Testing device and testing system

Test device and test system

TESTING DEVICE AND TESTING SYSTEM

The present invention relates to a test device, a test system and a test method, and a test device, a test system and a test for a wireless module using a non-contact technique. method.

Wireless modules (for example: mmWave RF wireless module) can use over the air (OTA) for testing. Such a test can be performed in a testing room (or testing chamber), in which (for example, on its internal surface) a plurality of absorbers are placed. The volume of such a test room (or test room) is quite large. For example, the size can be 6 meters (m)×6m×6m, or 60 centimeters (cm)×60cm×60cm. In addition, this type of test may take a long time. Therefore, this kind of test may not be suitable for testing mass production devices, that is, this kind of test is not suitable as a part of a mass production process or a mass production process.

According to one aspect, in some embodiments, a testing device includes a testing socket, a first transmission medium, and a second transmission medium. The test base defines a radiation space. The first transmission medium The mass is placed in the propagation space of the test base. The first transmission medium is used to support a device under test (DUT). The second transmission medium is arranged in the propagation space of the test base.

According to another aspect, in some embodiments, a test device includes a test base and a device holder. The test base has an inner surface defining a propagation space. The inner surface of the test base is a wave absorbing surface. The device holder is placed in the propagation space of the test base. The device holder defines a receiving space for receiving the device under test (DUT).

According to another aspect, in some embodiments, a test system includes a test device, a circuit board, a tester, and a sub-system. The test device includes a test base, a first transmission medium and a second transmission medium. The test base defines a propagation space. The first transmission medium is arranged in the propagation space of the test base. The first transmission medium is used to support a device under test (DUT). The second transmission medium is arranged in the propagation space of the test base. The circuit board is placed above the test base and is configured to be electrically connected to the DUT. The tester is arranged under the test base and is electrically connected to the circuit board. The subsystem includes an intermediate apparatus and an up/down converter. The intermediate device communicates with the device under test. The frequency up/down converter is electrically connected to the intermediate device and the tester. The frequency up/down converter is used to reduce or increase the frequency of a signal.

According to another aspect, in some embodiments, a testing method includes: (a) providing a test board and a device under test (DUT), the device under test (DUT) including a first surface and the first surface The second surface opposite to the surface and a plurality of electrical contacts arranged adjacent to the first surface; (b) applying suction on the first surface of the device under test (DUT) to make the DUT electrical The sexual contact is electrically connected to the test board; and (c) providing a subsystem, wherein the subsystem includes an intermediate device and an up/down converter, and the intermediate device communicates with the device under test (DUT), The frequency up/down converter is electrically connected to the intermediate device and a tester, and the frequency up/down converter is used to reduce or increase the frequency of a signal.

<p>1Test device</p><p>1aTest device</p><p>1bTest device</p><p>1cTest device</p><p>1dTesting device</p><p>1eTest device</p><p>1gTesting device</p><p>2Device bracket</p><p>2aDevice bracket</p><p>2bDevice bracket</p><p>2cDevice bracket</p><p>2eDevice bracket</p><p>2gDevice bracket</p><p>3Test System</p><p>3'Test System</p><p>3aTest System</p><p>3bTest System</p><p>3cTest System</p><p>3eTest System</p><p>3fTest System</p><p>3gTest System</p><p>4Device Under Test (DUT)</p><p>4aDevice Under Test (DUT)</p><p>4bDevice Under Test (DUT)</p><p>4cDevice Under Test (DUT)</p><p>7Subsystem</p><p>7aSubsystem</p><p>10Air</p><p>12Test base</p><p>12aTest base</p><p>12dTest base</p><p>14Absorber</p><p>14aAbsorber</p><p>21Accepting part</p><p>21bReceiving part</p><p>22Extension</p><p>22bExtended part</p><p>23Accommodating space</p><p>23bAccommodating space</p><p>23eAccommodating space</p><p>24Upper opening</p><p>25Support column</p><p>30Transporting arm</p><p>30'Transporting arm</p><p>32Chuck</p><p>34Top circuit board</p><p>35Connecting base</p><p>36Top absorber</p><p>38Tester</p><p>41First Surface</p><p>42Second Surface</p><p>43Substrate</p><p>44Electrical components</p><p>45Package body</p><p>46antenna</p><p>47Side surface</p><p>50Bottom circuit board</p><p>50'Bottom circuit board</p><p>52Board reinforcement</p><p>61The first measurement module</p><p>61aFirst measurement module</p><p>62Second measurement module</p><p>62aSecond measurement module</p><p>63The third measurement module</p><p>63aThe third measurement module</p><p>64Fourth measurement module</p><p>64aFourth measurement module</p><p>65Fifth measurement module</p><p>65aFifth measurement module</p><p>71Intermediate equipment</p><p>71aIntermediate equipment</p><p>72Up/Down Converter</p><p>80Airflow</p><p>82Connector</p><p>84Electrical connection components</p><p>86Adapter board</p><p>88Electrical connection components</p><p>121Sidewall</p><p>121a side wall</p><p>122Bottom wall</p><p>122aBottom wall</p><p>123Communication space</p><p>123aCommunication Space</p><p>124Inner surface</p><p>124aInner surface</p><p>125Top opening</p><p>127Slot</p><p>127aSlot</p><p>128Vent</p><p>129Test base</p><p>130Accommodating space</p><p>141First opening</p><p>141aFirst opening</p><p>142Second opening</p><p>142aSecond opening</p><p>143The third opening</p><p>143aThird opening</p><p>144Fourth opening</p><p>144aFourth opening</p><p>145Fifth opening</p><p>146Vent</p><p>211The first signal transmission part</p><p>211bThe first signal transmission part</p><p>212Second signal transmission part</p><p>212bSecond signal transmission part</p><p>221bPart One</p><p>222bPart Two</p><p>321Suction</p><p>341First terminal</p><p>351Test Probe</p><p>381Third terminal</p><p>382Digital Signal Processor (DSP) Circuit</p><p>383Power Supply</p><p>384Test computer</p><p>431Electrical contact</p><p>432Free Zone</p><p>461First radiation source/receiver</p><p>462Second radiator/receiver</p><p>463Third radiation source/receiver</p><p>464Fourth radiation source/receiver</p><p>465Fifth radiation source/receiver</p><p>501Second terminal</p><p>502Hole</p><p>502aHole</p><p>611Inner surface</p><p>611aFirst surface</p><p>612First antenna</p><p>621Inner surface</p><p>621aSecond surface</p><p>622second antenna</p><p>631Inner surface</p><p>631aThird surface</p><p>632third antenna</p><p>641Fourth surface</p><p>641aFourth surface</p><p>642Fourth antenna</p><p>651aFifth surface</p><p>652Fifth antenna</p><p>661First connector</p><p>661aFirst connector</p><p>662Second connector</p><p>662aSecond connector</p><p>663Third connector</p><p>663aThird connector</p><p>664Fourth connector</p><p>665Fifth connector</p><p>671First fixed cover</p><p>672Second fixed cover</p><p>673Third fixed cover</p><p>674Fourth fixed cover</p><p>675Fifth fixed cover</p><p>710Switch control circuit</p><p>710aPower Combiner Circuit</p><p>711First input port</p><p>712Second input port</p><p>713Third input port</p><p>714Fourth input port</p><p>715Fifth input port</p><p>716Output port</p><p>1211Upper surface</p><p>1211aUpper surface</p><p>1261First receiving opening</p><p>1261aFirst receiving opening</p><p>1262Second receiving opening</p><p>1262aSecond receiving opening</p><p>1263The third receiving opening</p><p>1263aThe third receiving opening</p><p>1264Fourth receiving opening</p><p>1264aFourth receiving opening</p><p>1265Fifth receiving opening</p><p>1265aFifth receiving opening</p><p>1291Sidewall</p><p>1292Bottom Wall</p><p>2111Side opening</p><p>2112Part of the first band</p><p>2121Lower opening</p><p>2121bLower opening</p><p>2122Second band part</p>

When read together with the drawings, the aspects of some embodiments of the present invention can be easily understood from the following detailed description. It should be noted that various structures may not be drawn to scale, and the size of various structures can be increased or decreased arbitrarily for clarity of discussion.

Figure 1 illustrates a cross-sectional view of a testing device according to some embodiments of the present invention.

FIG. 2 illustrates a top view of the testing device shown in FIG. 1. FIG.

FIG. 3 illustrates a cross-sectional view of the device holder of the test device of FIG. 1. FIG.

Fig. 4 illustrates a perspective view of the device holder shown in Fig. 3.

Figure 5 illustrates a cross-sectional view of a device holder according to some embodiments of the present invention.

FIG. 6 illustrates a perspective view of the device holder shown in FIG. 5. FIG.

Fig. 7 illustrates a perspective view of the test base of the test device of Fig. 1, in which the first connector, the second connector, and the third connector are omitted.

Figure 8 illustrates an exploded view of the test base of Figure 7;

Figure 9 illustrates a cross-sectional view of a testing system according to some embodiments of the present invention.

Figure 10 illustrates a perspective view of a DUT according to some embodiments of the present invention.

Figure 11 illustrates one or a plurality of stages of the test method according to some embodiments of the present invention.

Figure 12 illustrates one or a plurality of stages of the test method according to some embodiments of the present invention.

FIG. 13 illustrates a schematic circuit diagram for executing the first operation method and the second operation method of the test system according to some embodiments of the present invention.

FIG. 14 illustrates a schematic circuit diagram for performing a third operation method of the test system according to some embodiments of the present invention.

FIG. 15 illustrates a schematic circuit diagram for executing a fourth operation method of the test system according to some embodiments of the present invention.

Figure 16 illustrates a schematic diagram of a testing system according to some embodiments of the present invention.

