Lead arrangement, electric connector and electric assembly

Pin arrangement, electrical connector and electronic assembly

LEAD ARRANGEMENT, ELECTRIC CONNECTOR AND ELECTRIC ASSEMBLY

The present invention relates to an electrical connector, and more particularly to a pin arrangement of an electrical connector and its electrical connector and electronics assembly.

Universal Serial Bus 3.0 (USB 3.0) is a signal transmission specification developed from USB 2.0 with a transfer rate of 5G bps, while the traditional USB 2.0 transfer rate is only 480M bps. The USB 3.0 electrical connector has been determined to be compatible with USB 2.0 electrical connectors, meaning that USB 3.0 uses the same electrical connector structure as USB 2.0 and adds several pins for USB 3.0 functionality. Therefore, under the USB 2.0-based electrical connector structure, it is necessary to propose a USB 3.0 electrical connector structure to meet the demand.

This creation proposes a pin arrangement suitable for an electrical connector. The pin arrangement includes a first pin row including a pair of first differential signal pins, a pair of second differential signal pins, and a first ground connection between the two pairs of differential signal pins foot. The pair of first differential signal pins, the pair of second differential signal pins and the first ground pin respectively have a surface mounting section adapted to be soldered to a surface pad of a circuit board.

The present invention proposes an electrical connector comprising a metal housing, an insulating base connecting the metal housing, and a pin arrangement disposed on the insulating base. The pin arrangement includes a first pin row including a pair of first differential signal pins, a pair of second differential signal pins, and a first ground connection between the two pairs of differential signal pins foot. The pair of first differential signal pins, the pair of second differential signal pins and the first ground pin respectively have a surface mounting section adapted to be soldered to a surface pad of a circuit board.

The present application proposes an electronic assembly that includes a circuit board and an electrical connector. The circuit board has a plurality of surface pads and a plurality of through holes. The electrical connector includes a metal housing, an insulating base connected to the metal housing, and a pin arrangement disposed on the insulating base. The pin arrangement includes a first pin row including a pair of first differential signal pins, a pair of second differential signal pins, and a first ground connection between the two pairs of differential signal pins foot. The pair of first differential signal pins, the pair of second differential signal pins and the first ground pin respectively have a surface mounting section that is respectively soldered to the surface pads.

Based on the above, this design solders some key differential signal pins and grounding pins of the electrical connector to the surface pads of the circuit board in a surface-mounted manner, so as to avoid affecting the transmission of key signals and maintaining The quality of high-speed signal channels.

In order to make the above features and advantages of the present invention more comprehensible, the following embodiments are described in detail with reference to the accompanying drawings.

1 and 2 illustrate a front and rear view of a USB 3.0 electrical connector assembled to a circuit board according to an embodiment of the present invention. Referring to FIG. 1 and FIG. 2, an electrical connector 70 of the present embodiment is adapted to be soldered to a circuit board 7, and the circuit The board 7 constitutes an electrical assembly.

The electrical connector 70 includes a metal housing 72, an insulating base 74 connecting the metal housing 72, and a pin arrangement 700 disposed on the insulating base 74. The pin arrangement 700 includes a first pin row 710. And a second pin row 720 alongside the first pin row 710.

The first pin row 710 includes a pair of first differential signal pins 712, a pair of second differential signal pins 714, and a first ground pin located between the two pairs of differential signal pins 712 and 714. 716. In this embodiment, the pair of first differential signal pins 712 are a pair of transmitting differential signal pins T in the USB 3.0 architecture._x⁺And T_x^-And the pair of second differential signal pins 714 are a pair of receiving differential signal pins R in the USB 3.0 architecture._x⁺And R_x^- 。

The second pin row 720 includes a second ground pin 722 , a power pin 724 , and a pair of third differential signal pins 726 between the second ground pin 722 and the power pin 724 . In this embodiment, the pair of third differential signal pins 726 are a pair of transmit/receive differential signal pins D supporting USB 1.0 architecture or USB 2.0 architecture in the USB 3.0 architecture.⁺And D^- 。

