Heat-dissipation device of lamp
Abstract
A "lighting device for lamps" applied to a plurality of lamps The illuminating element performs heat dissipation, and the luminaire provides a constant current power supply Each of the light-emitting elements, the heat sink of the lamp includes a light-emitting device for carrying the light a substrate of the component, an annular heat sink disposed on a surface of the substrate, and Mounted on the annular heat sink and shared with the light-emitting elements a fan of a streaming power source, wherein the annular heat sink has a centering setting The heat dissipation channel, the plurality of heat dissipation protruding from the outer circumference and the inner circumference Fins, and multiple assemblies between two adjacent heat sink fins Holes, thereby solving the lack of conventional techniques.

Term
No projected expiry on record.
- Priority and filed
- Granted
- Today
10 claims: 2 independent, 8 dependent
- 1A "lighting device for heat dissipation" is applied to heat dissipation of a plurality of light-emitting elements in a lamp, and the lamp provides a constant current power source through each of the light-emitting elements, including:a substrate for carrying each of the light-emitting elements;The seat is disposed on a surface of the substrate, and has a heat dissipation channel disposed in the center, a plurality of heat dissipation fins respectively protruding from the outer circumference and the inner circumference, and a plurality of assembly holes located between the two adjacent heat dissipation fins;and a The fan is shared with each of the light-emitting elements and is mounted on the annular heat sink for generating a heat-dissipating airflow. M359644 六、申請專利範圍: 燈/、政熱裝置」,應用於對燈具_之複數 X 一 _件進行政熱,且該燈具係提供一恆流電源 通過各該發光元件,包括·· 一基板,係供承载各該發光元件; 裒形放熱座,係設於該基板一表面,具有對 I °又置之政熱通道、A別凸伸於外周緣及内周緣之 複數放熱鰭片、以及位於部分兩相鄰散熱鰭片間之 複數裝配孔;以及 風扇’係與各該發光元件共用該恆流電源, 且衷。又於邊環形散熱座上,用以產生散熱氣流。 2·如中π專利範圍第i項所述之「燈具散熱裝置」, 其中,該基板包括對應各發光元件的周邊而設置 之複數氣孔。 3_如申請專利範圍第1項所述之「燈具散熱裝置」, /、中°亥基板為金屬電路板及高導熱散熱基板之 其中一者。 4. 如申請專利範圍第i項所述之「燈具散熱裝置」, 其中’各該散熱鰭片係呈放射狀設置於該環形散 熱座之外周緣及内周緣。 5. 如申請專利範圍第!項所述之「燈具散熱裝置」, 其中,該複數裝配孔係包括複數C形裝配孔以及 複數U形裝配孔。 6. 如申請專利範圍第5項所述之「燈具散熱裝置」, 12 M359644 其中’該c形裝配孔係位於該 衣艰政熱座内周緣 相鄰散熱轉片間。 7. :申請專利範圍第6項所述之「燈具散熱裝置」, 其中,該C形裝配孔之設置位置係對應於該風扇。 8. 如申請專利範圍第5項所述之「燈具散熱裝置」, 其中’該U形裝配孔係位於該環形散熱座外周緣 之相鄰散熱鰭片間。 9 ·如申請專利範圍第8項所述之「燈具散熱裝置」, 其中’該U形裝配孔之設置位置係對應於該基板。 1 〇.如申請專利範圍第5項所述之「燈具散熱裝 置」,其中,係間隔設置該複數C形裝配孔與該 複數U形裝配孔。 13 一種「燈具散熱裝置」,應用於對燈具中之複數發光元件進行散熱,且該燈具係提供一恆流電源通過各該發光元件,包括:一基板,係供承載各該發光元件;一環形散熱座,係設於該基板一表面,具有對中設置之散熱通道、分別凸伸於外周緣及內周緣之複數散熱鰭片、以及位於部分兩相鄰散熱鰭片間之複數裝配孔;以及一風扇,係與各該發光元件共用該恆流電源,且裝設於該環形散熱座上,用以產生散熱氣流。
- 3The "lighting device for heat dissipation" according to the first aspect of the invention, wherein the substrate is one of a metal circuit board and a high heat conduction heat dissipation substrate. 如申請專利範圍第1項所述之「燈具散熱裝置」,其中,該基板為金屬電路板及高導熱散熱基板之其中一者。
Independent claims2
34 paragraphs, as filed
Lamp heat sink
A heat dissipation technology, especially a heat sink for a lamp.
