Connector

Connector

The present invention relates to the field of electrical connectors, and more particularly to the field of input/output (I/O) connectors.

A typical I/O connector system includes a cable component and a connector mounted on the circuit board. Cable components typically include a pair of plug connectors on opposite ends of a cable that are configured to transmit signals over a desired distance. The connector mounted on the circuit board is typically a socket in a panel that is configured to receive the plug connector and interface with the plug connector.

As data transmission rates increase, an insurmountable problem is the physical limitations of the medium used to transmit signals between the plug connectors. For example, passive cables are cost effective for shorter distances, but tend to be limited by distance as the signal frequency increases. Active copper and fiber optic cables are ideal for transmitting signals over long distances, but require energy, so if the connector system is not properly designed, it is prone to heat dissipation. One solution is to use a riding heat sink on the socket. Although existing solutions have some effect, there are still difficulties in providing sufficient heat dissipation. Therefore, further improvement of its thermal management will be appreciated by some people.

In view of the above problems of the prior art, the present invention provides a connector capable of improving thermal management.

To this end, the present invention provides a connector comprising: a cover assembly defining a first port and a second port; a housing in which the housing is located, The housing includes a first card slot located in the first port and a second card slot located in the second port; a heat transfer plate having the heat transfer plate along the first a main wall, a first side wall and a second side wall extending vertically from the first port and the second port; a first elastic finger carrier, wherein the first elastic finger carrier is mounted on the first a plurality of resilient fingers supported on a side wall, the plurality of resilient fingers on the first resilient finger carrier being configured to engage a module inserted into the first port; a second resilient finger carrier, the second resilient finger carrier is mounted on the second sidewall and supports a plurality of resilient fingers, the second resilient finger carrier A plurality of resilient fingers are configured to engage a module that is inserted into the second port.

Preferably, the main wall is supported by a plurality of fins.

Preferably, the fin is integral with the main wall.

Preferably, the first side wall supports an additional plurality of fins.

Preferably, the additional plurality of fins are integral with the first side wall.

Preferably, the first side wall and the second side wall are respectively located on the same side of the respective port.

Preferably, the plurality of elastic fingers are arranged in a plurality of columns.

Preferably, at least one resilient finger carrier is welded to the side wall.

Preferably, the first resilient finger carrier includes a vertical wall and a retaining leg.

Preferably, the first resilient finger carrier further includes a retaining member configured to engage a wall of the cover assembly.

Preferably, one of the main wall and the first side wall supports a heat dissipating component.

Preferably, the main wall and the first side wall each support a heat dissipating component.

The receptacle connector includes a port configured to receive a mating module. The port is provided with a plurality of resilient fingers that are configured to engage the docking module. The resilient fingers are in thermal communication with a heat transfer plate that is configured to provide a portion of the wall defining the port. The fins can be mounted on a heat transfer plate. During operation, the thermal energy of the module is transferred from the module to the resilient fingers and its thermal energy is transferred from the resilient fingers to the heat transfer plates in turn, to the fins (if included). The connector system can be arranged such that air flows from front to back, so the connector system shown is suitable for use, for example, to direct air from one side of the bracket (eg, the front or rear side) to the bracket The structure of the side bracket system. If desired, the socket can be a stacked connector configuration with two vertically aligned ports.

By using the novel, the heat dissipation problem of the connector in the prior art can be improved, and the heat dissipation effect is better.

The detailed description below describes a number of illustrative embodiments and is not intended to be limited to such combinations disclosed. Accordingly, the features disclosed herein may be grouped together to form other combinations that are not otherwise shown for the purpose of clarity.

Referring to Figures 1 through 3, as can be appreciated from the figures, a receptacle connector 10 is typically mounted behind a baffle 20 (showing a portion of the baffle 20). If the baffle 20 is considered to be positioned in front of the socket and its opposite end is considered to be a rear, a system configuration may allow air to flow from front to back. If the system configuration is configured to allow air to flow from front to back, the baffle 20 can include an air inlet 25 that can be formed by one or more apertures of a desired shape on the baffle 20. As can be appreciated, the size of the apertures and the arrangement of the apertures are primarily determined by the desired airflow required to cool the system, and those skilled in the art will be able to determine the desired configuration of the air inlet 25 based on system requirements.

