cross-sectional shape inclines with respect to the axis Z, as shown in <figref idref="DRAWINGS">FIG. 6</figref>. The spring structures <b>421</b> incline toward the same side in the X-axis direction. The number of spring structures <b>421</b> is not limited to four and only needs to be at least two. The spring structures <b>421</b> may each have, for example, a roughly parallelogrammatic lateral cross-sectional shape already in the design stage or may have a rectangular lateral cross-sectional shape in the design stage but change, for example, to a roughly parallelogrammatic or trapezoidal shape, a barrel-like shape having a width between the side surfaces greater than the lengths of the upper and lower surfaces, or a pincushion-like shape having a width between the side surfaces smaller than the lengths of the upper and lower surfaces due, for example, to processing errors and the characteristics of a processing apparatus described above.

At least one of the four spring structures <b>421</b>, the spring structures <b>421</b>A and <b>421</b>B in the present embodiment, is provided with a thin section <b>429</b> (is recessed), which has a thickness T (length in Z-axis direction, or height) smaller than that of the other spring structures <b>421</b>. The thin section <b>429</b> is formed by providing the upper surface (principal surface opposite substrate <b>2</b>) of the spring structure <b>421</b> with a recess <b>428</b> (cutout). Providing part of the four spring structures <b>421</b> with the thin section <b>429</b> allows reduction in the Z-axis-direction vibration component of the drive spring <b>42</b>. The quadrature can be reduced as compared with a configuration in which no thin section <b>429</b> is provided.

Specifically, providing at least one of the spring structures <b>421</b>A and <b>421</b>B, which are located on the front end side (front end side beyond center) (anchor end) in the inclining direction of the major axis L (positive side in X-axis direction), with the thin section <b>429</b> allows reduction in the Z-axis-direction vibration component of the drive spring <b>42</b>. Conversely, providing at least one of the spring structures <b>421</b>C and <b>421</b>D, which are located on the base end side (base end side beyond center) (frame end) in the inclining direction of the major axis L, with the thin section <b>429</b> allows increase in the Z-axis-direction vibration component of the drive spring <b>42</b>. The phrase “the inclining direction of the major axis L” means in the present embodiment the direction in which the upper end of the major axis L shifts from the lower end thereof in <figref idref="DRAWINGS">FIGS. 5 and 6</figref>, that is, the X-axis direction. Further, the phrase “the front end side in the inclining direction of the major axis L” means in the present embodiment the left side (positive side in X-axis direction) in <figref idref="DRAWINGS">FIGS. 5 and 6</figref>, and the phrase “the base end side in the inclining direction of the major axis L” means in the present embodiment the right side (negative side in X-axis direction) in <figref idref="DRAWINGS">FIGS. 5 and 6</figref> (the same holds true in the following description).

The reason why the Z-axis-direction vibration component of the drive spring <b>42</b> can be reduced and increased is believed to be the same reason why, considering the four spring structures <b>421</b> to be a unitary spring structure as shown in <figref idref="DRAWINGS">FIG. 7</figref>, removing an acute-angle portion out of the corners of the parallelogram allows reduction in the Z-axis-direction vibration component of the drive spring <b>42</b>, whereas removing an obtuse-angle portion out of the corners of the parallelogram allows increase in the Z-axis-direction vibration component of the drive spring <b>42</b>.

In view of the discussion described above, in the present embodiment, the spring structures <b>421</b>A and <b>421</b>B, which are located on the front end side in the inclining direction of the major axis L (positive side in X-axis direction), are each provided with the thin section <b>429</b> for reduction in the Z-axis-direction vibration component of the drive spring <b>42</b> and hence in the quadrature. The arrangement of the thin sections <b>429</b> is not particularly limited to the arrangement described above as long as the Z-axis-direction vibration component of the drive spring <b>42</b> can be reduced. For example, only the spring structure <b>421</b>A or the spring structure <b>421</b>B may be provided with the thin section <b>429</b>.

As described above, the arrangement of the thin section <b>429</b> is not limited to a specific arrangement as long as the Z-axis-direction vibration component of the drive spring <b>42</b> can be reduced, but it is preferable that at least the spring structure <b>421</b>A, which is located on the forefront end side in the inclining direction of the major axis L (positive side in X-axis direction), is provided with the thin section <b>429</b>. The reason for this is that a greater amount of reduction in the Z-axis-direction vibration component of the drive spring <b>42</b> is achieved by providing a spring structure <b>421</b> closer to the front end side in the inclining direction of the major axis L with the thin section <b>429</b>. That is, providing the spring structure <b>421</b>A with the thin section <b>429</b> allows a greater amount of reduction in the Z-axis-direction vibration component than providing the spring structure <b>421</b>B with the thin section <b>429</b>. Providing the spring structure <b>421</b>A, which is located on the forefront end side with the thin section <b>429</b>, therefore allows effective reduction in the Z-axis-direction vibration component of the drive spring <b>42</b>.

In the present embodiment, the thin section <b>429</b> provided in the spring structure <b>421</b>A is provided over roughly the entire region where the spring structure <b>421</b>A extends, but the region where the thin section <b>429</b> is formed is not particularly limited to the region described above. For example, part of the region in the direction in which the spring structure <b>421</b>A extends may be provided with the thin section <b>429</b>, as shown in <figref idref="DRAWINGS">FIG. 8</figref>, or the spring structure <b>421</b>A may be intermittently provided with a plurality of thin sections <b>429</b>, as shown in <figref idref="DRAWINGS">FIG. 9</figref>. Although not shown, the same holds true for the case where the spring structure <b>421</b>B is provided with the thin section <b>429</b>. Since the longer the region where the thin section <b>429</b> is formed (length in Y-axis direction), the greater the reduction in the Z-axis-direction vibration component of the drive spring <b>42</b>, the region where the thin section <b>429</b> is formed may be adjusted in accordance with the magnitude of the Z-axis-direction vibration component of the drive spring <b>42</b>.

In the present embodiment, the spring structure <b>421</b>B, which is located in a position adjacent to the spring structure <b>421</b>A (adjacent on negative side in X-axis direction), is also provided with the thin section <b>429</b>, as described above. The following effects can therefore be provided. As a first effect, the Z-axis-direction vibration component of the drive spring <b>42</b> can be further reduced. For example, in a case where forming the thin section <b>429</b> over the entire region of the spring structure <b>421</b>A does not allow sufficient reduction in the Z-axis-direction vibration component of the drive spring <b>42</b>, providing the spring structure <b>421</b>B adjacent to the spring structure <b>421</b>A with the thin section <b>429</b> allows further reduction in (preferably allows elimination of) the Z-axis-direction vibration component of the drive spring <b>42</b>.