According to recent years, as energy costs continue to soar, related energy-saving products have emerged. Among them, LEDs are widely used in display and lighting because of their advantages of energy saving, environmental protection, long life and multi-color. In the field.
For example, a luminaire using a light-emitting diode as a light-emitting element can use a high-luminance light-emitting diode. However, since the light source generated by the light-emitting diode is a "dot" light source, when a light-emitting diode is applied to the light-emitting device, Usually, a plurality of light-emitting diodes are provided as light-emitting elements to generate a "face" light source which is the same as a conventional fluorescent tube or a bulb, and at the same time, the light-emitting power is increased to produce the same brightness performance as that of the fluorescent tube or the bulb. At the same time, the light-emitting diode lamps generally used for long-time illumination often have a heat dissipation mechanism, and the purpose is to prevent problems such as light decay or related component breakage due to overheating of the wafer.
However, at present, the heat dissipation mechanism adopted by the illuminator of the illuminating diode is generally used directly for the purpose of dissipating heat by using a metal casing or a fin integrally provided on the metal casing, thereby having the following disadvantages:
1. Only use natural air convection to dissipate heat, which is easy to affect the heat dissipation efficiency of the lamp due to changes in surrounding environmental conditions.
2. The lamp housing is easily covered by dust, which reduces the original heat dissipation performance.
In order to improve the heat dissipation efficiency, the prior art provides a fan in the lamp housing, provides a power source through each of the light-emitting elements, and provides another power source through the fan, that is, adopts a dual power supply mode, so that the fan generates airflow. To remove the heat generated by each of the light-emitting elements.
However, if the fan in the prior art is damaged or fails for some reason, the heat dissipation effect is lost; thus, when the lamp is continuously used but the heat dissipation mechanism cannot be surely started, each of the light-emitting elements is easily damaged by overheating.
It can be seen from the above that how to propose a heat dissipation technology to solve the above-mentioned various shortcomings of the prior art is an urgent problem to be solved.
In view of the various shortcomings of the prior art, one of the aims of the present invention is to provide a heat sink for a lamp that can surely activate the heat dissipation mechanism.
Another object of the present invention is to provide a heat sink for a lamp that can improve heat dissipation efficiency.
A further object of the present invention is to provide an optical shading-free luminaire heat sink.
In order to achieve the purpose and other purposes, the creation of "lighting device for heat dissipation" is applied to heat dissipation of a plurality of light-emitting elements in a lamp, and the lamp provides a constant current power source through each of the light-emitting elements, including: a substrate, Each of the light-emitting elements is disposed on the surface of the substrate, and has a heat dissipation channel disposed in the center, a plurality of heat dissipation fins respectively protruding from the outer circumference and the inner circumference, and two adjacent heat dissipation portions a plurality of mounting holes between the fins; and a fan sharing the constant current power with each of the light emitting elements and mounted on the annular heat sink for generating a heat dissipation airflow.
In the above-mentioned "lamp heat sink", the substrate includes a plurality of air holes provided corresponding to the periphery of each of the light-emitting elements, and the substrate is one of a metal circuit board and a high heat-dissipating heat-dissipating substrate. Each of the heat dissipation fins is radially disposed on a periphery and an inner circumference of the annular heat sink. The plurality of assembly holes includes a plurality of C-shaped mounting holes and a plurality of U-shaped mounting holes. The C-shaped mounting hole is located between adjacent heat-dissipating fins of the inner circumference of the annular heat-dissipating seat, wherein the C-shaped mounting hole is disposed at a position corresponding to the fan. The U-shaped mounting hole is located between adjacent heat-dissipating fins on the outer circumference of the annular heat-dissipating seat, wherein the U-shaped mounting hole is disposed at a position corresponding to the substrate. In an embodiment, the plurality of C-shaped mounting holes and the plurality of U-shaped mounting holes are spaced apart.
