Polycrystalline diamond element

The present invention relates to elements of a super-hard polycrystalline material for wear, cutting, drawing and other applications where superhard surfaces are designed. In particular, this invention relates to polycrystalline diamond and elements similar to polycrystalline diamond (which are collectively referred to as PKA elements), with significantly improved wear resistance and methods of their production.

Description of related technology

Polycrystalline diamond and elements similar to polycrystalline diamond are known for the purposes of this disclosure as PKA elements. PKA elements are made of carbon-based materials, with exceptionally short interatomic distances between adjacent atoms. One type of polycrystalline diamond-like material, known as carbonyl nitride (ON), is described in U.S. Patent No. 5,776,615. Another, more commonly used formulation, is described in more detail below. In general, PKA elements are created from a mixture of materials processed at high temperature and high pressure in the polycrystalline matrix of interconnected superhard crystals on the basis of carbon. A common feature of PKA elements is the use of catalyst materials in the process of its formation,

A well-known industrial form of PKA element is a two-layer or multilayer PKA element, the de-outer layer of polycrystalline diamond surface is fully attached to the substrate of less solidmaterial, such as tungsten carbide. The PKA element may be in the form of a round or partially round tablet or may have other forms suitable for applications such as matrix for tube extrusion, heat transfer, slide bearings, valve surface, indenters, tool core, and so on. PKA elements of this type can be used in almost any application, where a solid wear-resistant and erosion-resistant material is required. Lining the PKA element can be made solid to the carrier, often also cemented tungsten carbide. This is the usual configuration for PC elements that are used as cutting elements, for example in fixed cutting tools or shear drill cutters when placed in a nesting drill or when they are attached to a cutter in a metal cutting machine for machining. These elements are commonly referred to as inserts reinforced with polycrystalline diamonds.

Another form of PKA element is a single PKA element without an integral substrate, where a flat surface polycrystalline diamond is attached to the surface of the cutting tool or the surface of the wear by a mechanical method or by means of thermocompression. These PKA elements differ from the ones described above that diamond particles are present throughout the element. These PKA elements can be fixed mechanically in a certain location, they can be inserted inside a larger PKA element having a substrate, or, alternatively, they can be made with a metallic layer that can be associated with processes soldering or soldering. A large number of these PKA elements can be made with a single PKA, as shown, for example, in US Pat. Nos. 4,481,016 and 4,525,179, incorporated herein by reference in their entirety.

PKA elements are most often formed by sintering a diamond powder with a suitable material that catalyzes the binding in a high-pressure press with high pressure. One particular way of forming this polycrystalline diamond is disclosed in US Patent No. 3,141,746, incorporated herein by reference in its entirety. In one common technological process of producing PKAelements, diamond powder is applied to the surface of a pre-pressed liner of carbide-sulfate with the inclusion of cobalt. This set is further exposed to very high temperatures and pressures in the press. During this process, cobalt migrates from the substrate to the diamond layer and acts as a material that catalyzes binding, causing the joining of diamond particles to one another with diamond binding diamond,

The complete PKA element has at least one matrix of diamond crystals bound to each other, with a plurality of interlayer containing material (metal) that catalyzes the binding as described above. Diamond crystals include the first continuous diamond matrix, and the interstitials form a second continuous matrix of interstitial containing material that catalyzes the binding. In addition, there is necessarily a relatively few sites where the growth of diamond to the diamond encapsulates a certain amount of material that catalyzes the binding. These "islets" are not part of the continuous inter-node matrix of material that catalyzes the binding.

In one common form, the diamond element ranges from 85% to 95% by volume, and the material that catalyzes the binding is between 5% and 15%. Such an element can be an object for thermal degradation as a consequence of the thermal expansion between the intercostal cobalt, the material that catalyzes the binding, and the diamond matrix, which begins at temperatures of about 40 ° C. With a sufficient expansion of the connection diamond diamond can be torn, and there may be cracks and chips.

Also, in the polycrystalline diamond, the presence of the material that catalyzes the binding, in the interstitium segments, linked to the diamond crystals of the diamond matrix, leads to another form of thermal disruption. Due to the presence of the material that catalyzes the binding, with increasing temperature, graphite diamond is usually caused, usually limiting the operating temperature to about 750 ° C.

Although cobalt is most often used as the catalyzing material, any element of group VIII, including cobalt, nickel, iron and their alloys, may be used.

To reduce the thermal destruction, the so-called "thermostable" components of the polycrystalline diamond were manufactured as pre-formed PKA elements for cutting and / or wear-resistant elements as disclosed in US Pat. No. 4,224,380, incorporated herein by reference in its entirety. In one type of thermostable PKA element of cobalt or another material that catalyzes the binding, in the usual polycrystalline diamond, is leached from the continuous inter-body matrix after the formation. At that time it can increase the thermostability of the diamond to about 1200 ° C., the leaching process also removes the cemented carbide substrate. In addition, since there is no integral substrate or other surface that has the ability to bind, there are serious difficulties in the layout of such material for use in action.