Figure 17 illustrates a cross-sectional view of a testing system according to some embodiments of the present invention.

Fig. 18 is an exploded cross-sectional view of the test system of Fig. 17;

Fig. 19 is an exploded perspective view illustrating the testing device of Figs. 17 and 18;

Figure 20 illustrates a cross-sectional view of a testing system according to some embodiments of the present invention.

FIG. 21 illustrates a perspective view of the device holder of FIG. 20. FIG.

Figure 22 illustrates a cross-sectional view of a testing system according to some embodiments of the present invention.

FIG. 23 illustrates a perspective view of the device holder of FIG. 22. FIG.

Figure 24 illustrates a cross-sectional view of a testing system according to some embodiments of the present invention.

Figure 25 illustrates a cross-sectional view of a testing system according to some embodiments of the present invention.

Figure 26 illustrates a perspective view of a DUT according to some embodiments of the present invention.

Figure 27 illustrates a bottom perspective view of a DUT according to some embodiments of the present invention.

Figure 28 illustrates a bottom perspective view of a DUT according to some embodiments of the present invention.

Figure 29 illustrates a cross-sectional view of a testing system according to some embodiments of the present invention.

Figure 30 illustrates a cross-sectional view of a testing system according to some embodiments of the present invention.

<b>Cross reference to related applications</b>

This application claims priority to the U.S. Provisional Patent Application No. 62/591,674 filed on November 28, 2017 and the U.S. Formal Patent Application No. 16/184,879 filed on November 8, 2018. The U.S. The provisional patent application and the formal patent application are hereby expressly incorporated herein by reference in their entirety.

Common reference numbers are used throughout the drawings and detailed description to indicate the same or similar components. The embodiments of the present invention will be easier to understand from the following detailed description in conjunction with the accompanying drawings.

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to reveal certain aspects of the present invention. Of course, these are only examples and are not intended to be limiting. For example, forming the first feature on or on the second feature in the following description may include embodiments in which the first feature and the second feature are formed or arranged in direct contact, and may also include An embodiment in which an additional feature is formed or arranged between the first feature and the second feature so that the first feature and the second feature may not directly contact. In addition, the present invention may repeat reference numbers and/or letters in various examples provided herein. This repetition is for simplicity and clarity and does not in itself indicate the relationship between the various embodiments and/or configurations discussed.

In the comparative test procedure, the device under test (DUT) may have a first surface and a second surface opposite to the first surface. The DUT may include a plurality of solder bumps and antennas. The solder bumps can be arranged on the first surface, and the antenna can be arranged on the second surface. During the testing procedure, the testing fixture picks up the DUT from the second surface of the DUT. Therefore, the hard material (such as metal material) of the test fixture may contact the antenna on the second surface. Therefore, the efficiency of the antenna is adversely affected (for example, through the deformation of the antenna).

If the DUT includes multiple antennas, the antennas of the DUT can transmit signals from different directions. However, the test antenna used to receive the signal from the antenna of the DUT may be located at a fixed location. Therefore, during the test, the test fixture and the DUT can be rotated 360 degrees so that all signals from the DUT can be received by the test antenna. It may be difficult to design this test fixture. In addition, if the DUT is a radio frequency (RF) AiP with a frequency of 25 GHz to 80 GHz, the frequency of the high-frequency signal from the antenna to the frequency that can be tested by the tester is reduced. The number of up/down converters is equal to the number of antennas. Therefore, if the DUT includes multiple antennas, the same number of up/down converters are required. Therefore, the test cost is increased.

This model provides a testing device for production line during mass production. In some embodiments, the test device includes a first transmission medium and a second transmission medium disposed in the transmission space of the test base. At least some embodiments of the present invention provide a test method that provides suction on the first surface of the DUT so that the electrical contacts on the first surface of the DUT are electrically connected to the test board.

Figure 1 illustrates a cross-sectional view of a testing device 1 according to some embodiments of the present invention. FIG. 2 illustrates a top view of the testing device 1 shown in FIG. 1. It should be noted that FIG. 1 is a cross-sectional view along the line II in FIG. 2. The testing device 1 includes a testing socket 12, a first transmission medium (including, for example, a device holder 2), a second transmission medium (including, for example, air 10), and an absorber. ) 14. A plurality of measurement modules (including, for example, a first measurement module 61, a second measurement module 62, and a third measurement module 63).

The test base 12 defines a radiation space 123, a top opening 125, and a plurality of accommodating openings (including, for example, a first accommodating opening 1261, a second accommodating opening 1262, and a third accommodating opening 1263). The propagation space 123 is located between the top opening 125 and the receiving opening (including, for example, the first receiving opening 1261, the second receiving opening 1262, and the third receiving opening 1263). Propagation space 123, top opening 125 and receiving opening (including example For example, the first accommodating opening 1261, the second accommodating opening 1262, and the third accommodating opening 1263) communicate with each other. In some embodiments, the test base 12 includes one or more side walls 121 (for example, four side walls 121) and a bottom wall 122. The corresponding top portion of the side wall 121 may define a top opening 125. The side wall 121 may be connected to the bottom wall 122 to define the propagation space 123. Each of the side walls 121 may define a receiving opening (including, for example, the first receiving opening 1261 and the second receiving opening 1262). The bottom wall 122 may define a receiving opening (including, for example, a third receiving opening 1263). Each of the side walls 121 (for example, the four side walls 121) and the bottom wall 122 have an inner surface 124. Therefore, the side walls 121 (for example, the four side walls 121) and the inner surface 124 of the bottom wall 122 define the propagation space 123.

As shown in FIG. 1, the first receiving opening 1261 and the second receiving opening 1262 may be located at the top of the side wall 121 and may penetrate through the side wall 121. The third receiving opening 1263 can be located in the center of the bottom wall 122 and can penetrate the bottom wall 122. The width of the top opening 125 is greater than the width of the third receiving opening 1263 (for example, about 2 times or more, about 4 times or more, or about 6 times or more). In some embodiments, the side wall 121 and the bottom wall 122 are independent walls, which are assembled together by, for example, screws. In some embodiments, the side wall 121 and the bottom wall 122 may be integrally formed as a single-piece structure. In addition, the test base 12 may further define a plurality of slots 127 in the top (for example, the upper surface 1211) of the side wall 121 for receiving the extension portion 22 of the device holder 2.

The absorber 14 is disposed on the inner surface 124 of the side walls 121 (for example, four side walls 121) and the bottom wall 122 of the test base 12 to define a propagation space 123. As shown in FIG. 1, the absorbent body 14 defines a plurality of openings corresponding to the receiving openings of the test base 12. For example, the absorber 14 defines a first opening 141, a second opening 142, and a third opening 143. The position of the first opening 141 corresponds to the first receiving opening 1261, and the size (or width) of the first opening 141 is substantially equal to the size (or width) of the first receiving opening 1261. The position of the second opening 142 corresponds to the second receiving opening 1262, and the size (or width) of the second opening 142 is substantially equal to the size of the second receiving opening 1262 Inch (or width). The position of the third opening 143 corresponds to the third receiving opening 1263, and the size (or width) of the third opening 143 is substantially equal to the size (or width) of the third receiving opening 1263.

The absorber 14 may be an electromagnetic wave absorbing material (such as a polymer in which metal particles are dispersed), and may be formed in a plate shape. The absorber 14 is attached to the inner surface 124 of the test base 12 by, for example, adhesion. Therefore, the inner surface 124 (with the absorber 14) of the test base 12 is a wave absorbing surface. In an embodiment, the absorber 14 may be formed on the inner surface 124 of the test base 12 by, for example, coating. The absorber 14 can absorb electromagnetic waves with a frequency of 25 GHz to 80 GHz.

The first transmission medium (including, for example, the device holder 2) and the second transmission medium (including, for example, air 10) are arranged in the propagation space 123 of the test base 12. The first transmission medium (including, for example, the device holder 2) is used to support the device under test (DUT) 4 (Figure 9). In an embodiment, the first transmission medium may be the device holder 2 and the second transmission medium may be air 10. Therefore, the dielectric constant (Dk) of the first transmission medium (for example, the device holder 2) is different from the dielectric constant (Dk) of the second transmission medium (for example, air 10). For example, the dielectric constant (Dk) of the first transmission medium (for example, the device holder 2) may be about 1.0 farad/meter (F/m) to about 6.0 F/m, and the material of the device holder 2 may be, for example, Plastic, wood, acrylic or aerogel. The dielectric constant (Dk) of the second transmission medium (for example, air 10) may be about 1.0. In some embodiments, the dielectric constant (Dk) of the first transmission medium (for example, the device holder 2) may be very close to the dielectric constant (Dk) of the second transmission medium (for example, air 10). Alternatively, the dielectric constant (Dk) of the first transmission medium (for example, the device holder 2) may be substantially equal to the dielectric constant (Dk) of the second transmission medium (for example, air 10).

The device holder 2 is placed in the propagation space 123 and is supported by the test base 12. As shown in FIG. 1, the device holder 2 includes a receiving portion 21 and an extending portion 22. The receiving portion 21 defines an accommodation space 23 for accommodating the DUT 4 (see FIG. 9). The extension part 22 extends from the receiving part 21 To the upper surface 1211 of the test base 12. In some embodiments, the extension portion 22 may be positioned in the slot 127 of the side wall 121 of the test base 12. As shown in Figures 1 and 2, the device holder 2 is placed in the propagation space 123, so that the containing space 23 is surrounded by the absorber 14, and the measurement modules (including, for example, the first measurement module 61 and the second measurement The module 62 and the third measurement module 63) face the accommodating space 23 of the device holder 2.