In the USB 3.0 architecture, the differential signal pin is transmitted (T_x⁺And T_x^-) and receiving differential signal pins (R_x⁺And R_x^-) is a full-duplex transmission mode, that is, the electronic device can be connected via a differential signal (T)_x⁺And T_x^-) and receiving differential signal pins (R_x⁺And R_x^-) Simultaneous transmission or reception of signals. In addition, transmit/receive differential signal pins (D⁺And D^-) is a half-duplex transmission mode, that is, the electronic device can be connected via a differential signal (D)⁺And D^-) Transfer or receive data. That is, when data transmission is performed, data reception cannot be performed, and when data reception is performed At this time, data transfer is impossible.

In order to ensure that the electrical connector 70 can be securely mounted on the circuit board 7, all of the aforementioned pins are soldered to the through vias 7b of the circuit board 7 by way of via holes. In addition, USB 3.0 high-speed signals (T) are used to prevent the effects of signal propagation caused by through-via caused by through vias between two different metal layers._x⁺And T_x^-And R_x⁺And R_x^-) is usually distributed on the surface metal layer of the circuit board 7.

3 and 4 respectively illustrate the front and rear of a USB 3.0 electrical connector assembled to a circuit board according to another embodiment of the present invention. Referring to FIGS. 3 and 4, an electrical connector 80 of the present embodiment is adapted to be soldered to a circuit board 8 and form an electronic assembly with the circuit board 8.

The electrical connector 80 includes a metal housing 82, an insulating base 84 connecting the metal housing 82, and a pin arrangement 800 disposed on the insulating base 84. The pin arrangement 800 includes a first pin row 810. And a second pin row 820 alongside the first pin row 810.

The first pin row 810 includes a pair of first differential signal pins 812, a pair of second differential signal pins 814, and a first ground pin located between the two pairs of differential signal pins 812 and 814. 816. In this embodiment, the pair of first differential signal pins 812 are a pair of transmission differential signal pins T in the USB 3.0 architecture._x⁺And T_x^-And the pair of second differential signal pins 814 are a pair of receiving differential signal pins R in the USB 3.0 architecture._x⁺And R_x^- 。

The pair of first differential signal pins 812 respectively have a surface seating portion 812a adapted to be soldered to the surface pad 8a of the circuit board 8.₁This is the second difference The signal pins 814 each have a surface seating portion 814a that is also suitable for soldering to the surface pads 8a of the circuit board 8.₂. In addition, the first grounding pin 816 has a via hole piercing section 816a adapted to be soldered to one of the circuit boards 8 through the via hole 8b.₁ 。

The second pin 820 includes a second ground pin 822, a power pin 824 (eg, Vcc), and a pair of third differential pin pins between the second ground pin 822 and the power pin 824. 826. In this embodiment, the pair of third differential signal pins 826 are a pair of transmit/receive differential signal pins D supporting USB 1.0 architecture or USB 2.0 architecture in the USB 3.0 architecture.⁺And D^-. In addition, the second ground pin 822 is adjacent to the pair of second differential signal pins 814 (eg, receiving the differential signal pin R)_x⁺And R_x^-) arranged side by side, and the power pin 824 is adjacent to the pair of first differential signal pins 812 (eg, transmitting the differential signal pin T_x⁺And T_x^-) Side by side configuration.

The second grounding pin 822 has a via hole penetrating section 822a adapted to be soldered to one of the circuit boards 8 through the via hole 8b.₂The power pin 824 has a via hole through section 824a adapted to be soldered to one of the circuit boards 8 through the via hole 8b.₃And the pair of third differential signal pins 826 respectively have a via hole piercing section 826a adapted to be soldered to one of the circuit boards 8 through the via holes 8b.₄ 。

The first differential signal pin 812 and the second differential signal pin 814 of the electrical connector 80 are soldered to the circuit board 8 in a surface manner, and the two pairs of differential signal pins 812 and 814 are improved in the circuit board 8. And the portion protruding below the circuit board 8 causes a large parasitic capacitance to affect the quality of the signal channel and attenuate the transmitted signal. Accordingly, the transmission speed of the electrical connector 80 is higher than the transmission speed of the electrical connector 70.