As a second effect, fine adjustment of the Z-axis-direction vibration component of the drive spring <b>42</b> can be performed. A greater amount of reduction in the Z-axis-direction vibration component of the drive spring <b>42</b> is achieved by providing a spring structure <b>421</b> located in a position closer to the front end side in the inclining direction of the major axis L with the thin section <b>429</b>, as described above. In view of the fact described above, providing the spring structure <b>421</b>A with the thin section <b>429</b> allows coarse adjustment of the Z-axis-direction vibration component, and providing the spring structure <b>421</b>B with the thin section <b>429</b> allows fine adjustment of the Z-axis-direction vibration component. As a result, the Z-axis-direction vibration component of the drive spring <b>42</b> can be reduced with further accuracy.

In the case where the drive spring <b>42</b> is provided with a plurality of thin sections <b>429</b>, as in the present embodiment, it is preferable that the thin sections <b>429</b> have the same thickness T (or depth of recess <b>428</b>). In this case, the plurality of thin sections <b>429</b> can be formed in the same step, as will be described later in the paragraph for a method for manufacturing the physical quantity sensor <b>1</b>, whereby the number of steps of manufacturing the physical quantity sensor <b>1</b> can be reduced. The physical quantity sensor <b>1</b> can therefore be manufactured in a shorter period at lower cost. The term “the same thickness T” described above is not limited to exactly the same thickness T but includes, for example, a thickness T containing an inevitable manufacture error.

The thickness T of the thin section <b>429</b> is not limited to a specific value but is preferably greater than or equal to 5/10 of the thickness of the other portion of the drive spring <b>42</b> but smaller than or equal to 9/10 thereof. The smaller the thickness T of the thin section <b>429</b>, the greater the amount of reduction in the Z-axis-direction vibration component of the drive spring <b>42</b>, whereby the Z-axis-direction vibration component of the drive spring <b>42</b> can be effectively reduced, and an excessive decrease in the mechanical strength of the thin sections <b>429</b> can be avoided.

The thin section <b>429</b> is preferably provided symmetrically with respect to the center axis L<b>1</b> of the drive spring <b>42</b>. The symmetry of the drive spring <b>42</b> with respect to the center axis L<b>1</b> can therefore be maintained. Occurrence of the vibration component, for example, in the Y-axis direction and an increase thereof can therefore be avoided, whereby the drive spring <b>42</b> can be more smoothly elastically deformed in the X-axis direction.

Further, the width W of each of the spring structures <b>421</b> in the X-axis direction (length in direction perpendicular to direction in which spring structure <b>421</b> extends) is smaller than the distance D by which a pair of adjacent spring structures <b>421</b> are separate from each other, as shown in <figref idref="DRAWINGS">FIG. 5</figref>. As a result, spring structures <b>421</b> adjacent to each other are sufficiently separate from each other. Therefore, for example, when the recess <b>428</b> (thin section <b>429</b>) is formed in a certain spring structure <b>421</b>, the possibility of damage of an adjacent spring structure <b>421</b> can be lowered.

The description has been made with reference to one drive spring <b>42</b> (<b>42</b>′) as a representative of the drive springs <b>42</b>. In the physical quantity sensor according to the present embodiment, eight drive springs <b>42</b> (four in each of structures <b>40</b><i>a </i>and <b>40</b><i>b</i>) are provided. The thin sections <b>429</b> may be formed in the drive springs <b>42</b> so that the Z-axis-direction vibration component is reduced to a sufficiently small value (preferably zero). That is, the shapes of the thin sections <b>429</b> differ from one another among the plurality of drive springs <b>42</b> in some cases or are equal to one another in other cases. Further, the thin section <b>429</b> may not be formed in the drive spring <b>42</b> not having the Z-axis-direction vibration component. Further, for example, in the case of the drive spring <b>42</b> shown in <figref idref="DRAWINGS">FIG. 5</figref>, the connector structure <b>422</b> that connects the spring structures <b>421</b>A and <b>421</b>B, which both have the thin sections <b>429</b>, to each other, may be as thin as the spring structures <b>421</b>A and <b>421</b>B. That is, the thin section <b>429</b> may also be formed in the connector structure <b>422</b> that connects the spring structures <b>421</b>A and <b>421</b>B to each other. Further, the thin section <b>429</b> may be formed in any of the other connector structures <b>422</b>.

The thin sections <b>429</b> formed in a plurality of the drive springs <b>42</b> all preferably have the same thickness T. As a result, the plurality of thin sections <b>429</b> can be formed in the same step, as will be described later in the paragraph for a method for manufacturing the physical quantity sensor <b>1</b>, whereby the number of steps of manufacturing the physical quantity sensor <b>1</b> can be reduced.

The physical quantity sensor <b>1</b> has been described above. The physical quantity sensor <b>1</b> includes the driven sections <b>41</b> and the drive springs <b>42</b>, which support the driven sections <b>41</b> so that the driven sections <b>41</b> are displaceable in the X-axis direction (first direction), and the drive springs <b>42</b> each have a serpentine shape and include the plurality of (span) spring structures <b>421</b>, which extend in the Y-axis direction (second direction) that intersects the X-axis direction. At least one of the plurality of spring structures <b>421</b> (spring structures <b>421</b>A and <b>421</b>B in present embodiment) has the thin section <b>429</b>, which is thinner in the Z-axis direction (third direction that intersects X-axis and Y-axis directions) than the other portions of the drive spring <b>42</b>. Providing the thin section <b>429</b> as described above allows reduction in the Z-axis-direction vibration component and suppression of displacement of each of the driven sections <b>41</b> in a direction other than the X-axis direction. That is, the quadrature of the driven sections <b>41</b> can be suppressed. The physical quantity sensor <b>1</b> therefore has an excellent physical quantity detection characteristic.

The plurality of spring structures <b>421</b> may all be provided with the thin sections <b>429</b>.

The drive springs <b>42</b> each have the recess <b>428</b>, which opens toward the drive spring principal surface on one side in the Z-axis direction (side opposite substrate <b>2</b>), and the portion above which the recess <b>428</b> is formed (portion located below recess <b>428</b>) forms the thin section <b>429</b>, as described above. The thin section <b>429</b> can therefore be readily formed, as will be described later in the description for a method for manufacturing the physical quantity sensor <b>1</b>.

The plurality of spring structures <b>421</b> each have an elongated cross-sectional shape when viewed in the Y-axis direction (second direction) and have a portion where the major axis L of the elongated shape inclines with respect to the Z-axis direction, as described above. The cross-sectional shape is a shape that tends to be formed due to processing errors, the characteristics of a processing apparatus, and other factors. Since the drive spring <b>42</b> having the cross-sectional shape tends to have a Z-axis-direction vibration component, the effect described above is provided in a more noticeable manner.

Out of the plurality of spring structures <b>421</b>, at least the spring structure <b>421</b>A, which is located on the forefront end side in the direction in which the major axis inclines with respect to the Z-axis direction, is provided with the thin section <b>429</b>, as described above. The Z-axis-direction vibration component of the drive spring <b>42</b> can therefore be effectively reduced, whereby the quadrature can be suppressed.