In addition, the receiving portion 21 of the device holder 2 defines an upper opening 24. The opening 24 on the device holder 2 corresponds to the first opening 125 of the test base 12. In addition, the receiving portion 21 of the device holder 2 includes at least one or more first signal transmission portions 211 and a second signal transmission portion 212. The first signal transmission part 211 is connected to the second signal transmission part 212, and the first signal transmission part 211 and the second signal transmission part 212 are connected together to define the accommodation space 23. The second signal transmission part 212 is opposite to the upper opening 24. As shown in FIGS. 1 and 2, the receiving portion 21 of the device holder 2 includes four first signal transmission portions 211 corresponding to the four lateral sides of the receiving portion 21 respectively. The second signal transmission part 212 corresponds to the bottom side of the receiving part 21. In addition, the extension portion 22 extends from the first signal transmission portion 211 to the upper surface 1211 of the test base 12. In one embodiment, the device holder 2 can be formed by injection molding.

The measurement modules (including, for example, the first measurement module 61, the second measurement module 62, and the third measurement module 63) are arranged in each of the receiving openings of the side wall 121 and the bottom wall 122. For example, the first measurement module 61 is disposed in the first accommodating opening 1261, the second measurement module 62 is disposed in the second accommodating opening 1262, and the third measurement module 63 is disposed in the third accommodating opening 1263 . That is, the measurement modules (including, for example, the first measurement module 61, the second measurement module 62, and the third measurement module 63) are attached to the test base 12. In addition, each of the measurement modules (including, for example, the first measurement module 61, the second measurement module 62, and the third measurement module 63) may include a transmitter/receiver The emitter/receiver is exposed from the opening of the absorber 14 (for example, the first opening 141, the second opening 142 or the third opening 143) and faces the receiving portion 21 of the device holder 2. In one embodiment, the measurement modules (including, for example, the first measurement module 61, the second measurement module 62, and the third measurement module 63) are radio units or antenna types. types). The transmitter/receiver of the measurement module (including, for example, the first measurement module 61, the second measurement module 62, and the third measurement module 63) is an antenna. As shown in FIG. 1, the first measurement module 61 has an inner surface 611 and includes a first antenna 612 disposed adjacent to the inner surface 611. The inner surface 611 of the first measurement module 61 may be substantially coplanar with the inner surface 124 of the side wall 121. The first antenna 612 of the first measurement module 61 can be exposed from the first opening 141 of the absorber 14. Similarly, the second measurement module 62 has an inner surface 621 and includes a second antenna 622 disposed adjacent to the inner surface 621. The inner surface 621 of the second measurement module 62 may be substantially coplanar with the inner surface 124 of the side wall 121. The second antenna 622 of the second measurement module 62 can be exposed from the second opening 142 of the absorber 14. Similarly, the third measurement module 63 has an inner surface 631 and includes a third antenna 632 disposed adjacent to the inner surface 631. The inner surface 631 of the third measurement module 63 may be substantially coplanar with the inner surface 124 of the bottom wall 122. The third antenna 632 of the third measurement module 63 can be exposed from the third opening 143 of the absorber 14.

As shown in FIG. 1, the testing device 1 may further include a first connector 661, a second connector 662, a third connector 663, a first fixing cover 671, and a second fixing cover 672 and the third fixed cover 673. The first connector 661 is electrically connected to the first measurement module 61. The second connector 662 is electrically connected to the second measurement module 62. The third connector 663 is electrically connected to the third measurement module 63. For example, the first connector 661, the second connector 662, and the third connector 663 may be coaxial cables (coaxial cables), flexible printed circuits (FPC) or conductive vias in the side walls 121 and the bottom wall 122. (conductive via). In addition, the size of the first fixing cover 671 is larger than that of the first receiving opening 1261 The size is such that the first fixing cover 671 is attached to the outer surface of the side wall 121 to cover and fix the first measurement module 61. The size of the second fixing cover 672 is larger than the size of the second receiving opening 1262 so that the second fixing cover 672 is attached to the outer surface of the side wall 121 to cover and fix the second measurement module 62. The size of the third fixing cover 673 is larger than the size of the third receiving opening 1263, so that the third fixing cover 673 is attached to the outer surface of the bottom wall 122 to cover and fix the third measurement module 63.

FIG. 3 illustrates a cross-sectional view of the device holder 2 of the test device 1 of FIG. 1. FIG. 4 illustrates a perspective view of the device holder 2 shown in FIG. 3. The device holder 2 may include a plurality of strips or rods, and may be integrally formed to form a single-piece structure. In some embodiments, the material of the device holder 2 can be, for example, plastic, wood, acrylic, or aerogel. The first signal transmission portion 211 of the receiving portion 21 defines a lateral opening 2111 and includes a lateral opening 2111 and a first strip portion 2112. The second signal transmission portion 212 of the receiving portion 21 defines the lower opening 2121 and includes the lower opening 2121 and the second strip portion 2122. The second strip portion 2122 can support the bottom edge of the DUT 4 (see FIG. 9). Therefore, the accommodating space 23 of the device holder 2 communicates with the propagation space 123 of the test base 12 (see FIG. 1) through the lower opening 2121 and the lateral opening 2111. The device holder 2 of Figs. 3 and 4 can be referred to as a "mesh bag type".

Figure 5 illustrates a cross-sectional view of the device holder 2a according to some embodiments of the present invention. Fig. 6 illustrates a perspective view of the device holder 2a shown in Fig. 5. The device holder 2a is similar to the device holder 2 shown in FIGS. 3 and 4, but the difference is as follows. As shown in FIGS. 5 and 6, the first signal transmission portion 211 may include a first signal transmission portion 211a, and the first strip portion 2112a of the first signal transmission portion 211a extends toward the lateral opening 2111a. Therefore, the size of the lateral opening 2111a of the first signal transmission portion 211a of FIGS. 5 and 6 is smaller than the size of the lateral opening 2111 of the first signal transmission portion 211 of FIGS. 3 and 4. The extended first strip portion 2112a can support the side surface 47 of the DUT4.

FIG. 7 illustrates a perspective view of the test base 12 of the test device 1 of FIG. 1, in which the first connector 661, the second connector 662, and the third connector 663 are omitted. FIG. 8 illustrates an exploded view of the test base 12 of FIG. 7. The test base 12 may include four side walls 121 and a bottom wall 122. The top portion of the side wall 121 may define a top opening 125. The side wall 121 may be connected to the bottom wall 122 to define the propagation space 123. Each of the side wall 121 and the bottom wall 122 has an inner surface 124 and defines a receiving opening (including, for example, a first receiving opening 1261, a second receiving opening 1262, a third receiving opening 1263, a fourth receiving opening 1264, and a fifth receiving opening). Opening 1265). The propagation space 123, the top opening 125, and the receiving openings (including the first receiving opening 1261, the second receiving opening 1262, the third receiving opening 1263, the receiving opening 1264, and the fifth receiving opening 1265) communicate with each other. Therefore, the inner surface 124 of the side wall 121 and the bottom wall 122 define the propagation space 123. In some embodiments, the side wall 121 and the bottom wall 122 are independent walls, and the walls are assembled together by, for example, screws. In some embodiments, the side wall 121 and the bottom wall 122 may be integrally formed as a single-piece structure. In addition, the test base 12 may further define a plurality of slots 127 on the top of the side wall 121 (for example, the upper surface 1211) for receiving the extension portion 22 of the device holder 2.

The absorber 14 is disposed on the inner surface 124 of the side wall 121 and the bottom wall 122 of the test base 12 by, for example, adhesion to define the propagation space 123. The absorber 14 defines a plurality of openings corresponding to the receiving openings of the test base 12. For example, the absorber 14 defines a first opening 141, a second opening 142, a third opening 143, a fourth opening 144, and a fifth opening 145. The positions of the first opening 141, the second opening 142, the third opening 143, the fourth opening 144, and the fifth opening 145 correspond to the first receiving opening 1261, the second receiving opening 1262, the third receiving opening 1263, and the fourth opening, respectively. The receiving opening 1264 and the fifth receiving opening 1265. The sizes (or widths) of the first opening 141, the second opening 142, the third opening 143, the fourth opening 144, and the fifth opening 145 are substantially equal to the first receiving opening 1261, the second opening receiving opening 1262, and the third receiving opening 1263,I don't know what to do The size (or width) of the opening 1264 and the fifth receiving opening 1265.

The measurement modules (including, for example, the first measurement module 61, the second measurement module 62, the third measurement module 63, the fourth measurement module 64, and the fifth measurement module 65) are arranged The receiving openings in the side wall 121 and the bottom wall 122 (including, for example, the first receiving opening 1261, the second receiving opening 1262, the third receiving opening 1263, the receiving opening 1264, and the fifth receiving opening 1265) respectively. In addition, the measurement modules (including, for example, the first measurement module 61, the second measurement module 62, the third measurement module 63, the fourth measurement module 64, and the fifth measurement module 65) Each of them may include a transmitter/receiver (ie, an antenna), which is self-contained from the openings of the absorber 14 (for example, the first opening 141, the second opening 142, the third opening 143, the fourth opening 144, and the fifth The opening 145) is exposed and faces the receiving portion 21 of the device holder 2.

As shown in FIGS. 1 and 8, the testing device 1 may further include a first fixed cover 671, a second fixed cover 672, a third fixed cover 673, a fourth fixed cover 674, and a fifth fixed cover 675. The first fixed cover 671, the second fixed cover 672, the third fixed cover 673, the fourth fixed cover 674, and the fifth fixed cover 675 are attached to the outer surfaces of the side wall 121 and the bottom wall 122 to respectively cover and fix the first amount The measurement module 61, the second measurement module 62, the third measurement module 63, the fourth measurement module 64, and the fifth measurement module 65.