A connector system 1 includes a receptacle connector 10 located on a circuit board 5 and includes a plurality of ports 30 (first port, second port) located in a plurality of openings 22 of the baffle 20, port 30 A plug connector that is configured to receive a docking. As shown, this design allows air to pass through the baffle 20. An EMI seal 26 and a gasket 28 help seal the receptacle connector 10 to the baffle 20.

As shown, a shield member 50 includes a top cover 51 that joins a first and second receptacle 90 together. As shown, the optional top cover 51 includes a hole 40 that can be used to direct airflow away from the circuit board 5 while also joining two adjacent receptacle connectors together. Because the top cover 51 extends between the two cover assemblies 100, the top cover 51 also tends to form a rear passage 42 that can be configured to direct air from front to back.

Referring to Figures 3 to 6, as shown, each of the first and second sockets Each of 90 includes a cover assembly 100 that includes a body portion 100b and a rear portion 100a, and further includes two heat transfer plates 125, 125' mounted to the wall 105 of the body portion 100b. A central guide member 110 is positioned between the heat transfer plates 125, 125' and includes a surface 111 that is capable of supporting the heat transfer plate 125. As can be appreciated, the surface 111 can be stepped to provide sufficient space for the heat transfer plate 125. Of course, it should be noted that the illustrated first and second receptacles 90 are provided with stacked two ports 30. A lower profile of the receptacle connector 10 (see FIG. 1) having a single port 30 is also suitable, and the optional central guide 110 can be omitted and has a single heat transfer plate 125. It should also be noted that although the system shown includes two resilient finger carriers 151, 152 that may be considered to be disposed on the top and bottom sides of the port 30 (where the resilient finger carrier 151 is the first elastic) The finger carrier, the resilient finger carrier 152 is the second resilient finger carrier, but other configurations are contemplated. For configurations with lower heat dissipation issues, for example, a single resilient finger carrier can be used. The resilient finger carrier and heat transfer plate can also be configured to engage one or both sides of a module when a heat transfer region is above or below the module (rather than the side as shown) ( Instead of the top and bottom of a module).

Each of the shell assemblies 100 encloses a housing 200 that includes a body portion 210 that supports the two nose portions 215, 215'. Each of the noses 215, 215' supports a card slot 220, 220', and the card slot 220, 220' is configured to receive a card from the docking module, that is, the housing 200 includes A card slot 220, 220' in the port 30. A front cowl wall 230 includes a plurality of conductive walls that help define a surrounding surrounding body portion 210. One tail 232. As shown, a plurality of light pipes 245 can be positioned and arranged to extend forward between the two noses 215, 215'.

The heat transfer plate 125 can extend vertically beyond a single port 30 if desired. For example, the heat transfer plate 125 shown in Figure 9 can be arranged such that a main wall (main The wall C extends vertically the height of the two ports 30 (see FIG. 4), and each of the side walls A (first side wall) and the side wall B (second side wall) engages a single plug inserted into the corresponding port 30. The side (the side wall B joins the top side, the side wall A engages the bottom side), and the elastic finger carrier plates 151, 152 are mounted on the side walls A, B. The main wall C supports a plurality of fins 300, that is, the fins 300 are integral with the main wall C, and it should be noted that if desired, the heat transfer plates are not necessarily one piece, but may It consists of multiple pieces. As can be appreciated, this allows the heat transfer plate 125 to have a main wall C extending vertically along the two stacked ports 30, while also providing a plurality of side walls for engaging the two surfaces of a plug connector that is inserted. . As can be further appreciated, the main wall C will follow a first side 30a of the port(s) 30, the side wall A will follow a side 30b of the port 30, and the side wall B will follow a side of the port 30. 30c. It should be noted that the sides 30b, 30c can be two opposite sides of the same port 30, or two different sides 30b of two different ports 30. It should further be noted that although the heat transfer plate 125 is shown as having a U-shaped design, one side thereof may be removed to provide a more L-shaped shape. It is also possible to arrange the resilient fingers 161 directly on the main wall C, but this configuration tends to reduce the amount of thermal energy that can be removed.