Compared with the prior art, the fan of the present invention shares a constant current power supply with each of the light-emitting elements, and when the fan is damaged or fails for some reason, power cannot be supplied to each of the light-emitting elements. In this way, on the one hand, each of the light-emitting elements can be prevented from being damaged by overheating, and on the other hand, the user can be reminded to replace or repair the fan in time. At the same time, when the present application is applied, since the substrate includes a plurality of air holes corresponding to the periphery of each of the light-emitting elements, the airflow generated by the fan can directly blow away or absorb the heat generated by each of the light-emitting elements, and relatively increase the heat-dissipating area. Improve heat dissipation efficiency.
In addition, the present invention is provided with a plurality of assembly holes between two adjacent heat dissipation fins, which can be used for fixing the fan and the substrate respectively; in other words, the heat sink fins can simultaneously fix the fan without the need for the fan and A corresponding fixed structure is additionally disposed between the substrates, so that each of the light-emitting elements directly emits light, so that an optical non-shadow heat sink of the lamp can be provided.
In order for the review board to clearly understand the contents of the present invention, only the following description will be used in conjunction with the drawings, as explained later.
As shown in Fig. 1, an embodiment of the "lighting device for heat dissipation" of the present invention is applied to heat dissipation of a plurality of light-emitting elements 51 in a lamp, and the lamp provides a constant current power source (not shown) through each of the lamps. Light-emitting element 51.
In this embodiment, the heat dissipation device of the lamp comprises: a substrate 10 for carrying each of the light-emitting elements 51, which may be a metal circuit board or a high heat-dissipation heat-dissipating substrate. In this embodiment, the substrate 10 can be constructed with a related circuit (not shown) for electrically connecting the light-emitting elements 51 to a power supply circuit (not shown), and corresponding to the periphery of each of the light-emitting elements 51. The plurality of air holes 11 and the plurality of mounting holes 13 provided near the side of the board, for example, as shown in Fig. 2 in Fig. 2, four air holes 11 are provided in the periphery (e.g., four corners) of the light-emitting elements 51. It should be understood that the number and position of the air holes 11 provided in this embodiment are illustrative and are not intended to limit the creation.
An annular heat sink 20 is disposed on a surface of the substrate 10. As shown in FIG. 2, the annular heat sink 20 has a centrally disposed heat dissipation channel 21, and a plurality of heat dissipation fins respectively protruding from the outer circumference and the inner circumference. 22. A plurality of mounting holes 23 between the two adjacent heat radiating fins 22. In this embodiment, the annular heat sink 20 is disposed on the back surface of the substrate 10, and each of the heat dissipation fins 22 is radially disposed on the outer circumference and the inner circumference of the annular heat sink 20. The plurality of mounting holes 23 includes four C-shaped mounting holes and four U-shaped mounting holes, which are described later.
A fan 30 is shared with each of the light-emitting elements 51 and is mounted on the annular heat sink 21 for generating a heat-dissipating airflow, and the heat-dissipating passage 21 of the heat-dissipating seat 21 and the substrate 10 The same. In this embodiment, for example, the electrical connection manner of the series connection may be adopted, so that the constant current power source passes through the fan 30 first, and then passes through the respective light emitting elements 51; thus, if the constant current power source does not pass the fan 30, Since the light-emitting elements 51 cannot be passed through, the light-emitting elements 51 cannot be activated even when the heat dissipation mechanism is not activated. It should be noted that those skilled in the art are aware of the technical and functional principle of providing the constant current power source through each of the light-emitting elements 51 and the fan 30. Therefore, the description and the related drawings are omitted. .
As shown in the second and third figures, the lamp has a cover 40 for accommodating the fan 30, the annular heat sink 20 and the substrate 10 for shielding the components it accommodates, and the cover 40 A plurality of venting grooves 41, and a plurality of fitting holes 42 corresponding to the U-shaped fitting holes in the fitting holes 23 and the fitting holes 13 are provided.