FIG. 9 illustrates a cross-sectional view of the test system 3 according to some embodiments of the present invention. FIG. 10 illustrates a perspective view of the DUT 4 according to some embodiments of the present invention. The test system 3 includes a test device 1, a DUT 4, a top circuit board 34 (for example, a test board), a handler arm 30, a chuck 32, a connecting socket 35, Top absorber 36, tester 38, bottom circuit board 50 (for example, load board), board stiffener 52, digital signal processor (DSP) circuit 382, and Sub-system 7. Figure 9 Test device 1 and Figure 1 It is the same as the test device 1 in FIG. 2 and includes a test base 12 and a device holder 2.

The DUT 4 is placed in the receiving space 23 of the device holder 2, and the DUT 4 includes at least one radiation source (that is, a signal emission source), which corresponds to the first signal transmission portion 211 and At least one of the second signal transmission part 212. The radiation source (that is, the signal emission source) may have the function of transmitting/receiving signals. In some embodiments, the DUT 4 may be a package structure, and may have a first surface 41, a second surface 42 opposite to the first surface 41, and a plurality of side surfaces 47. The DUT 4 may include a substrate 43, at least one electrical element 44, a package body 45 and an antenna 46. Therefore, the DUT 4 has an antenna in package (AiP) structure. For example, the DUT 4 may be a wireless module, such as a millimeter wave wireless module (mmWave wireless module). In an embodiment, the DUT 4 may be a radio frequency (RF) AiP with 25 GHz to 80 GHz or 30 GHz to 80 GHz.

The substrate 43 is arranged adjacent to the first surface 41 and includes a plurality of electrical contacts 431 (for example, solder balls or solder bumps) arranged adjacent to the upper surface thereof (that is, the first surface 41). Electrical components 44, such as semiconductor dies and/or passive components, are electrically connected to the lower surface of the substrate 43. The package body 45, such as a molding compound, covers the lower surface of the substrate 43 and the electrical components 44. The antenna 46 is embedded or arranged on the package body 45. That is, the antenna 46 is arranged near the second surface 42 of the DUT 4. The antenna 46 is a radiation source (that is, a signal transmission source). The bottom of the antenna 46 can be exposed from the second surface 42 of the DUT 4, and the side portion of the antenna 46 can be exposed from the side surface 47 of the DUT 4. Therefore, the side surface 47 of the DUT 4 can be a radiation source (that is, a signal emission source) corresponding to the first signal transmission portion 211 and the first measurement module 61 and the second measurement module 62 of the device holder 2 . The second surface 42 of the DUT 4 can be a radiation source (ie, a signal emission source) corresponding to the second signal transmission part 212 and the third measurement module 63 of the device holder 2. As shown in Figure 9, the antenna 46 may face downwards. The part of the side part of the antenna 46 comes from the device bracket 2 The lateral opening 2111 of the first signal transmission part 211 is exposed, and the bottom part of the antenna 46 is exposed from the lower opening 2121 of the second signal transmission part 212 of the device holder 2.

Referring to FIG. 10, the pattern of the antenna 46 of the DUT 4 may include a first radiation source/receiver 461 (also referred to as "port 1") and a second radiation source/receiver 462 (also referred to as "port 2") , The third radiation source/receiver 463 (also referred to as "port 3"), the fourth radiation source/receiver 464 (also referred to as "port 4"), and the fifth radiation source/receiver 465 (also referred to as "port 4") Called "Port 5"). The first radiation source/receiver 461 (also known as "port 1"), the second radiation source/receiver 462 (also known as "port 2"), and the fourth radiation source/receiver 464 (also known as "port 2") As "port 4") and the fifth radiation source/receiver 465 (also known as "port 5") are placed adjacent to the side surface 47 of the DUT 4. The third radiation source/receiver 463 (also referred to as "port 3") is placed adjacent to the second surface 42 of the DUT 4. Referring to FIG. 9, the first antenna 612 of the first measurement module 61 can receive radio frequency signals from the first radiation source/receiver 461 of the antenna 46 of the DUT 4, or can transmit radio frequency signals to the antenna 46 of the DUT 4 The first radiation source/receiver 461. The second antenna 622 of the second measurement module 62 can receive the radio frequency signal from the second radiation source/receiver 462 of the antenna 46 of the DUT 4, or can transmit the radio frequency signal to the second radiation of the antenna 46 of the DUT 4 Source/Sink 462. The third antenna 632 of the third measurement module 63 can receive from the DUT The radio frequency signal of the third radiation source/receiver 463 of the antenna 46 of 4, or the third radiation source/receiver 463 of the antenna 46 of the DUT 4 can transmit the radio frequency signal. In addition, the fourth antenna 642 of the fourth measurement module 64 (FIGS. 7 and 8) can receive the radio frequency signal from the fourth radiation source/receiver 464 (FIG. 10) of the antenna 46 of the DUT 4, or the radio frequency The signal is transmitted to the fourth radiation source/receiver 464 of the antenna 46 of the DUT 4. The fifth antenna 652 (FIG. 8) of the fifth measurement module 65 can receive the radio frequency signal from the fifth radiation source/receiver 465 of the antenna 46 of the DUT 4, or can transmit the radio frequency signal to the antenna 46 of the DUT 4 The fifth radiation source/receiver 465. That is, the measurement module (including, for example, the first measurement module 61, the second measurement module 62. The third measurement module 63, the fourth measurement module 64 and the fifth measurement module 65) respectively correspond to each of the radiation source/receiver (including, for example, the first radiation source/receiver 461, second radiation source/receiver 462, third radiation source/receiver 463, fourth radiation source/receiver 464, and fifth radiation source/receiver 465) and communicate with them.

Referring to FIG. 9, the top absorber 36 is placed on the top (for example, the upper surface 1211) of the test base 12 of the test jig 11, and is placed on the extension 22 of the device holder 2. Alternatively, the top absorber 36 may be attached to the bottom surface of the top circuit board 34. The material of the top absorbent body 36 may be the same as or different from the material of the absorbent body 14. The top circuit board 34 (for example, a printed circuit board (PCB)) is disposed above the first opening 125 of the test base 12 and is electrically connected to the DUT 4. In an embodiment, the top circuit board 34 is attached to the carrying arm 30 via a clamp 32. The chuck 32 can be used to apply suction to the DUT 4. In one embodiment, the top circuit board 34 includes a first terminal 341. A part of the extension 22 of the device holder 2 is arranged between the test base 12 and the top circuit board 34.

The connection base 35 is attached to the lower surface of the top circuit board 34 and includes a plurality of testing probes 351. One end of the test probe 351 is used to contact the electrical contact 431 of the DUT 4, and the other end of the test probe 351 is used to contact the top circuit board 34. When the chuck 32 sucks the first surface 41 of the DUT 4, the DUT 4 can be electrically connected to the top circuit board 34 via the electrical contacts 431 and the test probe 351.

The tester 38, the DSP circuit 382, the subsystem 7, the bottom circuit board 50 and the board reinforcement 52 are arranged under the testing device 1. The board reinforcement 52 is placed on the tester 38 and used to support the bottom circuit board 50. That is, the bottom circuit board 50 is supported by the tester 38 via the board reinforcement 52. The test device 1 is mounted on the bottom circuit board 50. Therefore, the bottom circuit board 50 is placed between the testing device 1 and the tester 38. The bottom circuit board 50 defines a hole 502 for receiving the third fixing cover 673. NS However, in one embodiment, the third fixing cover 673 and the hole 502 can be omitted. In addition, the bottom circuit board 50 may include a second terminal 501. In some embodiments, the bottom circuit board 50 may be electrically connected to the top circuit board 34 via the first terminal 341 and the second terminal 501. In some embodiments, the bottom circuit board 50 may be electrically connected to the tester 38.

The tester 38 includes a third terminal 381, a power supply 383, and a test computer 384. The tester 38 can be electrically connected to the top circuit board 34 via the third terminal 381 and the first terminal 341. In addition, the tester 38 may be electrically connected to the bottom circuit board 50 via the third terminal 381 and the second terminal 501. The power supply 383 and the test computer 384 are electrically connected to the top circuit board 34 to control the DUT 4. The test computer 384 may include a processor and can execute instructions written on a machine-readable medium. When the instructions are executed by the processor, the processor will cause the processor to execute the programs described herein, such as Analyze electromagnetic signals. The subsystem 7 may be electrically connected to the tester 38 via the DSP circuit 382. The subsystem 7 includes an intermediate apparatus 71 and an up/down converter 72. The frequency up/down converter 72 is electrically connected to the intermediate device 71 and is electrically connected to the tester 38 via the DSP circuit 382. The frequency up/down converter 72 is used to reduce or increase the frequency of the signal. Intermediate device 71 and DUT 4Communication. In one embodiment, the intermediate device 71 is electrically connected to the first measurement module 61 through the first connector 661, is electrically connected to the second measurement module 62 through the second connector 662, and is electrically connected to the second measurement module 62 through the third connector 663. It is electrically connected to the third measurement module 63. In addition, the intermediate device 71 is electrically connected to the fourth measurement module 64 through the fourth connector 664 (FIG. 13 ), and is electrically connected to the fifth measurement module 65 through the fifth connector 665 (FIG. 13 ).