FIG. 5 and FIG. 6 respectively illustrate the front and rear of a USB 3.0 electrical connector assembled to a circuit board according to still another embodiment of the present invention. Referring to FIGS. 5 and 6, an electrical connector 90 of the present embodiment is adapted to be soldered to a circuit board 9 and form an electronic assembly with the circuit board 9.

The electrical connector 90 includes a metal housing 92, an insulating base 94 connecting the metal housing 92, and a pin arrangement 900 disposed on the insulating base 94. The pin arrangement 900 includes a first pin row 910. And a second pin row 920 alongside the first pin row 910.

The first pin row 910 includes a pair of first differential signal pins 912, a pair of second differential signal pins 914, and a first ground pin located between the two pairs of differential signal pins 912 and 914. 916. In this embodiment, the pair of first differential signal pins 912 are a pair of transmission differential signal pins T in the USB 3.0 architecture._x⁺And T_x^-And the pair of second differential signal pins 914 is a pair of receiving differential signal pins R in the USB 3.0 architecture._x⁺And R_x^- 。

The pair of first differential signal pins 912 respectively have a surface seating portion 912a adapted to be soldered to the surface pad 9a of the circuit board 9.₁The pair of second differential signal pins 914 respectively have a surface seating portion 914a, which is also suitable for soldering to the surface pad 9a of the circuit board 9.₂. In addition, the first grounding pin 916 also has a surface mounting portion 916a, which is also suitable for soldering to the surface pad 9a of the circuit board 9.₃ 。

The second pin 920 includes a second ground pin 922, a power pin 924 (eg, Vcc), and a pair of third differential pin pins between the second ground pin 922 and the power pin 924. 926. In this embodiment, the pair of third differential signal pins 926 support USB 1.0 in the USB 3.0 architecture. A pair of transmit/receive differential signal pins D for architecture or USB 2.0 architecture⁺And D^-. In addition, the second ground pin 922 is adjacent to the pair of second differential signal pins 914 (eg, receiving the differential signal pin R)_x⁺And R_x^-) arranged side by side, and the power pin 924 is adjacent to the pair of first differential signal pins 912 (eg, transmitting the differential signal pin T_x⁺And T_x^-) Side by side configuration.

The second grounding pin 922 has a via hole penetrating section 922a adapted to be soldered to one of the circuit boards 9 through the via hole 9b.₁The power pin 924 has a via hole penetrating portion 924a adapted to be soldered to one of the circuit boards 9 through the via hole 9b.₂And the pair of third differential signal pins 926 respectively have a via hole penetrating portion 926a adapted to be soldered to one of the circuit boards 9 through the via holes 9b.₃ 。

The first differential signal pin 912 of the electrical connector 90, the second differential signal pin 914 and the first ground pin 916 are soldered to the circuit board 9 in a surface arrangement manner, and the two pairs of differential signal pins 912 can be improved. The portion 914 and the first ground pin 916 in the circuit board 9 and protruding below the circuit board 9 cause a large parasitic capacitance to affect the quality of the signal channel and attenuate the propagated signal. Accordingly, the transmission speed of the electrical connector 90 is higher than the transmission speed of the electrical connector 70.

7 and 8 are respectively a front view and a side view of a USB 3.0 electrical connector according to a further embodiment of the present invention. Referring to FIGS. 7 and 8, an electrical connector 100 of the present embodiment is adapted to be soldered to a circuit board 9 and form an electronic assembly with the circuit board 9.

The electrical connector 100 includes a metal housing 102, an insulating base 104 connecting the metal housing 102, and a pin arrangement 1000 disposed on the insulating base 104. The main difference between the electrical connector 100 and the electrical connector 90 is that The pin arrangement 1000 of the connector 100 includes a first pin row 1010, a second pin row 1020, and a third pin row 1030.

