Thermal management assemblies, device comprising thermal management assembly and housing, and device comprising housing, part and thermal management assembly

Thermal management components, devices including thermal management components and housings, and devices including housings, components, and thermal management components

THERMAL MANAGEMENT ASSEMBLIES, DEVICE COMPRISING THERMAL MANAGEMENT ASSEMBLY AND HOUSING, AND DEVICE COMPRISING HOUSING, PART AND THERMAL MANAGEMENT ASSEMBLY

This record generally refers to suitable transceivers (for example, small form-factor pluggable (SFP) transceivers, SFP+ transceivers, four-channel small form-factor pluggable (QSFP) transceivers, QSFP+ transceivers, XFP transceivers, etc.) and other devices (E.g., memory card reader, etc.) thermal management components used (e.g., configured for heat dissipation, etc.).

<b>Cross-reference of related applications</b>

This application claims the benefits and priority of U.S. Provisional Application No. 62/747,589 filed on October 18, 2018. The entire record of the above-mentioned application is incorporated herein by reference.

This chapter provides background information related to this record, which is not necessarily prior art.

Electrical components (e.g., semiconductors, integrated circuit packages, transistors, etc.) generally have a pre-designed temperature at which the electrical components operate optimally. Ideally, the pre-designed temperature is close to the temperature of the surrounding air. But the operation of electrical components generates heat. If the heat is not removed, the electrical components can then operate at a temperature significantly higher than their normal or desired operating temperature. This kind of excessive temperature is not Advantageously affect the operating characteristics of electrical components and the operation of related devices.

In order to avoid or at least reduce unfavorable operating characteristics from heat generation, the heat should be removed, for example, by conducting heat from the operating electrical components to the heat dissipation module. The heat dissipation module can then be cooled by traditional convection and/or radiation techniques. During the conduction, heat can be obtained from the direct surface contact between the electrical component and the heat dissipation module and/or through the contact between the electrical component and the heat dissipation module surface through an intermediate medium or thermal interface material (TIM). The electrical components are transferred to the heat dissipation module. Thermal interface materials can be used to fill the gaps between the heat transfer surfaces in order to increase the heat transfer efficiency compared to filling the gaps with air, which is a relatively poor heat conductor.

As a further background, small form-factor pluggable (SFP) transceivers may be compact, hot-pluggable transceivers used for telecommunications, data communication applications, and the like. The SFP transceiver can interface the main board of a network device (for example, for switches, routers, media converters, etc.) to optical fiber or copper networking cables. SFP transceivers can support communication standards including synchronous optical network, gigabit Ethernet, and optical fiber channel. As used herein, small form-factor pluggable (SFP) transceivers also include other small form-factor pluggable transceivers, such as SFP+ transceivers, quad-channel small form-factor pluggable (QSFP) transceivers, QSFP+ transceivers, and so on.

This chapter provides a general overview of this record, rather than a comprehensive record of its full scope or all its features.

In an exemplary embodiment, the thermal management assembly includes at least one flexible heat-dissipating material, which includes portions wound in different non-parallel directions around corresponding portions of the components, and the corresponding portions of the components may be configured to be coupled to the device housing The sides of the body and/or along the sides of the device housing. The heat-dissipating material is operative to define at least a portion of the thermally conductive heat path surrounding the corresponding portion of the component.

Based on the description provided in this article, further application areas will become apparent. The description and specific examples in this summary are intended for illustrative purposes only, and are not intended to limit the scope of this description.

<p>100: Small form-factor pluggable (SFP) transceiver</p><p>102: cage</p><p>104: Cooling module</p><p>106: Thermal Interface Material (TIM)</p><p>108: Spring contact</p><p>110: metal plate</p><p>112: round end</p><p>114: Graphite sheet</p><p>116: Connector</p><p>118: Material</p><p>200: Small form-factor pluggable (SFP) transceiver</p><p>300: Small form-factor pluggable (SFP) transceiver</p><p>302: cage</p><p>304: cooling module</p><p>306: Thermal Interface Material (TIM)</p><p>308: Spring contact</p><p>310: metal plate</p><p>314: Graphite Sheet</p><p>316: SFP cable connector</p><p>400: QSFP transceiver</p><p>402: Thermal Management Components</p><p>414: Graphite Sheet</p><p>416: Connector</p><p>420: Thermal management components</p><p>422: end part</p><p>424: top part</p><p>426: Latch member</p><p>428: Corresponding Structure</p><p>430: end part</p><p>432: middle part</p><p>500: QSFP transceiver</p><p>502: cage</p><p>514: (first and second) graphite sheet</p><p>520: Thermal management components</p><p>522, 530: end part</p><p>524: top part</p><p>526: Latch member</p><p>528: Corresponding Structure</p><p>534: part</p><p>536: first opening</p><p>538: second opening</p><p>540: third opening</p><p>600: QSFP transceiver</p><p>602: cage</p><p>614: (First and Second) Graphite Sheets</p><p>620: Thermal Management Components</p><p>624, 634: Part 1 and Part 2</p><p>626: first/second top part</p><p>628: Corresponding Structure</p><p>700: QSFP transceiver</p><p>702: cage</p><p>710: bottom part</p><p>714: Graphite Sheet</p><p>720: Thermal management component 720</p><p>722, 730: end part</p><p>724: top part</p><p>726: Latch member</p><p>728: Corresponding Structure</p><p>734: middle part</p><p>742: Part One</p><p>744: Part Two</p><p>746: Part Three</p><p>748: Part Four</p>

The drawings described herein are only for illustrative purposes of selected examples, and not all possible implementations, and are not intended to limit the scope of the present invention.

FIG. 1 is a cross-sectional side view of a small form-factor pluggable (SFP) transceiver according to an exemplary embodiment.

Fig. 2 is a perspective view of a spring contact and a metal plate of the SFP transceiver shown in Fig. 1.

Fig. 3 is a cross-sectional side view of the SFP transceiver shown in Fig. 1 and also shows a graphite sheet wound with a spring contact and a metal plate according to an exemplary embodiment.

Fig. 4 is a perspective view of the graphite sheet wound with the spring contact and the metal plate shown in Fig. 3.

FIG. 5 is a cross-sectional side view of the SFP transceiver shown in FIG. 3, and also shows the cable connector housed in the SFP transceiver.

FIG. 6 is a perspective view of an exemplary thermally and electrically conductive material wound around the thermal interface material shown in FIG. 1.

7 is a cross-sectional side view of a small form-factor pluggable (SFP) transceiver according to an exemplary embodiment, including first and second graphite sheets wound with corresponding first and second metal plates and spring contacts.

Fig. 8 is a cross-sectional side view of the SFP transceiver shown in Fig. 7 and also shows the thermal interface material between the graphite sheet and the external heat dissipation module.

Fig. 9 is a cross-sectional side view of the SFP transceiver shown in Fig. 8 and also shows the cable connector housed in the holder of the SFP transceiver.

Fig. 10 is a perspective view of a transceiver including a thermal management component according to an exemplary embodiment, in which a graphite sheet is disposed around an end of the thermal management component.

Figure 11 is a perspective view of the wound graphite sheet from Figure 10, shown without thermal management components or transceivers.

FIG. 12 is a perspective view of a transceiver including a thermal management assembly according to an exemplary embodiment, in which a first graphite sheet and a second graphite sheet are wound around a portion of the thermal management assembly.

Figure 13 is a perspective view of the wound graphite sheet from Figure 12, shown without thermal management components or transceivers.

14 is a perspective view of a transceiver including a thermal management assembly according to an exemplary embodiment, in which a first graphite sheet and a second graphite sheet are wound around a portion of the thermal management assembly.

Figure 15 is a perspective view of the wound graphite sheet from Figure 14, shown without thermal management components or transceivers.

Figure 16 is a perspective view of a transceiver including a thermal management assembly according to an exemplary embodiment, in which parts of the same/single graphite sheet are wound around parts of the thermal management assembly in different non-parallel directions.

Figure 17 is a perspective view of the wound graphite sheet from Figure 16, shown without thermal management components or transceivers.

Figure 18 shows an overview of the simulation model used during the QSFP (Four Channel Small Form-Factor Pluggable) simulation study to monitor and compare the maximum heat source temperature of thermal management components with different configurations.

FIG. 19 shows the result of thermal simulation using the model shown in FIG. 18 together with the wound graphite sheet according to the embodiment shown in FIG. 10 and FIG. 11.

FIG. 20 shows the result of thermal simulation using the model shown in FIG. 18 together with the first and second wound graphite sheets according to the embodiment shown in FIG. 12 and FIG. 13.

FIG. 21 shows the result of thermal simulation using the model shown in FIG. 18 together with the graphite sheet having portions wound in two non-parallel directions according to the embodiment shown in FIG. 16 and FIG. 17.

In the several views of the drawings, corresponding reference symbols indicate corresponding (though not necessarily the same) parts.

Exemplary embodiments will now be described more fully with reference to the accompanying drawings.

There is an expectation that the demand for an ever-increasing number of connection devices combined with physically smaller base stations can lead to higher base station temperatures at an ever-increasing rate. Small pluggable (for example, SFP, SFP+, QSFP, QSFP+, etc.) connections can be designed to stop at temperatures above 85 degrees Celsius. When a downtime occurs, users are frustrated because they cannot maintain their mobile phones, computers, etc. connections. This is also a health risk when medical devices such as personal alarms switch from cable connections to wireless connections.

The SFP connection can generate heat dissipation of up to two watts or more. In some applications, SFP ports can be stacked and grouped in large numbers, thus generating a lot of combined heat.

This article describes suitable transceivers (for example, small form-factor pluggable (SFP) transceivers, SFP+ transceivers, four-channel small form-factor pluggable (QSFP) transceivers, QSFP+ transceivers, XFP transceivers, etc.) and other devices (for example, An exemplary embodiment of a thermal management component used (e.g., configured for heat dissipation, etc.) by a memory card reader, etc.). In an exemplary embodiment, one or more heat sinks are applied to the metal spring assembly (for example, one or more graphite sheets are wound around parts of the metal spring assembly, etc.) to improve the device (for example, QSFP or Thermal performance of other transceivers, memory card readers, etc.). The metal spring assembly may include a metal plate and a spring contact, as shown in any one or more of FIGS. 1 to 5 and 7 to 9.

