Heat-dissipation module and electronic device using the same

Thermal module and electronic device using the same

The present invention relates to a heat dissipation module and an electronic device using the same, and more particularly to a heat dissipation module including a plurality of heat pipes and an electronic device using the same.

With the advancement of semiconductor technology and the shrinking process size, the number of transistors per unit area has grown exponentially, making the performance of the chip leaps and bounds. In contrast, the unit heat generation of the wafer is also increasing. Especially in today's electronic product internal component accumulation and the trend of miniaturization and light weight, how to effectively dissipate the internal components of the electronic product is becoming more and more important. a subject.

In electronic products such as notebook computers or ultra-portable computers, the efficiency of heat dissipation seriously affects the efficiency and stability of system operation. The main sources of heat include hard disk drives, central processing units, north bridge wafers, south bridge wafers, and display chips. Generally, for a wafer or a chip set disposed on a motherboard, a heat dissipation module is mostly used, and a plurality of heat pipes are used to dissipate heat from the heat source. In a common way, each wafer is transferred by a heat pipe to transfer heat generated by the wafer to a heat sink fin group that contacts the end of the heat pipe. However, this method does not effectively utilize the performance of the fan. For example, when only the central processing unit operates at full speed and generates a large amount of heat relative to other heat sources, the heat dissipation module allows the fan to operate at full speed in order to dissipate heat to the central processing unit. At this time, the airflow blown by the fan is blown toward the other heat sinks that do not need to be dissipated, except for the heat sink (which is corresponding to the heat sink of the central processing unit) that needs to be dissipated, so that the performance of the fan is only partially It is applied to the heat sink that really needs heat dissipation, which reduces the utilization of the fan.

In addition, the prior art includes a design in which both ends of a heat pipe are respectively contacted with different heat sources. However, when the heat source at one end of such a state generates a large amount of heat, the heat is diffused toward the heat source at the other end and accumulated on the heat source at the other end, which causes the temperature of the other end of the wafer set to be too high, and even the heat pipe is locally generated. The phenomenon of failure. As a result, problems such as poor heat dissipation efficiency and reduced wafer operational stability are caused.

The purpose of the present invention is to provide a heat dissipation module and an electronic device using the same, which uses a plurality of heat pipes to dissipate heat from the same heat source. One end of each heat pipe contacts the heat source, and the other end is in contact with the first heat sink fin group and the second heat sink fin group, respectively.

One aspect of the present invention provides a heat dissipation module including a first heat pipe, a second heat pipe, a first heat sink fin set, a second heat sink fin set, and a fan. One end of the first heat pipe is in contact with a first heat source. One end of the second heat pipe contacts the first heat source. The first heat dissipation fin group and the second heat dissipation fin group respectively contact the other end of the first heat pipe and the other end of the second heat pipe. The heat generated by the first heat source is transmitted from the first heat pipe and the second heat pipe to the first heat sink fin group and the second heat sink fin group, respectively. The fan is configured to provide an airflow to the first heat dissipation fin set and the second heat dissipation fin set for heat dissipation.

Another aspect of the present invention provides an electronic device including a first heat source and a heat dissipation module. The heat dissipation module includes a first heat pipe, a second heat pipe, a first heat sink fin set, a second heat sink fin set, and a fan. One end of the first heat pipe and one end of the second heat pipe are respectively in contact with the first heat source. The first heat dissipation fin group and the second heat dissipation fin group respectively contact the other end of the first heat pipe and the other end of the second heat pipe. The heat generated by the first heat source is transmitted from the first heat pipe and the second heat pipe to the first heat sink fin group and the second heat sink fin group, respectively. The fan is configured to provide an airflow to the first heat dissipation fin set and the second heat dissipation fin set for heat dissipation.

The novel uses a method in which one end of the plurality of heat pipes is respectively contacted with a heat source, so that heat generated by the heat source can be respectively transmitted to a plurality of heat radiating fin groups contacting the other ends of the heat pipes to perform heat dissipation. By forming a good heat exchange cycle between the two ends of the heat pipe, the heat dissipation efficiency, the heat dissipation capability, the fan utilization rate can be effectively improved, and the problem of partial failure of the heat pipe can be avoided, and the stability of the operation of the heat source can be ensured.

The heat dissipation module of the present invention uses a plurality of heat pipes to dissipate heat from the same heat source, and forms a complete heat exchange cycle between the two ends of the heat pipes to avoid the problem that heat is accumulated in the heat source due to local failure of the heat pipes. In addition, the same heat pipe can be contacted with a plurality of heat sources to transfer heat to the heat sink fins contacting the heat pipe end points for heat dissipation, thereby effectively improving the heat dissipation efficiency and heat dissipation capability of the heat dissipation module. The following is a description of a heat dissipation module according to a preferred embodiment of the present invention. Referring to FIGS. 1A and 1B, respectively, a front view and a rear view of a heat dissipation module according to a preferred embodiment of the present invention are shown.

