Apparatus for capturing image and LEN device

Image capturing device and lens device

APPARATUS FOR CAPTURING IMAGE AND LEN DEVICE

This case is about an imaging device, especially an imaging device with a sapphire lens.

A large number of consumer handheld devices with camera functions have been introduced in recent years. Due to the development of semiconductor technology and the rapid advancement of optical design technology, the size of optical components can become smaller and smaller. Therefore, digital camera lenses can be widely used in consumer mobile devices. For example, mobile phones, handheld game consoles, MP3 players, notebook computers, tablet computers, GPS global positioning devices, and driving recorders.

As the pixels of the photosensitive element of the digital camera lens are getting higher and higher, the requirements for the image quality of the digital camera device are also higher. The protective lens materials used in mobile devices with camera functions currently on the market are generally transparent acrylic materials or other transparent polymer materials. The protective lenses made of these materials provide the basic protection of the digital camera lens and make The digital camera device is not damaged and can image normally, but often after the user operates the digital camera device for a period of time, the protective lens made of acrylic or transparent polymer material will be protected by friction or impact during use. Damage to the surface of the lens. At this time, if the digital camera lens captures the image through the surface of the damaged protective lens, the image quality will be poor, or the photosensitive element will not be able to correctly and effectively determine the image of the subject. The output of the signal, which in turn causes the function of the digital camera device to decrease or fail.

Please refer to the first figure (a) and the first figure (b). The first figure (a) is a schematic diagram of the front side of the conventional image capturing device, and the first figure (b) is a schematic diagram of the back side of the conventional image capturing device. In the first figure (a), the conventional image capturing device 10 includes a front cover housing 101, a liquid crystal screen 102, and physical buttons 103. In the first figure (b), the conventional imaging device 10 includes a protective lens 104 and a back cover 105.

Please refer to the second figure, which is a schematic diagram of the structure 12 of the conventional image capturing device. The image capturing device structure 12 includes a protective lens 104, a back cover shell 105, and a lens module 106. The protective lens 104 is disposed above the back cover shell 105 to protect the lens module 106 below it. The material of the protective lens 104 is mainly polymer, which includes acrylic or carbonic acid resin.

Please refer to the third figure, which is a schematic cross-sectional view of the structure 12 of the conventional image capturing device. In the third figure, the image capturing device structure 12 further includes a liquid crystal screen 102 and a circuit board 107. The lens module 106 is electrically connected to the circuit board 107. The circuit board 107 is located below the back cover housing 105. 105 surrounds the lens module 106, and the lens module 106 is located under the protective lens 104, so it can be protected by the protective lens 104.

In the third figure, strengthened glass can also be used as the protective lens 104 of the lens module 106. Although strengthened glass provides higher hardness protection than polymer materials, it will still be scratched due to frequent use, and if not Cautiously dropping the imaging device 10 onto a hard surface (such as the ground) will cause the strengthened glass to be ruptured by the impact of external forces. The fractured surface after the rupture has sharp sharp corners, which can easily cause cuts and scratches to the user. Therefore, using strengthened glass as the protective lens 104 of the lens module 106 is potentially dangerous.

Another conventional technology is to use the stacking of multiple layers of materials as the protective lens 104, and the stacking of multiple layers of materials will cause loss of light, and will also lead to poor imaging and noise generation.

Please refer to the fourth figure, which is a schematic diagram of the structure 14 of the conventional image capturing device. In the new creation of the Republic of China Patent Publication No. M267775, the imaging device structure 14 includes a multilayer material protective lens 109, a back cover 105, a lens module 106, a circuit board 107, and a liquid crystal screen 102. The multi-layer material protective lens 109 includes a protective lens 104 and a protective layer 108. Although the protective layer 108 can enhance the protective ability of the multi-layer material to protect the lens 109, the addition of the protective layer 108 will greatly reduce the light penetration filter, thereby affecting the quality of the image taken by the lens module 106.

This creation provides a kind of sapphire as a protective lens material. The sapphire has a single crystal structure and different crystal axis to be used as a protective lens for the camera lens module of the imaging device. The hardness of sapphire is second only to that of diamond. Using sapphire as a protective lens material can achieve scratch resistance, abrasion resistance, and impact resistance. In addition, the excellent mechanical properties of sapphire can not only avoid the decrease in yield or performance caused by the collision of external force during the processing, but also reduce the loss caused by transmission during the manufacturing process, and provide the lens with powerful anti-scratch function. .