In an exemplary embodiment, the device (e.g., transceiver, memory card reader, etc.) generally includes a housing (e.g., holder, etc.). The heat dissipation (in a broad sense, thermal management) component can be coupled to one side of the housing so that an object (for example, a connector, a memory card, etc.) is inserted into the housing and is in thermal contact with the heat dissipation component, so that the heat dissipation component can be defined from the inserted object At least a part of the heat conduction path to another component (for example, housing, heat dissipation module, thermal interface material, thermoelectric module, heat sink, heat dissipation device, etc.). One or more flexible heat dissipation packages or materials (e.g., one or more graphite sheets, etc.) can be wound (broadly, broadly, Placement).

For example, parts of the graphite sheet can be wound (broadly, arranged) around parts of the heat dissipation component in different directions (for example, in two non-parallel directions, in the vertical direction, in the X and Y directions, etc.). Continuing this example, one or more parts of the graphite sheet may be wound around one or more ends of the heat dissipation assembly in a first direction parallel to the sliding direction of the object sliding into/out of the housing. One or more other parts of the graphite sheet may be wound around one or more sides of the heat dissipation component in a second direction that is not parallel (for example, perpendicular, etc.) to the first direction.

The heat dissipation assembly may include one or more spring finger contacts (broadly, elastic flexible contacts or elements). Spring finger contacts can provide mechanical or spring pressure, such as when inserting objects, Between the shell and the flexible heat dissipation package, this in turn can improve the thermal contact between the heat dissipation component (for example, the rolled heat dissipation material, etc.), the shell and the inserted object.

The exemplary transceivers described herein can provide one or more (or none) of the following advantages: with increased reliability (for example, even in the case of multiple connections and disconnects between the cable connector and the transceiver) Increased reliability after connection) enhanced cooling; enhanced heat transfer; modularization and flexibility; allowed the use of thermoelectric modules (TEM) and/or thermal interface materials (TIM); allowed different materials to meet different height requirements, Length requirements, heat conduction requirements, passive or active applications, the ability to cool cable connectors, housings or cages, etc.

Referring now to the drawings, FIG. 1 illustrates an exemplary embodiment of a small form-factor pluggable (SFP) transceiver 100 (in a broad sense, a device) equipped with one or more aspects of this description. As shown in the figure, the SFP transceiver 100 includes a small pluggable holder 102 (in a broad sense, a housing). The holder 102 is suitable for accommodating a small pluggable cable connector (in a broad sense, a connector). The SFP transceiver 100 also includes an external heat dissipation module 104. The thermal interface material (TIM) 106 is generally located between the top side or other side of the cage 102 and the external heat dissipation module 104 (for example, thermal contact coupling, etc.). The TIM 106 can be used to transfer the heat from the cage 102 to the external heat dissipation module 104.

The SFP transceiver 100 further includes a spring contact 108 coupled to the top side of the holder 102, and the spring contact 108 is generally located between the cable connector and the TIM 106. The spring contact 108 may be configured to contact the cable connector housed in the cage 102 to define, provide, establish, or create at least a portion of the thermally conductive heat path between the cable connector and the top side of the cage 102, thereby increasing Heat transfer from the cable connector to the top side of the holder 102.

The holder 102 may be any suitable holder capable of accommodating an SFP cable connector. The retainer 102 can accommodate the cable connector via any suitable releasable coupling engagement (including but not limited to friction fit, snap fit, etc.). The holder 102 may include an interface such as an optical cable interface, a power cable interface, and the like for transmitting and/or receiving signals via the SFP connector. This interface can allow and/or slave cable The connector communicates with a motherboard, a printed circuit board (PCB), a network card, etc., on which the cage 102 is installed.

The holder 102 may include any suitable material (including metal, etc.). For example, the holder 102 may include a material suitable for shielding noise (eg, electromagnetic interference (EMI) shielding, etc.) generated by the transmission of data through the cable connector. Alternative embodiments may include other devices, such as other transceivers (for example, SFP+ transceivers, XFP+ transceivers, QSFP transceivers, QSFP+ transceivers, etc.), which are configured to interact with other than SFP cable connectors, etc. The housing or cage used with the connector. Therefore, the aspects of this description should not be limited to SFP transceivers and SFP cable connectors.

The heat dissipation module 104 is adapted to transfer heat away from the holder 102 and the cable connector contained in the holder 102 to reduce the temperature of the holder 102 and the cable connector, so that the temperature of the holder 102 and the cable connector is maintained at Below the prescribed threshold etc. The heat dissipation module 104 may include any suitable heat dissipation module material, structure, etc., suitable for reducing the temperature of the holder 102 and the cable connector. For example, the material and structure of the heat dissipation module can be selected so that the heat dissipation module 104 can dissipate heat at a rate sufficient to maintain the temperature of the cage 102 and the cable connector below a specified threshold temperature, otherwise the operation of the cable connector is within the specified threshold. The threshold temperature is compromised. The heat transfer to the heat dissipation module 104 can reduce the heat transferred from the cable connector to the board of the SFP transceiver 100, thereby reducing the heat that can be further dissipated from the board to more sensitive components.

The thermal interface material 106 may include any suitable material for increasing the heat transfer from the top of the cage (for example, from the spring contact 108 defining a part of the top of the cage) to the heat dissipation module 104 (for example, gap filler, etc.) ). The thermal interface material 106 can provide increased thermal conductivity than air gaps because the thermal interface material 106 can fill the gaps between the surfaces, which would otherwise be separated by the air. Therefore, the thermal interface material 106 may have a higher thermal conductivity than air.

The thermal interface material 106 may be coupled between the top side of the holder 102 and the heat dissipation module 104 to transfer heat from the holder 102 to the heat dissipation module 104. In some embodiments, the thermal interface material 106 may include one or more thermoelectric modules. For example, a thermoelectric module may be coupled between the top side of the holder 102 and the heat dissipation module 104 to connect the connector from the holder 102 (for example, a connector accommodated in the holder, and a connection). The heat of the spring contact (108, etc.) contacted by the connector is transferred to the heat dissipation module 104. For example, the thermal interface material 106 can be coupled between the thermoelectric module and the holder 102, between the thermoelectric module and the heat dissipation module 104, etc., to increase the distance from the holder 102 to the thermoelectric module and/or the heat dissipation module. 104 of thermal conductivity.

The thermoelectric module can be any suitable module that can transfer heat between its opposite sides when a voltage is applied. The thermoelectric module may have a cold side oriented toward the holder 102 and a hot side oriented toward the heat dissipation module 104. The cold side of the thermoelectric module can be in direct contact with the top side of the holder 102; the top side of the holder 102 can be contacted via a thermal interface material or the like. Similarly, the hot side of the thermoelectric module can directly contact the heat dissipation module 104; the heat dissipation module 104 can be contacted via the thermal interface material 106 or the like.

As shown in FIG. 1, the spring contact 108 is coupled to the top side of the holder 102 and may be configured to contact a cable connector (not shown) housed in the holder 102. The spring contact 108 helps create a thermally conductive thermal path between the cable connector and the top side of the cage 102 (for example, a thermally conductive thermal path from the connector to the thermal interface material 106, etc.) to enhance the connection from the cable connector to the cage The heat transfer to the top side of 102. For example, the spring contact 108 can provide mechanical or spring pressure between the cable connector and the cage 102, the thermal interface material 106, etc., thereby increasing the thermal energy between the cable connector and the cage 102, the thermal interface material 106, etc. get in touch with.

The spring contact 108 may include any suitable thermally conductive material (including stainless steel, etc.) capable of transferring heat from the cable connector to the top of the holder 102. The spring contact 108 may include a material that is hard enough to maintain at least some mechanical pressure between the cable connector and the top of the holder 102. In some embodiments, the spring contact 108 includes a metalized thermally conductive material.

The spring contact 108 can be coupled to the cage 102 using any suitable connection. In some embodiments, the spring contact 108 may be coupled to the cage 102 via laser welding, riveting, glue, or the like.

The spring contact 108 may be sized to apply mechanical pressure between the connector housed in the cage 102 and the top side of the cage 102, the thermal interface material 106, and the like. For example, spring contact The member 108 may have a height corresponding to the distance between the cable connector and the top side of the holder 102 when the cable connector is inserted into the holder 102, and may have a height slightly larger than that of the cable when the cable connector is inserted into the holder 102. The height of the distance between the connector and the top side of the holder 102 is such that when the cable connector is inserted into the holder 102, the spring contact 108 is slightly deformed or the like. Therefore, the spring contact 108 may include an elastically compressible, deformable, etc. material to apply mechanical pressure to the cable connector.

The spring contact 108 may be coupled to the metal plate 110 (in a broad sense, a conductive support). The metal plate 110 may increase the surface area contacting the cable connector when the cable connector is received in the holder 102, thereby increasing the thermal conductivity from the cable connector through the spring contact 108 to the top of the holder. In some embodiments, the top side of the cage 102 may include an opening in which the metal plate 110 is positioned such that the metal plate 110 and/or the spring contact 108 define at least a portion of the top side of the cage 102.

The metal plate 110 may include any thermally conductive material suitable for heat transfer from the cable connector to the spring contact 108. The metal plate 110 may be adapted to increase the surface area of mechanical pressure, thermal contact, etc., applied to the cable connector when the cable connector is received in the holder 102.

FIG. 2 shows an exemplary metal plate 110 with spring contacts 108. As shown in FIG. 2, the metal plate 110 may be integrally formed with the spring contact 108. For example, a piece of metal can be cut to form the spring contact part. The spring contact 108 may then be defined by the spring contact portion cut upward from the metal plate 110. In other embodiments, the spring contact 108 may be coupled to the metal plate 110, attached to the metal plate 110, or the like.

The metal plate 110 may include a rounded end 112. The rounded end 112 may be adapted to allow the cable connector to be inserted against the bottom side of the metal plate 110 without being caught on the end of the metal plate 110. For example, when the cable connector is inserted into the holder 102, the rounded end 112 may allow the connector to slide over the edge of the metal plate 110 and be located below the edge of the metal plate 110. The rounded end may be formed by any suitable technique (including bending the metal plate 110, etc.).