As shown in the third and fourth figures, the C-shaped mounting holes are located between the adjacent heat radiating fins 22 of the inner circumference of the annular heat sink 20, and the C-shaped mounting holes are disposed at a position corresponding to the fan 30. The U-shaped mounting holes are located between the adjacent heat-dissipating fins 22 of the outer periphery of the annular heat-dissipating base 20, and the U-shaped mounting holes are disposed at a position corresponding to the substrate 10, and the plurality of C-shaped mounting holes are spaced apart from the A plurality of U-shaped mounting holes. In this way, the fan 30 and the substrate 10 can be respectively fixed by the mounting holes 23, so that the heat dissipating fins can simultaneously fix the fan 30 and the substrate 10 without separately between the fan 30 and the substrate 10. The corresponding fixed structure is arranged, and each of the light-emitting elements is directly exposed to light without being blocked.
Therefore, in the implementation of the "lighting device", the light-emitting diode can be used as the light-emitting element 51 of the lamp; and the annular heat-dissipating block 20 is provided with a plurality of mounting holes 23 for respectively and the substrate 10 and The fan 30 is assembled and engaged; likewise, the cover 40 is provided with a plurality of mounting holes 42 for assembly engagement with a lamp cover 52 to form a complete LED luminaire.
For example, in use, the luminaire can utilize the heat dissipation channel 21 of the annular heat sink 20 for the substrate 10 to communicate with the fan 30, and the heat dissipation channel 21 can also be used as a power supply module 53. The air hole 11 on the substrate 10 further accelerates the heat dissipation effect of each of the light-emitting elements 51, and the heat dissipation effect of the airflow generated by the fan 30 can greatly improve the heat dissipation efficiency of the lamp, and the heat dissipation performance thereof is less than Affected by surrounding environmental conditions.
It is worth mentioning that the fan 30, the annular heat sink 20 and the substrate 10 in the present invention are housed inside the cover 40, and the cover 40 can be better shielded by the cover 40 to prevent the related components from being covered by dust. And to ensure that the fan can run smoothly, it is relatively helpful for the heat sink to maintain its operational efficiency.
In summary, the present invention provides a better and feasible heat sink for the lamp, which has the novelty of the patent, and the value of the use of the industry is very significant, practical, and the patent application is filed according to law; The implementation description and the drawings show that the preferred embodiment of the present invention is not limited to the creation of the present invention. Therefore, all the similarities and similarities to the structure, device, and features of the present creation should belong to the present creation. The purpose of creation and the scope of patent application.
<p>10. . . Substrate</p><p>11. . . Stomata</p><p>13. . . Assembly hole</p><p>20. . . Ring heat sink</p><p>twenty one. . . Cooling channel</p><p>twenty two. . . Heat sink fin</p><p>twenty three. . . Assembly hole</p><p>30. . . fan</p><p>40. . . Shell cover</p><p>41. . . Ventilation slot</p><p>42. . . Assembly hole</p><p>51. . . Light-emitting element</p><p>52. . . lampshade</p><p>53. . . Power supply module</p>
FIG. 1 is a partial cross-sectional view showing the appearance of an embodiment of the heat sink of the creative lamp applied to the lamp.
Fig. 2 is an exploded view showing the structure of the heat sink of the lamp of Fig. 1 of the present invention.
Figure 3 is an exploded view of another perspective of the heat sink of the lamp of Figure 1 of the present invention.
Fig. 4 is a plan view showing the structure of the annular heat sink in Fig. 1 of the creation.
Fig. 5 is a cross-sectional view showing the structure of the lamp heat sink of the first drawing of the present invention applied to the lamp.
6 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| CN102374403A | Cited by | China | Search report |
| US8517574B2 | Cited by | United States of America | Applicant |
| US8974092B2 | Cited by | United States of America | Applicant |
2 priority claims, no other members on record
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 98200958 | Taiwan Province of China | U | |
| TW20090200958U | – | – | – |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Annulment or lapse of a utility model due to non-payment of feesLapsedMM4K | MM4K |
Numbers
- Publication
- M359644
- Publication, DOCDB
- M359644
- Publication, EPODOC
- TWM359644U
- Application
- 9858
- Application, DOCDB
- 98200958
- Application, EPODOC
- TW20090200958U
Titles2
- English
- Heat-dissipation device of lamp
- Chinese
- ??????