The first pin row 1010 includes a pair of first differential signal pins 1012, a pair of second differential signal pins 1014, and a first ground pin located between the two pairs of differential signal pins 1012 and 1014. 1016, arranged in the same manner as the first pin row 910 of the electrical connector 90 described above. In this embodiment, the pair of first differential signal pins 1012 are a pair of transmitting differential signal pins T in the USB 3.0 architecture._x⁺And T_x^-And the pair of second differential signal pins 1014 are a pair of receiving differential signal pins R in the USB 3.0 architecture._x⁺And R_x^- 。

In addition, the pair of first differential signal pins 1012 respectively have a surface placement section 1012a. The pair of second differential signal pins 1014 respectively have a surface placement section 1014a, and the first grounding pin 1016 also has a surface placement. Segment 1016a is adapted to be soldered to a surface pad (not shown) of the circuit board, respectively.

On the other hand, the second pin row 1020 includes a power pin 1024 and a first signal pin 1028, and the third pin row 1030 includes a second signal pin 1026 and a second ground pin 1022. The second pin row 1020 and the third pin row 1030 are disposed side by side and aligned with each other on both sides of the insulating base 104. The first signal pin 1028 and the second signal pin 1026 form a pair of third differential signal pins. In this embodiment, the first signal pin 1028 and the second signal pin 1026 are respectively a pair of transmitting/receiving differential signal pins D supporting the USB 1.0 architecture or the USB 2.0 architecture.^-And D⁺ 。

The second grounding pin 1022 has a via hole piercing section 1022a. The power pin 1024 has a via hole penetrating section 1024a suitable for soldering to the through via of the circuit board. Similarly, the pair of third differential signal pins 1026 and 1028 points There is a via hole piercing section 1026a and 1028a which is suitable for soldering to the through hole (not shown) of the circuit board.

The electrical connector 90 can be, for example, an electrical connector of the type "Standard-A" in the electrical connector of USB 3.0, and the electrical connector 100 can be, for example, an electrical connector of the type "Standard-B" in the electrical connector of USB 3.0. . Accordingly, the transmission speed of the electrical connector 90 is higher than the transmission speed of the electrical connector 70, and the manner in which the first pin row in the pin arrangement is soldered to the surface of the surface of the circuit board by the surface placement section can be applied. For different types of electrical connectors.

9 illustrates the installation of FIG. 2 and FIG. 4 of the circuit board to which the electrical connector of USB 3.0 differential mode performance comparison. Referring to Figure 5, since the USB 3.0 signal speed reaches 5 Gbps, the corresponding clock is 2.5 GHz. Preferably consider channel performance increase to three times the frequency range, i.e. 7.5 GHz.

From the comparison of the response of the USB 3.0 differential mode, the differential return loss Sdd11_smd of the differential signal pin soldered to the board in the surface placement mode has a larger bandwidth, and FIG. 2 The differential return loss Sdd11_org of the differential signal pin soldered to the board by the via hole insertion mode has a small bandwidth.

With the significant improvement in return loss, the differential insertion loss Sdd12_smd of the present embodiment of FIG. 4 is also improved compared to the differential insertion loss Sdd12_org of the existing structure of FIG. The range of frequencies. In addition, the response ringing effect of the improved intervention loss Sdd12_smd is smaller than the original differential intervention loss Sdd12_org.

As can be seen from the above, for signal propagation, Figure 4 is provided in comparison with Figure 2. A better signal channel. The reason for this may be that the electrical connector structure of FIG. 2 has two pairs of differential signal pins 712 and 714 (refer to FIG. 1) located in the circuit board 7 and protruding below the circuit board 7 to cause a large parasitic capacitance. And cause a response at a higher frequency, which affects the quality of the signal channel and attenuates the transmitted signal. In the present invention, two pairs of differential signal pins 712 and 714 are connected to the surface pads of the circuit board and are connected to the control chip disposed on the circuit board via the surface wiring of the circuit board, and the wiring design can obtain a better signal. Quality, especially for high speed signals.