Based on the above-mentioned concept, an image capturing device is proposed. The image capturing device includes a lens device and a sapphire lens. The lens device includes a first housing. The sapphire lens is directly joined to the first housing to protect the lens device, wherein the sapphire lens has a crystal structure and a crystal axis, the crystal structure is a single crystal structure, and the crystal axis is a c-axis To (0001), a-axis [including (1<img file="TWM438642U_D0001.tif" />10)、(11<img file="TWM438642U_D0002.tif" />0)、(2<img file="TWM438642U_D0003.tif" />0)、(<img file="TWM438642U_D0004.tif" />20)、(<img file="TWM438642U_D0005.tif" />110), and (<img file="TWM438642U_D0006.tif" />2<img file="TWM438642U_D0007.tif" />0)], m-axial [including (<img file="TWM438642U_D0008.tif" />010)、(<img file="TWM438642U_D0009.tif" />100)、(01<img file="TWM438642U_D0010.tif" />0)、(10<img file="TWM438642U_D0011.tif" />0)、(1<img file="TWM438642U_D0012.tif" />00), and (0<img file="TWM438642U_D0013.tif" />10)], and r-axial [including (10<img file="TWM438642U_D0014.tif" />1)、(<img file="TWM438642U_D0015.tif" />01<img file="TWM438642U_D0016.tif" />)、(01<img file="TWM438642U_D0017.tif" />)、(0<img file="TWM438642U_D0018.tif" />11)、(1<img file="TWM438642U_D0019.tif" />0<img file="TWM438642U_D0020.tif" />),as well as(<img file="TWM438642U_D0021.tif" />101)] one of them.

Based on the above concept, an image capturing device is proposed. The image capturing device includes a lens device and a sapphire lens. The lens device has a recessed area. The sapphire lens is located in the recessed area to protect the lens device, wherein the sapphire lens has a crystal structure and a crystal axis, the crystal structure is a single crystal structure, and the crystal axis is c-axis (0001), a-axial [include (1<img file="TWM438642U_D0022.tif" />10)、(11<img file="TWM438642U_D0023.tif" />0)、(2<img file="TWM438642U_D0024.tif" />0)、(<img file="TWM438642U_D0025.tif" />20)、(<img file="TWM438642U_D0026.tif" />110), and (<img file="TWM438642U_D0027.tif" />2<img file="TWM438642U_D0028.tif" />0)], m-axial [including (<img file="TWM438642U_D0029.tif" />010)、(<img file="TWM438642U_D0030.tif" />100)、(01<img file="TWM438642U_D0031.tif" />0)、(10<img file="TWM438642U_D0032.tif" />0)、(1<img file="TWM438642U_D0033.tif" />00), and (0<img file="TWM438642U_D0034.tif" />10)], and r-axial [including (10<img file="TWM438642U_D0035.tif" />1)、(<img file="TWM438642U_D0036.tif" />01<img file="TWM438642U_D0037.tif" />)、(01<img file="TWM438642U_D0038.tif" />)、(0<img file="TWM438642U_D0039.tif" />11)、(1<img file="TWM438642U_D0040.tif" />0<img file="TWM438642U_D0041.tif" />),as well as(<img file="TWM438642U_D0042.tif" />101)] one of them.

Based on the above idea, an image capturing device is proposed. The image capturing device includes a lens device and a sapphire lens. The sapphire lens is directly joined to the lens device, wherein the sapphire lens has a crystal structure and a crystal axis, the crystal structure is a single crystal structure, and the crystal axis is c-axis (0001), a-axis To [include(1<img file="TWM438642U_D0043.tif" />10)、(11<img file="TWM438642U_D0044.tif" />0)、(2<img file="TWM438642U_D0045.tif" />0)、(<img file="TWM438642U_D0046.tif" />20)、(<img file="TWM438642U_D0047.tif" />110), and (<img file="TWM438642U_D0048.tif" />2<img file="TWM438642U_D0049.tif" />0)], m-axial [including (<img file="TWM438642U_D0050.tif" />010)、(<img file="TWM438642U_D0051.tif" />100)、(01<img file="TWM438642U_D0052.tif" />0)、(10<img file="TWM438642U_D0053.tif" />0)、(1<img file="TWM438642U_D0054.tif" />00), and (0<img file="TWM438642U_D0055.tif" />10)], and r-axial [including (10<img file="TWM438642U_D0056.tif" />1)、(<img file="TWM438642U_D0057.tif" />01<img file="TWM438642U_D0058.tif" />)、(01<img file="TWM438642U_D0059.tif" />)、(0<img file="TWM438642U_D0060.tif" />11)、(1<img file="TWM438642U_D0061.tif" />0<img file="TWM438642U_D0062.tif" />),as well as(<img file="TWM438642U_D0063.tif" />101)] one of them.

Based on the above concept, an image capturing device is proposed. The image capturing device includes a lens device and a sapphire lens. The sapphire lens is directly joined to the lens device.

Based on the above concept, an image capturing device is proposed. The lens device includes a lens module and a sapphire lens lens. The sapphire lens lens is installed on the lens module to form the lens device.