In the embodiment illustrated in FIG. 9, the test system 3 can test the transmitting function and/or receiving function of the DUT 4. For example, in the first test mode, test the transmitting function of DUT 4. The tester 38 controls the DUT 4 to emit high-frequency waves (for example, a millimeter-level wavelength millimeter Wave). The high-frequency waves emitted from the DUT 4 can pass through the first signal transmission portion 211 and/or the second signal transmission portion 212 of the device holder 2, and then be used by measurement modules (including, for example, the first measurement module 61 and the second measurement module). The measurement module 62, the third measurement module 63, the fourth measurement module 64, and the fifth measurement module 65) receive. Then, from the measurement module (including, for example, the first measurement module 61, the second measurement module 62, the third measurement module 63, the fourth measurement module 64, and the fifth measurement module 65) The signal can be reduced to the intermediate frequency by the up/down converter 72. Finally, the tester 38 can determine whether the DUT 4 achieves the desired transmitting function based on the analysis of the signals from the DSP circuit 382 and the up/down converter 72. In addition, in the second test mode, the receiving function of DUT 4 is tested. The tester 38 uses the up/down converter 72 to process the intermediate frequency signal into a high frequency signal. Then, the tester 38 controls the measurement modules (including, for example, the first measurement module 61, the second measurement module 62, the third measurement module 63, the fourth measurement module 64, and the fifth measurement module). Group 65) emits high frequency waves (for example, millimeter waves). From the measurement module (including, for example, the first measurement module 61, the second measurement module 62, the third measurement module 63, the fourth measurement module 64, and the fifth measurement module 65) High-frequency waves can pass through the first signal transmission part 211 and/or the second signal transmission part 212 of the device holder 2, and then the DUT 4Receive. Finally, the tester 38 can determine whether the DUT 4 achieves the desired receiving function according to the analysis of the signal from the DUT 4.

Therefore, waves can be transmitted in the air (e.g., only propagating in the air). Therefore, the material of the device holder 2 may not substantially affect the test result, so that the material of the device holder 2 may not be an important environmental variable in the test process. In addition, all waves transmitted in the propagation space 123 can be measured by measurement modules (including, for example, the first measurement module 61, the second measurement module 62, the third measurement module 63, and the fourth measurement module 64). And the fifth measurement module 6) or DUT 4 receives, which is due to the design of the absorber 14 and the top absorber 36. Therefore, the size of the test device 1 can be reduced to a size of X*X*X, where X is, for example, about 30 cm or less, about 10 cm or less, or about 5 cm or less. Measurement The dimensions of the test device 1 need not be equal to each other. In addition, this test method can be executed in less time than the comparative test method. Therefore, this test device 1 can be used in a production line during mass production. In addition, during the testing process, the DUT 4 does not need to rotate 360 degrees, so the testing device 1 can be more easily designed and manufactured. In addition, the testing process of the multiple radiation sources/receivers of the antenna 46 of the DUT 4 can be performed by only one up/down converter 72, thereby reducing the testing cost.

Figures 11-15 illustrate testing methods according to some embodiments of the present invention. Referring to FIG. 11, a DUT 4, a top circuit board 34 (for example, a test board), a carrying arm 30, a chuck 32, a connection base 35, and a top absorber 36 are provided. In some embodiments, the DUT 4 may be a package structure, and may have a first surface 41, a second surface 42 opposite to the first surface 41, and a plurality of side surfaces 47. The DUT 4 may include a substrate 43, at least one electrical component 44, a package body 45 and an antenna 46. The substrate 43 is disposed adjacent to the first surface 41, and includes a free area 432 disposed adjacent to the upper surface of the DUT 4 (for example, the first surface 41) and a plurality of electrical contacts 431 (for example, solder balls or solder bumps). piece). The free area 432 is located on the upper surface of the substrate 43 (for example, the first surface 41 of the DUT 4) without any electrical contacts. Therefore, the free area 432 is an area for the chuck 32 to contact. The electronic component 44, such as a semiconductor die or a passive component, is electrically connected to the lower surface of the substrate 43. The package body 45, such as a molding compound, covers the lower surface of the substrate 43 and the electrical element 44. The antenna 46 is embedded in or arranged on the package body 45. That is, the antenna 46 is arranged near the second surface 42 of the DUT 4. The bottom of the antenna 46 can be exposed from the second surface 42 of the DUT 4, and the side portion of the antenna 46 can be exposed from the DUT The side surface 47 of 4 is exposed. As shown in Figure 11, the antenna 46 may face downwards. In one embodiment, as shown in FIG. 10, the pattern of the antenna 46 may include a first radiation source/receiver 461 (also referred to as "port 1"), and a second radiation source/receiver 462 (also referred to as "port 1"). Called "Port 2"), the third radiator/receiver 463 (also known as "Port 3"), the fourth radiator/receiver 464 (also known as "Port 4") and the fifth radiator /receiver 465 (also known as "Port 5").

The top circuit board 34 is attached to the carrying arm 30 by a clamp 32. The chuck 32 is used to apply suction to the DUT 4. The connection base 35 is attached to the lower surface of the top circuit board 34 and includes a plurality of test probes 351. Then, the chuck 32 provides a suction force 321 on the free area 432 of the first surface 41 of the DUT 4. Therefore, the chuck 32 sucks the first surface 41 of the DUT 4, and the electrical contact 431 of the DUT 4 can be electrically connected to the top circuit board 34 via the test probe 351.

12, a test base 12 and measurement modules (including, for example, a first measurement module 61, a second measurement module 62, a third measurement module 63, and a fourth measurement module 64 are provided). And the fifth measurement providing module 65) (see Figure 1, Figure 7 and Figure 8). Then, the device holder 2 (refer to FIGS. 1 to 4) is provided to be placed in the first opening 125 of the test base 12, so that the device holder 2 is placed in the propagation space 123 and is supported by the test base 12 . In some embodiments, the extension portion 22 may be positioned in or coupled to the slot 127 of the side wall 121 of the test base 12. At the same time, the test device 1 is obtained (refer to FIG. 1).

The tester 38, the DSP circuit 382, the subsystem 7, the bottom circuit board 50, and the board reinforcement 52 are provided to be placed under the testing device 1. The board reinforcement 52 is placed on the tester 38 and used to support the bottom circuit board 50. In some embodiments, the bottom circuit board 50 may be electrically connected to the top circuit board 34 via the first terminal 341 and the second terminal 501. In some embodiments, the bottom circuit board 50 may be electrically connected to the tester 38 via the third terminal 381 and the second terminal 501. The tester 38 includes a power supply 383 and a test computer 384. The tester 38 may be electrically connected to the top circuit board 34 via the third terminal 381 and the first terminal 341. The subsystem 7 may be electrically connected to the tester 38 via the DSP circuit 382. The subsystem 7 includes an intermediate device 71 and an up/down converter 72. The frequency up/down converter 72 is electrically connected to the intermediate device 71 and is electrically connected to the tester 38 via the DSP circuit 382. In one embodiment, the intermediate device 71 is electrically connected to the first measurement module 61 via the first connector 661, and is The second connector 662 is electrically connected to the second measurement module 62 and the third connector 663 is electrically connected to the third measurement module 63. In addition, the intermediate device 71 is electrically connected to the fourth measurement module 64 through the fourth connector 664 (FIG. 13 ), and is electrically connected to the fifth measurement module 65 through the fifth connector 665 (FIG. 13 ).

Then, the assembly of the DUT 4, the top circuit board 34, the carrying arm 30, the chuck 32, the connection base 35, and the top absorber 36 moves downward. Therefore, as shown in FIG. 9, the DUT 4 can be placed in the receiving portion 21 of the device holder 2 on the test base 12. The device holder 2 accommodates the lower surface of the DUT 4 (for example, the second surface 42) and the side surface 47 of the DUT 4. At the same time, the intermediate device 71 communicates with the DUT 4 because the measurement modules (including, for example, the first measurement module 61, the second measurement module 62, the third measurement module 63, and the fourth measurement module) 64 and the fifth measurement module 65) respectively face the pattern of the antenna 46 (including, for example, the first radiation source/receiver 461, the second radiation source/receiver 462, the third radiation source/receiver 463, and the fourth radiation source /Receiver 464 and fifth radiation source/receiver 465).

FIG. 13 illustrates a schematic circuit diagram for executing the first operation method and the second operation method of the test system 3 according to some embodiments of the present invention. In the embodiment illustrated in FIG. 13, the subsystem 7 includes an intermediate device 71 and an up/down converter 72. The intermediate device 71 includes a switch control circuit 710, a plurality of input ports (including, for example, a first input port 711, a second input port 712, a third input port 713, a fourth input port 714, and a second input port). Five input ports 715) and output ports 716. The switch control circuit 710 may include one or more switches to control input ports (including, for example, the first input port 711, the second input port 712, the third input port 713, the fourth input port 714, and the fifth input port 715) and Electrical connection between output ports 716. The input ports (including, for example, the first input port 711, the second input port 712, the third input port 713, the fourth input port 714, and the fifth input port 715) communicate with the DUT 4. Up/down converter 72 is electrically connected to the intermediate device 71 through the output port 716. In the embodiment illustrated in FIG. 13, there is only one of the input ports (including, for example, the first input port 711, the second input port 712, the third input port 713, the fourth input port 714, and the fifth input port 715) It is electrically connected to the output port 716 under the control of the switch control circuit 710.

