Fastener of heat dissipation module

Fixing device for heat dissipation module

The present invention provides a fastener for a heat dissipation module, in particular, a buckle that can adjust the telescopic length and a fixed position of the cantilever to match the preset positioning portion of various electronic products, and has the advantages of simple assembly, quick assembly, and low use restriction. .

According to the rapid development of today's technology information, personal computers, electronic notebooks and notebook computers are widely used in various industries due to their powerful computing functions and speed. The advent of the Internet era has also led to the popularization of computers. The CPU (central processing unit) and the heat generating component and heat source which generate heat energy during operation, and the higher the speed, the higher the heat energy generated, so as to avoid burning the wafer due to high heat, the life of the wafer is shortened, so the heat is generated. The heat sink is provided on the source, so that the heat generated by the wafer is transmitted to the heat sink, and then the cold air generated by the fan is blown to the surface gap of the heat sink for heat dissipation; as disclosed in the announcement No. M280099 The new patent case was filed on July 26, 1994, in the new patent application, application number No. 94212637, and published in the patent gazette of November 1, 1994, please refer to the twelfth figure. The buckle A includes a pin body A1, a cap A2, a second flap A3, a bottom hook portion A4 and an elastic member A5. The bottom surface of the cap A2 is connected to the upper end of the pin body A1. The flap A3 is fixed to the outer edge of the cap A2, and the bottom hook portion A4 is connected to the lower end of the pin body A1. The elastic member A5 is sleeved on the pin body A1, and the upper end of the elastic member A5 is abutted against the same. The bottom surface of the cap A2, and the pin body A1 is passed through the first hole B1 of the heat sink B by the pin A1, and then locked into the second hole C1 of the circuit board C to lock the heat sink B to the electronic heating element. Above the C2, to achieve the function of auxiliary heat dissipation; however, when the buckle A is actually used, there are still many defects and inconveniences, such as: (1) the board C is different from the manufacturer, and the preset second slot C1 position It will also be different, so it must be assembled on the circuit board C with a specially matched heat sink B. If the hole of the first slot B1 cannot be symmetrically symmetrical, it cannot be used on this circuit board C, so that it can be used. More restrictions and quite inconvenient.

(2) A-type fasteners in two, respectively, through the first through-hole B1 sides of the radiator slot B, and then penetrates the second hole C1 to form a positioning groove, but if the two sides A clip is securely fastened Therefore, the central portion of the heat sink B is formed into a curved shape on the two sides, and cannot be flatly attached to the electronic heating element C2, and directly affects the heat dissipation effect; however, if the buckle A is slightly loosened, the heat sink B is easily caused by an external force. The effect is biased and tilted, and it cannot be completely flattened on the surface of the electronic heating element C2, which directly affects the heat dissipation effect.

(3) When the buckle A is used, the first hole slot B1 and the second hole slot C1 must be respectively disposed on the heat sink B and the circuit board C. Otherwise, the buckle A cannot fasten the heat sink B to the circuit board C. .

Therefore, how to solve the problem of using the fasteners of the conventional radiators is the direction that the relevant manufacturers engaged in this industry are eager to study and improve.

Therefore, in view of the above problems and deficiencies, the creators have collected relevant information, and through multi-party assessment and consideration, and through years of experience in the industry, through continuous trial and modification, the design of such adjustable buckles has been designed. The birth of the patent for the creation of the fixture for the thermal module of the location.

The main purpose of the present invention is that the buckle is fixed on the bottom of the heat dissipation module by using the substrate, and the bottom of the heat dissipation module is abutted on the heat source, and the two sides of the substrate are respectively provided with a cantilever that can be rotated and displaced. Adjusted by the cantilever rotation, for the fixed part of the movable side, for the positioning part preset on the electronic product, the heat dissipation module is stably fixed on the heat source, and the buckle can be adjusted to match various Presetting the positioning parts of different positions on the electronic product, the assembly is simple, fast, and the use restriction is small.

The secondary purpose of the creation is that the cantilever arm provided on the two sides of the buckle has a fixed hole on the movable side thereof, and a circular hole is provided for the card body to penetrate, and a positioning hole is formed through the preset hole on the circuit board to form a card. The positioning portion can also be provided with a buckle body at the fixing portion to buckle the buckle on the circuit board by the buckle body.