In addition, if a more complicated heat transfer plate is desired, the heat transfer plate may have The main wall is formed by a vapor chamber or some other system having a lower thermal resistance than a copper plate. However, for most applications, heat transfer plates 125, 125' made of copper plates will suffice. It should also be noted that the fins 300 need not be disposed on the sides between the connectors (as shown). Such a system provides certain benefits, but if the system is designed to benefit from airflow over the connector, it may be more desirable that the heat transfer plates 125, 125' direct thermal energy up above the connector, and The fins 300 (or other desired thermal energy transfer system, such as may be liquid cooled, etc.) are positioned above the receptacle connector 10.

As can be appreciated, the illustrated construction advantageously has the ability to allow for stacked configurations, and also utilizes the increased surface area of the top and bottom surfaces of a rectangular module (eg, an SFP type module) to minimize heat. The advantage of resistance. Additionally, the provision of resilient finger carriers 151, 152, 153, 154 on opposite sides helps provide a mechanical balancing system because the two opposing resilient fingers 161, 161' facilitate centering of the module. It should be noted that the contact force provided by each of the resilient fingers 161, 161' can be based on the desired thermal resistance (increasing the contact force will tend to improve heat conduction) and the desired module insertion force (increasing the contact force will be easy Increase the required insertion force) and change. Thus, the profile and contact force can be adjusted as needed to meet system requirements, wherein the contact force can be, but is not limited to, a range of about 100 to 400 grams force per resilient finger 161, 161'.

Referring to Figures 6 and 7, as shown, the heat transfer plate 125 includes a plurality of channels 130. The illustrated channel 130 extends through the heat transfer plate 125 and when the contacts 162, 162' of the resilient fingers 161, 161' are joined to the insertion On the module, the channel 130 provides a displacement region for the tail portions 163, 163' of the resilient fingers 161, 161'. Therefore, when the docking module is inserted in a first direction 166, the resilient fingers 161, 161' are translated in a second direction 164 and a third direction 165, respectively, and the second direction 164 and the third direction 165 are opposite each other. . As can be appreciated, in alternative embodiments, the functionality provided by the channel 130 can also be provided by a plurality of recesses or recesses in the heat transfer plate 125 that do not extend through the heat transfer plate 125. Accordingly, the displacement region in the heat transfer plate 125 may be a recess or channel 130 that does not extend through the heat transfer plate 125.

Referring to Figures 4, 6 and 7, each of the resilient finger carriers 151, 152, 153, 154 includes a plurality of resilient fingers 161, 161', each of which includes a contact Surfaces 162, 162' and tails 163, 163'. As shown, the resilient fingers 161 are arranged in a plurality of columns 160, each column 160 including a plurality of resilient fingers 161. It should be noted that the plurality of columns are shown in a pattern that is straight forward to align the channel 130 in the heat transfer plate 125 with the tails 163, 163' so that when the module is inserted into the port 30, The tails 163, 16 3' can be displaced into the channel 130. However, the use of multiple columns 160 may not be required, and may be set to other styles as desired.

The resilient fingers 161, 161' are configured to engage a module that is inserted into the corresponding port 30 to provide a plurality of thermal contacts to the inserted module. This design is advantageous in comparison to existing designs that tend to use a single board to engage the module in that the plurality of resilient fingers 161, 161' are capable of individually engaging the surface of the module and are therefore more suitable for coping with the mold group The change in surface flatness. Although the total surface area (compared to the large plates typically used with jumper heat sink designs) has been reduced, it has been determined that the use of multiple resilient fingers 161, 161' is actually very effective and can actually be somewhat unexpected. The ground provides a lower thermal resistance between the module and the resilient finger carrier plates 151, 152, 153, 154 than is typically provided between the module and a floating heat sink having a flat surface.

The thermal resistance can be managed by increasing the spring force associated with each of the resilient fingers 161, 161 ' and by varying the number of resilient fingers 161, 161 '. In general, the limit on the number of spring force and resilient fingers 161, 161 ' will be based on the acceptable maximum insertion force and the thermal energy that needs to be removed from the module to be inserted.