Although FIG. 2 shows four spring contacts 108, it is obvious that other embodiments may include any combination A suitable number of spring contacts, including but not limited to a single spring contact, two spring contacts, three spring contacts, more than four spring contacts, etc. Similarly, FIG. 2 shows the metal plate 110 as having a rectangular shape, but it should be clear that other embodiments may include any other suitable shapes for the metal plate 110, including circular metal plates, square metal plates, and the like.

Figure 3 shows an exemplary embodiment of a small form-factor pluggable (SFP) transceiver 200 embodying one or more aspects of the present invention. As shown in FIG. 3, the graphite sheet 114 is wound around at least a part of the spring contact 108. Similar to the SFP transceiver 100 of FIG. 1, the SFP transceiver 200 shown in FIG. 2 includes a small-sized pluggable holder 102. The holder 102 is adapted to accommodate a small pluggable cable connector (not shown). The SFP transceiver 200 also includes an external heat dissipation module 104. A thermal interface material (TIM) and/or a thermoelectric module (TEM) 106 is coupled between the top side of the cage 102 and the external heat dissipation module 104 to transfer heat from the cage 102 to the external heat dissipation module 104.

The SFP transceiver 200 also includes a spring contact 108 coupled to the top side of the holder 102. This spring contact 108 is adapted to contact the cable connector housed in the holder 102 to create a thermally conductive heat path between the cable connector and the top side of the holder 102, thereby increasing the amount of heat from the cable connector to the holder 102 Heat transfer on the top side.

As shown in FIG. 3, the graphite sheet 114 is wound around at least a part of the metal plate 110 and the spring contact 108. The graphite sheet 114 may be adapted to increase the thermal conductivity between the cable connector housed in the holder 102 and the top side of the holder 102. In some embodiments, the top side of the cage 102 may include an opening within which the graphite sheet 114 is positioned to thereby define a portion of the top side of the cage 102. Therefore, the graphite sheet 114 can contact the thermal interface material 106 to dissipate and transfer heat from the cable connector to the thermal interface material 106.

Any suitable graphite material (or other heat dissipation material) that can be wound around at least a part of the spring contact 108, the metal plate 110, etc. may be used. For example, the graphite sheet 114 can have very high thermal conductivity and can guide heat from the cable connector to the top of the cage 102 well.

FIG. 4 shows the spring contact 108, the metal plate 110 and the graphite sheet 112 of FIG. 3. As shown in Figure 4 As shown, the graphite sheet 114 may be wound around at least a portion of the spring contact 108 and the metal plate 110. The graphite sheet 114 is shown as being wound on the metal in a direction parallel to the length of the metal plate 110 and/or parallel to the direction in which the connector 116 is slidably inserted into and removed from the holder 102 (FIG. 5) Around the board 110. Obviously, other embodiments may include one or more graphite sheets wound around the spring contact 108 and/or the metal plate 110 in other directions.

In some embodiments, the graphite sheet 114 may include synthetic graphite. The graphite sheet 114 may include a polyethylene terephthalate (PET) layer for improving mechanical and/or abrasion resistance and/or for adhering the graphite sheet 114 to the surface (for connecting the graphite sheet 114 To the surface, etc.) of the adhesive material (for example, pressure sensitive adhesive (PSA), etc.). In an exemplary embodiment, the graphite sheet 114 may include such as Tgon from Raelder Technology Co., Ltd.^TM 9017, Tgon^TM 9025, Tgon^TM 9040, Tgon^TM 9070 and/or Tgon^TM 9100 Graphite flakes such as synthetic graphite flakes (for example, Tgon^TM 9000 series graphite flakes, etc.). Table 1 below includes Tgon from Raelder Technology Co., Ltd.^TM Additional details of 9000 series synthetic graphite.

In some embodiments, the graphite sheet 114 may include a label with a mark indicating the performance of the SFP transceiver 200. The use of graphite labels for the SFP transceiver 200 can increase the thermal conductivity from the cable connector to the heat dissipation module, etc., while also providing information about the performance of the SFP transceiver 200.

FIG. 5 shows the SFP transceiver 200 of FIG. 3, and the cable connector 116 is accommodated in the holder 102. As shown in FIG. 5, when the cable connector 116 is accommodated in the holder 102, the cable connector 116 contacts the graphite sheet 114 on the bottom surface of the metal plate 110.

As described above, in the case where the heat from the cable connector 116 can be dissipated by the heat dissipation module 104 via the thermal interface material 106 which may include one or more thermoelectric modules, the spring contact 108 wound by the graphite sheet 114 and The metal plate 110 increases the thermal conductivity from the cable connector to the top of the holder 102.

In some embodiments, the thermally and electrically conductive material may be wound around at least a portion of the TIM 106. Therefore, the TIM 106 and the material wound around the TIM 106 can provide a thermal and electrical path between the holder 102 of the SFP transceiver and the heat dissipation module or other materials. This can increase the The cable connector accommodated in the holder 102 transfers the heat away and also electrically grounds the holder 102.

FIG. 6 shows an exemplary TIM 106 and a thermally and electrically conductive material 118 wrapped around the TIM 106. Although FIG. 6 shows the thermally conductive/electrically conductive material 118 wound around the top, bottom, and sides of the TIM 106, it should be understood that other embodiments may include other parts surrounding the TIM 106 (eg, the end of the TIM 106, etc.) The thermally conductive/electrically conductive material 118 is wound.

The TIM 106 may include any material suitable for conducting heat from the holder 102 to an external heat dissipation module or the like. Exemplary thermal interface materials that can be used in exemplary embodiments include thermal gap fillers, thermal phase change materials, thermally conductive EMI absorbing materials or mixed thermal/EMI absorbing materials, thermal putty, heat dissipation pads, and the like. The TIM 106 is compressible between the cage 102 and the heat dissipation module. For example, in some embodiments, the TIM 106 may include a fabric-over-foam material, so that the TIM 106 may provide both a thermal interface material and a conductive and wound around at least a portion of the thermal interface material. Thermally conductive fabric. Metal (for example, copper, foil, or other metal foil, etc.) can be used to wrap the fabric foam material.

In some embodiments, the TIM 106 may include a silicone elastomer. Silicon elastomer can be filled with suitable thermal conductive materials (including ceramics, boron nitride, etc.). The silicone elastomer can be processed to allow the thermally and electrically conductive material 118 to adhere to the silicone elastomer. For example, TIM 106 may include a thermal interface material from Raelder Technology Co., Ltd., for example, Tputty^TM 502 series thermal gap filler, Tflex^TMSeries gap fillers (e.g. Tflex^TM 300 series thermal gap filler, Tflex^TM 600 series thermal gap filler, Tflex^TM 700 series thermal gap filler, etc.), Tpcm^TMSeries of thermal phase change materials (for example, Tpcm^TM 580 series phase change material, Tpcm^TM 780 series phase change material, Tpcm^TM 900 series phase change materials, etc.), Tpli^TMSeries gap fillers (e.g. Tpli^TM 200 series gap filler, etc.), IceKap^TMSeries thermal interface materials and/or CoolZorb^TMSeries of thermally conductive microwave absorbing materials (for example, CoolZorb^TM 400 series thermally conductive microwave absorbing material, CoolZorb^TM 500 series thermally conductive microwave absorbing material, CoolZorb^TM Any one or more of 600 series thermally conductive microwave absorbing materials, etc.). In some exemplary embodiments, the TIM 106 may include a compliant gap filler with high thermal conductivity. By way of example, the TIM 106 may include Reids thermal interface material Material, for example, Tflex^TM 200, Tflex^TM HR200, Tflex^TM 300, Tflex^TM 300TG, Tflex^TM HR400, Tflex^TM 500, Tflex^TM 600, Tflex^TM HR600, Tflex^TM SF600, Tflex^TM 700, Tflex^TM One or more of SF800 thermal gap fillers.

The TIM 106 may include elastomer and/or ceramic particles, metal particles, ferrite electromagnetic interference/radio frequency interference absorbing particles, metal or glass fiber mesh in a matrix of rubber, gel, or wax. TIM 106 may include compliant or conformal silicon pads, non-silicon-based materials (for example, non-silicon-based gap filler materials, thermoplastic and/or thermosetting polymers, elastomer materials, etc.), screen materials, polyurethane foam, or coagulation materials. Glue, thermal conductivity additives, etc. The TIM 106 can be configured to have sufficient conformability, compliance, and/or flexibility (for example, it does not have to undergo phase change or reflow, etc.) so that it can be used at low temperatures (for example, room temperature of 20°C to 25°C, etc.) Flexing to adjust tolerances or gaps and/or allow the thermal interface material to closely conform (for example, with a relatively tight fit) when placed in contact (pressing against, etc.) with matching surfaces (including uneven, curved or uneven matching surfaces) And the way of packaging, etc.) match the surface.

The TIM 106 may include a soft thermal interface material formed of an elastomer and at least one thermally conductive metal, boron nitride, and/or ceramic filler, so that the soft thermal interface material can be conformable even if it does not undergo phase change or reflow. In some exemplary embodiments, the TIM 106 may include a ceramic-filled silicon elastomer, a boron nitride-filled silicon elastomer, or a thermal phase change material including a substantially non-reinforced film.

Exemplary embodiments may include high thermal conductivity (e.g., 1W/mK (watts per meter per Kelvin), 1.1W /mK, 1.2W/mK, 2.8W/mK, 3W/mK, 3.1W/mK, 3.8W/mK, 4W/mK, 4.7W/mK, 5W/mK, 5.4W/mK, 6W/mK, etc.) Of one or more thermal interface materials. These thermal conductivity are only examples, as other embodiments may include thermal interface materials with thermal conductivity higher than 6 W/mK, less than 1 W/mK, or other values between 1 and 6 W/mK. Therefore, the described aspects should not be limited to use in any particular thermal interface material, as exemplary embodiments may include a wide range of thermal interface materials.

