Backlight module and display device

Backlight module and display

The present invention relates to a backlight module and a display, and more particularly to a backlight module and a display having a light emitting diode.

In recent years, due to the improved luminous efficiency of Light Emitting Diodes (LEDs), LEDs have gradually replaced fluorescent lamps and incandescent bulbs in certain product applications, becoming a commonly used light source, such as LEDs as liquid crystal displays. The backlight of the device. LEDs are components that are highly heated and very sensitive to temperature. Therefore, if too much heat is accumulated in the backlight module, the temperature of the LEDs rises, resulting in a decrease in luminous efficiency or uneven illumination. Therefore, how to design the heat dissipation structure of the backlight module is an extremely important problem in practice.

Referring to FIG. 1 , a conventional LED liquid crystal display device 10 includes a front frame 11 , an LED unit 12 , a diffusion plate 13 , a reflective sheet 14 , an optical material layer 15 , a back plate 18 , and a liquid crystal panel 17 . The LED unit 12 is disposed above the backplane 18 and includes a substrate 122 and an LED 121 carried on the substrate 122. The substrate 122 is a Metal Core Printed Circuit Board (MCPCB). A reflective sheet 14 is attached between the inner walls of the two sides of the back plate 18 and the adjacent LEDs 121; the diffusing plate 13 is disposed above the LED unit 12, and the optical material layer 15 is disposed above the diffusing plate 13 and disposed above the front frame 11. A liquid crystal panel 17 is used to constitute the liquid crystal display device 10.

The heat dissipation mechanism of the liquid crystal display device 10 is such that when the LED 121 is turned on, the generated heat is first transmitted to the substrate 122, then transmitted from the substrate 122 to the back plate 18, and finally transmitted through a heat dissipation mechanism such as a fan or heat dissipation disposed on the back plate 18. A heat sink or the like (not shown) heats the heat out of the device. Since the heat transfer path is too long, the contact surface of the heat conduction is excessive, the effect of heat conduction is not good, and the heat conduction of the contact surfaces of the substrate 122 and the back plate 18 is not good, so even if the heat conductive sheet is attached, the heat cannot be quickly discharged, resulting in heat. The heat is accumulated and the temperature distribution is uneven, which causes the luminous efficiency of each of the LEDs 121 to be different, and affects the display quality of the liquid crystal display device 10. Moreover, the reflection sheet 14 is only partially attached to the substrate 122, and the remaining portion is suspended. Therefore, the reflection sheet 14 is easily affected by heat and is easily deformed.

2 is a heat dissipation structure diagram of another conventional LED liquid crystal display device. Unlike the liquid crystal display device 10, the LED 121 is mounted on the substrate 122. The substrate 122 has a fixing base 24 below the substrate 122, and a back plate 18 is disposed on the fixing base 24. Below, a heat pipe 22 is mounted in the mount 24. The heat dissipation fins 28 and the fan 26 are connected below the back plate 18. Referring to FIG. 3, the arrow indicates the heat dissipation direction. The heat generated after the LED 121 is turned on is first transmitted to the substrate 122, and then transferred from the substrate 122 to the fixed base 24, and the heat pipe 22 in the fixed seat 24 is used as the heat balance. The medium (not directly acting as a heat transfer medium) is quickly transferred to the backing plate 18 after being thermally balanced, and then transmitted to the heat dissipating fins 28 by the backing plate 18, and the wind blown by the fan 26 can discharge the heat on the heat dissipating fins 28. . The heat pipe 22 continuously transfers heat from the middle to the left and right sides, and the heat radiating fins 28 continuously transmit heat to form a heat dissipation cycle. However, because the heat-absorbing portion of the heat pipe is not directly in contact with the heat source, the heat-absorbing effect of the heat pipe is reduced, and the heat-dissipating portion of the heat pipe is not directly in contact with the heat-dissipating fin, thereby causing the heat-dissipating performance of the heat pipe to be lowered. Moreover, since the heat transfer path is too long, the contact surface of heat conduction is excessive, and the effect of heat conduction is also poor.