Please refer to the fifth figure (a) and the fifth figure (b). The fifth figure (a) is a schematic diagram of the front side of the imaging device 20 according to the first preferred embodiment of this project, and the fifth figure (b) is the first comparison of this project. A schematic view of the back of the image capturing device 20 of the preferred embodiment. In the fifth figure (a), the image capturing device 20 includes a front cover housing 201, a liquid crystal display screen 202, and physical buttons 203. In the fifth figure (b), the imaging device 20 includes a sapphire lens 204 and a back cover shell 205. The imaging device 20 in the fifth figure (a) and (b) is preferably a handheld device with a camera function. The sapphire lens 204 can also be applied to, for example, handheld game consoles, MP3 players, notebook computers, tablet computers, GPS global positioning device, and driving recorder, etc.

Please refer to the fifth figure (c), which is a schematic cross-sectional view of the structure 22 of the imaging device according to the first preferred embodiment of the present invention. The image capturing device structure 22 includes a sapphire lens 204, a bonding glue 210, a lens device 208, and a liquid crystal screen 202. The lens device 208 includes a lens module 206, a circuit board 207, and a back cover shell 205. The lens module 206 is coupled to the circuit board 207. The back cover shell 205 is, for example, a mobile phone back cover, which is located on the liquid crystal screen 202 and surrounds the lens module 206. The back cover shell 205 has an opening area 209 at the position of the lens module 206 so that the lens module 206 can capture images. The bonding glue 210 is used to directly bond the sapphire lens 204 and the lens device 208 at a first high temperature relative to room temperature.

The sapphire lens 204 has a crystal axis, a crystal structure and a light transmittance, wherein the crystal axis is c-axis (0001), a-axis [including (1<img file="TWM438642U_D0064.tif" />10)、(11<img file="TWM438642U_D0065.tif" />0)、(2<img file="TWM438642U_D0066.tif" />0)、(<img file="TWM438642U_D0067.tif" />20)、(<img file="TWM438642U_D0068.tif" />110), and (<img file="TWM438642U_D0069.tif" />2<img file="TWM438642U_D0070.tif" />0)], m-axial [including (<img file="TWM438642U_D0071.tif" />010)、(<img file="TWM438642U_D0072.tif" />100)、(01<img file="TWM438642U_D0073.tif" />0)、(10<img file="TWM438642U_D0074.tif" />0)、(1<img file="TWM438642U_D0075.tif" />00), and (0<img file="TWM438642U_D0076.tif" />10)], and r-axial [including (10<img file="TWM438642U_D0077.tif" />1)、(<img file="TWM438642U_D0078.tif" />01<img file="TWM438642U_D0079.tif" />)、(01<img file="TWM438642U_D0080.tif" />)、(0<img file="TWM438642U_D0081.tif" />11)、(1<img file="TWM438642U_D0082.tif" />0<img file="TWM438642U_D0083.tif" />),as well as(<img file="TWM438642U_D0084.tif" />101)], the crystal structure is a single crystal structure, and the light transmittance is greater than or equal to 80%. The sapphire lens 204 is second only to diamond in material hardness, and has high mechanical strength, scratch resistance, and corrosion resistance, so it is suitable as a protective lens for the imaging device 20. However, not all types of sapphire are suitable as protective lenses. Only sapphire with a single crystal structure is more suitable because of its light transmittance of over 80%; polycrystalline structure is not suitable because its light transmittance is mostly below 60%. , It does not meet the demand.

In addition, the physical or optical characteristics of the sapphire lens 204 are different due to the different crystal axis. The physical properties include, for example, at least one of hardness, Young's coefficient, compressive strength, thermal conductivity, and wetting angle. The optical characteristics include, for example, light transmittance. Table 1 below lists the comparison of the physical and optical properties of each crystal axis of the sapphire lens 204 with the strengthened glass.

<tables><img file="TWM438642U_D0085.tif" /></tables>

When the crystal axis is any one of the c-axis, a-axis, m-axis, and r-axis, the hardness, Young's coefficient, compressive strength, and thermal conductivity of the sapphire lens 204 One characteristic far exceeds that of strengthened glass, and although the light transmittance of the sapphire lens 204 is a little lower than that of strengthened glass, it still has good light transmittance characteristics.

In one embodiment, in order to improve the light transmittance of the sapphire lens 204, before the sapphire lens 204 is joined to the back cover shell 205, an anti-reflection layer (not shown) may be plated on the sapphire lens 204 to increase the sapphire lens 204. The light transmittance of the lens 204, wherein the number of layers of the anti-reflection layer and a thickness are related to the light transmittance, the number of layers is at least one layer, preferably about dozens of layers, and the thickness of each layer is about 3~5 microns .

The anti-reflection layer can be formed on the surface 211 or the surface 212 of the sapphire lens 204. When the anti-reflection layer is not formed on the sapphire lens 204, the light transmittance is at least 80% or more. The anti-reflection layer is formed on the sapphire lens After 204, the light transmittance can reach at least 95%. The anti-reflection layer can be formed by a physical vapor deposition or a chemical vapor deposition, and the anti-reflection layer includes a metal oxide or a semiconductor oxide.