The drive springs <b>42</b> each include a plurality of thin sections <b>429</b>, and the plurality of thin sections <b>429</b> are separately provided in at least two spring structures <b>421</b> (spring structure <b>421</b>A and adjacent spring structure <b>421</b>B in present embodiment), as described above. As a result, in the case where forming the thin section <b>429</b> in the spring structure <b>421</b>A does not allow sufficient reduction in the Z-axis-direction vibration component of the drive spring <b>42</b>, the Z-axis-direction vibration component of the drive spring can be more effectively reduced, as described above. Further, since the amounts of reduction in the Z-axis-direction vibration component of the drive spring <b>42</b> per unit length of the thin section <b>429</b> differ from one another among the plurality of spring structures <b>421</b>, separately providing the plurality of spring structures <b>421</b> with the thin sections <b>429</b> allows coarse and fine adjustments of the Z-axis-direction vibration component of the drive spring <b>42</b>. The Z-axis-direction vibration component of the drive spring <b>42</b> can therefore be reduced with increased accuracy.

The plurality of thin sections <b>429</b> have the same thickness T, as described above. The plurality of thin sections <b>429</b> can therefore be formed in the same step, as will be described later in the description for a method for manufacturing the physical quantity sensor <b>1</b>. The number of steps of manufacturing the physical quantity sensor <b>1</b> can therefore be reduced. The physical quantity sensor <b>1</b> can therefore be manufactured in a shorter period at lower cost.

The width W of each of the spring structures <b>421</b> in the X-axis direction (length in direction perpendicular to direction in which spring structure <b>421</b> extends) is smaller than the distance D by which a pair of adjacent spring structures <b>421</b> are separate from each other, as described above. As a result, spring structures <b>421</b> adjacent to each other are sufficiently separate from each other. Therefore, for example, when the thin section <b>429</b> is formed in a certain spring structure <b>421</b>, the possibility of damage of an adjacent spring structure <b>421</b> can be effectively lowered.

A method for manufacturing the physical quantity sensor <b>1</b> will be described next. The method for manufacturing the physical quantity sensor <b>1</b> includes a substrate preparation step of preparing the substrate <b>2</b>, an element formation step of forming the element <b>4</b> on the substrate <b>2</b>, a thin section formation step of forming the thin section <b>429</b> in each of the drive springs <b>42</b>, a lid bonding section of bonding the lid <b>3</b> to the substrate <b>2</b>, and a dicing step, as shown in <figref idref="DRAWINGS">FIG. 10</figref>.

Substrate Preparation Step

A glass substrate <b>20</b>, which has a plurality of regions S<b>2</b>, which will each form the substrate <b>2</b>, is first prepared, and the recess <b>21</b> and the grooves <b>22</b>, <b>23</b>, <b>24</b>, <b>25</b>, <b>26</b>, <b>27</b>, and <b>28</b> are formed in each of the regions S<b>2</b>, as shown in <figref idref="DRAWINGS">FIG. 11</figref>. The recess <b>21</b> and the grooves <b>22</b>, <b>23</b>, <b>24</b>, <b>25</b>, <b>26</b>, <b>27</b>, and <b>28</b> can be formed, for example, by using a photolithography technique and a wet etching technique. The fixed detection electrodes <b>5</b> are then formed on the bottom surface of the recess <b>21</b>, and the wiring lines <b>72</b>, <b>73</b>, <b>74</b>, <b>75</b>, <b>76</b>, <b>77</b>, and <b>78</b> in the grooves <b>22</b>, <b>23</b>, <b>24</b>, <b>25</b>, <b>26</b>, <b>27</b>, and <b>28</b> and the electrode pads P are formed.

Element Formation Step

A substrate <b>400</b> formed of a silicon substrate is then prepared and bonded onto the substrate <b>2</b> by using an anode bonding method, as shown in <figref idref="DRAWINGS">FIG. 12</figref>. The thickness of the substrate <b>400</b> is then reduced, for example, by using CMP (chemical mechanical polishing) so that the thickness of the substrate <b>400</b> is equal to the thickness of the element <b>4</b>. Phosphor, boron, or any other impurity is then doped into the substrate <b>400</b> to impart electrical conductivity to the substrate <b>400</b>, and the substrate <b>400</b> is then patterned to produce the element <b>4</b>, as shown in <figref idref="DRAWINGS">FIG. 13</figref>. The patterning method is not limited to a specific method, and it is preferable to use a dry Bosch method, which is the combination of an etching process using a reactive plasma gas and a deposition process. A high-aspect-ratio through hole can therefore be formed, whereby the element <b>4</b> can be patterned with increased precision and minuteness.

A dry etcher used to pattern the substrate <b>400</b> will now be briefly described. An etcher <b>900</b> includes a stage electrode <b>910</b> and a counter electrode <b>920</b>, which is provided so as to face the stage electrode <b>910</b>, and the two electrodes are disposed in a chamber <b>930</b>, as shown in <figref idref="DRAWINGS">FIG. 14</figref>. In the thus configured etcher <b>900</b>, a wafer Q (laminate of glass substrate <b>20</b> and substrate <b>400</b>) is placed on the stage electrode <b>910</b>, and an etching gas is caused to flow in the chamber <b>930</b> in a vacuum state to achieve a plasma environment. In this state, a reaction gas G is accelerated between the stage electrode <b>910</b> and the counter electrode <b>920</b> to collide with the wafer Q. The substrate <b>400</b> of the wafer Q can thus be processed. In this process, in a position closer to the outer edge of the wafer Q, the substrate <b>400</b> tends to be more obliquely processed because the reaction gas G radially moves (accelerates) from a central portion of the chamber <b>930</b> due, for example, to the influence of the plasma distribution. Therefore, in an element <b>4</b> located in a position closer to the outer edge of the wafer Q, the drive springs <b>42</b> are obliquely processed, and the inherent Z-axis-direction vibration component therefore tends to increase.

Thin Section Formation Step

The Z-axis-direction vibration component of each of the drive springs <b>42</b> is then detected for each of the elements <b>4</b>. A method for detecting the Z-axis-direction vibration component is not limited to a specific method. For example, the elements <b>4</b> are each driven in the drive vibration mode on the substrate <b>400</b> with inspection probe pins pressed against the electrode pads P, and the Z-axis-direction vibration component of each of the drive springs <b>42</b> can be detected based on a detected signal (change in capacitance C).

In the case of the gyro sensor described in JP-T-2002-540406, JP-T-2002-540406 proposes to reduce a Y-axis-direction vibration, such as that described above, by irradiating a surface of the spring structure is irradiated with laser light so that the surface undergoes laser ablation (removal) or depositing a material on the spring structure.

To irradiate the spring structure with laser light, however, high-precision alignment is necessary, or it is difficult to simultaneously process the spring structure at a plurality of locations with the laser light or deposit the material on the spring structure, undesirably resulting in poor productivity (efficiency).