The first method of operation is described below. For example, in the first test mode of the first operating method, the transmitting function of the DUT 4 is tested. The bottom circuit board 50 and/or the tester 38 can control the switch control circuit 710 and the DUT 4 at the same time. When the antenna 46 of the DUT 4 is controlled to transmit a signal with high frequency waves (for example, millimeter waves with a wavelength on the order of millimeters) from a radiation source/receiver (for example, the first radiation source/receiver 461 of DUT 4) , The bottom circuit board 50 and/or the tester 38 control the switch control circuit 710 to electrically connect the first input port 711 and the output port 716. That is, there is only one electrical connection path in the intermediate device 71 (that is, between the first input port 711 and the output port 716). Other input ports (including, for example, the second input port 712, the third input port 713, the fourth input port 714, and the fifth input port 715) are not electrically connected to the output port 716. At the same time, the corresponding measurement module (ie, the first measurement module 61) will receive the signal. Then, the signal from the measurement module (ie, the first measurement module 61) can be reduced to the intermediate frequency by the up/down converter 72. Then, the DSP circuit 382 processes the signal from the subsystem 7 into a digital signal, and transmits the digital signal to the tester 38. Finally, the tester 38 can determine the DUT based on the analysis of the signals from the DSP circuit 382 and the up/down converter 72 4. Whether the first radiation source/receiver 461 achieves the desired transmitting function. That is, the tester 38 determines that the received signal is "passed" or "failed". If the result is "pass", it means that the transmitting function of the first radiation source/receiver 461 of the DUT 4 is normal (or qualified). If the result is "failure", it means that the transmitting function of the first radiation source/receiver 461 of the DUT 4 is abnormal (or unqualified). In the same way, the second radiation source/connection of the DUT 4 can be tested under another path (that is, the electrical connection path between the second input port 712 and the output port 716). The transmitting function of the receiver 462 . Therefore, the other radiation source/receiver of the DUT 4 (that is, the third radiation source/receiver 463, the fourth radiation source/receiver 464, and the fifth radiation source/receiver 465) can be tested in the same manner.

Similarly, the receiving function of DUT 4 can be tested in the opposite way. That is, in the second test mode of the first operation method, test the receiving function of the DUT 4, as shown below. The tester 38 uses the DSP circuit 382 and the up/down converter 72 to process the intermediate frequency signal into a high frequency signal (for example, millimeter wave). Then, the bottom circuit board 50 and/or the tester 38 control the first measurement module 61 to transmit high-frequency signals. The frequency signal transmitted from the first measurement module 61 can be received by the first radiation source/receiver 461 of the DUT 4. Finally, the tester 38 can determine whether the first radiation source/receiver 461 of the DUT 4 achieves the desired receiving function according to the analysis of the signal from the DUT 4.

In the embodiment illustrated in FIG. 13, due to the design of the intermediate device 71, only one up/down converter 72 is required. Therefore, the cost of testing is reduced.

In addition, the embodiment illustrated in FIG. 13 can implement the second operation method described below. For example, in the first test mode of the second operation method, the transmitting function of the DUT 4 is tested. The bottom circuit board 50 and/or the tester 38 can control the switch control circuit 710 and the DUT 4 at the same time. When the antenna 46 of the DUT 4 is controlled to transmit signals with high frequency waves (for example, millimeter waves with millimeter-level wavelengths) from an unknown radiation source/receiver, the bottom circuit board 50 and/or the tester 38 control the switch control circuit 710 is used to process polling operations. That is, during a period of time, the switch control circuit 710 sequentially switches all input ports (including, for example, the first input port 711, the second input port 712, the third input port 713, the fourth input port 714, and the fifth input port 715). ). If the signal from the input port (for example, the third input port 713) and its corresponding measurement module (that is, the third measurement module 63) is better, then this input port (for example, the third input The electrical connection path between the port 713) and the output port 716 will be fixed. At the same time, the unknown radiation source/receiver of DUT 4 The device can be determined as the third radiation source/receiver 463 of the DUT 4. Then, the signal from the measurement module (ie, the third measurement module 63) can be reduced to the intermediate frequency by the up/down converter 72. Then, the DSP circuit 382 processes the signal from the subsystem 7 into a digital signal, and transmits the digital signal to the tester 38. Finally, the tester 38 can determine whether the third radiation source/receiver 463 of the DUT 4 achieves the desired transmitting function based on the analysis of the signals from the DSP circuit 382 and the up/down converter 72.

Similarly, the receiving function of the third radiation source/receiver 463 of the DUT 4 can be tested in the opposite way. That is, in the second test mode of the second operation method, the receiving function of the third radiation source/receiver 463 of the DUT 4 is tested, as described below. The tester 38 uses the DSP circuit 382 and the up/down converter 72 to process the intermediate frequency signal into a high frequency signal (for example, millimeter wave). Then, the bottom circuit board 50 and/or the tester 38 control the third measurement module 63 to transmit high-frequency signals. The frequency signal transmitted from the third measurement module 63 can be received by the third radiation source/receiver 463 of the DUT 4. Finally, the tester 38 can determine whether the third radiation source/receiver 463 of the DUT 4 achieves the desired receiving function based on the analysis of the signal from the DUT 4.

In addition, the other radiation source/receiver of the DUT 4 (ie, the first radiation source/receiver 461, the second radiation source/receiver 462, the fourth radiation source/receiver 464, and the fifth radiation source/receiver 461) can be tested in the same manner. The transmitting function and receiving function of the source/receiver 465).

FIG. 14 illustrates a schematic circuit diagram for performing a third operation method of the test system 3 according to some embodiments of the present invention. The schematic circuit diagram shown in FIG. 14 is similar to the schematic circuit diagram shown in FIG. 13, and the differences therebetween are described as follows. In the embodiment illustrated in FIG. 14, the subsystem 7 a includes an intermediate device 71 a and an up/down converter 72. The intermediate device 71a includes a power combiner circuit 710a, input ports (including, for example, a first input port 711, a second input port 712, a third input port 713, a fourth input port 714, and a fifth input port). Incoming port 715) and outgoing port 716. All input ports (including, for example, the first input port 711, the second input port 712, the third input port 713, the fourth input port 714, and the fifth input port 715 are electrically connected to the output port 716 through the power combiner circuit 710a. All the electrical connection paths between the input ports (including, for example, the first input port 711, the second input port 712, the third input port 713, the fourth input port 714, and the fifth input port 715) and the output port 716 exist simultaneously.

The third operation method is described as follows. For example, in the first test mode of the third operation method, the transmitting function of the DUT 4 is tested. The bottom circuit board 50 and/or the tester 38 can control the power combiner circuit 710a and the DUT 4 at the same time. When the antenna 46 of the DUT 4 is controlled to transmit a signal with high frequency waves (for example, millimeter waves with a wavelength on the order of millimeters) from a radiation source/receiver (for example, the first radiation source/receiver 461 of DUT 4) , The corresponding measurement module (ie, the first measurement module 61) will receive the signal. Then, the signal from the measurement module (ie, the first measurement module 61) can be reduced to the intermediate frequency by the up/down converter 72. Then, the DSP circuit 382 processes the signal from the subsystem 7a into a digital signal, and transmits the digital signal to the tester 38. Finally, the tester 38 can determine whether the first radiation source/receiver 461 of the DUT 4 achieves the desired transmitting function based on the analysis of the signals from the DSP circuit 382 and the up/down converter 72. In addition, the other radiation source/receiver of DUT 4 (that is, the second radiation source/receiver 462, the third radiation source/receiver 463, the fourth radiation source/receiver 464, and the fifth radiation source/receiver can be tested in the same way. Source/receiver 465) transmitting function. Similarly, the receiving function of DUT 4 can be tested in the opposite way.

FIG. 15 illustrates a schematic circuit diagram for executing the fourth operation method of the test system 3 according to some embodiments of the present invention. The schematic circuit diagram shown in FIG. 15 is similar to the schematic circuit diagram shown in FIG. 14, and the differences therebetween are described as follows. The fourth operation method is described as follows. For example, in the first test mode of the fourth operation method, the transmitting function of the DUT 4 is tested. The bottom circuit board 50 and/or the tester 38 can control the power combiner circuit 710a and the DUT 4 at the same time. The antenna 46 of the DUT 4 is controlled to simultaneously transmit from all radiation sources/receivers (for example, the first radiation source/receiver 461, the second radiation source/receiver 462, the third radiation source/receiver 463, and the first radiation source/receiver 461 of the DUT 4 The fourth radiation source/receiver 464 and the fifth radiation source/receiver 465) emit signals having high frequency waves (for example, millimeter waves having a wavelength of about millimeters). Then, all corresponding measurement modules (ie, the first measurement module 61, the second measurement module 62, the third measurement module 63, the fourth measurement module 64, and the fifth measurement module 65) The signal will be received. Then, the frequency up/down converter 72 can be used to convert all corresponding measurement modules (that is, the first measurement module 61, the second measurement module 62, the third measurement module 63, the second measurement module) The signals of the fourth measurement module 64 and the fifth measurement module 65) are reduced to the intermediate frequency. Then, the DSP circuit 382 processes the signal from the subsystem 7a into a digital signal and transmits the digital signal to the tester 38. That is, from all corresponding measurement modules (ie, the first measurement module 61, the second measurement module 62, the third measurement module 63, the fourth measurement module 64, and the fifth measurement module) The power of the signal of module 65) will be accumulated together. Finally, the tester 38 can determine whether the DUT 4 achieves the desired transmitting function according to the analysis of the total signal (that is, the sum of power) from the DSP circuit 382 and the up/down converter 72.

Compared with the first operation method, the second operation method, and the third operation method mentioned above, the fourth operation method can reduce the test time and complexity. However, the fourth operation method may not be able to determine which of the radiation source/receiver of the DUT 4 "passes" or "failures". In addition, the receiving function of DUT 4 cannot be tested in the opposite way.

FIG. 16 illustrates a schematic diagram of a testing system 3'according to some embodiments of the present invention. The test system 3'may include four DUTs 4, four top circuit boards 34, a carrying arm 30', four test devices 1 and a bottom circuit board 50'. Each of the DUTs 4 corresponds to a respective one of the top circuit boards 34, and the four DUTs 4 and the four top circuit boards 34 can be handled by one carrying arm 30'. Four test devices 1 can be placed on a bottom circuit board 50'. With four DUT4 and four top The carrying arm 30 of the circuit board 34 can move to cover the four test devices 1, and each of the DUT 4 is placed in each of the test devices 1. Therefore, the test system 3 can provide multi-site testing, and the signal in one test device 1 may not significantly affect the adjacent test device 1. In some embodiments, more than four DUTs 4 or less than four DUTs 4 can be tested in a multi-site test using suitable equipment.

