TWM424054U

Light-emitting diode nail lamp structure with high illumination ultraviolet and light-emitting diode light source module thereof

Abstract

The present invention is a high-intensity ultraviolet LED nail lamp structure and an LED light source module thereof, comprising: a casing and an LED light source module. An LED light source module is disposed in the housing, the LED light source module has a plurality of ultraviolet light LEDs, and the LED chips of each ultraviolet light LED are disposed in a concave light cup. Through the implementation of this creation, the illumination of the LED nail lamp structure can be improved to achieve better illumination effects.

TWM424054U, drawing sheet 1
Sheet 1 of 3

Term

No projected expiry on record.

  1. Priority and filed
  2. Granted
  3. Today

14 claims: 14 independent, 0 dependent

  1. 1
    A high-illuminance ultraviolet light LED nail lamp structure, comprising:a housing, which is a hollow housing and has an opening;and an LED light source module, which is an ultraviolet light source, arranged in the housing On the upper side and projecting light from top to bottom, the LED light source module includes: a circuit substrate;and a plurality of ultraviolet LEDs, electrically connected and fixed on the circuit substrate, each ultraviolet LED includes: a bracket, It has a concave lamp cup and at least two electrodes;an LED chip integrated in the concave lamp cup and conductively combined with the electrodes;a silicon glue filled in the concave lamp cup and covering the LED chip;and a lens, Combine and cover the bracket. 一種高照度紫外光之LED指甲燈結構,其包括:一殼體,其為一中空殼體並具有一開口部;以及一LED光源模組,係為一紫外光光源,設置於該殼體內之上側且由上向下投射光線,該LED光源模組包括:一電路基板;及複數顆紫外光LED,電性連接且固設於該電路基板,每一該紫外光LED包括:一支架,具有一凹型燈杯及至少二個電極;一LED晶片,結合於該凹型燈杯內並與該些電極導電結合;一矽膠,充填於該凹型燈杯內且覆蓋該LED晶片;及一透鏡,結合並覆蓋於該支架上。
  2. 2
    According to the LED nail lamp structure described in item 1 of the scope of patent application, the circuit substrate is an aluminum circuit substrate or a PCB circuit board. 如申請專利範圍第1項所述之LED指甲燈結構,其中該電路基板為一鋁電路基板或一PCB電路板。
  3. 3
    For the LED nail lamp structure described in item 1 of the scope of patent application, the depth of the concave lamp cup is less than 1 mm. 如申請專利範圍第1項所述之LED指甲燈結構,其中該凹型燈杯之深度為小於1公釐。
  4. 4
    As for the LED nail lamp structure described in item 1 of the scope of patent application, the angle between the wall surface of the concave lamp cup and the extension line of the bottom surface is greater than 25°. 如申請專利範圍第1項所述之LED指甲燈結構,其中該凹型燈杯之壁面與底面延伸線之夾角係大於25°。
  5. 5
    According to the LED nail lamp structure described in item 1 of the scope of patent application, the bracket has a heat-conducting base, and the concave lamp cup is a part of the heat-conducting base. 如申請專利範圍第1項所述之LED指甲燈結構,其中該支架具有一導熱基座,該凹型燈杯為該導熱基座之一部。
  6. 6
    The LED nail lamp structure described in item 5 of the scope of patent application, wherein the LED chip is combined with the concave lamp cup by a silver glue. 如申請專利範圍第5項所述之LED指甲燈結構,其中該LED晶片係藉由一銀膠與該凹型燈杯結合。
  7. 7
    Such as the LED nail lamp structure described in item 1 of the scope of patent application, wherein the transparent The mirror is a silicone lens or a glass lens. 如申請專利範圍第1項所述之LED指甲燈結構,其中該透 鏡為一矽膠透鏡或一玻璃透鏡。
  8. 8
    An LED light source module is a high-illuminance ultraviolet light source and is applied to an LED nail lamp structure. The LED light source module includes:a circuit substrate;and a plurality of ultraviolet LEDs, which are electrically connected and fixed on The circuit substrate and each ultraviolet LED includes: a bracket with a concave lamp cup and at least two electrodes;an LED chip integrated in the concave lamp cup and conductively combined with the electrodes;a silicone gel filled in The concave lamp cup is inside and covers the LED chip;and a lens is combined and covered on the bracket. 一種LED光源模組,係為一高照度之紫外光光源並應用於一LED指甲燈結構中,該LED光源模組包括:一電路基板;以及複數顆紫外光LED,電性連接且固設於該電路基板,每一該紫外光LED包括:一支架,具有一凹型燈杯及至少二個電極;一LED晶片,結合於該凹型燈杯內並與該些電極導電結合;一矽膠,充填於該凹型燈杯內且覆蓋該LED晶片;及一透鏡,結合並覆蓋於該支架上。
  9. 9
    The LED light source module described in item 8 of the scope of patent application, wherein the circuit substrate is an aluminum circuit substrate or a PCB circuit board. 如申請專利範圍第8項所述之LED光源模組,其中該電路基板為一鋁電路基板或一PCB電路板。
  10. 10
    For the LED light source module described in item 8 of the scope of patent application, the depth of the concave lamp cup is less than 1 mm. 如申請專利範圍第8項所述之LED光源模組,其中該凹型燈杯之深度為小於1公釐。
  11. 11
    The LED light source module described in item 8 of the scope of patent application, wherein the angle between the wall surface of the concave lamp cup and the extension line of the bottom surface is greater than 25°. 如申請專利範圍第8項所述之LED光源模組,其中該凹型燈杯之壁面與底面延伸線之夾角係大於25°。
  12. 12
    The LED light source module described in item 8 of the scope of patent application, wherein the bracket has a heat-conducting base, and the concave lamp cup is a part of the heat-conducting base. 如申請專利範圍第8項所述之LED光源模組,其中該支架具有一導熱基座,該凹型燈杯為該導熱基座之一部。
  13. 13
    The LED light source module described in item 12 of the scope of patent application, wherein the LED chip is combined with the concave lamp cup by a silver glue. 如申請專利範圍第12項所述之LED光源模組,其中該LED晶片係藉由一銀膠與該凹型燈杯結合。
  14. 14
    The LED light source module described in item 8 of the scope of patent application, wherein the lens is a silicone lens or a glass lens. 如申請專利範圍第8項所述之LED光源模組,其中該透鏡為一矽膠透鏡或一玻璃透鏡。