Manufacturing techniques for this "heat-resistant" PKA element usually create relatively low

density of diamonds, about 80% or less. This low diamond density makes a complete process possible

leaching, but the resultant treated piece is usually relatively weak in impact obliqueness.

In the alternative form of heat-resistant polycrystalline diamond, as a catalytic material, silicon is used. The technological process of manufacturing polycrystalline diamond with silicon as catalytic material is quite similar to that described above, except that intemperatures and synthesis pressures most of the silicon reacts with the formation of silicon carbide, which is not an effective catalytic material. Thermal stability is somewhat improved, but there is still a thermal depletion due to the fact that there remains some residual amount of silicon, usually uniformly distributed in the interstitials of the interstitial matrix. In addition, with this type of PKA element there are mounting problems, because it has no surface capable of connection.

Most recently, a new type of PKA became available, in which carbonates, such as powdery carbonates, Md, Ca, Ca and Ba, were used as a material that catalyzed the binding during the digestion of the diamond powder. PKAs of this type usually have a higher wear resistance and hardness than previous types of PKA elements. However, this material is difficult to produce on an industrial scale, since sintering requires much higher vise than in the case of conventional and thermosetting polycrystalline diamond. One of the results of this is that the size polycrystalline diamonds, manufactured in this way, are smaller than conventional polycrystalline diamond elements. In addition, thermodestruction may still occur, due to the residual quantities of the catalyzed material, which remain in the interstitium vesicles. In addition,

Attempts to combine heat-resistant PKA elements with mounting systems in order to introduce their improved temperature stability, were not as successful as hoped for, due to their low impact penetration viscosity. For example, various methods of attaching various PKA elements are shown in U.S. Patent Nos. 4,726,718, 5,199,832, 5,025,684, 5,238,074, 6,009,963, incorporated herein by reference in its entirety. Although many of these developments were commercially successful, these developments were not particularly successful when combining high wear resistance and / or abrasion resistance with maintaining a toughness level, reaching in non-thermostable PKAs.

Other types of diamonds or diamond-like coatings for surfaces are disclosed in US Pat. Nos. 4,976,324, 5,213,248, 5,337,844, 5,379,853, 5,946,638, 5,523,121,5,624,068, incorporated herein by reference in their entirety. Similar coatings are also disclosed in UK Patent Publication No. 2 268 768, publications RST No. 96/34 131, and publications EPC 500 253, 787 820, 860 515 for highly loaded surfaces of tools. In these publications, diamonds and / or diamond-like coatings are indicated on the surfaces for wear resistance and / or erosion resistance.

In many of the above applications for use of diamond or diamond coatings, gas condensation processes (GFP) and / or chemical deposition from the gas phase (KOHF) are used. Processes of diamond coatings of KGF and KHOG are well known and described, for example, in US Pat. Nos. 5 439 492.4 707 384, 4 645 977, 4 504 519, 4 486 286, incorporated herein by reference.

CGF and / or KHGF processes for coating surfaces with diamond or diamond coatings may be used, for example, to provide a densely packed set of epitaxially oriented diamond crystals or other superhard crystals on the surface. Although these materials have a very high density of diamonds, because they are so tightly packed, there is not a significant amount of diamond diamond ties between adjacent crystals, which makes them rather weak in general, and that break down when applying large sliding loads. The result is that although these coatings have very high diamond densities, they have a tendency toward mechanical weakness, which causes very poor impact and abrasion resistance when used in highly loaded applications such as cutting elements, carrying devices, wearing parts , and matrices.

Some attempts were made to improve the toughness and wear resistance of these diamond or diamond-like coatings by coating on a tungsten carbide substrate and further processing under high pressure high temperatures as described in US Pat. Nos. 5 264 283, 5 496 638, 5 624 068 , included here with the help of the link in its entirety. Although this type of treatment can improve the wear resistance of the diamond layer, a sharp transition between a diamond layer of high density and a substrate makes the diamond ball acceptable to mass cracking near the separation surface at very low mechanical stresses. This translates into very poor strength and toughness during operation.

When PKA elements made of cobalt or other metal of the group VIII -materials that catalyze bonding, used against each other as bearing materials, it was found that the coefficient of wear tended to increase with use. As described in the European Patent Application No. 617207, it has been found that removal (by means of scrubbing with a hydrochloric acid) of a cobalt-rich friction film, which tends to be gradually formed during operation, from the surface of the carrier PKC, contributes to reducing this problem. Presumably, during the operation some of the cobalt from the PKABile surface migrates to the bearing area, causing increased friction, when the two PKAelementy act against each other as bearings (bearings). Now believe

Since cobalt is removed only from the surface of the PKA, there are no effective changes in the temperature at which the thermal deposition of these bearing elements takes place. Hence, the harmful effects of the material that catalyzes binding, and the thermal destruction of the diamond layer due to the presence of catalytic material, is still taking place.