A drive spring <b>42</b> in which the thin section <b>429</b> (recess <b>428</b>) is formed and the position in which the thin section <b>429</b> (recess <b>428</b>) is formed are then determined based on the result of the detection described above for each of the elements <b>4</b>, and the thin section <b>429</b> (recess <b>428</b>) is formed in the drive spring <b>42</b> according to the result of the determination. A method for forming the thin section <b>429</b> (recess <b>428</b>) is not limited to a specific method, and it is preferable to form the thin section <b>429</b> (recess <b>428</b>), for example, by using dry etching. In dry etching, in which a mask is used, the thin section <b>429</b> can be formed with increased precision and minuteness. In each of the elements <b>4</b>, the distance D by which a pair of adjacent spring structures <b>421</b> are separate from each other is greater than the width W of each of the spring structures <b>421</b>, as described above. A shift of the mask in the X-axis direction can therefore be fully tolerated, whereby the thin section <b>429</b> can be formed with precision in a specified position even when the mask is shifted to some extent.

In the physical quantity sensor <b>1</b>, since the recess <b>428</b> is formed in the upper surface (surface opposite substrate <b>2</b>) of each of the drive springs <b>42</b>, the dry etching described above allows the thin section <b>429</b> to be more readily formed than in other methods.

In the physical quantity sensor <b>1</b>, in particular, the thin sections <b>429</b> all have the same thickness (depth of recess <b>428</b>). The thin sections <b>429</b> can therefore be all formed in the same etching period. The thin sections <b>429</b> can therefore all be formed in the same step, whereby the number of manufacturing steps can be reduced. In other words, in the physical quantity sensor <b>1</b>, since the Z-axis-direction vibration component of each of the drive springs <b>42</b> is reduced by setting the thin sections <b>429</b> at a fixed thickness and adjusting the length thereof, the Z-axis-direction vibration component of the drive spring <b>42</b> can be more reliably reduced in a smaller number of steps than in other methods, as described above.

The thin section formation step described above may be formed of the step of detecting the Z-axis-direction vibration component of the drive spring <b>42</b> and the step of forming the thin section <b>429</b> based on the result of the detection with the two steps repeated multiple times. As a result, the Z-axis-direction vibration component of the drive spring <b>42</b> can be reduced with increased precision.

The method for forming the thin section <b>429</b> is not limited to the dry etching described above and may instead, for example, be a processing method for irradiating a target spring structure <b>421</b> with an IB (ion spring structure) or any other energy line via a mask.

Lid Bonding Step

A substrate <b>30</b> including a plurality of lids <b>3</b> is then prepared, and the substrate <b>30</b> is bonded to the upper surface of the substrate <b>2</b> via the glass frit <b>39</b>, as shown in <figref idref="DRAWINGS">FIG. 15</figref>. The atmosphere of the accommodation space S is replaced with a desired atmosphere, and then the communication hole <b>32</b> is closed with the sealing member <b>33</b>. The accommodation space S is thus sealed.

Dicing Step

A dicing blade or any other tool is then used to cut the resultant structure into individual physical quantity sensors <b>1</b>, as shown in <figref idref="DRAWINGS">FIG. 16</figref>. The physical quantity sensors <b>1</b> are thus provided.

The aforementioned method for manufacturing the physical quantity sensor <b>1</b> includes the element formation step of patterning the substrate <b>400</b> to form the elements <b>4</b>, which each include the driven sections <b>41</b> and the drive springs <b>42</b>, which support the driven sections <b>41</b> so that the driven sections <b>41</b> are displaceable in the X-axis direction (first direction), with the drive springs <b>42</b> each having a serpentine shape and including a plurality of spring structures <b>421</b>, which extend in the Y-axis direction (second direction), which intersects the X-axis direction, and the thin section formation step of forming the thin section <b>429</b> in at least one of the plurality of spring structures <b>421</b> so that the thin section <b>429</b> is thinner in the Z-axis direction (third direction that intersects X-axis and Y-axis directions) than the other spring structures <b>421</b>, as described above. Forming the thin section <b>429</b> in each of the drive springs <b>42</b> as described above allows reduction in the Z-axis-direction vibration component of the drive spring <b>42</b> and hence suppression of the quadrature. A physical quantity sensor <b>1</b> having an excellent physical quantity detection characteristic can therefore be provided.

Further, in the thin section formation step, the thin section <b>429</b> is formed by processing each of the drive springs <b>42</b> via a mask. The thin section <b>429</b> can therefore be formed with increased precision.

Second Embodiment

A physical quantity sensor according to a second embodiment of the invention will be described next.

<figref idref="DRAWINGS">FIG. 17</figref> is a cross-sectional view of a drive spring provided in the physical quantity sensor according to the second embodiment of the invention.

The physical quantity sensor according to the present embodiment is the same as the physical quantity sensor according to the first embodiment described above primarily except that the drive springs <b>42</b> are configured differently.

In the following description, the physical quantity sensor according to the second embodiment will be described primarily on the difference from the first embodiment described above, and the same items will not be described. Further, in <figref idref="DRAWINGS">FIG. 17</figref>, the same configurations as those in the first embodiment described above have the same reference characters.

In the present embodiment, out of the plurality of spring structures <b>421</b>, at least one of the spring structures <b>421</b>C and <b>421</b>D (spring structure <b>421</b>D in present embodiment), which are located on the base end side in the direction in which the major axis L inclines, is also provided with the thin section <b>429</b>. The Z-axis-direction vibration component of the drive spring <b>42</b> can therefore be increased. Therefore, for example, in a case where too a large thin section <b>429</b> has been formed in the spring structures <b>421</b>A and/or <b>421</b>B, the thin section <b>429</b> can be formed in the spring structures <b>421</b>C and/or <b>421</b>D to cancel the excessive amount of the thin section <b>429</b> formed in the spring structures <b>421</b>A and/or <b>421</b>B, whereby the Z-axis-direction vibration component of the drive spring <b>42</b> can be more effectively reduced. In the present embodiment, the thin section <b>429</b> for cancellation is formed in the spring structure <b>421</b>D, but not necessarily, as long as the Z-axis-direction vibration component is increased and may be formed, for example, in the adjacent spring structure <b>421</b>C.

The second embodiment described above can also provide the same effects as those provided by the first embodiment described above.

Third Embodiment

A physical quantity sensor according to a third embodiment of the invention will be described next.

<figref idref="DRAWINGS">FIG. 18</figref> is a plan view showing the physical quantity sensor according to the third embodiment of the invention.

The physical quantity sensor according to the present embodiment is the same as the physical quantity sensor according to the first embodiment described above except that the configuration of the element and the detection axis differ from those in the first embodiment.

In the following description, the physical quantity sensor according to the third embodiment will be described primarily on the differences from the first embodiment described above, and the same items will not be described. Further, in <figref idref="DRAWINGS">FIG. 18</figref>, the same configurations as those in the first embodiment described above have the same reference characters.