The thermally conductive/electrically conductive material 118 wound around the TIM 106 may include any material suitable for conducting heat from the cage 102 and for electrically grounding the cage 102. In some embodiments, the thermally conductive/electrically conductive material 118 may include foil (for example, copper foil, etc.), metalized and/or electroplated fabric (for example, nickel-copper nylon, etc.), metalized plastic, graphite sheet, and the like. The thermally conductive/electrically conductive material 118 may include graphite sheets from Raelder Technology Co., Ltd. (e.g., Tgon^TM 9000 series graphite sheet, etc.), for example, Tgon^TM 9017, Tgon^TM 9025, Tgon^TM 9040, Tgon^TM 9070 and/or Tgon^TM 9100 synthetic graphite flakes. Table 1 below includes Tgon from Raelder Technology Co., Ltd.^TM Additional details of 9000 series synthetic graphite.

The thermally and electrically conductive material 118 may have any suitable thickness that allows the material 118 to wrap around at least a portion of the TIM 106. For example, in some embodiments, the thermally and electrically conductive material may have a thickness of less than about one hundred micrometers (um) (eg, 17um, 25um, 40um, 70um, 100um, etc.). This material can have any suitable thermal conductivity (for example, about 500 to 1900 W/mK, etc.).

Figures 7-9 show exemplary embodiments of a small form-factor pluggable (SFP) transceiver 300 embodying one or more aspects of the present invention. The SFP transceiver 300 may be similar to the SFP transceiver 200 of FIG. 3. As shown in FIGS. 7-9, a plurality of graphite sheets 314 have been wound around a portion of the spring contact 308. The graphite sheet 314 forms a plurality of individual rings, which increase the cross section for heat transfer and shorten the heat transfer path.

The SFP transceiver 300 includes a small pluggable holder 302, which is adapted to receive a small pluggable cable connector 316 (FIG. 9). The holder 302 may be any suitable holder capable of accommodating the SFP cable connector 316. The holder 302 may have a size corresponding to the SFP connector 316 to allow the SFP cable connector 316 to be inserted into the holder 302. The holder 302 can be engaged via any suitable releasable coupling (including but not limited to friction fit, snap fit, etc.) to accommodate the cable connector 316. The holder 302 may include an interface such as an optical cable interface, a power cable interface, or the like for transmitting and/or receiving signals via the SFP connector 316. This interface may allow communication with and/or from the cable connector 316 to a motherboard, a printed circuit board (PCB), a network card, etc., on which the cage 302 is installed.

The holder 302 may include any suitable material (including metal, etc.). For example, cage 302 may include materials suitable for shielding noise (for example, electromagnetic interference (EMI) shielding, etc.) generated by the transmission of data through the cable connector. Alternative embodiments may include other devices, such as other transceivers (eg, SFP+ transceivers, XFP+ transceivers, QSFP transceivers, QSFP+ transceivers, etc.), the devices having connectors configured to interact with other than SFP cable connectors, etc. Shell or cage used together. Therefore, the aspects of this description should not be limited to SFP transceivers and SFP cable connectors.

The SFP transceiver 300 further includes a spring contact 308 coupled to the top side of the holder 302, and the spring contact 308 may be similar to or the same as the spring contact 108 shown in FIGS. 1 to 5. The spring contact 308 may be configured (e.g., sized, shaped, formed of an elastic material, etc.) to provide for biasing the top and bottom of the graphite sheet 314 to respectively abut the thermal interface material 306 (FIG. 8 and FIG. 9) Mechanical or spring pressure in good thermal contact with the top of the connector 316 and/or the thermal interface material 306 (FIGS. 8 and 9) and the top of the connector 316. In turn, this can improve the thermal contact between the top of the connector 316 and the bottom of the graphite sheet 314 and between the top of the graphite sheet 314 and the thermal interface material 306.

The spring contact 308 may include any suitable thermally conductive material (including stainless steel, etc.) capable of transferring heat. The spring contact 308 may include a material that is hard enough to maintain at least part of the mechanical pressure between the graphite sheet 314 and the cable connector 316 and the thermal interface material 306. In some embodiments, the spring contact 308 includes a metalized thermally conductive material.

The spring contact 308 may be coupled or attached using any suitable connection. In some embodiments, the spring contact 308 may be coupled to the holder 302 via laser welding, via riveting, via glue, or the like. The spring contact 308 may be configured (e.g., have a certain height, etc.) such that the cable connector 316 slightly deforms the spring contact 308 when inserted into the holder 302, etc. Therefore, the spring contact 308 may include a material that is elastically compressible, deformable, etc. to apply mechanical pressure to the cable connector.

In the illustrated embodiment, the spring contact 308 may include multiple groups (e.g., first and second, etc.) or multiple spring contacts 308, which are respectively coupled to multiple (e.g., first Corresponding to one of the second grade) metal plates 310. By way of example, the SFP transceiver 300 It may include first and second metal plates 310 having a spring contact 308, and the metal plate 310 and the spring contact 308 are similar to or the same as the metal plate 110 and the spring contact 108 shown in FIG. 2. Therefore, the first and second metal plates 310 shown in FIGS. 7 to 9 can also be formed integrally with the spring contact 308. For example, a piece of metal can be cut (e.g., stamped, etc.) to form the spring contact portion. The spring contact 308 may then be defined by the spring contact portion cut upward from the corresponding metal plate 310. In other embodiments, the spring contact 308 may be coupled to the metal plate 310, attached to the metal plate 310, and the like.

The first and second metal plates 310 may include round or upwardly curved end portions. The rounded end portion may facilitate the graphite sheet 314 to be wound around the metal plate 310 and/or allow the cable connector 316 to be inserted along the bottom side of the metal plate 310 without being caught on the end portion of the metal plate 310. For example, when the cable connector 316 is inserted into the holder 302, the rounded end portion may allow the connector 316 to slide over the edges of the graphite sheet 314 and the metal plate 310 and be located below the edges of the graphite sheet 314 and the metal plate 310. The rounded end portion can be formed using any suitable technique (including bending the metal plate 310, etc.).

In some embodiments, the top side of the cage 302 may include one or more openings in which the metal plate 310 is positioned such that the metal plate 310 and/or the spring contact 308 defines at least a portion of the top side of the cage 302.

The metal plate 310 may include any thermally conductive material suitable for transferring heat from the cable connector to the spring contact 108308. The metal plate 310 may be adapted to increase the surface area of mechanical pressure, thermal contact, etc., applied to the cable connector when the cable connector is received in the holder 302.

As shown in FIG. 7, the first and second graphite sheets 314 are wound around the corresponding portions of the first and second metal plates 310 and the spring contact 308. Therefore, the first and second graphite sheets 314 form first and second rings that help increase the cross section for heat transfer and shorten the separation of the heat transfer path. When the cable connector 316 is received in the holder 302, the cable connector 316 contacts the graphite sheet 314 along the bottom surface of the metal plate 310.

Any suitable graphite material (or other suitable heat dissipation material) can be used to surround The graphite sheet 314 is wound around at least a part of the spring contact 308, the metal plate 310, and the like. For example, the graphite sheet 314 may have a very high thermal conductivity, and may conduct heat from the cable connector 316 to the top of the cage 302 well.

Each graphite sheet 314 may be in a direction parallel to the length of the metal plate 310 (for example, FIG. 4, etc.) and/or parallel to the direction in which the connector 316 is slidably inserted into and removed from the holder 302 The upper part is wound around at least a part of the spring contact 308 and the corresponding metal plate 310. Obviously, other embodiments may include one or more graphite sheets that are wound around the spring contact 308 and/or the metal plate 310 in other directions.

In some embodiments, the graphite sheet 314 may be synthetic. The graphite sheet 314 may include a polyethylene terephthalate (PET) layer for enhancing mechanical resistance and/or abrasion resistance, and may include a layer for fixing the graphite sheet 314 to the surface and for connecting the graphite sheet 314 Adhesive materials to the surface, etc. In an exemplary embodiment, the one or more graphite sheets 314 may include such as Tgon from Raelder Technology Co., Ltd.^TM 9017, Tgon^TM 9025, Tgon^TM 9040, Tgon^TM 9070 and/or Tgon^TM 9100 Graphite flakes such as synthetic graphite flakes (for example, Tgon^TM 9000 series graphite flakes, etc.). Table 1 below includes Tgon with a single crystal structure in the carbon plane^TM Additional details of 9000 series synthetic graphite.

In some embodiments, the graphite sheet 314 may include a label with a mark indicating the performance of the SFP transceiver 300. Using the graphite label for the SFP transceiver 300 can increase the thermal conductivity from the cable connector to the heat dissipation module, etc., and also provide information about the performance of the SFP transceiver 300.

The SFP transceiver 300 may also include one or more external heat dissipation modules and one or more thermal interface materials (TIM). As shown in FIGS. 8 and 9, a thermal interface material (TIM) 306 is generally located (eg, coupled in thermal contact, etc.) between the graphite sheet 314 and the external heat dissipation module 304. The TIM 306 can be used to transfer the heat from the graphite sheet 314 to the external heat dissipation module 304 more effectively. Although FIGS. 8 and 9 show a single TIM 306 positioned on top of the two graphite sheets 314 and extending across the two graphite sheets 314, other embodiments may include positioning on the top of the first and second graphite sheets 314, respectively The first and second TIM. Similarly, although FIGS. 8 and 9 also show a single heat dissipation module 304 positioned on the top of the TIM 306, other embodiments may include first and second heat dissipation modules positioned on the top of the first and second TIMs, respectively. Group.

The heat dissipation module 304 is adapted to transfer heat away from the holder 302 and the cable connector 316 contained in the holder 302 to reduce the temperature of the holder 302 and the cable connector 316, so that the temperature of the holder 302 and the cable connector 316 Maintained below the prescribed threshold, etc. The heat dissipation module 304 may include any suitable heat dissipation module material, structure, etc., suitable for reducing the temperature of the holder 302 and the cable connector 316. For example, the material and structure of the heat dissipation module can be selected so that the heat dissipation module 304 can dissipate heat at a rate sufficient to maintain the temperature of the holder 302 and the cable connector 316 below the specified threshold temperature, otherwise the operation of the cable connector 316 will be The prescribed threshold temperature is impaired. The heat transfer to the heat dissipation module 304 can reduce the heat transferred from the cable connector 316 to the board of the SFP transceiver 300, thereby reducing the heat that can be further dissipated from the board to more sensitive components.

