Plating film apparatus with gas dispersion plate
Abstract
The present invention is a coating device having a dispersion plate for dispersing a gas, the coating device comprising a hollow casing having a coating chamber, an electrode unit having a plurality of electrode plates disposed in the coating chamber, and a a gas conveying pipe fed into the coating chamber of the casing, an air pumping unit having a pump connected to the coating chamber, and a shunt hole adjacent to the bottom surface of the electrode plates and having a plurality of spaced apart orifices The dispersing plate, wherein the diverting holes cover a majority of the area of the bottom surface of the electrode plate, and the coating gas can be uniformly distributed in the coating chamber by the diverting holes to improve the coating yield and improve the overall coating efficiency.
Term
No projected expiry on record.
- Priority and filed
- Granted
- Today
3 claims: 1 independent, 2 dependent
- 1A coating device with a dispersing plate for dispersing a gas, comprising:a hollow casing having a coating chamber;an electrode unit having an electrode plate disposed at a plurality of intervals in the coating chamber;and a gas pipe for plating the gas Delivered into the coating chamber of the housing;a pumping unit having a pump in communication with the coating chamber;and a dispersing plate adjacent the bottom surface of the electrode plates and having a plurality of spaced apart shunt holes, wherein These shunt holes cover most of the area of the bottom surface of the electrode plate. 一種具有分散氣體之分散板的鍍膜裝置,包含:一具有一鍍膜室的中空狀殼體;一電極單元,具有複數間隔設置於該鍍膜室中的電極板;一輸氣管,用以將鍍膜氣體輸送進該殼體的鍍膜室中;一抽氣單元,具有一與該鍍膜室相連通的泵浦;以及一分散板,鄰近該等電極板的底面,並具有複數相間隔的分流孔,其中,該等分流孔涵蓋所電極板之底面的大部分面積。
18 paragraphs, as filed
Coating device with dispersing plate for dispersing gas
The present invention relates to a coating device, and more particularly to a coating device having a dispersion plate for dispersing a gas.
As shown in FIG. 1 , a conventional vacuum coating apparatus 1 is provided for at least one object to be electroplated 100. The coating apparatus 1 has a hollow casing 11 defining a coating chamber 10, and a coating chamber is disposed in the coating chamber. The electrode plate holder 12 in the 10, the electrode plate 13 (only one of which is shown) disposed on the electrode plate holder 12, and a gas pipe connected to the coating chamber 10 and located on the top surface of the casing 11 14. A venting plate 15 disposed in the coating chamber 10 and having two circular venting holes 151, a pump 16 connected to the coating chamber 10 and located on a bottom surface of the housing 11, and a plurality of Heating elements (not shown) on both sides of the casing 11 and above and below, wherein the object to be plated 100 is disposed between the two electrode plates 13, and the gas pipe 14 is used for conveying the coating gas into the coating chamber 10. And heating the coating chamber 10 to a temperature suitable for coating by using the heating members, so that the coating gas between the electrode plates 13 is dissociated and attached to the object to be plated 100, and the pump 16 is The dissociated exhaust gas in the coating chamber 10 passes through the exhaust holes 151 of the exhaust plate 15 to extract the plating Outside the chamber 10, 10 maintained the vacuum degree in the vacuum chamber set to 100 for the article to be electroplated vacuum coating operation.
However, the conventional coating apparatus 1 extracts the plating gas located in the coating chamber 10 by the pump 16 to maintain the degree of vacuum in the coating chamber 10, because the coating gas must pass through the exhaust plate 15 The hole 151 is extracted by the pump 16 out of the coating chamber 10, causing the coating gas to generate a two-potential flow 200 in the coating chamber 10 as indicated by the phantom line in FIG. 2, so that the coating gas in the coating chamber 10 is formed. Flowing along the flow direction 200 toward the venting holes 151, causing uneven distribution of the coating gas in the coating chamber 10, so that the coating gas does not easily flow into the electrode plate to be plated 100 adjacent to the electrode plate holder 12, Moreover, the concentration of the coating gas is uneven, which causes the coating effect of the object to be plated 100 to be different, resulting in poor coating yield of the object to be plated 100 and the quality of the tube is not easy to control. In the event of a situation, even a process of secondary processing such as cutting, trimming, etc. must be performed on the finished product, which will inevitably affect the overall operating efficiency and productivity.
As described above, when the coating operation is performed using the conventional coating apparatus 1, the potential flow 200 generated when the pump 16 extracts the plating gas in the coating chamber 10 causes the coating gas in the coating chamber 10. Uneven distribution, resulting in poor coating yield and overall coating efficiency, how to improve coating yield and improve overall coating efficiency, the industry needs further research and development.
Therefore, the object of the present invention is to provide a coating apparatus having a dispersion plate for dispersing a gas which can make the distribution of the coating gas more uniform and make the coating effect more uniform.
Therefore, the coating device of the present invention has a dispersion plate with a dispersed gas, comprising a hollow casing having a coating chamber, an electrode unit having a plurality of electrode plates disposed in the coating chamber, and a coating gas. a gas delivery pipe fed into the coating chamber of the casing, a pumping unit having a pump connected to the coating chamber, and a dispersion plate having a plurality of spaced apart orifices adjacent to the bottom surface of the electrode plates Wherein the split holes cover a majority of the area of the bottom surface of the electrode plate.