In summary, this design solders some of the critical differential signal pins or grounding pins of the electrical connector to the surface pads of the circuit board in a surface-mounted manner, so that the transmission of key signals can be avoided. And maintain the quality of high-speed signal channels. In addition, this creation changes the shape of some of the critical differential signal pins of the electrical connector so that it can be soldered to the surface pads of the board, so that other components of the electrical connector can still use the existing USB 3.0 electrical connectors, thus saving the development cost of electrical connectors.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person having ordinary knowledge in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection of this creation is subject to the definition of the scope of the patent application attached.

<p>7 boards</p><p>7bthrough guide hole</p><p>8 boards</p><p>8a₁Surface pads</p><p>8a₂Surface pads</p><p>8b₁through guide hole</p><p>8b₂through guide hole</p><p>8b₃through guide hole</p><p>8b₄through guide hole</p><p>9Circuit board</p><p>9a₁Surface pads</p><p>9a₂Surface pads</p><p>9a₃Surface pads</p><p>9b₁through guide hole</p><p>9b₂through guide hole</p><p>9b₃through guide hole</p><p>70Electrical connector</p><p>72Metal housing</p><p>74Insulated body</p><p>80Electrical connector</p><p>82Metal housing</p><p>84Insulated body</p><p>90Electrical connector</p><p>92Metal housing</p><p>94Insulated body</p><p>100Electrical connector</p><p>102Metal housing</p><p>104Insulated body</p><p>700 pin arrangement</p><p>710first pin</p><p>712First differential signal pin</p><p>714Second differential signal pin</p><p>716First grounding pin</p><p>720Second pin</p><p>722Second grounding pin</p><p>724Power pin</p><p>7263rd differential signal pin</p><p>800 pin arrangement</p><p>810first pin</p><p>812First differential signal pin</p><p>812aSurface placement</p><p>814Second differential signal pin</p><p>814aSurface placement section</p><p>816First grounding pin</p><p>816aPipe hole wear section</p><p>820Second pin</p><p>822Second grounding pin</p><p>822aGuide-through section</p><p>824Power pin</p><p>824aGuide-through section</p><p>8263rd differential signal pin</p><p>826aGuide-through section</p><p>900 pin arrangement</p><p>910first pin</p><p>912First differential signal pin</p><p>912aSurface placement</p><p>914Second differential signal pin</p><p>914aSurface placement section</p><p>916First grounding pin</p><p>916aSurface placement section</p><p>920Second pin</p><p>922Second grounding pin</p><p>922a Guide hole penetration section</p><p>924Power pin</p><p>924aPipe hole wear section</p><p>926 Third differential signal pin</p><p>926a Guide hole penetration section</p><p>1000 pin arrangement</p><p>1010First pin</p><p>1012First differential signal pin</p><p>1012aSurface placement</p><p>1014Second differential signal pin</p><p>1014aSurface placement section</p><p>1016First grounding pin</p><p>1016aSurface placement section</p><p>1020Second pin</p><p>1022Second grounding pin</p><p>1022a Guide hole penetration section</p><p>1024Power pin</p><p>1024aPipe hole wear section</p><p>1026Second signal pin</p><p>1026a Guide hole piercing section</p><p>1028First signal pin</p><p>1028a Guide hole penetration section</p><p>1030 third pin</p>

1 and 2 illustrate a front and rear view of a USB 3.0 electrical connector assembled to a circuit board according to an embodiment of the present invention.

3 and FIG. 4 respectively illustrate a USB of another embodiment of the present creation The 3.0 electrical connectors are assembled to the front and rear of the board.

FIG. 5 and FIG. 6 respectively illustrate the front and rear of a USB 3.0 electrical connector assembled to a circuit board according to still another embodiment of the present invention.

7 and 8 are respectively a front view and a side view of a USB 3.0 electrical connector according to a further embodiment of the present invention.

FIG. 9 is a diagram showing the performance comparison of the USB 3.0 differential mode of the electrical connector mounted to the circuit board of FIGS. 2 and 4.