The thermal interface material 306 may include any suitable material for increasing heat transfer to the heat dissipation module 304 (for example, gap filler, silicon elastomer, etc.). The thermal interface material 306 can provide increased thermal conductivity than air gaps because the thermal interface material 306 can fill the gaps between the surfaces, which would otherwise be separated by the air. Therefore, the thermal interface material 306 may have a higher thermal conductivity than air.

The thermal interface material 306 may be similar to or the same as the exemplary TIM 106 shown in FIG. 6 and described above. Therefore, the thermal interface material 306 may also include a thermally conductive and electrically conductive material wound around the TIM 306, for example, foil (for example, copper foil, etc.), metalized and/or electroplated fabric (for example, nickel-plated copper nylon, etc.), Metallized plastics, graphite flakes, etc. The thermally and electrically conductive material wound around the TIM 306 may include graphite sheets from Raelder Technology Co., Ltd. (e.g., Tgon^TM 9000 series graphite sheet, etc.), for example, Tgon^TM 9017, Tgon^TM 9025, Tgon^TM 9040, Tgon^TM 9070 and/or Tgon^TM 9100 synthetic graphite flakes. Table 1 below includes Tgon with a single crystal structure in the carbon plane^TM Additional details of 9000 series synthetic graphite.

In some embodiments, the thermal interface material 306 may be or may include one or more thermoelectric modules. For example, the thermoelectric module can be coupled between the heat dissipation module 304 and the top of the graphite sheet 314, In order to transfer the heat from the graphite sheet 314 to the heat dissipation module 304. In another embodiment, the thermal interface material 306 can be coupled between the thermoelectric module and the holder 302, between the thermoelectric module and the heat dissipation module 304, between the thermoelectric module and the graphite sheet 314, etc., Between the top of the holder 302 and the graphite sheet 314, etc., to increase the thermal conductivity along the heat transfer path from the holder 302 to the thermoelectric module to the heat dissipation module 304.

The thermoelectric module can be any suitable module that can transfer heat between its opposite sides when a voltage is applied. The thermoelectric module may have a cold side oriented toward the holder 302 and a hot side oriented toward the heat dissipation module 304. The cold side of the thermoelectric module can be in direct contact with the top side of the holder 302; it can be in thermal contact with the top side of the holder 302 via the thermal interface material 306 and/or the graphite sheet 314. Similarly, the hot side of the thermoelectric module can be in direct contact with the heat dissipation module 304; it can be in thermal contact with the heat dissipation module 304 via the thermal interface material 306 and/or the graphite sheet 314.

Figure 10 shows an exemplary embodiment of a QSFP transceiver 400 (in a broad sense, a device) and a thermal management component 420 embodying one or more aspects of the present invention. As shown in FIG. 10, the transceiver 400 includes a holder 402 (in a broad sense, a housing) adapted to receive the connector 416. Although FIG. 10 shows that the thermal management component 420 is used with the QSFP transceiver 400, the thermal management component 420 can be used with other transceivers (eg, SFP transceivers, SFP+ transceivers, XFP transceivers, QSFP+ transceivers, etc.) with a configuration It is used with other devices (for example, memory card reader, etc.) that are used with other objects (for example, memory card, etc.) other than cable connectors or the like. Therefore, aspects of the present invention should not be limited to use with any one particular type of device.

The graphite sheet 414 (in a broad sense, a heat sink) is wound (in a broad sense, arranged) around the end portion 422 of the thermal management assembly 420. The graphite sheet 414 is wound around the end portion 422 in a direction substantially parallel to the direction in which the connector 416 is slidably inserted into and removed from the holder 502.

The end portion 422 may be defined by one or more portions of the thermal management component 420. For example, the thermal management component 422 can include a first or top portion 424 that defines an end portion 422. The thermal management component 420 may also include a second or bottom portion, which is coupled to the top portion 424 and is substantially disposed at Below the top portion 424. The bottom portion may include one or more features (e.g., rounded or curved edges or lip portions, etc.) to facilitate when the connector 416 is slidably inserted into or removed from the holder 402 416 slides under the bottom part.

The thermal management component 420 may include one or more spring contacts configured to provide mechanical or spring pressure (eg, set size, set shape, formed of an elastic material, etc.) for biasing the lower portion of the graphite sheet 414 against the connection The top of the connector 416 and/or is in good thermal contact with the top of the connector 416, and is used to bias the upper part of the graphite sheet 414 against another surface (for example, thermal interface material, etc.) and/or in good thermal contact with the other surface. get in touch with. In turn, this can improve the thermal contact between the top of the connector 416 and the lower part of the graphite sheet 414 and between the upper part of the graphite sheet 414 and the other surface. The spring contact of the thermal management assembly 420 may be similar or equivalent to the spring contact 108 shown in FIGS. 1 to 5 and/or the spring contact 308 shown in FIGS. 7 to 9.

The top portion 424, the bottom portion, and/or the spring contacts may be made of metal (for example, stainless steel, etc.) or other suitable thermally conductive materials. The top portion 424 may further include a latch member 426 (in a broad sense, an engagement member) configured to extend downward along the side wall of the holder 402. The latch member 426 may include a latch surface and an opening to enable the top portion 424 to be latched to the corresponding structure 428 of the holder 402. Alternatively, other methods of mechanically coupling the top portion 424 to the cage 402 may be used in other exemplary embodiments.

Although FIG. 10 shows the top portion 424 as a single piece, other exemplary embodiments may include more than one top portion 424 that spans the top of the cage 402. Similarly, FIG. 10 shows a single graphite sheet 414 wound around the end portion 424. Alternative embodiments may include one or more additional graphite sheets wrapped around other parts of the thermal management assembly 420. For example, one or more graphite sheets may be wrapped around and opposite to the end portion 430 and/or the middle portion 432 of the thermal management assembly 420.

The thermal management component 420 may be configured to diffuse and transfer heat from the connector 416 (in a broad sense, a heat source) to one or more other components, such as a housing or holder 402, a heat dissipation module, a thermal interface material, Thermoelectric modules, radiators, heat sinks, etc. For example, the thermal management component 420 may be configured to directly diffuse and transfer heat from the connector 416 or another heat source (for example, an integrated circuit, etc.) to an external heat dissipation module (for example, a heat dissipation module with fins, etc.) , As shown in Figure 18. Alternatively, for example, the thermal management component 420 may be configured to diffuse and transfer heat from the connector 416 (or other heat source) to the heat dissipation module via the thermal interface material. See, for example, the heat dissipation modules 104, 304 and the thermal interface materials 106, 306 described herein and shown in FIGS. 1, 3, 5, 6, 8, and 9.

Therefore, the thermal management component 420 may include or be used with one or more external heat dissipation modules and/or one or more thermal interface materials (TIM), as described herein. Similar to those shown in FIGS. 3 and 5, a thermal interface material (TIM) may be roughly positioned (eg, coupled in thermal contact, etc.) between the graphite sheet 414 and the external heat dissipation module. In this case, the TIM can be used to more effectively transfer heat from the graphite sheet 414 to the external heat dissipation module.

Figure 12 shows an exemplary embodiment of a QSFP transceiver 500 (in a broad sense, a device) and a thermal management component 520 embodying one or more aspects of the present invention. As shown in FIG. 12, the transceiver 500 includes a holder 502 (in a broad sense, a housing) adapted to receive a connector. Although FIG. 12 shows that the thermal management component 520 is used with the QSFP transceiver 500, the thermal management component 520 can be used with other transceivers (for example, SFP transceivers, SFP+ transceivers, XFP transceivers, QSFP+ transceivers, etc.) with a configuration It is used with other devices (for example, memory card reader, etc.) that are used with other objects (for example, memory card, etc.) other than cable connectors or the like. Therefore, aspects of the present invention should not be limited to use with any one particular type of device.

The first and second graphite sheets 514 (in a broad sense, heat sink) are wound (in a broad sense, arranged) around the portion 534 of the thermal management assembly 520. The first graphite sheet 514 and the second graphite sheet 514 are wound around the portion 534 in a direction substantially parallel to the direction in which the connector will be slidably inserted into and removed from the holder 502. In other words, the first graphite sheet 514 and the second graphite sheet 514 are wound around the portion 534 in a direction substantially parallel to the length of the holder 502.

The first graphite sheet 514 and the second graphite sheet 514 extend through the corresponding first opening 536, second opening 538, and third opening 540 (e.g., slots, etc.) of the thermal management assembly 520. The first opening 536 and the second opening 538 are adjacent to the opposite end portions 522 and 530 of the thermal management component 520. The third opening 540 is located approximately in the middle of the thermal management component 520 and between the openings 536 and 538.

The third opening 540 may be wide enough to allow portions of the first graphite sheet 514 and the second graphite sheet 514 to pass through the same third opening 540. As shown in FIGS. 12 and 13, the portions of the first graphite sheet 514 and the second graphite sheet 514 that pass through the third opening 540 may be spaced apart from each other by a gap or an interval distance.

The portion 534 and the openings 536, 538, and 540 may be defined by one or more portions of the thermal management component 520. For example, the thermal management component 520 may include a first or top portion 524 that defines a portion 534 and openings 536, 538, and 540. The thermal management component 520 may also include a second or bottom portion that is coupled to the top portion 524 and disposed generally below the top portion 524. The bottom portion may include one or more features (for example, rounded or curved edges or lip portions, etc.) to facilitate the connector under the bottom portion when the connector is slidably inserted into or removed from the cage 502 Of sliding.

The thermal management component 520 may include one or more spring contacts configured to provide mechanical or spring pressure (eg, set size, set shape, formed of an elastic material, etc.) for biasing the lower portion of the graphite sheet 514 against the connection The top of the connector and/or the top of the connector are in good thermal contact, and is used to bias the upper portion of the graphite sheet 514 against another surface (eg, thermal interface material, etc.) and/or in good thermal contact with the other surface. In turn, this can improve the thermal contact between the top of the connector and the lower part of the graphite sheet 514 and between the upper part of the graphite sheet 514 and the other surface. The spring contact of the thermal management component 520 may be similar or equivalent to the spring contact 108 shown in FIGS. 1 to 5 and/or the spring contact 308 shown in FIGS. 7 to 9.