Figure 17 illustrates a cross-sectional view of a test system 3a according to some embodiments of the present invention. FIG. 18 illustrates an exploded cross-sectional view of the test system 3a of FIG. 17. Fig. 19 illustrates an exploded perspective view of the test device 1a of Figs. 17 and 18. The test system 3a of Figs. 17 and 18 is similar to the test system 3 of Figs. 9 and 12 except for the structure of the test device 1a.

19, the test device 1a includes a test base 12a, a device holder 2, an absorber 14a, a plurality of measurement modules (including, for example, a first measurement module 61a, a second measurement module 62a, and a third measurement module). The measurement module 63a, the fourth measurement module 64a and the fifth measurement module 65a). The test base 12a defines a propagation space 123a and a plurality of receiving openings (including, for example, a first receiving opening 1261a, a second receiving opening 1262a, a third receiving opening 1263a, a fourth receiving opening 1264a, and a fifth receiving opening 1265a). The propagation space 123a and the receiving opening (including, for example, the first receiving opening 1261a, the second receiving opening 1262a, the third receiving opening 1263a, the fourth receiving opening 1264a, and the fifth receiving opening 1265a) communicate with each other.

In some embodiments, the test base 12a includes one or more side walls 121a (for example, four side walls 121a) and a bottom wall 122a. The side wall 121a may be connected to the bottom wall 122a to define the propagation space 123a. Each of the side walls 121a may define a receiving opening (including, for example, the first receiving opening 1261a, the second receiving opening 1262a, the fourth receiving opening 1264a, and the fifth receiving opening 1265a). The bottom wall 122 may define a receiving opening (including, for example, the third receiving opening 1263a). Each of the side walls 121a (for example, four side walls 121a) and the bottom wall 122a has an inner surface 124a. because Therefore, the side walls 121a (for example, four side walls 121a) and the inner surface 124a of the bottom wall 122a define the propagation space 123a.

As shown in FIG. 19, the first accommodating opening 1261a, the second accommodating opening 1262a, the fourth accommodating opening 1264a, and the fifth accommodating opening 1265a may be located at the top portion of the side wall 121a and may penetrate the side wall 121a. The third receiving opening 1263a can be located at the center of the bottom wall 122a and can penetrate the bottom wall 122a. In some embodiments, the side wall 121a and the bottom wall 122a are independent walls, which are assembled together by, for example, screws. In some embodiments, the side wall 121a and the bottom wall 122a may be integrally formed as a single-piece structure. In addition, the test base 12a may further define a plurality of slots 127a in the top (for example, the upper surface 1211a) of the side wall 121a for receiving the extension portion 22 of the device holder 2.

The absorber 14a is disposed on the side walls 121a (for example, four side walls 121a) of the test base 12a and the inner surface 124a of the bottom wall 122a to define the propagation space 123a. As shown in FIG. 19, the absorbent body 14a defines a plurality of openings (including, for example, a first opening 141a, a second opening 142a, a third opening 143a, a fourth opening 144a, and a fifth opening 145a), which respectively correspond to the test base The receiving opening of the seat 12a (including, for example, the first receiving opening 1261a, the second receiving opening 1262a, the third receiving opening 1263a, the fourth receiving opening 1264a, and the fifth receiving opening 1265a). The absorber 14a may be an electromagnetic wave absorbing material (such as a polymer in which metal particles are dispersed), and may be formed in a plate shape. The absorber 14a is attached to the inner surface 124a of the test base 12a by, for example, adhesion. Therefore, the inner surface 124a (with the absorber 14a) of the test base 12a is a wave absorbing surface. In an embodiment, the absorber 14a may be formed on the inner surface 124a of the test base 12a by, for example, coating. The absorber 14a can absorb electromagnetic waves with a frequency of 25 GHz to 80 GHz.

The device holder 2 of FIGS. 17 to 19 is the same as the device holder 2 of FIGS. 3 and 4. Pack The bracket 2 is placed in the propagation space 123a and is supported by the test base 12a. In some embodiments, the extension 22 of the device holder 2 can be positioned in or coupled to the slot 127a of the side wall 121a of the test base 12a. Therefore, the device holder 2 can be placed in the propagation space 123 such that the containing space 23 is surrounded by the absorber 14a, and the measurement modules (including, for example, the first measurement module 61a, the second measurement module 62a, The third measurement module 63a, the fourth measurement module 64a, and the fifth measurement module 65a) face the receiving space 23 of the device holder 2.

Measurement modules (including, for example, the first measurement module 61a, the second measurement module 62a, the third measurement module 63a, the fourth measurement module 64a, and the fifth measurement module 65a), respectively Installed in each of the receiving openings of the side wall 121a and the bottom wall 122a (for example, including the first receiving opening 1261a, the second receiving opening 1262a, the third receiving opening 1263a, the fourth receiving opening 1264a, and the fifth receiving opening 1265a) . In addition, the measurement modules (including, for example, the first measurement module 61a, the second measurement module 62a, the third measurement module 63a, the fourth measurement module 64a, and the fifth measurement module 65a) can Including the transmitter/receiver surface (including, for example, the first surface 611a, the second surface 621a, the third surface 631a, the fourth surface 641a and the fifth surface 651a), which are exposed from the opening of the absorber 14a and face the device holder 2 The undertaking part 21. In one embodiment, the measurement modules (including, for example, the first measurement module 61a, the second measurement module 62a, the third measurement module 63a, the fourth measurement module 64a, and the fifth measurement module) Group 65a) is waveguides or probe antenna types.

As shown in FIGS. 17 and 18, the testing device 1a may further include a first connector 661a, a second connector 662a, a third connector 663a, a fourth connector (not shown), and a fifth connector (not shown). exhibit). The intermediate device 71 of the subsystem 7 is electrically connected to the first measurement module 61a through the first connector 661a, is electrically connected to the second measurement module 62a through the second connector 662a, and is electrically connected to the third connector 663a. The third measurement module 63a is electrically connected via the fourth connector To the fourth measurement module 64a, and is electrically connected to the fifth measurement module 65a through the fifth connector.

The DUT 4 of the test system 3a of Figs. 17 and 18, the top circuit board 34 (for example, a test board), the carrying arm 30, the chuck 32, the connection base 35, the top absorber 36, the tester 38, and the bottom circuit board 50 (E.g., load board), board reinforcement 52, digital signal processor (DSP) circuit 382, and subsystem 7 can be combined with DUT 4 and top circuit board 34 (e.g., test board) of test system 3 in FIGS. 9 and 12 , Carrying arm 30, chuck 32, connection base 35, top absorber 36, tester 38, bottom circuit board 50 (for example, load board), board reinforcement 52, digital signal processor (DSP) circuit 382 and sub System 7 is the same.

FIG. 20 illustrates a cross-sectional view of a test system 3b according to some embodiments of the present invention. FIG. 21 illustrates a perspective view of the device holder 2b of FIG. 20. FIG. The test system 3b of Fig. 20 is similar to the test system 3 of Figs. 9 and 12, except for the structure of the device holder 2b of the test device 1b.

The device holder 2b is placed in the propagation space 123 and is supported by the test base 12. The device holder 2b includes a receiving portion 21b and an extending portion 22b. The receiving portion 21 defines a receiving space 23b for receiving the DUT 4. The extension portion 22b extends from the receiving portion 21b to the upper surface 1211 of the test base 12. In some embodiments, the extension portion 22b may include a first portion 221b and a second portion 222b. The first part 221b is in the shape of a horizontal ring and is disposed on the upper part 1211 of the test base 12. The second part 222b has a vertical ring shape and is arranged on the inner surface of the absorbent body 14. The second part 222b is connected to the first part 221b. The device holder 2b is arranged in the propagation space 123 so that the accommodating space 23b is surrounded by the absorber 14, and the measurement modules (including, for example, the first measurement module 61, the second measurement module 62, and the third measurement module) The module 63) faces the receiving space 23b of the device holder 2b.

In addition, the receiving portion 21b of the device holder 2b includes at least one or more peripheral portions 211b and at least one or more supporting portions 212b. The peripheral part 211b is connected to the extension part The second part 222b of 22b. In one embodiment, the peripheral portion 211b may be four inclined side walls defining the accommodating space 23b and the lower opening 2121b. The supporting portion 212b may be four horizontal pads connected to the bottom portion of the peripheral portion 211b. Therefore, the supporting parts 212b can be arranged at the four corners of the lower opening 2121b for supporting the four bottom corners of the DUT 4. In one embodiment, the device holder 2b may be integrally formed as a single-piece structure.

Figure 22 illustrates a cross-sectional view of a test system 3c according to some embodiments of the present invention. FIG. 23 illustrates a perspective view of the device holder 2c of FIG. 22. FIG. The test system 3c of FIG. 22 is similar to the test system 3b of FIG. 20, except for the structure of the device holder 2c of the test device 1c. The device holder 2c of FIGS. 22 and 23 is similar to the device holder 2b of FIGS. 20 and 21, and the differences are described as follows. The device holder 2c of FIGS. 22 and 23 further includes four support columns 25. The top end of each of the support columns 25 is connected to each of the support portions 212b. The bottom end of the support column 25 contacts the absorber 14 on the bottom wall 122 of the test base 12. That is, the part of the device holder 2c (that is, the bottom end of the support column 25) extends to the bottom of the test base 12. When the DUT 4 is placed on the supporting portion 212b, the supporting column 25 can increase the supporting force of the supporting portion 212b. In an embodiment, the device holder 2c may be integrally formed as a single-piece structure.