Brief description of the invention

The present invention is a super-hard polycrystalline diamond or diamond-like element with a significant

Improved resistance to thermal decomposition without loss of impact strength. Collectively referred to as PKA elements for the purposes of this description, these elements are formed with a material that catalyzes the binding in the technological process with high temperatures and high pressures. The PKA element has a large number of partially bound diamond or diamond-like crystals that form at least one continuous diamond matrix, and inter-nodule among diamond crystals that form at least one continuous inter-body matrix containing a catalytic material. This element has a working surface and a main portion, wherein the portions of the jaw matrix in the main portion adjacent to the working surface are substantially free from the catalytic material, and the remaining interatomic matrix contains a catalytic material.

The part of the working surface on the main part of the PKA element can be subjected to a final treatment in such a way that the interlayer among superhard crystals is basically free of the catalytic material. The working surface, which is basically free of catalytic material, is not subject to thermal decompression, which encounters in other areas of the working surface, which leads to improved stability beforethermodel. In the cutting elements, the treated working surface may be part of the outer flat surface of the main part, part of the peripheral surface of the main part or parts of all these surfaces.

In yet another embodiment, the catalytic material is cobalt or another metal from the group of iron, and the method of depuration from the catalytic material is its leaching from the interstitial at the surface of the PKA element in the technological process of acid etching. It is contemplated that a method for removing catalytic material from the surface may also be carried out by means of an electrical discharge or other electrical oralvanic process, or by evaporation.

In yet another embodiment, the catalytic material is later removed from the working surface of the PKA element by chemically combining it with another material such that it no longer acts as a catalyst material. In this way, the material may remain in the interstitials of diamond crystals, but this material no longer serves as a catalyst material - an effective removal or reduction of the amount of catalytic material.

In yet another embodiment, the catalytic material is removed, resulting in its transformation into a material, rather than acting as a catalytic material. This can be achieved by changing the crystalline structure, mechanical "treatment", heat treatment or other processing methods. This method can be applied to non-metallic or non-reactive catalytic materials. Again, the material may remain in the interstitials of the middle hard crystals of the material, but this material no longer acts as a catalytic material - an effective removal or reduction of the amount of catalytic material.

Described is an element that includes a large number of partially bound diamond crystals, a catalytic material, an intercellular matrix, and a main part with a working surface. The interstitial matrix in the main part adjacent to the working surface is basically free of catalytic material, and the remaining intruding matrix contains a catalytic material.

Similarly, a PKA element having a catalytic material, an inter-body matrix and a main part with a working surface is disclosed. The interstitial matrix in the main part adjacent to the working surface is basically free of catalytic material, and the remaining interatomic matrix contains a catalytic material.

Also disclosed PKA element, which has a large number of superhard crystals, the catalytic material andbasis part with the working surface. In this element, most of the crystals in the main body, within the limits of at least 0.1 mm depth from the working surface, have a surface that is essentially a free open catalytic material, and the remaining crystals are in contact with the catalytic material.

In addition, the PKA element is disclosed that has a main part with a working surface. The first volume of the main part, remote from the working surface, contains a catalytic material, and the second volume of the main part that adjoins the working surface is basically free of catalytic material.

Also disclosed is an element that has a large number of partially bound diamond crystals, catalyticmaterial, and the main part with the working surface. The volume of the main part adjacent to the working surface has a significantly higher density of diamond than anywhere else in the main part, and this volume is basicallyvolume from the catalytic material.

A PKA element is also disclosed that has a main part with a working surface. The volume of the main part adjacent to the working surface has a diamond density significantly higher than anywhere else in the main part, and this volume is basically free of catalytic material.

In addition, the preformed cutting element is uncovered. This element has an outer flat surface of a super-hard polycrystalline material that has a large number of partially bound super-hard crystals, a large number of interconnected areas among superhard crystals, and a catalytic material. The outer flat surface has a cutting surface and a main part. Intersubsectors, at least part of the cutting surface, are basically free of catalytic material, and internally-located regions that are left contain catalytic material.

PKA elements of the present invention can be used for wear, cutting, drawing and other applications where design diamond surfaces are required. Separate applications are such as cutting elements in the rows of drill bit, both fixed type and shiroshkovogo type, as matrix for pipe pressing, heat transfer, slide bearings, valve surfaces, indenters, the core of tools and so on. The PKA element of the present invention can be used for machine grinding of wood, glandless and non-removable materials, as well as very hard or designed abrasive materials such as masonry and asphalt, and the like.

Brief description of drawings

Figure 1A is a typical PKA element of the present invention.

The EWA figure is a typical PKA of the present invention, shown as a cutting element.

Figure 2 is a side view of a fixed chuck of a bit of rotational drilling using a PKA element

according to the present invention.

Figure 3 is a perspective view of a roller drill bit that utilizes a PKA element of the present invention.

Figure 4 is an insert perspective used in metal cutting machines using the PAO element of the present invention.