The top portion 524, the bottom portion, and/or the spring contacts may be made of metal (for example, stainless steel, etc.) or other suitable thermally conductive materials. The top portion 524 may further include a latch member 526 (in a broad sense, an engagement member) configured to extend downward along the side wall of the holder 502. The latching member 526 may include a latching surface and an opening to enable the top portion 524 to be latched to the corresponding structure 528 of the holder 502. Can Alternatively, other methods of mechanically coupling the top portion 524 to the cage 502 may be used in other exemplary embodiments.

The thermal management component 520 may be configured to diffuse heat from the connector in the cage 502 and transfer it to one or more other components, such as the housing or cage 502, heat dissipation module, thermal interface material, thermoelectric module, heat dissipation Device, heat sink, etc. For example, the thermal management component 520 may be configured to directly diffuse and transfer heat from a connector or other heat source (for example, an integrated circuit, etc.) to an external heat dissipation module (for example, a heat dissipation module with fins, etc.), as shown in FIG. 18 shown. Alternatively, for example, the thermal management component 520 may be configured to diffuse and transfer heat from the connectors in the cage 502 to the heat dissipation module via the thermal interface material. See, for example, the heat dissipation modules 104, 304 and the thermal interface materials 106, 306 described herein and shown in FIGS. 1, 3, 5, 6, 8, and 9.

Therefore, the thermal management component 520 may include or be used with one or more external heat dissipation modules and/or one or more thermal interface materials (TIM), as described herein. Similar to those shown in FIGS. 8 and 9, a thermal interface material (TIM) may be roughly positioned (eg, coupled in thermal contact, etc.) between the graphite sheet 514 and the external heat dissipation module. In this case, the TIM can be used to more effectively transfer heat from the graphite sheet 514 to the external heat dissipation module.

Figure 14 shows an exemplary embodiment of a QSFP transceiver 600 (in a broad sense, a device) and a thermal management component 620 embodying one or more aspects of the present invention. As shown in FIG. 14, the transceiver 600 includes a holder 602 (in a broad sense, a housing) adapted to receive a connector. Although FIG. 14 shows that the thermal management component 620 is used with the QSFP transceiver 600, the thermal management component 620 can be used with other transceivers (for example, SFP transceivers, SFP+ transceivers, XFP transceivers, QSFP+ transceivers, etc.) with a configuration It is used with other devices (for example, memory card reader, etc.) that are used with other objects (for example, memory card, etc.) other than cable connectors or the like. Therefore, aspects of the present invention should not be limited to use with any one particular type of device.

The first and second graphite sheets 614 (in a broad sense, heat sink) are wound (in a broad sense, arranged) in the heat Around the corresponding first and second parts 634 of the management component 620. The first graphite sheet 614 and the second graphite sheet 614 are wound around the first part 634 and the second part 634 in a direction substantially parallel to the direction in which the connector will be slidably inserted into and removed from the holder 602. In other words, the first graphite sheet 614 and the second graphite sheet 614 are wound around the first part 634 and the second part 634 in a direction substantially parallel to the length of the holder 602.

In this exemplary embodiment, the first and second portions 634 are defined by the first or second top portion 624 of the thermal management assembly 620. The first top portion 624 and the second top portion 624 and the first graphite sheet 614 and the second graphite sheet 614 may be configured (for example, set size, set shape, set position, etc.) such that the first graphite sheet 614 and the second graphite sheet 614 The adjacent end portions of the sheet 614 are in thermal contact with each other, for example, there is no perceptible gap, no significant separation distance, and/or there is a substantially zero gap between the two.

The thermal management assembly 620 may also include one or more bottom portions that are coupled to the top portion 624 and disposed generally below the top portion 624. The bottom portion may include one or more features (for example, rounded or curved edges or lip portions, etc.) to facilitate when the connector is slidably inserted into or removed from the holder 602 Slide under the bottom part.

The thermal management assembly 620 may include one or more spring contacts configured to provide mechanical or spring pressure (eg, set size, set shape, formed of elastic material, etc.) for biasing the lower portion of the graphite sheet 614 against the connection The top of the connector and/or the top of the connector are in good thermal contact, and is used to bias the upper part of the graphite sheet 614 against another surface (eg, thermal interface material, etc.) and/or in good thermal contact with the other surface. In turn, this can improve the thermal contact between the top of the connector and the lower part of the graphite sheet 614 and between the upper part of the graphite sheet 614 and the other surface. The spring contact of the thermal management component 620 may be similar or equivalent to the spring contact 108 shown in FIGS. 1 to 5 and/or the spring contact 308 shown in FIGS. 7 to 9.

The first top portion 624 and the second top portion 624, the bottom portion, and/or the spring contact member may be made of metal (for example, stainless steel, etc.) or other suitable thermally conductive materials. The first top portion 624 and the second top portion 624 may also include a latch mechanism configured to extend downward along the side wall of the holder 602 Piece 626 (in a broad sense, joining member). The latch member 626 may include a latch surface and an opening to enable the top portion 624 to be latched to the corresponding structure 628 of the holder 602. Alternatively, other methods of mechanically coupling the top portion 624 to the cage 602 may be used in other exemplary embodiments.

The thermal management component 620 may be configured to diffuse heat from the connector in the cage 602 and transfer it to one or more other components, such as the housing or cage 602, heat dissipation module, thermal interface material, thermoelectric module, heat dissipation Radiator, heat sink, etc. For example, the thermal management component 620 may be configured to directly diffuse and transfer heat from a connector or other heat source (for example, an integrated circuit, etc.) to an external heat dissipation module (for example, a heat dissipation module with fins, etc.), as shown in FIG. 18 shown. Alternatively, for example, the thermal management component 620 may be configured to diffuse heat from the connector in the holder 602 and transfer to the heat dissipation module via the thermal interface material. See, for example, the heat dissipation modules 104, 304 and the thermal interface materials 106, 306 described herein and shown in FIGS. 1, 3, 5, 6, 8, and 9.

Therefore, the thermal management component 620 may include or be used with one or more external heat dissipation modules and/or one or more thermal interface materials (TIM), as described herein. Similar to those shown in FIGS. 8 and 9, a thermal interface material (TIM) may be roughly positioned (eg, coupled in thermal contact, etc.) between the graphite sheet 614 and the external heat dissipation module. In this case, the TIM can be used to more effectively transfer heat from the graphite sheet 614 to the external heat dissipation module.

Figure 16 shows an exemplary embodiment of a QSFP transceiver 700 (in a broad sense, a device) and a thermal management component 720 embodying one or more aspects of the present invention. As shown in FIG. 16, the transceiver 700 includes a holder 702 (in a broad sense, a housing) adapted to receive a connector. Although FIG. 16 shows that the thermal management component 720 is used with the QSFP transceiver 700, the thermal management component 720 can be used with other transceivers (for example, SFP transceivers, SFP+ transceivers, XFP transceivers, QSFP+ transceivers, etc.) with a configuration Used with other devices (for example, memory card readers, etc.) that are used with other objects (for example, memory cards, etc.) other than cable connectors or the like. Therefore, aspects of the present invention should not be limited to use with any one particular type of device.

The graphite sheet 714 (in a broad sense, a heat sink) is wound (in a broad sense, arranged) around a portion of the thermal management assembly 720 in different non-parallel directions. More specifically, this exemplary embodiment includes first and second (or end) portions 742, 744 of the same/single graphite sheet 714, which will be slidably inserted into the retainer 702 and from the retainer approximately parallel to the connector The frame 702 is wound around the opposite end portions 722 and 730 of the thermal management component 720 respectively in the direction in which the frame 702 is removed. In other words, the first portion 742 and the second portion 744 of the same/single graphite sheet 714 are wound approximately around the opposite ends 722, 730 of the thermal management assembly 720 in a direction approximately parallel to the length of the holder 702, respectively.

Also in this exemplary embodiment, the third and fourth (or middle) portions 746 and 748 of the same/single graphite sheet 714 are substantially in a direction that is not parallel to the winding direction of the first and second portions 742 and 744. Wrap around the middle portion 734 of the thermal management assembly 720. The third portion 746 and the fourth portion 748 of the same/single graphite sheet 714 generally surround the middle of the thermal management assembly 720 in a direction generally perpendicular to the direction in which the connector will be slidably inserted into and removed from the holder 702 The part 734 is wound. In other words, the third portion 746 and the fourth portion 748 of the same/single graphite sheet 714 are wound approximately around the middle portion 734 of the thermal management assembly 720 in a direction approximately perpendicular to the length of the holder 702.

The opposing end portions 722, 730 and the middle portion 734 may be defined by one or more portions of the thermal management component 720. For example, the thermal management component 720 may include a first or top portion 724 that defines portions 722, 730, 734. The thermal management component 720 may also include a second or bottom portion that is coupled to the top portion 724 and disposed generally below the top portion 724. The bottom portion may include one or more features (for example, rounded or curved edges or lip portions, etc.) to facilitate the connector under the bottom portion when the connector is slidably inserted into or removed from the cage 702 Of sliding.

The thermal management component 720 may include one or more spring contacts configured (eg, set size, set shape, formed of an elastic material, etc.) to provide mechanical or spring pressure for biasing the lower portion of the graphite sheet 714 against the connection The top of the connector and/or the top of the connector is in good thermal contact, and is used to bias the upper part of the graphite sheet 714 against another surface (for example, thermal interface material, etc.) and/or in good thermal contact with the other surface get in touch with. In turn, this can improve thermal contact between the top of the connector and the lower part of the graphite sheet 714 and between the upper part of the graphite sheet 714 and the other surface. The spring contact of the thermal management component 720 may be similar or equivalent to the spring contact 108 shown in FIGS. 1 to 5 and/or the spring contact 308 shown in FIGS. 7 to 9.

The top portion 724, the bottom portion 710, and/or the spring contacts may be made of metal (for example, stainless steel, etc.) or other suitable thermally conductive materials. The top portion 724 may further include a latch member 726 (in a broad sense, an engagement member) configured to extend downward along the side wall of the holder 702. The latch member 726 may include a latch surface and an opening to enable the top portion 724 to be latched to the corresponding structure 728 of the holder 702. Alternatively, other methods of mechanically coupling the top portion 724 to the cage 702 may be used in other exemplary embodiments.