The resilient finger carriers 151, 152 can be mounted on the heat transfer plate 125 to minimize thermal resistance between the two structures. For example, in one embodiment, the resilient finger carrier 151 can be soldered to the sidewall A of the heat transfer plate 125 by a reflow process, and/or the resilient finger carrier 152 can be soldered to the heat transfer plate using a reflow process. Side wall B of 125. In one embodiment, the reflow process can be performed in conjunction with the mounting of the fins 300 to the heat transfer plates 125 to provide a highly efficient manufacturing process. Of course, other methods of installation (e.g., using a thermally conductive adhesive or the like) can be used. While the solder joint method can provide very low thermal resistance, the use of a thermally conductive adhesive (when kept thin) is also suitable because its total surface area is sufficient to provide low thermal resistance between the two mating structures. It should be noted that in an embodiment, the heat transfer plate 125 and the elastic finger carrier plates 151, 152 may be combined into a single structure, however, this structure is more challenging for mass production, and thus is considered to be two-piece. The structure provides a lower total cost.

The fins 300 are configured to provide an increased surface area to improve heat transfer from the socket to the air flowing through the socket. As shown, the fins 300 are configured to provide good heat transfer (or vice versa) to the air flowing from front to back. However, the shape of the fins 300 can be varied to suit the desired direction of airflow, and thus the shapes shown are merely illustrative. It should be noted that the fins 300 are optional, and the surfaces of the heat transfer plates 125, 125' may be used instead of the fins 300. Additionally, a system provided for liquid cooling can provide a conduit that rests on the heat transfer plates 125, 125' and that is configured to conduct heat away from the heat transfer plates 125, 125'. Additionally, if it is desired to use the fins 300, the fins 300 can be formed as part of the heat transfer plates 125, 125'. However, as can be appreciated, one advantage of forming the fins 300 separately from the heat transfer plates 125, 125' is that the fins 300 can be designed for a particular airflow configuration and positioned in a desired orientation (eg, in a connection) The side of the device, above the connector, etc.) thus provides considerable flexibility in the design of the connector.

As can be appreciated from Figures 4, 7, and 8, the fins 300 can occupy a substantial amount of space between the two stacked connectors. Thus, the size and position of the fins 300 can be varied as discussed herein to allow for a reduction in the spacing between the ports 30.

Thus, in general, the thermal energy of the module is transferred to the resilient fingers 161, 161' (and thus to the resilient finger carrier). If the resilient finger carriers 151, 152, 153, 154 are welded to the heat transfer plates 125, 125', the resilient finger carriers 151, 152, 153, 154 and the heat transfer plates The thermal resistance between 125 and 125' can be minimal. Similarly, if the optional fins 300 are soldered to the heat transfer plates, the thermal resistance can be minimized. Thus, with reference to the thermal energy path shown in Figure 10, the temperature difference between the module and the fin can be made less than 15 °C, and in some embodiments about 10 °C. In general, the maximum temperature drop (except for the temperature drop between the fin and any outside air flowing through the fin) will exist between the module and the resilient finger carrier, and in one embodiment, The temperature difference between the module and the resilient fingers can be substantially greater than the temperature difference between the other components.

While a wide variety of embodiments are contemplated, it should be noted that the thermal path arrangement between the illustrated module and the fins 300 enables the channel 130 to be aligned with the intended thermal path and thus has only minimal thermal resistance. influences.

As can be appreciated from Figure 10, in step 400, thermal energy is generated by the module when a module is inserted into the connector. Next, in step 410, thermal energy is directed away from the module by the resilient fingers. Then in step 420, thermal energy is transferred to the heat transfer plates. Finally, in step 430, thermal energy is transferred to a system to direct thermal energy away from the system (step 430, such as but not limited to being performed by fins 300). However, it should be noted that fins (or any special heat transfer system) can be omitted in some systems because the improved performance of directing thermal energy away from the module is sufficient to cool the system. However, in many applications, the increased power output of the module may make it desirable to have certain heat transfer systems.

11-15B illustrate another embodiment of a receptacle connector 210a that includes variations of the features discussed above. As shown, the receptacle connector 210a includes a cover assembly 350 that is configured to enclose a housing 400a . The cover assembly 350 (which, as shown, can be assembled from a plurality of separate components) includes a side aperture 360 and a top aperture 355 that allow a heat dissipation system 301 to be used. The heat dissipation system 301 includes a heat transfer plate 301a having a main wall 302, an upper side wall 306 (first side wall), and a lower side wall 304 (second side wall). Of course, some other number of sidewalls may be added if desired, and if desired, only one sidewall may be used (although this system will tend to be most beneficial for a non-overlapping configuration).