Figure 5 is a perspective of a dome-shaped PKA element suitable for use in shaft-bobbin drill bits and in fixed-cutter drill bits.

Figure 6 is a microfilm of the PKA surface of a prototype element that shows the material that catalyzes the binding in the interstitial regions.

Figure 7 is a microphotograph of a PKA element of the present invention, which shows the first part with a catalytic material in the interstitial regions and a second part without a catalytic material in the intermediate regions.

Figure 8 is a microstructural image of a PKA element of a prototype showing linked diamond crystals, with intervex regions and the crystallographic orientation of individual crystals.

Figure 9 is a microstructural image of a PKA element of the present invention, as shown in FIG. 7, indicating the depth of the site free of catalytic material relative to the surface of the PKA element.

Figure 10 is a graph of indicators of relative wear of several embodiments of the PKA element according to the input.

The PA shape is a frontal projection of the encapsulated PKA embodiment of the PKA element of the present invention.

FIG. 11B is a cross-sectional view of another encapsulated PKA embodiment of the PKA element according to the present invention.

Figure 11C is a kind of cross-section of yet another encapsulated PKA embodiment of the PKA element according to the input.

FIG. 12A is a perspective of a surface with the use of a KOHF / KGF for another embodiment of a PKA element of the present invention.

12B is an enlarged perspective of the crystalline structure of the embodiment of the PKA element according to the present invention shown in FIG. 12A.

FIG. 13 is a cross-sectional view of a fillet for drawing a wire having a PKA element of the present invention.

Figure 14 is a perspective of a heat transfer having an PKA element of the present invention.

Figure 15 is a perspective of a bearing having a PKA element of the present invention.

Figures 16A and 16B are frontal projections of connecting valve parts having an PKA element of the present invention.

FIG. 17A is a side view of an indenter having a PKA element of the present invention.

17B is a partially sectional view of a perforator having a PKA element of the present invention.

FIG. 18 is a perspective of a measuring device having a PKA element of the present invention.

A detailed description of the invention and preferred embodiments of the invention

The polycrystalline diamond or diamond-like material (PKA) element 2 of the present invention is shown in FIG. 1A of the PKA element 2 with a large amount of partially bound super-hard diamond or diamond-like crystals 60 (shown in Figures 7 and 9), catalyst material 64, and intercellular matrix 68 formed the intermediate sections 62 of the crystals 60. The element 2 also has one or more working surfaces 4, and diamond crystals 60 and interlayer 62 form the volume of the main part 8 of the PKA element 2.

The working surface 4 is any part of the main part 8 of the PKA element, which can act in contact with the machined object in operation. In this description, when discussing the work surface 4, it should be understood that it relates to any part of the main part 8, which can be exposed and / or used as a working surface. In addition, any part of any working surface 4 is essentially and by itself working surface.

In the process of producing high temperatures and high pressures of the interchannel 62, the crystals 60 are filled with a catalytic material 64 exactly when the bonds between the crystals 60 are formed. In the further stage of production, a certain amount of catalytic material 64 is selectively removed from some intermolecular 62. The result is that the first the volume of the main part 8 of the PKA element 2, remote from the working surface 4, contains a catalytic material 64, and the second volume of the main part 8 adjacent to the expensive surface 4 is basically free of catalysis the material 64. The interstices 62, which are basically free of catalytic material 64, are designated by a numeral 66.

Thus, the interstitial matrix 68 of the main portion 8 adjacent to at least a portion of the working surface 4 is basically free of catalytic material 64, and the internatricular matrix 68, which remains, contains a catalytic material 64. The PKA element 2 can be attached to the substrate 6 from a less solid material, usually cemented with a carbide of a spinfire, but the use of substrate 6 is optional.

Since the bulk of the adjacent to the working surface 4 is basically free of catalytic material 64, the harmful effect of the material 64 that catalyzes the binding substantially decreases, and the thermodestruction of the working surface 4 due to the presence of the catalytic material 64 is effectively extinguished. The result is a new PKA element 2, which has improved thermal properties, which approximate it to the so-called heat-resistant PKA elements, while maintaining strength, ease of use and the ability to bind traditional inserts, reinforced with polycrystalline diamonds. This leads to a higher wear resistance in applications involving cutting, higher heat transfer capacity in applications associated with heat transfer, higher permissible load in applications associated with supports, less surface deformation in applications associated with valves, and has the advantages of other educational applications, including matrices for pressing tubes, indents, core tools and elements of wear. Details of the separate applications of the new PCA element 2 will be discussed more detail further in this description.

Referring now to the microphotogram of the prototype of the PKA element in Figure 6 and also on the microstructure

the image of the PKA of the prototype element in FIG. 8 is well known that the crystallographic orientation of the diamond or diamond crystals 60 is random, as shown by the parallel lines representing the cleavage plane of each crystal 60. As can be seen, adjacent crystals 60 are tied together, with inter-nodes spaced 62 between them. Since the cleavage planes are oriented in different directions on adjacent crystals 60, there is usually no direct trajectory available for a diamond fracture, and the structure allows PAC materials to work well under extreme load conditions, where high shock loads are usual.