In another embodiment, since the sapphire lens 204 is more resistant to high temperature and corrosion than general materials, before it is joined to the back cover shell 205, an ink printing layer (not shown) or a decorative film layer ( (Not shown) can be formed on the sapphire lens 204 at a second high temperature relative to the room temperature by a specific process, the specific process includes an ink transfer, physical vapor deposition coating, a laser engraving, a silk Printing, or spraying.

In another embodiment, the anti-reflection layer and the ink printing layer may be formed on one of the surface 211 and the surface 212 of the sapphire lens 204 in a different order, or may be formed on the surface 211 and the surface of the sapphire lens 204 respectively. 212.

Please refer to the fifth figure (c). In the first preferred embodiment of the present invention, the sapphire lens 204 is directly bonded to the back cover shell 205 by the bonding glue 210 to protect the lens module 206, wherein the back cover shell The body 205 is a mobile phone cover, the bonding glue 210 is a polymer glue, and the polymer glue has a bonding reaction at the first high temperature. The polymer glue includes a high temperature reaction glue and a photosensitive glue (such as UV glue). ), or two-component glue.

In another embodiment, the anti-reflection layer or the ink printing layer has been formed on the sapphire lens 204, and the anti-reflection layer or the ink printing layer is directly bonded to the back cover shell 205 by the bonding glue 210.

In another embodiment, due to the high temperature resistance of the sapphire lens 204, the sapphire lens 204 is heterogeneously bonded with the foreign material at a third high temperature relative to the room temperature, and the bonding glue 210 may not be used.

Please refer to Figure 6 (a) and Figure 6 (b). Figure 6 (a) is a schematic diagram of the front side of the imaging device 30 according to the second preferred embodiment of this case, and Figure 6 (b) is the second comparison of this case. A schematic view of the back of the image capturing device 30 of the preferred embodiment. In the sixth figure (a), the image capturing device 30 includes a front cover housing 301, a liquid crystal display screen 302, and physical buttons 303. In the sixth figure (b), the imaging device 30 includes a sapphire lens 304, a first back cover housing 311, and a second back cover housing 305. In one embodiment, the first back cover housing 311 It is a battery cover, and the second back cover shell 305 is a mobile phone back cover.

Please refer to Figure 6 (c), which is a schematic cross-sectional view of the structure 32 of the image capturing device according to the second preferred embodiment of the present invention. The image capturing device structure 32 includes a sapphire lens 304, a plurality of bonding glue 310, a lens device 308, and a liquid crystal screen 302. The lens device 308 includes a lens module 306, a circuit board 307, and a second back cover shell 305. The lens module 306 is coupled to the circuit board 307, and the second back cover shell 305 is, for example, a mobile phone back cover, which is located on the liquid crystal screen 302 and surrounds the lens module 306. The second back cover shell 305 has an opening area 309 at the position of the lens module 306.

Please refer to Figure 6 (d), which is a schematic top view of the sapphire lens 304. In the sixth figure (d), the sapphire lens 304 has a plurality of through holes 313, and the first back cover shell 311 also has an opening area 312. The opening area 312 and the opening area 309 are both located at the position of the lens module 306, so that The lens module 306 can capture images.

Please refer to the sixth figure (e), which is a schematic diagram of the first back cover shell 311 and the sapphire lens joining 304. The sapphire lens 304 has a convex portion 315 which is aligned with the position of the lens module 306, as shown in FIG. 6(a). The first back cover shell 311 has a plurality of hot melt pillars 314. When the first back cover shell 311 and the sapphire lens 304 are superimposed, the plurality of hot melt pillars 314 pass through the plurality of through holes 313 and are heated by heating The plurality of hot-melt pillars 314 connect the first back cover shell 311 and the sapphire lens 304, the plurality of hot-melt pillars 314 will be heated to melt into a plurality of bonding glue 310, wherein the plurality of hot-melt pillars 314 have a composition Thermoplastic plastic. The sapphire lens 304 and the first back cover shell 311 can be directly joined without heating the plurality of hot melt columns 314.

Similar to the first preferred embodiment of the present case, before the sapphire lens 304 is joined, a film may be coated on the sapphire lens 304, such as the anti-reflective layer, the ink printing layer, or the decorative film layer to increase light transmittance And beautiful.

Please refer to the seventh figure (a) and the seventh figure (b). The seventh figure (a) is a schematic diagram of the front of the imaging device 40 according to the third preferred embodiment of the present case, and the seventh figure (b) is the third comparison of the present case. A schematic view of the back of the image capturing device 40 of the preferred embodiment. In the seventh figure (a), the image capturing device 40 includes a front cover housing 401, a liquid crystal display screen 402, and physical buttons 403. In the seventh figure (b), the imaging device 40 includes a sapphire lens 404 and a back cover housing 405. The back cover housing 405 has a recessed area 413 for embedding the sapphire lens 404.