In order to achieve the above objectives and effects, the technical means and structure of the present invention are described in detail in the preferred embodiment of the present invention, and the features and functions are as follows.

Please refer to the first, second, third, fourth and fifth figures, which are the three-dimensional appearance drawing, the three-dimensional exploded view, the assembled three-dimensional exploded view, the side-viewing sectional view and the three-dimensional exploded view of the heat dissipation module. It can be clearly seen that the present invention is composed of a substrate 1, a plurality of cantilevers 2, and a heat dissipation module 3, wherein the substrate 1 has a through hole 11 at the center and is respectively disposed on both sides of the through hole 11. There is a screw hole 12, and a limiting shaft body 121 is protruded from each of the screw holes 12, and each of the screw holes 12 is locked by a screw 122 through which the disk-shaped elastic piece 123 can be inserted.

The plurality of cantilevers 2 are provided with a shaft hole 21 on one side, and the other side away from the shaft hole 21 is a fixed portion 22 bent into a shoulder shape, and a circular hole 221 is provided in the fixing portion 22, that is, a circular hole 221 is used. The retaining body 23 is inserted into the top of the retaining body 23, and the retaining cap body 231 has a diameter larger than the diameter of the circular hole 221, and a buckle is extended under the stopping cap 231. The rod 232 is held, and the outer edge of the holding rod 232 is provided with an elastic portion 233 which is hollowed out.

The heat dissipation module 3 is provided with a heat dissipation block 31, and the heat dissipation block 31 is provided with a positioning screw hole 311. The screw hole 311 is locked for the lock solid 3111, and the heat dissipation block 31 is fixed with a plurality of heat pipes 312 extending upward. And a locking screw 313 is respectively disposed on the top of each heat pipe 312, and each heat pipe 312 penetrates into each of the insertion holes 321 of the heat sink group 32, and then is locked to the top of each heat pipe 312 by using a plurality of nuts 322 respectively. The locking screw 313 locks the heat sink group 32 on the heat sink block 31, and the heat sink block 31 is provided with a through hole 323 on the heat sink block 32 with respect to the position of the positioning screw hole 311 of the heat sink block 31.

When the components are assembled, the screw holes 12 of the substrate 1 on the two sides of the through hole 11 are respectively aligned with the shaft holes 21 of the cantilever 2, and the shaft holes 21 are locked in the limiting shaft body 121 for the cantilever 2 can be rotated on the limiting shaft body 121, and then the screw 122 is passed through the disc-shaped elastic piece 123 and the shaft hole 21, and then locked into the screw hole 12, and pressed against the cantilever 2 by the disk-shaped elastic piece 123, so that the cantilever 2 can be The substrate 1 and the second cantilever 2 are placed on the heat dissipation block 31 of the heat dissipation module 3, and the through hole 11 of the substrate 1 is positioned on the positioning screw hole 311 of the heat dissipation block 31. After the heat pipes 312 of the heat dissipating block 31 are respectively inserted into the respective insertion holes 321 of the heat sink group 32, the locking solids 3111 can be inserted into the through holes 323 of the heat sink group 32 and pass through the through holes 11 of the substrate 1. The positioning screw hole 311 of the base is locked, that is, the assembly cost creates a fastener for the heat dissipation module.

Referring to the sixth, seventh and eighth figures, it is a top view of the cantilever contraction mode, a top view of the cantilever extension mode, and a three-dimensional appearance of the preferred embodiment. It can be clearly seen from the figure that the creation is to utilize heat dissipation. The block 31 abuts against the heat source 41 of the electronic product 4, and then rotates the cantilever 2 on both sides of the substrate 1 to be adjusted to the positioning portion 42 of the electronic product 4 with the fixing portion 22, and the circular hole 221 of the fixing portion 22 The pair of positioning holes 421 located in the positioning portion 42 and passing through the circular hole 221 of the cantilever 2 through the holding body 23, and then passing through the positioning hole 421, and pressing the stopper body 231 with the holding body 23 The fixing portion 22 of the cantilever 2, and the fastening rod 232 and the elastic portion 233 of the holding body 23 pass through the positioning hole 421, and are retained at the bottom of the positioning hole 421 to fix the heat dissipation module 3 to the heat source 41. The heat dissipation module 3 can be used to assist the heat source 41 to dissipate heat.