In the process of binding the crystals 60 in the press with a high temperature and high pressure, the intervertebral intervals 62 among the crystals 60 are filled with material 64 that catalyzes the binding. This is a catalytic material 64, which makes it possible to form links between adjacent diamond crystals 60 at relatively low pressures and temperatures available in the press.

The PKA prototype of the element has at least one continuous matrix of crystals 60 connected to each other with many intermediate nodes 62 containing the catalyst binding material 64, usually cobalt or another element of group VIII. The crystals 60 include the first continuous diamond matrix, and the interstitials 62 form a second continuous matrix of interstitial 62, known as an interstitial matrix 68, which contains the catalyzing material of the binding. In addition, there are bound to be relatively few sites where the growth of the diamond diamond encapsulates a certain amount of material that catalyzes the binding. These "islets" are not part of the continuous inter-body matrix 68 of the material 64 that catalyzes the binding.

Referring to Figures 7 and 9, is shown a cross-sectional view of the PKA element 2 of the present invention. The FKelement 2 can be created in the same way as the prototype of the PKA elements described above. In a preferred embodiment after the previous cleaning operation, or at any time thereafter, in the manufacturing process, the working surface 4, 70, 72 of the PKA of the element 2 is treated in such a way that it removes part of the catalyzing material from the adjacent main portion. The result is that the interlayer 62 within the diamond crystals 60 adjacent to the working surface is basically free of catalytic materials 64, denoted by the numeral 66. The part of the working surface 4, 70, 72 which is free of catalytic material 64 is not an object thermal deformation, which is encountered in other parts of the PKA, which leads to improved thermal characteristics.

There are many ways to remove or reduce the amount of catalytic material 64 from the interstitial 62. The aqueous process with the catalytic material 64 is cobalt or another material from the iron group, and the method for removing the catalytic material 64 is its leaching from the interstate 62 at the working surface 4, 70, 72PKA of the element 2 in the process of acid etching to a depth greater than about 0.2 mm. It is also possible that the method of removing the catalytic material 64 from the sites at the surface may be carried out using an electric discharge or nshoho electric or galvanic process or withthrough evaporation.

In yet another method for reducing the amount of catalytic material 64 in the interstitials, the catalytic material 64 is removed by its chemical bonding, such as fusion, with anothermaterial, such that it no longer acts as a catalyst material. In this method, the material may remain in the interstitials among the diamond crystals 60, but this material no longer acts as a catalytic material 64-there is effective removal.

In yet another method for reducing the amount of catalytic material 64 in the interstitials 62, the catalytic material 64 is removed, causing it to be converted to a material that no longer acts as a catalytic material. This can be achieved by changing the crystalline structure, mechanical "processing", thermal processing or other processing methods. This method can be applied to non-metallic or non-reactive catalyticmaterials. Again, the material may remain in the interstitials 62 among the diamond crystals, but thismaterial no longer acts as a catalytic material 64 - there is an effective removal of the catalyticmaterial.

As soon as the catalytic material 64 adjoining the working surface 4, 70, 72 has become ineffective, the PKAelement 2 of the present invention is not more susceptible to the type of thermal destruction that occurred in the prototype of the PKA elements. As described previously, there are two types of thermal destruction that are known to have been caused by the catalytic material 64. The first type of thermal decomposition begins at such low temperatures as about 400 ° C, and is due to the difference in thermal expansion between the catalytic material 64 in the interchannel 62 and crystals 60. With sufficient expansion the diamond diamond connection may be torn, and there may be a crack and chip.

The second type of thermal decomposition begins at temperatures of about 750 ° C. This species is due to the catalytic ability of the catalysing binder 64 to interact with the crystals 60 and cause the crystallization 60 to be grafted at a temperature of about 750 ° C. While crystals 60 are graphite, theyare a huge increase in volume, which leads to cracking and communication disturbance in the mainpart 4. Even the thickness of a few microns of catalytic material 64 on the surfaces of diamond crystals 60can launch this kind of thermal decomposition.

Therefore, one skilled in the art would appreciate that the catalytic material 64 should be removed as much as possible from the interstitial 62 among the diamond crystals 60 and from the surfaces of diamond crystals, as well as for the maximum benefit. If the catalyst material 64 is removed both from the surfaces of diamond crystals 60 and from the interstitial62, the initiation of thermal degradation for diamond crystals 60 in this region could approach 1200 ° C.

This double kind of destruction, however, provides some unexpected benefits. For example, in many applications, it is advisable to design the speed of wear on the working surface. In the present invention, this can be achieved by changing the processing process of the process, such that in areas where the maximum resistance is required, the catalytic material is removed both from the interstitial 62 and from the surfaces of the diamond crystals 60. In areas where less wear resistance is desired, for example, in self-closing tools , these areas could be treated in such a way as to remove the catalytic material 64 primarily from the interstitial62, but to allow some, if not all, diamond crystals 60 to remain in contact with the catalytic material th.