The thermal management component 720 can be configured to diffuse heat from the connector in the cage 702 and transfer it to one or more other components, such as the housing or cage 702, heat dissipation module, thermal interface material, thermoelectric module, heat dissipation Radiator, heat sink, etc. For example, the thermal management component 720 may be configured to directly diffuse and transfer heat from a connector or other heat source (for example, an integrated circuit, etc.) to an external heat dissipation module (for example, a heat dissipation module with fins, etc.), such as Shown in Figure 18. Alternatively, for example, the thermal management component 720 may be configured to diffuse heat from the connectors in the cage 702 and transfer to the heat sink via the thermal interface material. See, for example, the heat dissipation modules 104, 304 and the thermal interface materials 106, 306 described herein and shown in FIGS. 1, 3, 5, 6, 8, and 9.

Therefore, the thermal management component 720 may include or be used with one or more external heat dissipation modules and/or one or more thermal interface materials (TIM), as described herein. Similar to those shown in FIGS. 3 and 5, a thermal interface material (TIM) may be roughly positioned (eg, coupled in thermal contact, etc.) between the graphite sheet 714 and the external heat dissipation module. In this case, the TIM can be used to more effectively transfer heat from the graphite sheet 714 to the external heat dissipation module.

Exemplary embodiments that include parts that wind the same/single graphite sheet (or other heat sink) in different non-parallel directions can provide the benefit that in the winding process of mass production, there is no need to Positioning portions of the graphite sheet into relatively narrow gaps, slots, or small spaces (e.g., slots 536, 538, 540 shown in Figure 12) is a challenging task. Another potential benefit is that a single graphite winding can be implemented more easily than having two graphite sheets respectively wound around two parts (for example, part 624 in Figure 14) (which may require two product lines) Manufacturing process. And if the two parts are not interchangeable, the positioning of the two parts is also not interchangeable. In this case, more attention may be required during the assembly process to ensure the correct positioning of the two components, which in turn may bring the possibility of assembly errors in mass production. With a single graphite winding, a simplified production line and/or easier graphite winding can be achieved in automated mass production. In addition, compared with multiple graphite windings that may have the possibility of rotating along its length direction, the integrated structure of a single graphite winding may have greater structural stability in actual operation to resist rotational vibration.

Figure 18 shows an overview of the simulation model used during the QSFP (Four Channel Small Form-Factor Pluggable) simulation study to use different thermal management components (specifically, the thermal management component 420 shown in Figure 10, and the thermal management component 420 shown in Figure 12). The thermal management component 620 and the thermal management component 720 shown in FIG. 16) monitor and compare the maximum heat source temperature.

For the simulation, each thermal management component 420, 620, and 720 includes graphite sheets or layers 414, 614, 714, with polyethylene terephthalate (PET) and pressure sensitive adhesive along each side of the graphite, respectively Thin layer of agent (PSA) (for example, 0.05mm thick PSA/PET layer, etc.). PET can provide graphite with increased mechanical and/or wear resistance. PSA can be used to adhere graphite to other surfaces. Also for the simulation, the graphite sheets 414, 614, 714 include Tgon with a single crystal structure in the carbon plane^TM 9000 series synthetic graphite. Table 1 below includes Tgon from Raelder Technology Co., Ltd.^TM Additional details of 9000 series synthetic graphite.

During the simulation, the power generation of the integrated circuit was 6 watts (W). The cooling method includes a fan blowing through the cooling module at a flow rate of 40 cubic feet per minute (CFM), while the rest of the system is under natural convection and radiation, and the ambient temperature (Tamb) is 22 degrees Celsius (°C).

FIG. 19 shows the result of thermal simulation using the model shown in FIG. 18 together with the wound graphite sheet 414 according to the embodiment shown in FIG. 10 and FIG. 11. As shown in Figure 19, the integrated circuit (in a broad sense, the heat source) has the highest The temperature is 73.1 degrees Celsius (°C).

FIG. 20 shows the result of thermal simulation using the model shown in FIG. 18 together with the first and second wound graphite sheets 614 according to the embodiment shown in FIG. 12 and FIG. 13. As shown in Figure 20, the maximum temperature of the integrated circuit (in a broad sense, heat source) is 63.9 degrees Celsius (°C).

FIG. 21 shows the result of a thermal simulation using the model shown in FIG. 18, together with a single graphite sheet 714 having portions wound in two non-parallel directions according to the embodiment shown in FIG. 16 and FIG. As shown in Figure 21, the maximum temperature of the integrated circuit (in a broad sense, the heat source) is 65.8 degrees Celsius (°C).

In general, the comparison of Figures 19, 20 and 21 shows the thermal performance improvement and lower maximum temperature that can be achieved by using graphite to define multiple thermal paths (for example, Figures 12 to 17, etc.), which improves thermal diffusion.

In an exemplary embodiment, a transceiver (in a broad sense, a device) (e.g., small form-factor pluggable (SFP) transceiver, SFP+ transceiver, four-channel small form-factor pluggable (QSFP) transceiver, QSFP+ transceiver, XFP transceiver Transceivers, devices other than transceivers, etc.) include a holder (in a broad sense, housing) (e.g., SFP holder, etc.) suitable for accommodating connectors (e.g., SFP cable connectors, other cable connectors, etc.). At least one of the thermal interface material and the thermoelectric module is usually between one side (for example, the top side, the other side, etc.) of the holder and the external heat dissipation module. At least one spring contact is usually coupled to the side of the cage between the connector and at least one of the thermal interface material and the thermoelectric module. The at least one spring contact and at least one of the thermal interface material and the thermoelectric module define at least a part of the thermal conduction path between the connector and the external heat sink.

The at least one spring contact may include at least four spring contacts, each of which is typically coupled to the side of the cage between the connector and the thermal interface material and/or thermoelectric module.

The transceiver may also include a metal plate coupled to the at least one spring contact. The metal plate may be substantially parallel to the side surface of the holder and contact the connector housed in the holder, thereby defining a thermally conductive heat path between the connector and the at least one spring contact. The transceiver may also include graphite, which usually Wrap around at least a part of the metal plate and the at least one spring contact. The sides of the cage may include openings. The metal plate may be positioned in the opening such that the metal plate and/or the at least one spring contact thereby define at least a part of the side surface of the cage.

The transceiver may further include a tag arranged on the holder. This label may include graphite and include markings about the transceiver.

The at least one spring contact can be coupled to the top of the cage via laser welding.

In an exemplary embodiment, at least one of the thermal interface material and the thermoelectric module is a thermoelectric module.

In another exemplary embodiment, at least one of the thermal interface material and the thermoelectric module is a thermal interface material. The transceiver may further include a thermally and electrically conductive material wound around at least a part of the thermal interface material for conducting heat from the cage and for electrically grounding the cage. The thermally conductive and electrically conductive material wound around at least a portion of the thermal interface material may include at least one of copper foil, electroplated fabric, nickel-copper nylon, graphite sheet, and synthetic graphite sheet. Polyethylene terephthalate (PET) layer for resistance and/or abrasion resistance. The thermal interface material may include ceramic and/or boron nitride filled silicon elastomer. The thermal interface material may include a surface processed so that the thermally conductive and electrically conductive material can be attached to the silicone elastomer.

In another exemplary embodiment, a transceiver (in a broad sense, a device) (e.g., a small form-factor pluggable (SFP) transceiver, an SFP+ transceiver, a four-channel small form-factor pluggable (QSFP) transceiver, a QSFP+ transceiver, XFP+ transceivers, in addition to transceivers, other devices, etc.) include a holder (in a broad sense, housing) suitable for accommodating connectors (e.g., small pluggable cable connectors, other cable connectors, etc.) (e.g., small Plug and unplug the cage, etc.). The thermal interface material is generally located between the side surface (for example, the top side, the other side, etc.) of the cage and the external heat dissipation module. Thermally conductive and electrically conductive materials surround the thermal world at least a portion of the surface of the material to be wound. The thermal interface material and the thermally and electrically conductive material define at least a part of the thermally conductive path between the holder and the external heat dissipation module. Wrapped around at least a part of the thermal interface material The thermally and electrically conductive material is operable to electrically ground the cage.

The thermally and electrically conductive material wound around at least a portion of the thermal interface material may include copper foil, electroplated fabric, nickel-copper nylon, graphite sheet, and polyethylene terephthalic acid for enhancing mechanical resistance and/or abrasion resistance. At least one of the synthetic graphite flakes of ethylene glycol (PET) layer. The thickness of the thermally and electrically conductive material wound around at least a portion of the thermal interface material may be less than about one hundred microns. The thermal interface material may include ceramic and/or boron nitride filled silicon elastomer. The thermal interface material may include a surface processed so that the thermally conductive and electrically conductive material can be attached to the silicone elastomer.

In another exemplary embodiment, a transceiver (in a broad sense, a device) (e.g., a small form-factor pluggable (SFP) transceiver, an SFP+ transceiver, a four-channel small form-factor pluggable (QSFP) transceiver, a QSFP+ transceiver, XFP+ transceivers, in addition to transceivers, other devices, etc.) include a holder (in a broad sense, housing) suitable for accommodating connectors (e.g., small pluggable cable connectors, other cable connectors, etc.) (e.g., small Plug and unplug the cage, etc.). The thermal interface material is generally located between the side surface (for example, the top side, the other side, etc.) of the holder and the external heat dissipation module. The thermally and electrically conductive material is wound around at least a portion of the thermal interface material. At least one spring contact is coupled to the top side of the cage, generally located between the connector and the thermal interface material.

The at least one spring contact, the thermal interface material, and the thermally and electrically conductive material may define at least a part of the thermally conductive path between the connector and the external heat dissipation module. The thermally and electrically conductive material wrapped around at least a portion of the thermal interface material is operable to electrically ground the cage.

The thermally and electrically conductive material wound around at least a portion of the thermal interface material may include copper foil, electroplated fabric, nickel-copper nylon, graphite sheet, and polyethylene terephthalic acid for enhancing mechanical resistance and/or abrasion resistance. At least one of the synthetic graphite flakes of ethylene glycol (PET) layer.

The transceiver may further include a thermoelectric module coupled to the thermal interface material.