The physical quantity sensor <b>1</b> according to the present embodiment is a gyro sensor capable of detecting the angular velocity ωz around the axis Z. The structures <b>40</b> (<b>40</b><i>a </i>and <b>40</b><i>b</i>) each include the driven section <b>41</b>, the drive springs <b>42</b>, the fixers <b>43</b>, the movable drive electrodes <b>44</b>, the fixed drive electrodes <b>45</b> and <b>46</b>, the drive monitor electrodes <b>49</b>, a movable section <b>61</b>, detection springs <b>62</b>, movable detection electrodes <b>63</b>, and fixed detection electrodes <b>64</b>, as shown in <figref idref="DRAWINGS">FIG. 18</figref>. The driven sections <b>41</b>, the drive springs <b>42</b>, the fixers <b>43</b>, the movable drive electrodes <b>44</b>, the fixed drive electrodes <b>45</b> and <b>46</b>, the drive monitor electrodes <b>49</b> are configured in the same manner as in the first embodiment described above, and the movable section <b>61</b>, the detection springs <b>62</b>, the movable detection electrodes <b>63</b>, and the fixed detection electrodes <b>64</b> will therefore be described below.

The movable section <b>61</b> has a frame-like shape and is located inside each of the frame-shaped driven sections <b>41</b>. The detection springs <b>62</b> link the driven section <b>41</b> and the movable section <b>61</b> to each other so that the movable section <b>61</b> is displaceable in the Y-axis direction relative to the driven section <b>41</b>. The detection springs <b>62</b> are formed of four detection springs <b>62</b> provided in the driven section <b>41</b> and connected to the four corners of the driven section <b>61</b>. The detection springs <b>62</b> can therefore support the movable section <b>61</b> in a more stable attitude. Further, the detection springs <b>62</b> have elasticity in the Y-axis direction and support the movable section <b>61</b> so that the movable section <b>61</b> is displaceable in the Y-axis direction. The thus configured detection springs <b>62</b> each have a serpentine shape and extend in the Y-axis direction with protruding back and forth in the X-axis direction. The arrangement or number of the detection springs <b>62</b> is not limited to a specific arrangement or a specific number.

The movable detection electrodes <b>63</b> are provided inside the movable section <b>61</b>. The movable detection electrodes <b>63</b> extend in the X-axis direction, and the opposite ends of each of the movable detection electrodes <b>63</b> are connected to the movable section <b>61</b>.

The fixed detection electrodes <b>64</b> each include a first fixed detection electrode <b>641</b> and a second fixed detection electrode <b>642</b>. The first fixed detection electrodes <b>641</b> and the second fixed detection electrodes <b>642</b> are fixed to the substrate <b>2</b>. Although not shown, the first fixed detection electrodes <b>641</b> are electrically connected to the wiring line <b>76</b>, and the second fixed detection electrodes <b>642</b> are electrically connected to the wiring line <b>77</b>.

The first fixed detection electrodes <b>641</b> in the structure <b>40</b><i>a </i>are disposed on the positive side in the Y-axis direction so as to face the movable detection electrodes <b>63</b>, and the first fixed detection electrodes <b>641</b> in the structure <b>40</b><i>b </i>are disposed on the negative side in the Y-axis direction so as to face the movable detection electrodes <b>63</b>. On the other hand, the second fixed detection electrodes <b>642</b> in the structure <b>40</b><i>a </i>are disposed on the negative side in the Y-axis direction so as to face the movable detection electrodes <b>63</b>, and the second fixed detection electrodes <b>642</b> in the structure <b>40</b><i>b </i>are disposed on the positive side in the Y-axis direction so as to face the movable detection electrodes <b>63</b>. Capacitance is created between the movable detection electrodes <b>63</b> and the first fixed detection electrodes <b>641</b> and between the movable detection electrodes <b>63</b> and the second fixed detection electrodes <b>642</b>.

The thus configured physical quantity sensor <b>1</b> is an angular velocity sensor capable of detecting the angular velocity ωz around the axis Z. Specifically, when the angular velocity ωz acts on the physical quantity sensor <b>1</b> during the vibration of the driven sections <b>41</b> in the drive vibration mode, a Coriolis force acts on the physical quantity sensor <b>1</b> and causes the movable sections <b>61</b> to vibrate in the Y-axis direction relative to the driven sections <b>41</b> (detection vibration mode). As a result, the gaps between the movable detection electrodes <b>63</b> and the first fixed detection electrodes <b>641</b> change, so that the capacitance between the movable detection electrodes <b>63</b> and the first fixed detection electrodes <b>641</b> changes, and the gaps between the movable detection electrodes <b>63</b> and the second fixed detection electrodes <b>642</b> change, so that the capacitance between the movable detection electrodes <b>63</b> and the second fixed detection electrodes <b>642</b> changes. The angular velocity ωz can therefore be determined by detection of the amount of change in the capacitance.

In the present embodiment, in the detection vibration mode, ideally, it is preferable that the movable sections <b>61</b> translate in the Y-axis direction. That is, in the detection vibration mode, it is preferable that the movable sections <b>61</b> are not displaced in the Z-axis direction. The reason for this is that when the movable sections <b>61</b> are displaced in the Z-axis direction, the area over which the movable detection electrodes <b>63</b> face the first and second fixed detection electrodes <b>641</b>, <b>642</b> changes, and the capacitance between the movable detection electrodes <b>63</b> and the first and second fixed detection electrodes <b>641</b>, <b>642</b> undesirably changes accordingly. As a result, only a change in the capacitance based on a change in the gaps between the movable detection electrodes <b>63</b> and the first and second fixed detection electrodes <b>641</b>, <b>642</b> (change in capacitance corresponding to angular velocity ωz) cannot be detected, and the accuracy in the detection of the angular velocity ωz could therefore decrease. To avoid the problem, the thin section may also be formed in each of the detection springs <b>62</b> to reduce the Z-axis-direction vibration component, as in the case of the drive springs <b>42</b> described above. The angular velocity ωz can thus be detected with increased accuracy.

The third embodiment described above can also provide the same effects as those provided by the first embodiment described above.

Fourth Embodiment

A physical quantity sensor according to a fourth embodiment of the invention will be described next.

<figref idref="DRAWINGS">FIG. 19</figref> is a cross-sectional view of a drive spring provided in the physical quantity sensor according to the fourth embodiment of the invention.

The physical quantity sensor according to the present embodiment is the same as the physical quantity sensor according to the first embodiment described above except that the element (drive springs, in particular) is configured differently.

In the following description, the physical quantity sensor according to the fourth embodiment will be described primarily on the difference from the first embodiment described above, and the same items will not be described. Further, in <figref idref="DRAWINGS">FIG. 19</figref>, the same configurations as those in the first embodiment described above have the same reference characters.