Please refer to FIG. 7 (c), which is a schematic cross-sectional view of the structure 42 of the imaging device according to the third preferred embodiment of the present invention. The image capturing device structure 42 includes a sapphire lens 404, a bonding glue 410, a back cover shell 405, a lens device 408, and a liquid crystal screen 402. The lens device 408 includes a back cover housing 405, a lens module 406, and a circuit board 407. The back cover shell 405 further has an opening area 409 for the lens module 406 to capture images. The sapphire lens 404 has a plurality of grooves 414.

Similarly, before the sapphire lens 304 is embedded in the back cover housing 405, a film, such as the anti-reflection layer, the ink printing layer, or the decorative film layer, can be coated on the sapphire lens 404 to increase light transmittance and aesthetics.

The method of embedding the sapphire lens 404 is an injection molding technique. First, a plurality of grooves 414 can be formed on the sapphire lens 404 by grinding or etching. Then, the sapphire lens 404 is placed in a mold (not shown), which has the same shape as the back cover shell 405, and the sapphire lens 404 is placed at a position corresponding to the recessed area 413. Then a plastic fluid (not shown) is poured into the mold at a fourth high temperature relative to room temperature, and the back cover shell 405 is formed by an injection molding technique, so that the sapphire lens is embedded in the back cover Cover the recessed area 413 in the housing 405.

In one embodiment, the material of the back cover shell 405 is a plastic. When the bonding glue 410 joins the sapphire lens 404 and the back cover shell 405, the plurality of grooves 414 are provided to drain the plastic fluid and the bonding glue The function of 410 is that the plastic fluid and the bonding glue 410 will overflow to one or both of the surface 411 and the surface 412 of the sapphire lens 404 at the fourth high temperature, and the plural grooves 414 can prevent the overflow of glue. . In another embodiment, the bonding glue 410 may not be used, and the plural grooves 414 can prevent the plastic fluid from overflowing. After the injection molding, the sapphire lens 404 naturally enters the recessed area 413 of the back cover shell 405 middle.

Please refer to FIG. 8, which is a schematic cross-sectional view of the image capturing device structure 52 of the fourth preferred embodiment of the present invention. The image capturing device structure 52 includes a lens device 508 and a liquid crystal screen 502. The image capturing device structure 52 further includes a housing 505. The lens device 508 includes a lens module 506 and a sapphire lens lens 504. The sapphire lens lens 504 is installed in the lens module, and directly serves as an optical lens for imaging of the lens module 506, and also has the characteristics of high hardness, scratch resistance, abrasion resistance, and impact resistance.

Example

1. An image capturing device includes a lens device and a sapphire lens. The lens device includes a first housing. The sapphire lens is directly joined to the first housing to protect the lens device, wherein the sapphire lens has a crystal structure and a crystal axis, the crystal structure is a single crystal structure, and the crystal axis is a c-axis To (0001), a-axis [including (1<img file="TWM438642U_D0086.tif" />10)、(11<img file="TWM438642U_D0087.tif" />0)、(2<img file="TWM438642U_D0088.tif" />0)、(<img file="TWM438642U_D0089.tif" />20)、(<img file="TWM438642U_D0090.tif" />110), and (<img file="TWM438642U_D0091.tif" />2<img file="TWM438642U_D0092.tif" />0)], m-axial [including (<img file="TWM438642U_D0093.tif" />010)、(<img file="TWM438642U_D0094.tif" />100)、(01<img file="TWM438642U_D0095.tif" />0)、(10<img file="TWM438642U_D0096.tif" />0)、(1<img file="TWM438642U_D0097.tif" />00), and (0<img file="TWM438642U_D0098.tif" />10)], and r-axial [including (10<img file="TWM438642U_D0099.tif" />1)、(<img file="TWM438642U_D0100.tif" />01<img file="TWM438642U_D0101.tif" />)、(01<img file="TWM438642U_D0102.tif" />)、(0<img file="TWM438642U_D0103.tif" />11)、(1<img file="TWM438642U_D0104.tif" />0<img file="TWM438642U_D0105.tif" />),as well as(<img file="TWM438642U_D0106.tif" />101)] one of them.

2. The device according to embodiment 1, wherein the lens device further includes a lens module and a circuit board, the first housing surrounds the lens module, and the circuit board is coupled to the lens module. The sapphire lens is bonded to the first housing by a bonding glue at a first high temperature relative to room temperature, wherein the bonding glue is a polymer glue, and the polymer glue has a For bonding reaction, the polymer glue includes a high temperature reaction glue, photosensitive glue (such as UV glue), or two-component glue. The sapphire lens performs a heterogeneous bonding with the first housing at a second high temperature relative to the room temperature. The first shell is a mobile phone cover. The image capturing device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen.