The transceiver may further include a metal plate coupled to the at least one spring contact. The metal plate may be substantially parallel to the top side of the cage and contact the connector housed in the cage to thereby fix It is defined as the heat conduction path between the connector and the at least one spring contact. The transceiver may further include graphite wound generally around at least a portion of the metal plate and the at least one spring contact. The top side of the cage may include an opening. The metal plate may be located in the opening such that the metal plate and/or the at least one spring contact thus define at least a part of the top side of the cage.

It also records the use of transceivers (for example, small form-factor pluggable (SFP) transceivers, SFP+ transceivers, four-channel small form-factor pluggable (QSFP) transceivers, QSFP+ transceivers, XFP+ transceivers, etc.) The method of transferring heat from the heat source of the connector (e.g., small pluggable cable connector, other cable connector, etc.) in the housing of the device or the holder (e.g., small pluggable cage, etc.), and Components. In an exemplary embodiment, the assembly includes at least one of a thermal interface material and a thermoelectric module and at least one spring contact that may be generally positioned between the connector and at least one of the thermal interface material and the thermoelectric module. At least one of the thermal interface material and the thermoelectric module may be positioned between the at least one spring contact and the external heat dissipation module for transferring heat from the holder to the external heat dissipation module. At least one spring contact, thermal interface material, and/or thermoelectric module is operable to define at least a portion of the thermal path between the connector and the external heat dissipation module.

The at least one spring contact may include at least four spring contacts.

The assembly may further include a metal plate coupled to the at least one spring contact. The metal plate may be configured to be substantially parallel to the top side of the holder and to contact the connector housed in the holder to thereby define a thermally conductive heat path between the connector and the at least one spring contact. The assembly may further include graphite wound generally around at least a portion of the metal plate and the at least one spring contact.

Small form-factor pluggable transceivers (in a broad sense, devices) (for example, small form-factor pluggable (SFP) transceivers, SFP+ transceivers, four-channel small form-factor pluggable (QSFP) transceivers, QSFP+ transceivers, XFP+ transceivers, except Other devices of the transceiver, etc.) may include components, a small pluggable holder (in a broad sense, housing), and a small pluggable cable connector (in a broad sense, connector) located in the holder. The sides of the cage (e.g., the top side, the other side, etc.) may include openings. The metal plate can be located in the opening so that the gold The sub-plate and/or at least one spring contact thus define at least a part of the top side of the cage.

In an exemplary embodiment, at least one of the thermal interface material and the thermoelectric module is a thermoelectric module.

In another exemplary embodiment, at least one of the thermal interface material and the thermoelectric module is a thermal interface material. The assembly may further include a thermally and electrically conductive material wound around at least a portion of the thermal interface material for conducting heat from the cage and for electrically grounding the cage. The thermally and electrically conductive material wound around at least a portion of the thermal interface material may include copper foil, electroplated fabric, nickel-copper nylon, graphite sheet, and polyethylene terephthalic acid for enhancing mechanical resistance and/or abrasion resistance. At least one of the synthetic graphite flakes of ethylene glycol (PET) layer. The thermal interface material may include ceramic and/or boron nitride filled silicon elastomer. The thermal interface material may include a surface processed so that the thermally conductive and electrically conductive material can be attached to the silicone elastomer.

In another exemplary embodiment, the assembly includes a thermal interface material generally located between the top side of the cage and the external heat dissipation module. The thermally and electrically conductive material is wound around at least a portion of the thermal interface material. The thermal interface material and the thermally conductive and electrically conductive material are operable to define at least a part of the thermally conductive heat path between the holder and the external heat dissipation module. The thermally and electrically conductive material wrapped around at least a portion of the thermal interface material is operable to electrically ground the cage.

The thermally and electrically conductive material wound around at least a portion of the thermal interface material may include copper foil, electroplated fabric, nickel-copper nylon, graphite sheet, and polyethylene terephthalic acid for enhancing mechanical resistance and/or abrasion resistance. At least one of the synthetic graphite flakes of ethylene glycol (PET) layer.

The thickness of the thermally and electrically conductive material wound around at least a portion of the thermal interface material may be less than about one hundred microns.

The thermal interface material may include ceramic and/or boron nitride filled silicon elastomer. The thermal interface material may include a surface processed so that the thermally conductive and electrically conductive material can be attached to the silicone elastomer.

Small form-factor pluggable transceiver (in a broad sense, device) (for example, small form-factor pluggable (SFP) Transceivers, SFP+ transceivers, four-channel small pluggable (QSFP) transceivers, QSFP+ transceivers, XFP+ transceivers, other devices other than transceivers, etc.) may include components, small pluggable cages (in a broad sense, shell Body) and a small pluggable cable connector (in a broad sense, connector) located in the cage. The thermal interface material and the thermally conductive and electrically conductive material can define a thermally conductive path between the holder and the external heat dissipation module. The thermally and electrically conductive material wound around at least a portion of the thermal interface material can electrically ground the cage.

In an exemplary embodiment including one or more graphite flakes, the graphite flakes may include one or more Tgon^TM 9000 series graphite sheet. Tgon^TM The 9000 series graphite sheets include synthetic graphite thermal interface materials, which have a carbon in-plane single crystal structure and are ultra-thin, lightweight, flexible and provide excellent in-plane thermal conductivity. Tgon^TM The 9000 series graphite sheet can be used for a variety of thermal diffusion applications where in-plane thermal conductivity is dominant and in a limited space. Tgon^TM The 9000 series graphite sheet can have a thermal conductivity from about 600 to about 1900W/mK, which can help reduce hot spots and protect sensitive areas. The ultra-thin sheet thickness of about 17 microns to 25 microns makes the device design slim , Can have a light weight with a density from about 2.05g/cm3 to 2.25g/cm3, can be flexible and can withstand more than 10,000 deflections with a 6mm radius. Table 1 below includes information about Tgon^TM Other details of 9000 series graphite sheet.

<tables><img file="TWM592989U_D0001.tif" /></tables><tables><img file="TWM592989U_D0002.tif" /></tables>

Exemplary embodiments are provided so that this description will be thorough and fully convey the scope to those skilled in the art. Numerous specific details such as specific components, devices, and method embodiments are enumerated to provide a thorough understanding of the described embodiments. It will be obvious to those skilled in the art that the exemplary embodiments can be embodied in some different forms without using specific details, and should not be constructed to limit the scope of this description. In some exemplary embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. In addition, the benefits and improvements that can be achieved by one or more exemplary embodiments of this description are provided for illustrative purposes only, and these benefits and improvements do not limit the scope of this description, because the exemplary embodiments described herein can provide All the above-mentioned benefits and improvements or none at all provide the above-mentioned benefits and improvements and still fall within the scope of this record.

The specific dimensions, specific materials, and/or specific shapes described herein are essentially examples, and do not limit the scope of this description. The recitation of specific values and specific value ranges for a given parameter here is not an exhaustive list of other values and value ranges that can be used in one or more of the examples described herein. Moreover, it is envisioned that any two specific values used for the specific parameters described herein can define the end points of the range of values suitable for the given parameter (that is, the recording of the first value and the second value for the given parameter can be It is interpreted as stating that any value between the first value and the second value can also be adopted for a given parameter). For example, if the parameter X is exemplified here as having the value A and is also exemplified as having the value Z, it is envisioned that the parameter X may have a value range from about A to about Z. Similarly, the description of two or more value ranges (regardless of whether such ranges are nested, overlapping, or different) intended for the parameter includes the values clamped by the end points of the range that can be used. All possible combinations of ranges. For example, if the parameter X is exemplified here as having a value in the range 1-10 or 2-9 or 3-8, it is also envisioned that the parameter X may have values including 1-9, 1-8, 1-3, 1-2 , 2-10, 2-8, 2-3, 3-10 And other value ranges from 3-9.

The terminology used herein is for the purpose of describing specific example embodiments only and is not intended to be limiting. For example, when inclusive phrases such as "may include" are used, at least one embodiment includes the features described above. As used herein, the singular form "a" may be intended to also include the plural form, unless the context clearly dictates otherwise. The terms "including" and "having" are inclusive and therefore specify the existence of the recited features, integers, steps, operations, elements, and/or components, but do not exclude one or more other features, integers, steps, operations, elements, The presence or addition of components and/or groups thereof. The method steps, processes, and operations described herein are not to be interpreted as necessarily requiring their execution in the specific order discussed or illustrated, unless specifically identified as an execution order. It is also understood that additional or alternative steps may be employed.

When an element or layer is referred to as being "on", "bonded to", "connected to" or "coupled to" another element or layer, the element or layer can be directly on the other element or layer On, directly engaged, connected or coupled to another element or layer, or intervening elements or layers may be present. On the contrary, when an element is referred to as being "directly on" another element or layer, "directly joined to", "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. . Other words used to describe the relationship between elements should be interpreted in the same style (for example, "between" and "directly between", "adjacent" For "directly adjacent" etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The term "approximately" when applied to a value indicates that the calculation or measurement allowable value is slightly imprecise (approximately accurate in value; approximately or reasonably close to the value; almost). If for some reason, the imprecision provided by "about" is not otherwise understood in the art in its ordinary sense, then "about" as used herein indicates at least a change that may be caused by ordinary measurement methods or the use of such parameters . For example, the terms "substantially", "approximately" and "approximately" may be used herein to mean within manufacturing tolerances.

Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms system. These terms can only be used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first", "second" and other numerical terms when used herein do not imply an order unless the context clearly dictates it. Thus, a first element, component, region, layer or section may be referred to as a second element, component, region, layer or section without departing from the teachings of the example embodiments.

Spatially relative terms (such as "inner", "outer", "below", "below", "lower", "above", "upper", etc.) are used here for the convenience of description and can be used to describe one as illustrated in the drawings. The relationship of an element or feature to another element or feature. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is turned over, elements described as "below" or "beneath" other elements or features will be oriented "above" the other elements or features. Thus, the example term "below" can encompass both above and below orientations. The device can be oriented in other ways (rotated by 90 degrees or in other orientations), and therefore explain the spatially relative descriptors used here.

The foregoing description of the embodiments has been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit this record. The individual elements, intended or stated uses or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable under appropriate circumstances, and can be used in the selected embodiment (even if the embodiment is not specifically shown or described). The same way can be changed in many ways. Such changes are not considered as deviations from this record, and all such modifications are intended to be included in the scope of this record.