The heat dissipation module 100 mainly includes a first heat pipe 111, a second heat pipe 112, a first heat dissipation fin group 131, a second heat dissipation fin group 132, and a fan 150. One end of the first heat pipe 111 is in contact with a first heat source S1. One end of the second heat pipe 112 is also in contact with the first heat source S1. The first heat dissipation fin group 131 is in contact with the other end of the first heat pipe 111. The second heat dissipation fin group 132 is in contact with the other end of the second heat pipe 112. The heat generated by the first heat source S1 is respectively transmitted from the first heat pipe 111 and the second heat pipe 112 to the first heat radiation fin group 131 and the second heat radiation fin group 132. The fan 150 is configured to provide an airflow to the first heat dissipation fin set 131 and the second heat dissipation fin set 132 to dissipate heat from the first heat dissipation fin set 131 and the second heat dissipation fin set 132.

The airflow provided by the fan 150 is simultaneously blown to the first heat dissipation fin group 131 and the second heat dissipation fin group 132 to simultaneously dissipate heat from the first heat dissipation fin group 131 and the second heat dissipation fin group 132. Therefore, the heat generated by the first heat source S1 can be dissipated by the first and second heat dissipation fin groups 131 and 132 at the same time, which can effectively improve the utilization efficiency of the fan 150 and improve the heat dissipation efficiency of the first heat source S1. .

Further, the heat dissipation module 100 can contact the heat source other than the first heat source S1 by the first heat pipe 111 and/or the second heat pipe 112 to dissipate heat from the plurality of heat sources. For example, the heat dissipation module 100 can be used to dissipate heat from a second heat source S2. The second heat source S2 can be dissipated by one of the first heat pipe 111 and the second heat pipe 112. In this embodiment, the first heat pipe 111 is in contact with the second heat source S2 as an example. As shown in FIG. 1A, the second heat source S2 is in contact with both ends of the first heat pipe 111. Further, the heat dissipation module 100 is further configured to dissipate heat from a third heat source S3. The third heat source S3 can also dissipate heat by one of the first heat pipe 111 and the second heat pipe 112. In this embodiment, the first heat pipe 111 is in contact with the second heat source S2 and the third heat source S3 as an example. As shown in FIG. 1A, the second heat source S2 and the third heat source S3 are in contact with each other between the two ends of the first heat pipe 111.

Although the first heat pipe 111 is in contact with the second and third heat sources S2 and S3 in the present embodiment, the heat dissipation mode and the number of heat sources are not limited thereto. For example, the second heat source S2 and the third heat source S3 are respectively in contact with the first heat pipe 111 and the second heat pipe 112, and the heat is transferred to the first heat sink fin group by the first heat pipe 111 and the second heat pipe 112. 131 and a second heat dissipation fin group 132. In addition, the heat dissipation module 100 is more applicable to heat dissipation of more than four heat sources.

On the other hand, in the embodiment, the first heat pipe 111 and the second heat pipe 112 are substantially in a Y shape. Please refer to FIG. 2 , which is a schematic diagram of the first and second heat pipes and the first and second heat dissipation fin sets of FIG. 1A . The first heat pipe 111 is in contact with the end of the first heat source S1, and is adjacent to the end of the first heat source S1 adjacent to the second heat pipe 112. The other ends of the first heat pipe 111 and the second heat pipe 112 are respectively in contact with the first heat radiation fin group 131 and the second heat radiation fin group 132. The first heat pipe 111 and the second heat pipe 112 respectively have a working fluid, and the working fluid is used for heat transfer. The first and second heat pipes 111, 112 are respectively a closed pipe body and have an in-pipe pressure of less than 1 atmosphere. In addition, the inner tube walls of the first and second heat pipes 111, 112 respectively have a microporous structure for providing a capillary force to the working fluid.

In practical applications, water can be applied as a working fluid, and the first and second heat pipes 111, 112 are evacuated to form a low vacuum. After the heat generated by the heat sources S1, S2, and S3 is transferred to the first heat pipe 111 and the second heat pipe 112, the working fluid absorbs heat and vaporizes into steam under a low vacuum state. The vapor volume after evaporation expands and produces a vapor pressure. Since the first and second heat pipes 111, 112 are respectively in contact with the ends of the first and second heat radiation fin groups 131, 132 have a relatively low pressure, so that the working fluid vapor contacts the first and second heat pipes 111, 112. The ends of the first heat dissipation fin set 131 and the second heat dissipation fin set 132 are diffused. Then, the heat of the working fluid vapor is radiated and cooled by the first heat radiation fin group 131 and the second heat radiation fin group 132. The cooled steam condenses into a working fluid and is driven by the capillary force provided by the microporous structure to move back to the first and second heat pipes 111, 112 to contact the heat sources S1, S2, and S3. In this way, the heat generated by any one of the heat sources S1, S2, and S3 can be dispersed by the first heat radiation fin group 131 and the second heat radiation fin group 132.