Referring to Figures 11 and 12, as can be appreciated, the main wall 302 extends vertically along two ports 230a, 230b (where port 230a is the first port and port 230b is the second port), that is, the upper side wall The 306 and lower sidewalls 304 are located on the same side of the respective ports 230a, 230b, respectively, thereby obviating the need for heat transfer between the two ports 230a, 230b (and thus helping to maintain low thermal resistance). If desired, and as shown, the main wall 302 can extend even over the top port 230a to provide additional surface area. And the housing 400a includes a card slot located in the ports 230a, 230b.

As can be appreciated, when the design of the two fins and walls discussed above with respect to Figures 1-9 is suitable, the main wall 302 of the heat transfer plate 301a illustrated in Figures 11-15B can be squeezed The pressure is formed such that the selectable fins 307 are integral with the main wall 302, thereby reducing potential heat transfer between the two components. The fins 307 act as a heat dissipating component. That is, the main wall 302 and/or the upper sidewall 306 supports a heat dissipating component. Of course, a liquid cooling solution with a liquid filled container can also be used as a heat dissipating element to help transfer the transferred thermal energy away from one of the main wall 302 or the plurality of side walls (by This replaces the fins). It is contemplated that the use of a liquid cooling scheme will slightly complicate the heat transfer plate 301a and the overall heat dissipating component (e.g., the heat dissipating component may benefit from being welded to the heat transfer plate).

Referring to FIGS. 12, 13 and 14, the upper sidewall 306 includes a plurality of fins 309 extending away from the upper sidewall 306 along a first direction X. The additional plurality of fins 309 are integral with the upper sidewall 306. . At the same time, the main wall 302 includes a plurality of fins 307 extending away from the heat transfer plate 301a in a second direction Y, wherein the first direction X and the second direction Y are perpendicular. One advantage of this configuration is that the design of the extruded fins 307, 309 can be employed when the fins 307, 309 allow for a very suitable position on the sides and top of the respective connector.

The illustrated upper sidewall 306 supports a resilient finger carrier 316 (first resilient finger carrier) that includes a finger that is configured to engage the wall of the cover assembly 350. Part 317. The resilient finger carrier 316 also supports a plurality of resilient fingers 318 that can function similarly to the resilient fingers 161 discussed above, the plurality of resilient fingers 318 being configured to engage to be inserted into the port 230a In one of the modules, the plurality of resilient fingers 318 are shown arranged in a plurality of columns. The lower side wall 304 supports an elastic finger carrier 315 (second elastic finger carrier), and the elastic finger carrier 315 is supported and a plurality of elastic fingers 318 are provided for engagement to be inserted into the A module in the port 230b, the plurality of resilient fingers 318 are arranged in a plurality of columns. In particular, the resilient fingers 318 extend away from their support sidewalls and are configured to deflect toward the support sidewalls. One difference is that the resilient fingers 318 do not include a recess that needs to be in the side wall of the support. The tail. As can be appreciated, including or not including the tail will depend on the desired contact interface and desired number of lead-in. The illustrated resilient finger carrier plates 315, 316 further include a vertical wall 321 and a retaining leg 320 that extends below the bottom of the corresponding port and can include a wall that engages one of the cover assemblies 350 The retaining members 322, both of which help secure the heat dissipation system 301 to the corresponding shroud assembly 350. However, it should be noted that the vertical wall 321, the holding leg 320, and the retaining member 322 are selectable, and one or the other (or both) may be used depending on the application.

To secure the upper and lower sidewalls 304, 306 to the main wall 302, slots 311a, 311b may be provided to help secure the upper and lower sidewalls 304, 306 in place. In an embodiment, the upper and lower sidewalls 304, 306 can be welded in place. When it is desired to weld the resilient finger carriers 315, 316 in place (although this configuration may not be required), if all of the components are welded together at once, a certain scale benefit can be obtained.

As can be appreciated from Figures 15A and 15B, one benefit of the illustrated design is the ability to remove thermal energy from the top of the inserted module. As the thermal energy increases, the top of the module tends to be hottest, whereby the illustrated design keeps the system relatively compact and relatively more efficient when transferring thermal energy from the module out of the system. One benefit of the design illustrated in Figures 11-15B is that it is compact and thereby facilitates increasing the number of connectors that can be positioned in a particular space. Of course, this additional compactness reduces the surface area of the selectable fins 307, 309, thereby limiting heat dissipation. It is contemplated that it may be more desirable for certain designs to remove the fins on the main wall 302. 307, 309 and replace the fins on the upper side wall with a liquid cooling chamber. Thus, the illustrated connector system 1 is not limited to working with a particular heat dissipation system 301.