3. The device according to embodiments 1 to 2, wherein the lens device further includes a second housing, a lens module, and a circuit board. The sapphire lens is joined to the first housing by a bonding glue, wherein the bonding glue is a polymer glue, and the polymer glue includes a high temperature reaction glue, photosensitive glue (such as UV glue), or two-component glue. The first shell has a plurality of hot melt columns, and the sapphire lens has a plurality of through holes. When the first shell and the sapphire lens are superimposed, the plurality of hot melt columns pass through the plurality of through holes, and the first shell and the sapphire lens are joined by heating the plurality of hot melt columns, wherein The composition of the hot melt column includes a thermoplastic plastic. The sapphire lens has a convex part which is aligned with the position of the lens module. The second housing surrounds the lens module, and the circuit board is coupled with the lens module. The first housing is a battery cover, and the second housing is a mobile phone cover. The image capturing device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen.

4. An image capturing device includes a lens device and a sapphire lens. The lens device has a recessed area. The sapphire lens is located in the recessed area to protect the lens device, wherein the sapphire lens has a crystal structure and a crystal axis, the crystal structure is a single crystal structure, and the crystal axis is c-axis (0001), a-axial [include (1<img file="TWM438642U_D0107.tif" />10)、(11<img file="TWM438642U_D0108.tif" />0)、(2<img file="TWM438642U_D0109.tif" />0)、(<img file="TWM438642U_D0110.tif" />20)、(<img file="TWM438642U_D0111.tif" />110), and (<img file="TWM438642U_D0112.tif" />2<img file="TWM438642U_D0113.tif" />0)], m-axial [including (<img file="TWM438642U_D0114.tif" />010)、(<img file="TWM438642U_D0115.tif" />100)、(01<img file="TWM438642U_D0116.tif" />0)、(10<img file="TWM438642U_D0117.tif" />0)、(1<img file="TWM438642U_D0118.tif" />00), and (0<img file="TWM438642U_D0119.tif" />10)], and r-axial [including (10<img file="TWM438642U_D0120.tif" />1)、(<img file="TWM438642U_D0121.tif" />01<img file="TWM438642U_D0122.tif" />)、(01<img file="TWM438642U_D0123.tif" />)、(0<img file="TWM438642U_D0124.tif" />11)、(1<img file="TWM438642U_D0125.tif" />0<img file="TWM438642U_D0126.tif" />),as well as(<img file="TWM438642U_D0127.tif" />101)] one of them.

5. The device of embodiment 4, wherein the lens device includes a housing, a lens module, and a circuit board, the housing surrounds the lens module, and the circuit board is coupled to the lens module. The housing has the recessed area, and when the sapphire lens is placed in a mold, the sapphire lens is embedded in the recessed area in the housing by an injection molding technique. The sapphire lens is bonded to the lens device by a bonding glue, so that the sapphire lens protects the lens device, wherein the bonding glue is a polymer glue, and the polymer glue includes a high-temperature reaction glue, photosensitive glue (such as UV glue) ), or two-component glue. The sapphire lens has a plurality of grooves, and the material of the housing is a plastic. When the bonding glue joins the sapphire lens and the housing, the plurality of grooves prevent an overflow of the plastic from occurring. The shell is a mobile phone cover. The image capturing device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen.

6. An image capturing device, which includes a lens device and a sapphire lens. The sapphire lens is directly joined to the lens device, wherein the sapphire lens has a crystal structure and a crystal axis, the crystal structure is a single crystal structure, and the crystal axis is c-axis (0001), a-axis To [include(1<img file="TWM438642U_D0128.tif" />10)、(11<img file="TWM438642U_D0129.tif" />0)、(2<img file="TWM438642U_D0130.tif" />0)、(<img file="TWM438642U_D0131.tif" />20)、(<img file="TWM438642U_D0132.tif" />110), and (<img file="TWM438642U_D0133.tif" />2<img file="TWM438642U_D0134.tif" />0)], m-axial [including (<img file="TWM438642U_D0135.tif" />010)、(<img file="TWM438642U_D0136.tif" />100)、(01<img file="TWM438642U_D0137.tif" />0)、(10<img file="TWM438642U_D0138.tif" />0)、(1<img file="TWM438642U_D0139.tif" />00), and (0<img file="TWM438642U_D0140.tif" />10)], and r-axial [including (10<img file="TWM438642U_D0141.tif" />1)、(<img file="TWM438642U_D0142.tif" />01<img file="TWM438642U_D0143.tif" />)、(01<img file="TWM438642U_D0144.tif" />)、(0<img file="TWM438642U_D0145.tif" />11)、(1<img file="TWM438642U_D0146.tif" />0<img file="TWM438642U_D0147.tif" />),as well as(<img file="TWM438642U_D0148.tif" />101)] one of them.

7. The device of embodiment 6, wherein the lens device includes a housing, a lens module, and a circuit board, the housing surrounds the lens module, and the circuit board is coupled to the lens module. The sapphire lens is joined to the lens device by a bonding glue, so that the sapphire lens protects the lens device, wherein the bonding glue is a polymer glue, and the polymer glue includes a high-temperature reaction glue and photosensitive glue (such as UV glue) ), or two-component glue. The sapphire lens is bonded to the housing by the polymer glue at a first high temperature relative to room temperature. The sapphire lens performs a heterogeneous bonding with the housing at a second high temperature relative to the room temperature. The shell is a mobile phone cover. The image capturing device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen.