It should also be apparent that it is more difficult to remove the catalytic material 64 from the surfaces of the diamond crystals 60 than with the interstitial 62. For this reason, depending on the method by which the catalytic material is removed in order to be effective in reducing thermal degradation, the depth of removal of the catalytic material 64 from the working surface 4 may vary depending on the method used to reduce the amount of catalytic material 64.

In some applications, the improvement of the thermal threshold to a temperature above 400 ° C, but below 750 ° C. is sufficient and, therefore, a less intensive removal process of the catalytic material 64 is allowed. As a consequence, it would be appreciated that there are numerical combinations of methods for removing catalytic material 64 , which could be used to achieve a level of removal of the catalytic material 64 that is required for a separate application.

In this description, when using the term "substantially free" in relation to the catalytic material 64 in the interior voids 62, the interconnected matrix 68, or in the volume of the main portion 8, it should be understood that, if not all, the surfaces of neighboring diamond crystals 60 may still have coating from the catalyticmaterial 64. Similarly, when the term "relatively free" is used in relation to the catalyticmaterial 64 on the surfaces of diamond crystals 60, the catalytic material 64 may still be present in adjacent intervertebrates 62.

With the removal or reduction of the amount of catalytic material 64, two main mechanisms of thermodestruction are no longer present. However, it has been found that the catalyst material 64 has to be removed to a depth sufficient to allow the bound crystals 60 to produce heat produced during the thermal process to reduce the temperature of the destruction of the crystals 60 where catalyst material 64 is present.

In one set of laboratory tests, heat was fed into the PKA element 2, arranged as a cutting element 10. As this test was developed as a standard test for wear for these cutting elements, he provided a correct comparison of the cutting elements 10 with different depths of removal catalytic material 64. These tests drew attention to ensure that the removal process reduces the amount of catalytic material 64 both in the interstitial nodes 62 and on the surfaces of diamond crystals60. This test was designed in such a way that periodic heat supply was applied to the cutting edge of the cutting element 10 over a period of time.

As soon as the test was completed, the wear indicator was calculated. The higher the wear rate, the better the wear resistance. Due to the nature of the test, it is assumed that the increased figure of the ratio of the tile indicates an increased resistance to thermal destruction of the working surface 70, 72 of the cutting element 10.

As can be seen on the curve "A" on the graph of figure 10, there is an impressive increase in the results of the wear rate for the cutting elements 10, when the depth of removal of the catalytic material 64 reaches 0.1 mm. Thus, for the types of heat supply commonly used in the cutting elements 10, the depth of 0.1 m is the critical depth of removal from the working surface 4, 70, 72, when the catalytic material 64 is removed both from the interstitial 62 and from the surfaces of the diamond crystals 60.

In other tests, on the cutting elements 10, made with the help of a more economical process for removing the catalytic material 64, it is believed that wear is approximated with the depth of removal shown on curve B of FIG. 10. The process for removing catalytic material 64 applied to these cutting elements is not was so effective in removing the catalytic material 64 from the surfaces of the diamond crystals 60 as the process of the curve "A". Therefore, only when most of the catalytic material 64 was removed from the interstate 62 to a depth of approximately 0.2 mm, the wear rate improved to such a cover "A".

It is believed that thermal degradation related to wear rates, as shown in the curve "C" of FIG. 10, can be projected in GJA elements 2, where this is useful. For example, it may be desirable that the free cutting elements 10, away from the center of contact, wear out faster than the central point. This could save the curved shape of the cutting element, instead of turning it into a spray surface.

Improved resistance to thermal decomposition improves wear rate, since diamond is an extremely good conductor of heat. If the friction phenomenon on the working surface 4, 70, 72 causes a sudden, extremely high heat supply, the bound diamond crystals can heat in all directions from the heat source. This would allow an extremely high temperature gradient across the material, possibly 1000 ° C, to be created. on mm or higher. The gradient of such a steep rise would make it possible to achieve a temperature of 950 ° with a working surface of 4, 70, 72 and does not cause significant thermal degradation if the intermediate body 62 and the surface of the diamond crystals 60 adjacent to the working surface are basically free of catalytic material 64 at a depth of only 0 , 2mm from the heat source.

It should be obvious that the temperature gradient will vary, depending on the size of the crystal 60 and the number of intercrystal bonds. However, in tests under the conditions of operation of the cutting elements 10 for drill valleys, the removal of substantially all of the catalytic material 64 from the interstate 62 to the distance U from about 0.2 mm to about 0.3 mm from the working surface of 4, 70, 72 caused an impressive improvement in the wear resistance, with a combination of 40% an increase in the mechanical speed of drilling and a 40% improvement in wear resistance. Improvement in wear resistance indicates that wear on friction of diamond crystals 60 resulted in a deterioration caused by catalytic material 64, astonishingly decreased. It is believed that an increase in mechanical speed of drilling is due to the possibility of a cutter longer to remain "sharper" due to increased wear resistance.