The electronic product 4 described above is different in the manufacturer of the different brands. Therefore, the positioning portion 42 of the heat source (CPU, wafer, etc.) 41 is different, but the cantilever provided on the two sides of the substrate 1 of the fastener 2, because the adjustable, rotating, and the cantilever 2 generates a downward resisting force, the fixing portion 22 of the second cantilever 2 can be adjusted to be located at the positioning portion 42 of the electronic product, and can be free from the position of the positioning portion 42. The effect is that the use of the buckle is not limited and can be applied to electronic products of different brands.

The substrate 1 is fixed to the positioning portion 42 of the electronic product 4 by the cantilever 2 on both sides, and the second cantilever 2 is pressed against the substrate 1 to press the substrate 1 against the heat dissipation block of the heat dissipation module 3. At 31, the heat dissipating block 31 can be completely attached to the heat generating source 41 without being tilted or loosened.

Please refer to the ninth, tenth, and eleventh drawings, which is a perspective external view of another embodiment of the present invention, a stereoscopic appearance view of another embodiment substrate and a cantilever, and a partial enlarged view of another embodiment. It can be clearly seen that the substrate 1 of the present invention is provided on the two sides of the cantilever 2, and the fixed portion 22 of the cantilever 2 on the movable side can be provided with the embedded body 222, and the heat source 41 of the electronic product 4 is opposite to the embedded body 222. The positioning portion 42 of the periphery is provided with a plurality of buckles 422, so that the heat dissipation block 31 of the heat dissipation module 3 can be pressed against the heat source 41 by the substrate 1, and the two sides of the cantilever 2 are respectively inserted into the body 222. The buckles 422 of the positioning portion 42 are fastened to the heat source 41, and the holes of the electronic product 4 are not required to be disposed, which can reduce the trouble of processing; and the two sides of the substrate 1 The cantilever 2 is fastened to the buckle 422 by the buckle body 222, so that the cantilever 2 forms a downward abutting force on both sides of the substrate 1, and the substrate 1 is pressed against the substrate 1 to completely abut against the heat source 41.

Therefore, the above description is only a preferred embodiment of the present invention, and thus the limitation of the patent scope of the present invention is not limited. The fastener of the heat dissipation module of the present invention is provided with a cantilever 2 on both sides of the substrate 1 and the substrate is provided. 1 is fixed on the heat dissipating block 31 of the heat dissipating module 3, and a plurality of heat pipes 312 and a heat sink group 32 are connected to the heat dissipating block 31, so that the heat dissipating block 31 can be adhered to the heat source 41 of the electronic product 4 by using the substrate 1. Then, the fixing portion 22 of the two side cantilever 2 is positioned at the positioning portion 42 around the heat source 41 to achieve the purpose of quickly mounting the heat dissipation module 3 on the heat source 41, and using the cantilever provided on both sides of the substrate 1. 2 can be rotated and adjusted, and can smoothly rotate the cantilever 2 pair to be located in the positioning portion 42, so that the heat dissipation module 3 can be used with less restrictions, and the assembly is simple and fast, so the structure and device that can achieve the aforementioned effects should be Subject to the scope of this creation, such simple modifications and equivalent structural changes shall be included in the scope of the patent of this creation and shall be combined with Chen Ming.

The fastener of the above-mentioned heat dissipation module can have the following advantages in practical use, such as: (1) The electronic product 4 is manufactured by different manufacturers, and the position of the positioning portion 42 around the heat source 41 is also different. However, the movable cantilever 2 of the two sides of the substrate 1 can be adjusted to rotate, so that the cantilever 2 can be adjusted to the positioning portion 42 and the buckle for the substrate 1, the cantilever 2 and the heat dissipation module 3 can be used less. Easy and fast assembly.

(2) The substrate 1 is provided with adjustable cantilevered arms 2 on both sides, and the second cantilever 2 is fixed on the electronic product 4, so that the two side arms 2 generate an average downward pressure on the substrate 1 to make the substrate 1 completely resists the heat dissipation block 31 of the heat dissipation module 3, and the heat dissipation block 31 is flatly attached to the heat source 41 to achieve a good heat dissipation function.