8. The device according to embodiments 6 to 7, wherein the lens device includes a first housing, a second housing, a lens module, and a circuit board. The sapphire lens is joined to the lens device by a bonding glue, so that the sapphire lens protects the lens device, wherein the bonding glue is a polymer glue, and the polymer glue includes a high-temperature reaction glue and photosensitive glue (such as UV glue) ), or two-component glue. The first shell has a plurality of hot melt columns, and the sapphire lens has a plurality of through holes. When the first housing and the sapphire lens are superimposed, the plurality of hot-melt pillars pass through the plurality of through holes, and the first housing and the sapphire lens are joined by the heat of the plurality of hot-melt pillars, wherein the The composition of the plural hot-melt columns includes a thermoplastic plastic. The sapphire lens has a convex part which is aligned with the position of the lens module. The second housing surrounds the lens module, and the circuit board is coupled with the lens module. The first housing is a battery cover, and the second housing is a mobile phone cover. The image capturing device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen.

9. An image capturing device includes a lens device and a sapphire lens. The sapphire lens is directly joined to the lens device.

10. The device of embodiment 9, wherein the sapphire lens has a crystal structure and a crystal axis, the crystal structure is a single crystal structure, and the crystal axis is c-axis (0001), a-axis [Include (1<img file="TWM438642U_D0149.tif" />10)、(11<img file="TWM438642U_D0150.tif" />0)、(2<img file="TWM438642U_D0151.tif" />0)、(<img file="TWM438642U_D0152.tif" />20)、(<img file="TWM438642U_D0153.tif" />110), and (<img file="TWM438642U_D0154.tif" />2<img file="TWM438642U_D0155.tif" />0)], m-axial [including (<img file="TWM438642U_D0156.tif" />010)、(<img file="TWM438642U_D0157.tif" />100)、(01<img file="TWM438642U_D0158.tif" />0)、(10<img file="TWM438642U_D0159.tif" />0)、(1<img file="TWM438642U_D0160.tif" />00), and (0<img file="TWM438642U_D0161.tif" />10)], and r-axial [including (10<img file="TWM438642U_D0162.tif" />1)、(<img file="TWM438642U_D0163.tif" />01<img file="TWM438642U_D0164.tif" />)、(01<img file="TWM438642U_D0165.tif" />)、(0<img file="TWM438642U_D0166.tif" />11)、(1<img file="TWM438642U_D0167.tif" />0<img file="TWM438642U_D0168.tif" />),as well as(<img file="TWM438642U_D0169.tif" />101)] one of them. The lens device includes a housing, a lens module, and a circuit board. The housing surrounds the lens module and the circuit board is coupled to the lens module. The sapphire lens is bonded to the lens device by a bonding glue, so that the sapphire lens protects the lens device, wherein the bonding glue is a high-molecular glue, and the high-molecular glue includes a high-temperature reaction glue, photosensitive glue (such as UV glue) ), or two-component glue. The sapphire lens is bonded to the housing by the polymer glue at a first high temperature relative to room temperature, wherein the polymer glue has a bonding reaction at the first high temperature. The sapphire lens performs a heterogeneous bonding with the housing at a second high temperature relative to the room temperature. The shell is a mobile phone cover. The image capturing device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen.

11. The device according to embodiments 9 to 10, wherein the sapphire lens has a crystal structure and a crystal axis, the crystal structure is a single crystal structure, and the crystal axis is c-axis (0001), a- Axial [include(1<img file="TWM438642U_D0170.tif" />10)、(11<img file="TWM438642U_D0171.tif" />0)、(2<img file="TWM438642U_D0172.tif" />0)、(<img file="TWM438642U_D0173.tif" />20)、(<img file="TWM438642U_D0174.tif" />110), and (<img file="TWM438642U_D0175.tif" />2<img file="TWM438642U_D0176.tif" />0)], m-axial [including (<img file="TWM438642U_D0177.tif" />010)、(<img file="TWM438642U_D0178.tif" />100)、(01<img file="TWM438642U_D0179.tif" />0)、(10<img file="TWM438642U_D0180.tif" />0)、(1<img file="TWM438642U_D0181.tif" />00), and (0<img file="TWM438642U_D0182.tif" />10)], and r-axial [including (10<img file="TWM438642U_D0183.tif" />1)、(<img file="TWM438642U_D0184.tif" />01<img file="TWM438642U_D0185.tif" />)、(01<img file="TWM438642U_D0186.tif" />)、(0<img file="TWM438642U_D0187.tif" />11)、(1<img file="TWM438642U_D0188.tif" />0<img file="TWM438642U_D0189.tif" />),as well as(<img file="TWM438642U_D0190.tif" />101)] one of them. The lens device includes a first housing, a second housing, a lens module, and a circuit board. The sapphire lens is joined to the lens device by a bonding glue, so that the sapphire lens protects the lens device, wherein the bonding glue is a polymer glue, and the polymer glue includes a high-temperature reaction glue, photosensitive glue, or dual components Copies of glue. The first shell has a plurality of hot melt columns, and the sapphire lens has a plurality of through holes. When the first shell and the sapphire lens are superimposed, the plurality of hot melt columns pass through the plurality of through holes, and the first shell and the sapphire lens are joined by the heat of the plurality of hot melt columns, wherein the The composition of the plural hot-melt columns includes a thermoplastic plastic. The sapphire lens has a convex part which is aligned with the position of the lens module. The second housing surrounds the lens module, and the circuit board is coupled with the lens module. The first housing is a battery cover, and the second housing is a mobile phone cover. The image capturing device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen.

