TWM347405U

Plating film apparatus with gas dispersion plate

Abstract

The present invention is a coating device having a dispersion plate for dispersing a gas, the coating device comprising a hollow casing having a coating chamber, an electrode unit having a plurality of electrode plates disposed in the coating chamber, and a a gas conveying pipe fed into the coating chamber of the casing, an air pumping unit having a pump connected to the coating chamber, and a shunt hole adjacent to the bottom surface of the electrode plates and having a plurality of spaced apart orifices The dispersing plate, wherein the diverting holes cover a majority of the area of the bottom surface of the electrode plate, and the coating gas can be uniformly distributed in the coating chamber by the diverting holes to improve the coating yield and improve the overall coating efficiency.

Term

No projected expiry on record.

  1. Priority and filed
  2. Granted
  3. Today

3 claims: 1 independent, 2 dependent

  1. 1
    A coating device with a dispersing plate for dispersing a gas, comprising:a hollow casing having a coating chamber;an electrode unit having an electrode plate disposed at a plurality of intervals in the coating chamber;and a gas pipe for plating the gas Delivered into the coating chamber of the housing;a pumping unit having a pump in communication with the coating chamber;and a dispersing plate adjacent the bottom surface of the electrode plates and having a plurality of spaced apart shunt holes, wherein These shunt holes cover most of the area of the bottom surface of the electrode plate. 一種具有分散氣體之分散板的鍍膜裝置,包含:一具有一鍍膜室的中空狀殼體;一電極單元,具有複數間隔設置於該鍍膜室中的電極板;一輸氣管,用以將鍍膜氣體輸送進該殼體的鍍膜室中;一抽氣單元,具有一與該鍍膜室相連通的泵浦;以及一分散板,鄰近該等電極板的底面,並具有複數相間隔的分流孔,其中,該等分流孔涵蓋所電極板之底面的大部分面積。