The effect of the present invention is that the pumping unit is pumped in the coating chamber by the dispersing plate adjacent to the bottom surface of the electrode plates, and the shunt holes covering most of the area of the bottom surface of the electrode plates. The potential flow formed by the coating gas is relatively gentle, so that the coating gas can be uniformly distributed in the coating chamber to improve the coating yield and improve the overall coating efficiency.
The foregoing and other technical aspects, features and advantages of the present invention will be apparent from the following description of the preferred embodiments of the invention.
Referring to Figures 2, 3 and 4, a preferred embodiment of the coating apparatus 2 of the present invention having a dispersion plate 25 for dispersing a gas comprises a hollow casing 21 having a coating chamber 211 for heating the coating. a heating unit (not shown) of the chamber 211, an electrode unit 22 disposed in the housing 21, a gas delivery tube 23 for conveying the coating gas into the coating chamber 211 of the housing 21, The coating gas extracts the suction unit 24 of the coating chamber 211 of the casing 21, and a dispersion plate 25 adjacent to the bottom surface of the electrode plates 222 and having a plurality of spaced-apart flow holes 251.
The electrode unit 22 has an electrode holder 221 slidable in the coating chamber 211, and an electrode plate 222 disposed on the electrode holder 221 at intervals. The pumping unit 24 has a pump 241 that communicates with the coating chamber 211. An exhaust plate 242 located between the bottom surface of the electrode holder 221 and the housing 21, wherein the exhaust plate 242 has two circular vent holes 243 spaced apart, and the dispersion plate 25 is located in the row The gas plate 242 and the electrode holder 221 are disposed, and the diverting holes 251 on the dispersing plate 25 are substantially rectangular, and the diverting holes 251 cover a majority of the area of the bottom surface of the electrode plate 222.
In the preferred embodiment, the shunt holes 251 are generally rectangular, but may be other shapes, and the same effects can still be achieved, and should not be limited to the embodiment.
When performing the coating operation, a plurality of objects to be plated 20 (only one object to be plated 20 is shown in FIG. 4) are placed in the coating chamber 211 of the casing 21, and each object to be plated 20 is inserted adjacently. Between the two electrode plates 222, the coating gas flows into the coating chamber 211 from the gas delivery pipe 23, and the heating unit is activated to heat the coating chamber 211 to a temperature suitable for coating, so that it is located at every two adjacent The plating gas between the electrode plates 222 is dissociated and adhered to the waiting plating material 20 interposed between the adjacent two electrode plates 222 to perform a coating operation on the waiting plating material 20.
At the same time, the pump 241 of the pumping unit 24 is activated, and the dissociated exhaust gas is extracted from the coating chamber 211 to maintain the degree of vacuum in the coating chamber 211. At this time, the coating gas filled in the coating chamber 211 is The suction force of the pump 241 flows from the coating chamber 211 toward the dispersing plate 25, and when the coating gas flows through the diverting holes 251 on the dispersing plate 25, the exhausting of the pumping unit 24 When the vent hole 243 of the plate 242 covers the majority of the area of the bottom surface of the electrode plate 222, the coating gas can be uniformly distributed and flows through the object to be plated 20 At the periphery, since the coating gas can be uniformly distributed on the surface of the waiting platen 20, the coating gas can be uniformly dissociated and attached to the waiting plate 20, which can effectively improve the coating yield and improve the overall coating efficiency.
In summary, the coating device 2 of the present invention has a dispersing plate 25 for dispersing a gas, and the plated gas is uniformly distributed and flows by using the dispersing plate 25 covering the majority of the area of the bottom surface of the electrode plate 222. After waiting for the periphery of the plating material 20, since the coating gas can be uniformly distributed on the surface of the waiting plating material 20, the coating gas can be uniformly attached to the waiting plating material 20 after dissociation, so that the coating yield can be effectively improved. Improve overall coating efficiency. Therefore, it can indeed achieve the purpose of this new type.
However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent.
<p>2. . . Coating device</p><p>20. . . To be plated</p><p>twenty one. . . case</p><p>211. . . Coating chamber</p><p>twenty two. . . Electrode unit</p><p>221. . . Electrode holder</p><p>222. . . Electrode plate</p><p>twenty three. . . Gas pipe</p><p>twenty four. . . Pumping unit</p><p>241. . . Pump</p><p>242. . . Exhaust plate</p><p>243. . . Vent</p><p>25. . . Dispersion plate</p><p>251. . . Split hole</p>
1 is a cross-sectional view showing a conventional coating apparatus; FIG. 2 is a perspective view showing a preferred embodiment of the coating apparatus of the present invention having a dispersion plate for dispersing a gas; and FIG. 3 is a partial perspective view showing the preferred embodiment. Examples of the dispersion plate and the exhaust plate; and FIG. 4 is a cross-sectional view showing the state of the preferred embodiment at the time of coating.
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| US8663441B2 | Cited by | United States of America | Applicant |
2 priority claims, no other members on record
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 96219962 | Taiwan Province of China | U | |
| TW20070219962U | – | – | – |
Numbers
- Publication
- M347405
- Publication, DOCDB
- M347405
- Publication, EPODOC
- TWM347405U
- Application
- 96219962
- Application, DOCDB
- 96219962
- Application, EPODOC
- TW20070219962U
Titles2
- English
- Plating film apparatus with gas dispersion plate
- Chinese
- ???????????????