One of the purposes of this creation is to provide a backlight module and display to solve the conventional problems.

To achieve the above objective, the backlight module comprises a substrate, a light-emitting component, a heat pipe, a heat dissipating component and a backboard. The substrate has opposite first and second faces, the light emitting device is electrically connected to the first surface of the substrate, and the heat pipe is connected to the second surface of the substrate; the heat dissipating component is connected to the heat pipe and includes a heat transfer component, a heat sink fin and a fan The back plate has an opening, and the light-emitting element is exposed in the back plate through the opening, a connecting portion is extended on both sides of the substrate, and the connecting portion is fixed to the back plate by using the connecting member. In addition, the present invention proposes a display.

The following is a description of the preferred embodiment of the present invention in order to achieve the above object, and the following description is shown in conjunction with the drawings: Referring to FIG. 4, the backlight module of the present embodiment includes a backplane. 110. A light emitting device 120, a substrate 130, a heat pipe 140, a heat dissipating component 150, a reflective sheet 160, and a diffusion plate 170. A liquid crystal panel 180 is disposed above the diffusion plate 170 of the backlight module to form a display.

The light emitting device 120 is disposed on the substrate 130. The substrate 130 has a first surface 1301 and a second surface 1302. The light emitting device 120 is mounted on the substrate 130 and electrically connected to the first surface 1301 of the substrate 130. The heat pipe 140 directly faces the substrate. The second surface 1302 of the 130 is connected; wherein, the light emitting element 120 is, for example, a light emitting diode, an organic light emitting diode or other suitable light emitting element; and the substrate 130 is, for example, a metal core printed circuit board (MCPCB).

The back plate 110 has an opening 1101. The light emitting element 120 is exposed in the back plate 110 through the opening 1101. Both sides of the substrate 130 can be bent to extend a connecting portion 132, and the connecting portion 132 is fixed to the back by the connecting member 131. On the plate 110, the connecting member 131 is, for example, a screw. Bending the substrate 130 can strengthen the structural strength and effectively strengthen the overall structural strength of the backlight module.

The inner surface of the back plate 110 is attached with a reflection sheet 160, and a diffusion plate 170 is disposed at an appropriate distance above the light-emitting element 120. The light emitted by the light-emitting element 120 can be directly emitted upward to the diffusion plate 170, or reflected by the reflection sheet 160. The light diffusing plate 170 can make the light distribution more uniform, and an optical material layer (not shown) such as a crepe sheet, a brightness enhancing film or the like can be added to the diffusing plate 170.

The heat dissipating component 150 is located below the heat pipe 140 and is connected to the heat pipe 140 and the second surface 1302 of the substrate 130. The heat pipe 140 is directly soldered on the substrate 130. The heat pipe 140 is, for example, a flat heat pipe, a groove heat pipe, a powder sintered heat pipe, a fiber heat pipe, or a grid heat pipe, etc., so as to increase the transmission. The hot area increases the efficiency of heat transfer and reduces the thickness of the backing plate, which helps to improve the heat transfer of the backing plate 110. The heat dissipating component 150 is soldered to the heat pipe 140 and the substrate 130 by the electroless nickel treatment, so that it is not necessary to use a heat conductive medium (which is a high-priced product), and the heat-conducting block is not required, thereby reducing the overall thickness of the backlight module. The backlight module is thinner and lighter, and at the same time reduces thermal impedance, weight and cost. If the light-emitting element 120 or the substrate 130 is damaged, the light-emitting element 120 and the substrate 130 can be repaired by simply removing the connecting element 131, so that the creation can improve the convenience of maintenance. The conventional reflection sheet is suspended and attached to the substrate, so that the reflection sheet is easily deformed by the heat. The reflective sheet 160 of the present invention is flatly attached to the inner surface of the back sheet 110, and is not suspended, so that the reflection sheet is not easily deformed.