There are other possible designs of PKA elements that are useful in reducing the amount or removal of catalytic material 64 as described above. As shown in FIGS. 11A, 11B and 11C, another embodiment of the present invention is the PCA element 102 of the element 102. The PCA element 102 has a main portion 108 with a material of the VIII group that catalyzes the binding with a second preformed PCA of the software element embedded inside it. The inserted PKA element of the software may be aligned with the working surface 104 of the capsular PKA of the element 120, as shown in the figure of the PA, or it can be completely embedded inside

encapsulated PCA element 120 as shown in FIG. 11B. This inserted PKA element of the PO is made in a process using powdered carbonates Md, Ca, Zg and Ba as a catalysing bonding material and is made into a complex PKA element as described in the usual manner for one of the US patent applications of the same applicant (that is simultaneously being examined by the Patent Office), registration number 09/390 074, which is incorporated herein by reference.

In this embodiment, since the pre-formed PKA element is formed at a higher pressure, the density of the diamond may be higher than its density in the encapsulated PKA element 120. In this design, since the inserted PKA element of the software has a catalytic material with a higher temperature activation, may be useful. , for example, a decrease in the amount of catalytic material only on the working surface of the encapsulated PKA element 120. In addition, the inserted PKA element of the software can be placed in the set position inside the encapsulated PKA element 120 to take advantage of the higher shock impact viscosity of the inserted PKA element of the software, combined with improved wear resistance of the encapsulated element 120.

As shown in FIGS. 9, PA, 11B and PS, element 102 has a large number of partially bound diamond crystals 60, catalytic material 64, and a main portion 108 with a working surface 104. The volume 112 of the main part adjacent to the working surface 104 has a substantially higher diamond density than anywhere else in the main part 108, and this volume 112 is basically free of catalytic material b4.

Several inserted PKA elements 110 may be arranged in a composite element 100 as shown in Figure 11C in a manner in which the best of both the impact strength and the improved resistance to wear can be achieved.

It may be desirable to remove the catalytic material in the inserted PKA element 110, as well as the catalytic material in the encapsulated PKA element 120. This combination could provide an element and a known possible impact strength, combined with the highest possible wear resistance available to the diamond elements for commercial use.

Figures 12A and 12B show another embodiment of the PKA element 202 of the present invention. In this embodiment, the PKA element 202 is initially formed in the form of a prototype. After cooking the surface uses the process hOgF or KGF to provide a densely packed set of epitaxially oriented crystals of diamond 260, located on the future working surface 204 on the part 210 of the PKAelement 202. The compound unit is then subjected to a process with high temperatures and high pressure, whereby placed diamond crystals 260 form a bond ' diamond diamond is one with each other and with diamond crystals in the source PCA. Such diamond-diamond bonding is possible due to the presence of a catalytic material 64 introduced from the surface of the output PCC of element 202.

After cleaning, a portion of the working surface 204 is treated to remove the catalytic material 64 from the bed deposited by the KOHF or KGF. The end product is a PKA element having one part of the working surface 204 with a volume of 214, where the density of the diamond is much higher than the density of the other surfaces of 280 PKA elements of the element 202.This section of high density diamond 214 is later applied to the catalytic material 64. Parts of the other surfaces of 280 PKA elements 202 may also be deprived of the material that catalyzes the binding.

Generally, the elements 102, 202 shown in FIGS. 11A, 11B, 11C, 12A, and 12v can be characterized as PKA element 102, 202 having a main portion 108, 208 with a working surface 104, 204. The diamond density that adjoins the working surface 104, 204 is substantially higher than anywhere else in the main portion 108, 208 and is basically free of catalytic material 64.

One particularly useful application for PKA element 2 of the present invention is, for example, cutting elements 10, 50, 52, as shown in FIGS. 4, and 5. The working surface of the PKA cutting elements 10, 50, 52 may be an upper part of the working surface 70 and / or peripheral work surface 72. The PKA cutting element 10 in the figure of the EW is one that can be typically used in fixed cutters of the valleys of the rotary drill 12, or in devices for limiting the depth of penetration of the cutting device in other types of drill tools. The PKA cutting element 50 shown in FIG. 5 may have a dome-shaped form 39. This type of PKA of the cutting element 50 has an expanded base 51 for inserting into the nests in the pulley drill bit 38 or into the housing of both types of rotary drilling chambers 12, 38, as will be described in detail below .

The PKA cutting element 52 in FIG. 4 is adapted for use in machining processes. Although the configuration of the cutting element 52 in FIG. 4 is rectangular, it will be appreciated by those skilled in the art that this element could be triangular, quadrilateral, or many other forms suitable for machining highly abrasive materials that are difficult to handle on a machine with traditional equipment.