In each of the drive springs <b>42</b> in the present embodiment, out of the four spring structures <b>421</b>, the spring structures <b>421</b>C and <b>421</b>D are each provided with the thin section <b>429</b> having a thickness T (length in Z-axis direction, or height (even though from top down in this instance)) smaller than that of the other spring structures, as shown in <figref idref="DRAWINGS">FIG. 19</figref>. The thin section <b>429</b> is formed by providing the lower surface of the spring structure <b>421</b> (principal surface facing substrate <b>2</b>) with the recess <b>428</b> (cutout). Providing part of the four spring structures <b>421</b> with the thin section <b>429</b> as described above allows reduction in the Z-axis-direction vibration component of the drive spring <b>42</b>. The quadrature can therefore be reduced as compared with a configuration in which no thin section <b>429</b> is provided. The arrangement of the thin section <b>429</b> is not particularly limited to the arrangement described above as long as the Z-axis-direction vibration component of the drive spring <b>42</b> can be reduced, and only the spring structure <b>421</b>D or <b>421</b>C may be provided with the thin section <b>429</b>.

The arrangement of the thin section <b>429</b> is not limited to a specific arrangement as long as the Z-axis-direction vibration component of the drive spring <b>42</b> can be reduced, as described above, but it is preferable that the spring structure <b>421</b>D, which is located on the forefront end side in the inclining direction of the major axis L, is provided with the thin section <b>429</b>. The reason for this is that a greater amount of reduction in the Z-axis-direction vibration component of the drive spring <b>42</b> is achieved by providing a spring structure <b>421</b> closer to the front end side in the inclining direction of the major axis L with the thin section <b>429</b>. The phrase “the inclining direction of the major axis L” means in the present embodiment the direction in which the upper end of the major axis L shifts from the lower end thereof in <figref idref="DRAWINGS">FIG. 19</figref>, that is, the negative side in the X-axis direction. Further, the phrase “the front end side in the inclining direction of the major axis L” means in the present embodiment the right side (negative side in X-axis direction) in <figref idref="DRAWINGS">FIG. 19</figref>.

The fourth embodiment described above can also provide the same effects as those provided by the first embodiment described above.

Fifth Embodiment

A physical quantity sensor according to a fifth embodiment of the invention will be described next.

<figref idref="DRAWINGS">FIG. 20</figref> is a cross-sectional view of a drive spring provided in the physical quantity sensor according to the fifth embodiment of the invention.

The physical quantity sensor according to the present embodiment is the same as the physical quantity sensor according to the first embodiment described above except that the element (drive springs, in particular) is configured differently.

In the following description, the physical quantity sensor according to the fifth embodiment will be described primarily on the difference from the first embodiment described above, and the same items will not be described. Further, in <figref idref="DRAWINGS">FIG. 20</figref>, the same configurations as those in the first embodiment described above have the same reference characters.

In each of the drive springs <b>42</b> in the present embodiment, the four spring structures <b>421</b> incline so that the upper ends thereof shift from the lower ends thereof toward the negative side in the X-axis direction, as shown in <figref idref="DRAWINGS">FIG. 20</figref>. That is, the inclining direction of the spring structures <b>421</b> is opposite the inclining direction in the first embodiment described above. In the present embodiment, the direction in which the upper end of the major axis L shifts from the lower end thereof, that is, the X-axis direction is also called “the inclining direction of the major axis L,” and the negative side in the X-axis direction is also called “the front end side in the inclining direction of the major axis L.”

Out of the four spring structures <b>421</b>, the spring structures <b>421</b>C and <b>421</b>D, which are located on the front end side in the inclining direction of the major axis L, are each provided with the thin section <b>429</b> having a thickness T (length in Z-axis direction, or height) smaller than that of the other spring structures <b>421</b>. The thin section <b>429</b> is formed by providing the upper surface (principal surface opposite substrate <b>2</b>) of each of the spring structures <b>421</b>C and <b>421</b>D with the recess <b>428</b> (cutout). Providing part of the four spring structures <b>421</b> with the thin section <b>429</b> as described above allows reduction in the Z-axis-direction vibration component of the drive spring <b>42</b>. The quadrature can therefore be reduced as compared with a configuration in which no thin section <b>429</b> is provided. The arrangement of the thin section <b>429</b> is not particularly limited to the arrangement described above as long as the Z-axis-direction vibration component of the drive spring <b>42</b> can be reduced, and only the spring structure <b>421</b>D or <b>421</b>C may be provided with the thin section <b>429</b>.

The fifth embodiment described above can also provide the same effects as those provided by the first embodiment described above.

Sixth Embodiment

A physical quantity sensor according to a sixth embodiment of the invention will be described next.

<figref idref="DRAWINGS">FIG. 21</figref> is a cross-sectional view of a drive spring provided in the physical quantity sensor according to the sixth embodiment of the invention.

The physical quantity sensor according to the present embodiment is the same as the physical quantity sensor according to the first embodiment described above except that the element (drive springs, in particular) is configured differently.

In the following description, the physical quantity sensor according to the sixth embodiment will be described primarily on the difference from the first embodiment described above, and the same items will not be described. Further, in <figref idref="DRAWINGS">FIG. 21</figref>, the same configurations as those in the first embodiment described above have the same reference characters.

In each of the drive springs <b>42</b> in the present embodiment, the four spring structures <b>421</b> incline so that the upper ends thereof shift from the lower ends thereof toward the negative side in the X-axis direction, as shown in <figref idref="DRAWINGS">FIG. 21</figref>. That is, the inclining direction of the spring structures <b>421</b> is opposite the inclining direction in the first embodiment described above. In the present embodiment, the direction in which the upper end of the major axis L shifts from the lower end thereof, that is, the X-axis direction is also called “the inclining direction of the major axis L,” and the positive side in the X-axis direction is also called “the front end side in the inclining direction of the major axis L.”

Out of the four spring structures <b>421</b>, the spring structures <b>421</b>A and <b>421</b>B, which are located on the front end side in the inclining direction of the major axis L, are each provided with the thin section <b>429</b> having a thickness T (length in Z-axis direction, or height (even though from the top down in this instance)) smaller than that of the other spring structures <b>421</b>. The thin section <b>429</b> is formed by providing the lower surface (principal surface facing substrate <b>2</b>) of each of the spring structures <b>421</b>A and <b>421</b>B with the recess <b>428</b> (cutout). Providing part of the four spring structures <b>421</b> with the thin section <b>429</b> as described above allows reduction in the Z-axis-direction vibration component of the drive spring <b>42</b>. The quadrature can therefore be reduced as compared with a configuration in which no thin section <b>429</b> is provided. The arrangement of the thin section <b>429</b> is not particularly limited to the arrangement described above as long as the Z-axis-direction vibration component of the drive spring <b>42</b> can be reduced, and only the spring structure <b>421</b>A or <b>421</b>B may be provided with the thin section <b>429</b>.