(3) The positioning portion 42 of the electronic product 4 disposed around the heat source 41 can be a positioning hole 421 or a buckle 422, and the positioning portion 42 can be corresponding to the fixing portion 22 of the second cantilever 2, and a circular hole 221 and a card are provided. The holding body 23 and the inset body 222 form a downward pressing force by the two cantilever arms 2, so that the heat dissipating block 31 of the heat dissipating module 3 can be completely abutted against the heat source, and will not loose or lift up, and can assist the heat source. 41 fast heat dissipation.

Therefore, the present invention is mainly used for the fastener of the heat dissipation module, and the cantilever is respectively disposed on the two sides of the substrate, and the cantilever can be used to fix the heat dissipation module on the heat source of the electronic product, so that the cantilever can be adjusted and rotated by using the two sides of the substrate. The positioning part located on the electronic product can be quickly fixed to the heat source by the heat dissipation module as the main protection focus, and only the heat dissipation module uses the substrate and the cantilever to resist, and the bottom of the heat dissipation module is completely abutted. In the case of a heat source, it is advantageous to assist the heat source to rapidly dissipate heat. However, the above description is only a preferred embodiment of the present invention, and thus does not limit the scope of the patent of the creation, so the use of the present specification and the contents of the schema is The simple modification and equivalent structural changes shall be included in the scope of the patent of this creation and shall be combined with Chen Ming.

In summary, the fasteners of the above-mentioned heat-dissipating modules are used to achieve their efficacy and purpose. Therefore, the creation is a practical and excellent creation, which is in accordance with the requirements of the new patent application. To apply, I hope that the trial committee will grant this case as soon as possible to protect the creators' hard work. If there is any doubt in the ruling committee, please do not hesitate to give instructions. The creators will try their best to cooperate and feel good.

<p>1. . . Substrate</p><p>11. . . Through hole</p><p>12. . . Screw hole</p><p>121. . . Limit shaft</p><p>122. . . Screw</p><p>123. . . Disc shrapnel</p><p>2. . . cantilever</p><p>twenty one. . . Shaft hole</p><p>twenty two. . . Fixed part</p><p>221. . . Round hole</p><p>222. . . Buckle body</p><p>twenty three. . . Card body</p><p>231. . . Stop cap</p><p>232. . . Buckle rod</p><p>233. . . Elastic part</p><p>3. . . Thermal module</p><p>31. . . Heat sink</p><p>311. . . Positioning screw hole</p><p>3111. . . Lock solid</p><p>312. . . Heat pipe</p><p>313. . . Locking screw</p><p>32. . . Heat sink set</p><p>321. . . Jack</p><p>322. . . Nut</p><p>323. . . perforation</p><p>4. . . electronic product</p><p>41. . . Heat source</p><p>42. . . Positioning department</p><p>421. . . Positioning hole</p><p>422. . . Buckle</p><p>A. . . Buckle</p><p>A1. . . Pin body</p><p>A2. . . Cap</p><p>A3. . . Fold</p><p>A4. . . Bottom hook</p><p>A5. . . Elastic component</p><p>B. . . heat sink</p><p>B1. . . First slot</p><p>C. . . Circuit board</p><p>C1. . . Second slot</p><p>C2. . . Heating element</p>

The first picture is a three-dimensional appearance of the creation.

The second picture is a three-dimensional exploded view of the creation.

The third picture is an exploded view of the assembly method of the creation.

The fourth figure is a side cross-sectional view of the creation.

The fifth picture is a three-dimensional exploded view of the heat dissipation module of the creation.

The sixth picture is a top view of the cantilever contraction mode of the creation.

The seventh picture is a top view of the cantilever extension of the creation.

The eighth drawing is a perspective view of the preferred embodiment of the present invention.

The ninth drawing is a perspective view of another embodiment of the present creation.

The tenth figure is a perspective view of the substrate and the cantilever of another embodiment of the present invention.

The eleventh figure is a partial enlarged view of another embodiment of the present creation.

The twelfth figure is a three-dimensional appearance of a conventional heat sink clip.