The disclosure provided herein describes various features of the preferred embodiments and illustrative embodiments. Many other embodiments, modifications, and variations are possible within the scope and spirit of the claims and the scope of the disclosure.

<p>1Connector System</p><p>10Socket connector</p><p>100cover assembly</p><p>100aback</p><p>100b Main Body</p><p>105 wall</p><p>110Central Guides</p><p>111 surface</p><p>125heat transfer plate</p><p>125' heat transfer plate</p><p>130 channel</p><p>151Flexible finger carrier</p><p>152Flexible finger carrier</p><p>153Flexible finger carrier</p><p>154Flexible finger carrier</p><p>160</p><p>161Flexible fingers</p><p>161'Elastic finger</p><p>162Contact/contact surface</p><p>162'Contact/contact surface</p><p>163 tail</p><p>163' tail</p><p>164second direction</p><p>165 third direction</p><p>166 first direction</p><p>20Baffle</p><p>200shell</p><p>210 Main body</p><p>210aSocket connector</p><p>215Nose</p><p>215'Nose</p><p>22 openings</p><p>220 card slot</p><p>220' card slot</p><p>230 front cover wall</p><p>Port 230a</p><p>230b port</p><p>232 tail</p><p>245Light pipes</p><p>25air inlet</p><p>26EMI Seals</p><p>28shims</p><p>30port</p><p>30a first side</p><p>30b side</p><p>30c side</p><p>300Fins</p><p>301heating system</p><p>301aheat transfer plate</p><p>302Main wall</p><p>304lower side wall</p><p>306 upper side wall</p><p>307Fins</p><p>309Fins</p><p>311a slot</p><p>311b slot</p><p>315Flexible finger carrier</p><p>316Flexible finger carrier</p><p>317 finger</p><p>318Flexible fingers</p><p>320 Keep your feet</p><p>321 vertical wall</p><p>322 Keeping components</p><p>350Cover assembly</p><p>355Top hole</p><p>360 side hole</p><p>40 hole</p><p>400 steps</p><p>400ashell</p><p>410Steps</p><p>42post access</p><p>420 steps</p><p>430 steps</p><p>5Circuit board</p><p>50Shielding components</p><p>51Top cover</p><p>90first and second sockets</p><p>A sidewall</p><p>B sidewall</p><p>CMain Wall</p><p>X first direction</p><p>Ysecond direction</p>

The present invention is illustrated by way of example and not limitation in the drawings, in which the same reference numerals refer to the same elements, in which: Figure 1 shows a perspective view of an embodiment of a connector system.

Figure 2 shows an exploded perspective view of the connector system shown in Figure 1.

Figure 3 shows a perspective view of an embodiment of a stacked receptacle connector.

Figure 4 shows a partial exploded perspective view of the stacked receptacle connector shown in Figure 3.

Figure 5 shows another partial exploded perspective view of the stacked receptacle connector shown in Figure 3.

Figure 6 shows a perspective cross-sectional view of an embodiment of a portion of the receptacle connector system taken along line 6-6 of Figure 1.

Figure 7 shows a partial side elevational view of a section of an embodiment of a port of a receptacle connector.

Figure 8 shows a perspective cross-sectional view of a portion of the receptacle connector system taken along line 8-8 of Figure 1.

Figure 9 illustrates an exploded perspective view of an embodiment of a thermal management system.

Figure 10 shows a flow chart for heat transfer from a module.

Figure 11 shows a perspective view of an embodiment of a receptacle connector.

Figure 12 is a partial exploded perspective view of the receptacle connector shown in Figure 11.

Figure 13 shows a perspective view of an embodiment of a heat transfer plate.

Figure 14 shows an exploded perspective view of an embodiment of a heat transfer plate.

Figure 15A shows a perspective view of a cross section taken along line 15-15 of the embodiment shown in Figure 11.

Figure 15B shows another perspective view of the embodiment shown in Figure 15A.