The PKA cutting element 10 may be preformed by the cutting element 10 of the rotary drill bit 12 with a fixed cutter (as shown in FIG. 2). The bore bit 14 of the drill bit is formed from a large number of cutters 16, usually extending from the outside along the central longitudinal axis of 18 drill bit. A large number of PKA cutting elements 10 according to the present invention is located side-by-side along the guide plane 20 of each cutter.

Typically, the PKA cutting element 10 has a basic portion in the form of a round tablet that has a thin front surface 30 of diamond or diamond (PKA) material attached to a press with a high temperature and high pressure to the substrate 32 of a less solid material such as cemented carbidolfloram. The cutting element 10 is preformed and then normally connected to, as a rule, a cylindrical carrier 34, which is also formed from a cemented tungsten carbide, or alternatively can be attached directly to the cutter. The PKA cutting element 10 has working surfaces70 and 72.

The cylindrical carrier 34 is placed inside a slot that has the appropriate shape, or extends into the cutter

16. The carrier 34 will usually become solid or will shrink to fit the shape of the nest. In action

the drill bit 12 with a fixed incisor rotates, and axial load is carried out on it. It

causes the cutting elements 10 to drill the earth by cutting and / or drilling operations.

The PKA cutting elements 10 may also be applied to the site 36 to limit the depth of penetration of the bit 12 to provide action on the calibration expansion of the well, as well as to protect the bit 12 from excessive wear in the adjustment area 36 to limit the depth penetration. In order to place these cutting elements 10 as close as possible, it may be desirable to combine these elements into shapes such as a rectangular shape that more easily fit into the device 36 to limit the penetration depth.

In the second embodiment, the cutting member 50 (as shown in FIG. 5) of the present invention is located on a drill bit 38 of the shaft type shown in FIG. 3. The chopped drill bit 38 typically has one or more cut tapered rollers 40, 41, 42 mounted on a bearing spindle on the foot 44 shell 46 bits. The cutting elements 50 can be mounted as one or more of a large number of cutting inserts arranged in rows on rollers 40, 41, 42, or alternatively, PKA cutting elements can be positioned along the 44 bit of the bit 38. The PKA cutting element 50 has a basic portion in the form of the outer surface 35 diamond or diamond-like material attached to a less solid substrate37. The outer surface 35 in this embodiment of the present invention has the shape of a dome-shaped surface 39 and has work surfaces 70 and 72.

Accordingly, there is often a certain number of transition layers between the outer surface 35 and the substrate 37 in order to facilitate a more even distribution of the loads that arise during the production process, as is well known to those skilled in the art.

In operation, the roller drill bit 38 rotates, and axial load is applied to it. This makes the cutting inserts 50 in the rows of the conical rollers 40, 41, 42 deep into the ground, and since the bolt 36 rotates, the rollers 40, 41,42 also return, carrying out drilling operations.

In yet another embodiment, the PKA cutting element 52 of the present invention has the form of a triangle, a quadrilateral or a material of another form for use as a cutting insert in a cyclic technological process. In this embodiment, the cutting member 52 has a major portion in the form of an outer flat surface 54 of diamond or diamond material attached to a less solid substrate 56 with working surfaces 70 and 72. Typically, the cutting member 52 could then be cut into a large number of smaller parts, which then attach to the insert 58 mounted in the cutting tool of the metal cutting machine. The cutter member 52 can be attached to the insert by soldering with a hard solder, by means of adhesives, welding or fixing by clamping.

As shown in FIGS. 13-18, the PKA elements 2, 102, 202 of the present invention may also be used for other applications, such as tubes for pressing tubes shown, for example, as a fillet for drawing a wire 300 in FIG. 13, using a PKA element 302 according to the present invention. It may also be desirable to use the excellent characteristics of the heat transfer of PKA elements 2, 102, 202 together with their electrical insulation properties, as it is made in heat transfer 310 from PKA element 312 according to the input.

Other applications include sliding bearings 320 of PKA bearing element 322 shown in Fig. 15 and connecting parts of valves 340, 344 with surfaces 342 having PKA element 342 according to the inlet, as shown in Figures 16A and 16B. In addition, the indenters 360 for engraving incisors, devices for determining the hardness, for measuring surface roughness, and so on, may have PKA elements 362 of the present invention, as shown in FIG. 17A. The perforators 370 may have any of the two or two matrices 372, 374, made of PKA material of the present invention, as shown in FIG. 17B. In addition, the core of tools 382 and other types of deterioration elements for measuring instruments 380 shown in FIG. 18 may be made of PKA elements of the present invention. It must be clear

Although the present invention has been described in relation to the drawings applied to it, it should be understood that other and further modifications, other than those shown or suggested herein, may be made within the scope of the scope and general tendencies of the present invention.

2

FIG. IA

10

FIG. 2

FIG. WITH

at

FIG. 5

82 68

FIG. 7

-60

FIG. 8

FIG. 9

depth

FIG. 10

FIG. 1 IA

FIG. 11B

FIG. PS

280

FIG. 12V

302

FIG. 13

322

FIG. 15

evil

FIG. 16V

FIG. 17A

370

380

FIG. 18