The sixth embodiment described above can also provide the same effects as those provided by the first embodiment described above.

Seventh Embodiment

A physical quantity sensor device according to a seventh embodiment of the invention will be described next.

<figref idref="DRAWINGS">FIG. 22</figref> is a cross-sectional view showing the physical quantity sensor device according to the seventh embodiment of the invention.

A physical quantity sensor device <b>1000</b> includes a base substrate <b>1010</b>, a physical quantity sensor <b>1</b> provided on the base substrate <b>1010</b>, a circuit element <b>1020</b> (IC) provided on the physical quantity sensor <b>1</b>, bonding wires BW<b>1</b>, which electrically connect the physical quantity sensor <b>1</b> to the circuit element <b>1020</b>, bonding wires BW<b>2</b>, which electrically connect the base substrate <b>1010</b> to the circuit element <b>1020</b>, and a molding section <b>1030</b>, which molds the physical quantity sensor <b>1</b> and the circuit element <b>1020</b>, as shown in <figref idref="DRAWINGS">FIG. 22</figref>. The physical quantity sensor <b>1</b> can, for example, be any of those according to the first to third embodiments described above.

The base substrate <b>1010</b> is a substrate that supports the physical quantity sensor <b>1</b> and is, for example, an interposer substrate. A plurality of connection terminal <b>1011</b> are arranged on the upper surface of the base substrate <b>1010</b>, and a plurality of implementation terminals <b>1012</b> are arranged on the lower surface of the base substrate <b>1010</b>. Internal wiring lines that are not shown are routed in the base substrate <b>1010</b>, and the connection terminals <b>1011</b> are electrically connected to the corresponding implementation terminals <b>1012</b> via the internal wiring lines. The thus configured base substrate <b>1010</b> is not limited to a specific substrate and can, for example, be a silicon substrate, a ceramic substrate, a resin substrate, a glass substrate, or a glass epoxy substrate.

The physical quantity sensor <b>1</b> is disposed on the base substrate <b>1010</b> with the lower side of the substrate <b>2</b> facing downward (base substrate <b>1010</b>). The physical quantity sensor <b>1</b> is bonded to the base substrate <b>1010</b> via a bonding member.

The circuit element <b>1020</b> is disposed on the physical quantity sensor <b>1</b>. The circuit element <b>1020</b> is bonded to the lid <b>3</b> of the physical quantity sensor <b>1</b> via a bonding member. The circuit element <b>1020</b> is electrically connected to the electrode pads P on the physical quantity sensor <b>1</b> via the bonding wires BW<b>1</b> and electrically connected to the connection terminals <b>1011</b> on the base substrate <b>1010</b> via the bonding wires BW<b>2</b>. The thus configured circuit element <b>1020</b> includes, as required, a drive circuit that drives the physical quantity sensor <b>1</b>, a detection circuit that detects angular velocity based on an output signal from the physical quantity sensor <b>1</b>, an output circuit that converts a signal from the detection circuit into a predetermined signal and outputs the predetermined signal, and other circuits.

The molding section <b>1030</b> molds the physical quantity sensor <b>1</b> and the circuit element <b>1020</b>. The molding section <b>1030</b> can therefore protect the physical quantity sensor <b>1</b> and the circuit element <b>1020</b> from moisture, dust, impact, and other undesirable factors. The molding section <b>1030</b> is not necessarily made of a specific material and can, for example, be made of a thermosetting epoxy resin and can be molded, for example, by using a transfer molding method.

The physical quantity sensor device <b>1000</b> described above includes the physical quantity sensor <b>1</b>. A reliable physical quantity sensor device <b>1000</b> that can benefit from the effects of the physical quantity sensor <b>1</b> can therefore be provided.

The configuration of the physical quantity sensor device <b>1000</b> is not limited to the configuration described above. For example, the physical quantity sensor <b>1</b> may be accommodated in a ceramic package.

Eighth Embodiment

An electronic apparatus according to an eighth embodiment of the invention will be described next.

<figref idref="DRAWINGS">FIG. 23</figref> is a perspective view showing the electronic apparatus according to the eighth embodiment of the invention.

A mobile (or notebook) personal computer <b>1100</b> shown in <figref idref="DRAWINGS">FIG. 23</figref> is an example of an electronic apparatus including the physical quantity sensor according to any of the embodiments of the invention. In <figref idref="DRAWINGS">FIG. 23</figref>, the personal computer <b>1100</b> is formed of a main body <b>1104</b> including a keyboard <b>1102</b> and a display unit <b>1106</b> including a display <b>1108</b>, and the display unit <b>1106</b> is supported by the main body <b>1104</b> via a hinge structure so that the display unit <b>1106</b> is pivotable relative to the main body <b>1104</b>. The thus configured personal computer <b>1100</b> includes a built-in physical quantity sensor <b>1</b> that functions as an angular velocity sensor. The physical quantity sensor <b>1</b> can, for example, be any of those according to the embodiments described above.

The personal computer <b>1100</b> (electronic apparatus) described above includes the physical quantity sensor <b>1</b> and can therefore benefit from the effects of the physical quantity sensor <b>1</b> described above and provide high reliability.

Ninth Embodiment

An electronic apparatus according to a ninth embodiment of the invention will be described next.

<figref idref="DRAWINGS">FIG. 24</figref> is a perspective view showing the electronic apparatus according to the ninth embodiment of the invention.

A mobile phone <b>1200</b> (including PHS) shown in <figref idref="DRAWINGS">FIG. 24</figref> is another example of the electronic apparatus including the physical quantity sensor according to any of the embodiments of the invention. In <figref idref="DRAWINGS">FIG. 24</figref>, the mobile phone <b>1200</b> includes an antenna (not shown), a plurality of operation buttons <b>1202</b>, a voice receiver <b>1204</b>, and a voice transmitter <b>1206</b>, and a display <b>1208</b> is disposed between the operation buttons <b>1202</b> and the voice receiver <b>1204</b>. The thus configured mobile phone <b>1200</b> includes a built-in physical quantity sensor <b>1</b> that functions as an angular velocity sensor. The physical quantity sensor <b>1</b> can, for example, be any of those according to the embodiments described above.

The mobile phone <b>1200</b> (electronic apparatus) described above includes the physical quantity sensor <b>1</b> and can therefore benefit from the effects of the physical quantity sensor <b>1</b> described above and provide high reliability.

Tenth Embodiment

An electronic apparatus according to a tenth embodiment of the invention will be described next.

<figref idref="DRAWINGS">FIG. 25</figref> is a perspective view showing the electronic apparatus according to the tenth embodiment of the invention.