Referring to FIG. 1A, the heat dissipation module 100 further includes a housing 170 having two air outlets 170a, 170b. The fan 150 is disposed in the housing 170, and the airflow provided by the fan 150 is separated from the heat dissipation module 100 by the two air outlets 170a and 170b. Furthermore, the air flow is separated from the heat dissipation module 100 by the two air outlets 170a, 170b in the two air outlet directions D1, D2. In the heat dissipation module 100 of the preferred embodiment of the present invention, the first heat dissipation fin group 131 and the second heat dissipation fin group 132 are respectively disposed at the two air outlets 170a and 170b, and the two air outlet directions D1 and D2 are substantially perpendicular. Additionally, the fan 150 can be, for example, a centrifugal fan and has a rotating blade. The fan 150 is inducted along the axial direction of the rotating blade and exits in the radial direction of the rotating blade.

The heat dissipation module 100 of this embodiment can be applied to an electronic device. Please refer to FIG. 3 , which is a partial schematic view of an electronic device according to a preferred embodiment of the present invention. The electronic device 200 includes at least a first heat source S1 and a heat dissipation module 100. One end of the first heat pipe 111 and one end of the second heat pipe 112 are respectively in contact with the first heat source S1. The first heat dissipation fin group 131 and the second heat dissipation fin group 132 are respectively in contact with the other end of the first heat pipe 111 and the other end of the second heat pipe 112.

In an actual application, the electronic device 200 can be a notebook computer, and the electronic device 200 can further include a second heat source S2 and a third heat source S3. In one embodiment, the two heat sources S2 and S3 are in contact with each other between the two ends of the first heat pipe 111. The first heat source S1, the second heat source S2, and the third heat source S3 may be, for example, a wafer set such as a north bridge wafer, a display wafer, or a central processing unit in a notebook computer. However, the heat source for dissipating heat by the electronic device 200 by the heat dissipation module 100 is not limited thereto, and other components that generate heat and have heat dissipation requirements can be dissipated by the heat dissipation module 100 of the embodiment.

As shown in FIG. 3, in the electronic device 200, the heat dissipation capability of the heat dissipation module 100 for the first heat source S1 can be improved by using the first heat pipe 111 and the second heat pipe 112 to simultaneously dissipate heat from the first heat source S1. Therefore, in application, the operating power of the first heat source S1 can be increased; or, a component of a higher power can be selected as the first heat source S1. That is, in the heat sources S1, S2, and S3, the heat generated by the first heat source S1 in a unit time is greater than the heat generated by the second heat source S2 or the third heat source S3 in a unit time, which can improve the design. Flexibility.

In the heat dissipation module 100 of the embodiment, the end of the first heat pipe 111 contacting the first heat source S1 is the evaporation end of the first heat pipe 111, and the end of the second heat pipe 112 contacting the first heat source S1 is The evaporation end of the second heat pipe 112. The end of the first heat pipe 111 contacting the first heat radiation fin group 131 is the condensation end of the first heat pipe 111, and the end of the second heat pipe 112 contacting the second heat radiation fin group 132 is the condensation of the second heat pipe 112. end. A stable working fluid phase change cycle is formed between the evaporation end and the condensation end of the first and second heat pipes 111, 112, respectively, so that heat can be stably transferred from the evaporation end to the condensation end, avoiding the first and second heat pipes 111, 112. A problem of local failure has occurred.

The heat dissipation module and the electronic device using the same according to the preferred embodiment of the present invention utilize the first and second heat pipes to simultaneously dissipate heat from the first heat source, thereby increasing heat dissipation efficiency and improving utilization of the fan performance. Moreover, using the first heat pipe or the second heat pipe to dissipate heat from the plurality of heat sources can effectively improve the heat dissipation capability of the heat dissipation module and save the cost of using a higher specification heat pipe. In addition, by contacting the first and second heat dissipation fin groups with one end of the first and second heat pipes, a stable thermal cycle can be formed in the first heat pipe and the second heat pipe, respectively, to avoid the problem of partial failure of the heat pipe. Improve product quality.

Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the present invention, and it is to be understood that those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. The scope of the new protection is subject to the definition of the scope of the patent application.

<p>100. . . Thermal module</p><p>111. . . First heat pipe</p><p>112. . . Second heat pipe</p><p>131. . . First heat sink fin set</p><p>132. . . Second heat sink fin set</p><p>150. . . fan</p><p>170. . . case</p><p>170a. . . Air outlet</p><p>170b. . . Air outlet</p><p>200. . . Electronic device</p><p>D1. . . Ventilation direction</p><p>D2. . . Ventilation direction</p><p>S1. . . First heat source</p><p>S2. . . Second heat source</p><p>S3. . . Third heating source</p>

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

FIG. 1A is a front elevational view of a heat dissipation module in accordance with a preferred embodiment of the present invention.

FIG. 1B is a rear view of the heat dissipation module according to a preferred embodiment of the present invention.

FIG. 2 is a schematic view showing the first heat pipe, the second heat pipe, the first heat dissipation fin group, and the second heat dissipation fin group in FIG. 1A.

3 is a partial schematic view of an electronic device in accordance with a preferred embodiment of the present invention.