12. The device of embodiments 9 to 11, wherein the lens device includes a housing, a lens module, and a circuit board, the housing surrounds the lens module, and the circuit board is coupled to the lens module . The sapphire lens is embedded in the lens device. The housing has a recessed area. When the sapphire lens is placed in a mold, the sapphire lens is embedded in the recessed area in the housing by an injection molding technique. The sapphire lens is joined to the lens device by a bonding glue, so that the sapphire lens protects the lens device, wherein the bonding glue is a polymer glue, and the polymer glue includes a high-temperature reaction glue, photosensitive glue, or dual components Copies of glue. The sapphire lens has a plurality of grooves, and the material of the housing is a plastic. When the bonding glue joins the sapphire lens and the housing, the plurality of grooves prevent the plastic and the bonding glue from overflowing. The shell is a mobile phone cover. The image capturing device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen.

13. An image capturing device. The lens device includes a lens module and a sapphire lens lens. The sapphire lens lens is installed on the lens module to form the lens device.

In summary, the descriptions and examples of this creation have been disclosed above, but they are not used to limit this creation. Anyone who knows this skill can make various changes without departing from the spirit and scope of this creation. And modification, it should still fall within the scope of this creation patent.

<p>10,20,30,40. . . Imaging device</p><p>101,201,301,401. . . Front cover shell</p><p>102,202,302,402. . . LCD screen</p><p>103,203,303,403. . . Physical button</p><p>104. . . Protective lens</p><p>105,205,405. . . Back cover shell</p><p>204,304,404. . . Sapphire lens</p><p>311. . . The first back cover shell</p><p>106,206,306,406. . . Lens module</p><p>305. . . Second back cover shell</p><p>107,207,307,407. . . Circuit board</p><p>108. . . The protective layer</p><p>208,308,408. . . Lens device</p><p>109. . . Multi-layer material to protect the lens</p><p>209,309,312,409. . . Open area</p><p>210,310,410. . . Bonding glue</p><p>211,212,411,412. . . Sapphire lens surface</p><p>12,14. . . Structure of conventional imaging device</p><p>twenty two. . . The structure of the imaging device in the first preferred embodiment of this case</p><p>32. . . The structure of the image capturing device in the second preferred embodiment of the present case</p><p>42. . . The structure of the image capturing device of the third preferred embodiment of the present case</p><p>313. . . Multiple through holes</p><p>314. . . Plural hot melt column</p><p>315. . . Sapphire lens convex</p><p>413. . . Recessed area</p><p>414. . . Plural grooves</p>

Figure 1 (a): A schematic diagram of the front of the conventional imaging device;

Figure 1 (b): A schematic diagram of the back of the conventional photo-taking device;

Figure 2: A schematic diagram of the structure of the conventional image capturing device;

Figure 3: A schematic cross-sectional view of the structure of the conventional image capturing device;

Figure 4: A schematic diagram of the structure of the conventional image capturing device;

Figure 5 (a): A schematic diagram of the front side of the imaging device of the first preferred embodiment of this case;

Figure 5 (b): a schematic diagram of the back of the imaging device of the first preferred embodiment of the present case;

Figure 5 (c): A schematic cross-sectional view of the structure of the imaging device of the first preferred embodiment of the present case;

Figure 6 (a): A schematic diagram of the front side of the imaging device of the second preferred embodiment of the present case;

Figure 6 (b): a schematic diagram of the back of the imaging device of the second preferred embodiment of the present case;

Figure 6 (c): A schematic cross-sectional view of the structure of the imaging device according to the second preferred embodiment of the present case;

Figure 6 (d): A schematic view of the top view of the sapphire lens;

Figure 6 (e): A schematic diagram of the first back cover housing and the sapphire lens being joined;

Figure 7 (a): A schematic diagram of the front side of the imaging device of the third preferred embodiment of the present case;

Figure 7 (b): a schematic diagram of the back of the imaging device of the third preferred embodiment of the present case;

Figure 7 (c): A schematic diagram of the cross-section of the acquisition device of the third preferred embodiment of the present case; and

Figure 8: A schematic cross-sectional view of the acquisition device of the fourth preferred embodiment of this case.