A digital still camera <b>1300</b> shown in <figref idref="DRAWINGS">FIG. 25</figref> is another example of the electronic apparatus including the physical quantity sensor according to any of the embodiments of the invention. In <figref idref="DRAWINGS">FIG. 25</figref>, a display <b>1310</b> is provided on the rear side of a case (body) <b>1302</b> and performs display based on a captured image signal from a CCD. The display <b>1310</b> thus functions as a finder that displays a subject in the form of an electronic image. Further, a light receiving unit <b>1304</b> including an optical lens (imaging system), the CCD, and other components is provided on the front side (rear side in <figref idref="DRAWINGS">FIG. 25</figref>) of the case <b>1302</b>. When a user who uses the camera for photographing checks a subject image displayed in the display <b>1310</b> and presses a shutter button <b>1306</b>, a captured image signal from the CCD at that point of time is transferred to and stored in a memory <b>1308</b>. The thus configured digital still camera <b>1300</b> includes a built-in physical quantity sensor <b>1</b> that functions as an angular velocity sensor. The physical quantity sensor <b>1</b> can, for example, be any of those according to the embodiments described above.

The digital still camera <b>1300</b> (electronic apparatus) described above includes the physical quantity sensor <b>1</b> and can therefore benefit from the effects of the physical quantity sensor <b>1</b> described above and provide high reliability.

The electronic apparatus according to an embodiment of the invention is not limited to the personal computer or the mobile phone shown according to the embodiments described above or the digital still camera according to the present embodiment and can, for example, be a smartphone, a tablet terminal, a timepiece (including smartwatch), an inkjet-type liquid ejection apparatus (inkjet printer, for example), a laptop personal computer, a television receiver, an HMD (head mounted display) and other wearable terminals, a video camcorder, a video tape recorder, a car navigator, a pager, an electronic notebook (including electronic notebook having communication capability), an electronic dictionary, a desktop calculator, an electronic game console, a word processor, a workstation, a TV phone, a security television monitor, electronic binoculars, a POS terminal, a medical apparatus (such as electronic thermometer, blood pressure gauge, blood sugar meter, electrocardiograph, ultrasonic diagnostic apparatus, and electronic endoscope), a fish finder, a variety of measuring apparatus, an apparatus for a mobile terminal/base station, a variety of instruments (such as instruments in vehicles, airplanes, and ships), a flight simulator, and a network server.

Eleventh Embodiment

A vehicle according to an eleventh embodiment of the invention will be described next.

<figref idref="DRAWINGS">FIG. 26</figref> is a perspective view showing the vehicle according to the eleventh embodiment of the invention.

An automobile <b>1500</b> shown in <figref idref="DRAWINGS">FIG. 26</figref> is an automobile that is an example of a vehicle including the physical quantity sensor according to any of the embodiments of the invention. In <figref idref="DRAWINGS">FIG. 26</figref>, the automobile <b>1500</b> has a built-in physical quantity sensor <b>1</b> that functions as an angular velocity sensor, and the physical quantity sensor <b>1</b> can detect the attitude of a vehicle body <b>1501</b>. A detection signal from the physical quantity sensor <b>1</b> is supplied to a vehicle body attitude controller <b>1502</b>, and the vehicle body attitude controller <b>1502</b> can detect the attitude of the vehicle body <b>1501</b> based on the signal, control the degree of hardness of the suspension, and perform braking control on individual wheels <b>1503</b> in accordance with the result of the detection. The physical quantity sensor <b>1</b> can, for example, be any of those according to the first to third embodiments described above.

The automobile <b>1500</b> described above includes the physical quantity sensor <b>1</b> and can therefore benefit from the effects of the physical quantity sensor <b>1</b> described above and provide high reliability.

The physical quantity sensor <b>1</b> can also be widely used, for example, with a car navigation system, a car air conditioner, an anti-lock braking system (ABS), an airbag, a tire pressure monitoring system (TPMS), an engine control system, and an electronic control unit (ECU) that monitors or otherwise observes a battery in a hybrid automobile and an electric automobile.

The vehicle is not limited to the automobile <b>1500</b> and may instead, for example, be an airplane, a rocket, an artificial satellite, a ship, an AGV (automated guided vehicle), a bipedal walking robot, and a drone or any other unmanned airplane.

The physical quantity sensor, the method for manufacturing the physical quantity sensor, the physical quantity sensor device, the electronic apparatus, and the vehicle according to the embodiments of the invention have been described with reference to the drawings, but the invention is not limited thereto, and the configuration of each portion can be replaced with an arbitrary configuration having the same function. Further, any other arbitrary component can be added to the embodiments of the invention. In the embodiments described above, the X-axis direction (first direction) and the Y-axis direction (second direction) are perpendicular to each other, but not necessarily, and only need to intersect each other.

In the invention, the embodiments described above may be combined with each other as desired. For example, the four drive springs <b>42</b> provided in the structure <b>40</b><i>a</i>, out of the structures <b>40</b><i>a </i>and <b>40</b><i>b</i>, may incline so that the upper ends of the spring structures <b>421</b> shift from the lower ends thereof toward the negative side in the X-axis direction as in the fifth and sixth embodiments described above, and the four drive springs <b>42</b> provided in the structure <b>40</b><i>b</i>, out of the structures <b>40</b><i>a </i>and <b>40</b><i>b</i>, may incline so that the upper ends of the spring structures <b>421</b> shift from the lower ends thereof toward the positive side in the X-axis direction as in the first and fourth embodiments described above. Conversely, the four drive springs <b>42</b> provided in the structure <b>40</b><i>a </i>may incline so that the upper ends of the spring structures <b>421</b> shift from the lower ends thereof toward the positive side in the X-axis direction as in the first and fourth embodiments described above, and the four drive springs <b>42</b> provided in the structure <b>40</b><i>b </i>may incline so that the upper ends of the spring structures <b>421</b> shift from the lower ends thereof toward the negative side in the X-axis direction as in the fifth and sixth embodiments described above. That is, the inclination direction of the spring structures <b>421</b> in at least one of the plurality of drive springs <b>42</b> may differ from the inclination direction of the spring structures <b>421</b> in the other drive springs <b>42</b>.

The aforementioned embodiments have been described with reference to the configuration in which the number of elements is one. A plurality of elements may instead be provided. In this case, disposing the plurality of elements so that the detection axes differ from one another allows detection of acceleration in the plurality of axial directions.

The aforementioned first embodiment has been described with reference to the configuration in which the detection flap plates pivot around the pivotal axes. The detection flap plates may be displaced in any manner as long as they are allowed to be displaced in the Z-axis direction. For example, the detection flap plates may seesaw swing around the pivotal axes or may be displaced in the Z-axis direction with the attitude thereof maintained. That is, the physical quantity sensor may be a seesaw-swing-type physical quantity sensor or a parallel-plane-type physical quantity sensor.

The aforementioned embodiments have been described with reference to the configuration in which the physical quantity sensor is an angular velocity sensor that detects angular velocity. The physical quantity detected with the physical quantity sensor is not limited to angular velocity and may, for example, be acceleration or pressure.

The entire disclosure of Japanese Patent Application No. 2017-086119 filed Apr. 25, 2017 is expressly incorporated herein by reference.