Figure 24 illustrates a cross-sectional view of a test system 3d according to some embodiments of the present invention. The test system 3d of FIG. 24 is similar to the test system 3b of FIG. 20, except for the structure of the test base 12d of the test device 1d. The test base 12d of FIG. 24 is similar to the test base 12d of FIG. 20, and the difference is described as follows. The test base 12d of FIG. 24 further defines at least one vent 128 located at the bottom portion (ie, the bottom wall 122), and the absorber 14 on the bottom wall 122 further defines the vent 128 corresponding to the test base 12d It is at least one vent 146. At least one airflow 80 flows from the bottom of the test base 12d to (or blows toward) the device holder 2b through the vents 128 and 146. When the DUT 4 is placed on the supporting part 212b, the airflow 80 can increase the distance between the supporting part 212b Supporting force.

FIG. 25 illustrates a cross-sectional view of a test system 3e according to some embodiments of the present invention. The test system 3e of Fig. 25 is similar to the test system 3 of Figs. 9 and 12, except for the structure of the device holder 2e of the test device 1e. The device holder 2e extends adjacent to the inner surface 124 of the test base 12. In one embodiment, the device holder 2e fills (or fills) the propagation space 123 defined by the absorber 14 of the test base 12, so the device holder 2e contacts the absorber 14. The device holder 2e defines a receiving space 23e recessed from its upper surface for receiving the DUT 4. The size of the accommodating space 23e can be substantially equal to the size of the DUT 4. Alternatively, the size of the accommodation space 23e may be larger than the size of the DUT 4. The device holder 2e may be a solid block structure. In some embodiments, the material of the device holder 2e may include plastic, wood, acrylic or aerogel.

Figure 26 illustrates a perspective view of a DUT 4a according to some embodiments of the present invention. The DUT 4a in FIG. 26 is similar to the DUT 4 in FIG. Except for the DUT 4a, it further includes the connector 82 and does not include the electrical contacts 431 (for example, solder balls or solder bumps) in FIG. 10. That is, the electrical contacts 431 (for example, solder balls or solder bumps) in FIG. 10 are replaced by the connectors 82. The connector 82 is placed adjacent to its upper surface (ie, the first surface 41), and the antenna 46 is placed adjacent to the second surface 42 of the DUT 4a. Therefore, the connector 82 and the antenna 46 are placed on different sides of the DUT 4a. The connector 82 is electrically connected to the substrate 43 and is used for external connection. In some embodiments, the connector 82 may be an IPEX connector or an FPC connector.

Figure 27 illustrates a bottom perspective view of the DUT 4b according to some embodiments of the present invention. The DUT 4b of FIG. 27 is similar to the DUT 4a of FIG. 26. Except that the connector 82 and the antenna 46 are placed on the same side of the DUT 4b. In one embodiment, the connector 82 and the antenna 46 are both positioned adjacent to the second surface 42 of the DUT 4b. The connector 82 is electrically connected to the substrate 43 and is used for external connection.

FIG. 28 illustrates a bottom perspective view of the DUT 4c according to some embodiments of the present invention. The DUT 4c of FIG. 28 is similar to the DUT 4b of FIG. 27, except that the second radiation source/receiver 462 of the antenna 46 is omitted, and the third radiation source/receiver 463, the fourth radiation source/receiver 464, and the second radiation source/receiver 462 are omitted. The five radiation source/receiver 465 is placed on the right part of the DUT 4c. It should be noted that the connector 82 is placed on the left part of the DUT 4c. Therefore, the connector 82 and the antenna 46 (including, for example, the first radiation source/receiver 461, the third radiation source/receiver 463, the fourth radiation source/receiver 464, and the fifth radiation source/receiver 465) are arranged On different parts of DUT 4c.

Figure 29 illustrates a cross-sectional view of a testing system 3f according to some embodiments of the present invention. The test system 3f of Fig. 29 is similar to the test system 3 of Figs. 9 and 12, and the differences are described as follows. In the test system 3f, the DUT 4a (FIG. 26) replaces the DUT 4 in FIGS. 9 and 12. In addition, the connection base 35 and the test probe 351 are omitted. As shown in FIG. 29, the test system 3f further includes an electrical connection element 84. The electrical connection element 84 is electrically connected to the top circuit board 34 (for example, a test board). During the test, the electrical connection element 84 is inserted into the connector 82 of the DUT 4a or engaged with the connector 82 of the DUT 4a. Therefore, the top circuit board 34 (for example, the test board) is electrically connected to the DUT 4a via the electrical connection element 84 and the connector 82.

FIG. 30 illustrates a cross-sectional view of a test system 3g according to some embodiments of the present invention. The test system 3g of FIG. 30 is similar to the test system 3e of FIG. 25, and the differences are described as follows. In the test system 3g, DUT 4c (Figure 28) replaces DUT 4 in Figure 25. In addition, the connection base 35 and the test probe 351 are omitted. As shown in FIG. 30, the test system 3g further includes an additional test base 129, a conversion board 86, and an electrical connection element 88. The additional test base 129 includes one or more side walls 1291 (for example, three side walls 1291) and a bottom wall 1292. The additional test base 129 is attached to the side wall 121 of the test base 12 so as to define the accommodating space 130. That is, the three side walls 1291 and bottom wall 1292 of the additional test base 129 and one side wall of the test base 12 121 together define the accommodating space 130. The adapter plate 86 is arranged on the top part of the accommodating space 130 of the additional test base 129. That is, the adapter board 86 is arranged outside the test base 12. In an embodiment, the accommodating space 130 may be empty, and the adapter plate 86 is fixed to the side wall 121 of the test base 12 and the side wall 1291 of the additional test base 129. In an embodiment, the accommodating space 130 may be filled with a filling material, and the adapter plate 86 is disposed on the filling material. In addition, the electrical connection element 88 is electrically connected to the adapter board 86. During the test method, the electrical connection element 88 is inserted into or engaged with the connector 82 of the DUT 4c. Therefore, the adapter board 86 is electrically connected to the DUT 4c via the electrical connection element 88 and the connector 82. In addition, the adapter board 86 is electrically connected to the bottom circuit board 50 (for example, a load board) and/or the tester 38. Therefore, the top circuit board 34 (for example, a test board) can be omitted.

As shown in FIG. 30, the device holder 2g of the test device 1g fills (or fills) the propagation space 123 defined by the absorber 14 of the test base 12. The device holder 2g has an upper surface 26 which is substantially coplanar with the upper surface 1211 of the side wall 121 of the test base 12. During the test method, the second surface 42 of the DUT 4c can contact the upper surface 26 of the device holder 2g and the upper surface 1211 of the sidewall 121 of the test base 12.

Unless otherwise specified, such as "above", "below", "above", "left", "right", "below", "top", "bottom", "vertical" , "Level", "side", "higher", "lower", "upper", "above", "below", etc. The space descriptions are relative to those shown in the figure Directional instructions. It should be understood that the spatial description used in this article is for illustrative purposes only, and the actual implementation of the structure described in this article can be spatially configured in any orientation or manner, as long as the configuration does not deviate from the advantages of the embodiments of the present invention. .

As used herein, the terms "approximately", "basically", "basic" and "about" are used to describe and consider small changes. When used in conjunction with an event or situation, these terms can refer to a situation in which the event or situation clearly occurs and a situation in which the event or situation is close to occurrence. condition. For example, when used in conjunction with numerical values, these terms can refer to a range of variation less than or equal to ±10% of that value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3% , Less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two values is less than or equal to ±10% of the average of these values (for example, less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or Equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then these values can be considered substantially the same or equal.

If the displacement between the two surfaces is not more than 5 μm, not more than 2 μm, not more than 1 μm, or not more than 0.5 μm, the two surfaces can be considered coplanar or substantially coplanar.

As used herein, unless the context clearly indicates otherwise, the singular terms "a", "an" and "the" may include plural objects. In the description of some embodiments, a component provided "on" or "above" another component may include the condition that the latter component is directly on the previous component (for example, physical contact), and one or more of them The intervening component can be located between the previous component and the next component.

As used herein, the terms "conductivity", "conductivity" and "conductivity" refer to the ability to transmit electric current. Conductive materials generally indicate those materials that exhibit little or no resistance to current flow. One measure of electrical conductivity is Siemens/meter (S/m). Generally, the conductive material has a value greater than about 10⁴S/m conductivity material, for example at least 10⁵S/m or at least 10⁶S/m. The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of the material is measured at room temperature.

In addition, quantities, ratios, and other numerical values are sometimes presented in this document in a range format. It should be understood that this range format is used for convenience and brevity and should be flexibly understood as Including values clearly defined as the limits of the range, and also including all individual values or sub-ranges included in that range, as if each value and sub-range were clearly defined.

Although the present invention has been described and illustrated with reference to specific examples of the present invention, these descriptions and illustrations are not restrictive. Those familiar with this technology should understand that various changes can be made and equivalents can be substituted without departing from the true spirit and scope of the present model as defined by the scope of the attached patent application. The description does not have to be drawn to scale. Due to the manufacturing process and tolerances, there may be differences between the exquisite presentation in this model and the actual device. There may be other embodiments of the invention that are not specified. The description and drawings should be regarded as illustrative and not restrictive. Modifications can be made to adapt specific conditions, materials, material compositions, methods or procedures to the purpose, spirit and scope of the present invention. All such modifications are intended to fall within the scope of the attached patent application. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations can be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of the present invention. Therefore, unless otherwise specified herein, the order and grouping of operations are not the limitation of the present invention.