In addition, referring to FIG. 5, the connecting portion 132 of the substrate 130 can also be formed by bending the back plate 110, and the back plate 110 is bent out of the connecting portion 112 at the opening 1101 of the back plate 110, and the connecting member 131 is used. The connecting portion 112 is coupled to the substrate 130. Therefore, the substrate 130 can be prevented from being damaged by the improper processing during the bending process.

In addition, referring to FIG. 6 , the substrate 130 can be bent out of the connecting portion 132 , and the back plate 110 is bent out of the connecting portion 112 at the opening 1101 , and the connecting portion 132 and the connecting portion 112 are connected by the connecting member 131 . Connected together to secure the substrate 130 to the backing plate 110.

After the heat generated by the light-emitting element 120 is transmitted to the substrate 130, there are two ways of dissipating heat; the first way is that the substrate 130 transfers heat to the heat pipe 140 to quickly reach thermal equilibrium, and then the heat is transferred from the heat pipe 140 to the heat-dissipating component 150, and then through Natural convection discharges heat from the heat dissipating component 150. The second way is that heat is transferred from the substrate 130 to the backplane 110, and the backplane 110 is used as a heat dissipating medium.

In addition, referring to FIG. 7 , the heat dissipating component 150 further includes a heat transfer component 151 , a heat dissipation fin 152 , and a fan 153 . The heat pipe 140 is embedded in the heat transfer element 151, and the heat transfer element 151 is, for example, a bottom plate. The heat dissipation fins 152 are disposed under the heat transfer element 151 , and the heat dissipation fins 152 are in contact with the heat transfer element 151 , and the fan 153 is disposed under the heat dissipation fins 152 such that the heat dissipation fins 152 are located between the heat transfer element 15 and the fan 153 . The fan 153 is in contact with the heat dissipation fins 152. After the heat generated by the light-emitting element 120 is transmitted to the substrate 130, there are two ways of dissipating heat; the first way is that the substrate 130 transfers heat to the heat transfer element 151, and the heat pipe 140 in the heat transfer element 151 quickly reaches the heat balance, and then Heat is transferred to the heat dissipation fins 152 by the heat pipe 140, and the heat is discharged by the fan 153. The second way is that heat is transferred from the substrate 130 to the backplane 110, and the backplane 110 is used as a heat dissipating medium.

Referring to FIG. 8 , the heat dissipation fins 152 may be extended to be in contact with the back plate 110 , so that the heat generated by the light emitting element 120 is transmitted to the substrate 130 , and the heat is transmitted from the substrate 130 to the back plate 113 , and the heat is further transmitted from the back plate 113 . Passing to the heat dissipation fins 152, through the natural convection of the heat dissipation fins 152 or the forced convection of the fan 153, the heat can be effectively dissipated.

Referring to FIG. 9 , the heat pipe 140 can also be extended into the heat dissipation fins 152 to accelerate the heat transfer speed of the heat pipe 140 to improve the heat dissipation efficiency of the backlight module. Referring to FIG. 10, a portion of the heat pipe 140 extending to the heat dissipation fins 152 may be bent, such as bending the heat pipe 140 downward into a heat pipe 1401; or bending the heat pipe 140 upward into a heat pipe 1402; After the bending, an angle R of an arbitrary angle with the vertical line is formed, such as the heat pipe 1403. Referring to FIG. 11, the heat pipe 140 is also used by the plurality of heat pipes 1404. The heat pipe is spliced in three ways. The first type is to heat the pipe 140, such as bending into a heat pipe 1405, and then lapping. The plurality of heat pipes 1405 are used, or the heat pipe 140 is flattened into a heat pipe 1406, and then the plurality of heat pipes 1406 are lapped; the second type is coated with a high heat transfer material to cover the contact ends of the two heat pipes 1407, and the heat transfer is high. Materials such as metal materials, copper blocks, thermal pads, etc.; the third is to directly bond two heat pipes 1408 together with a heat transferable adhesive.

In summary, the advantages of the present invention are as follows: 1. Only the substrate 130 is spaced between the heat pipe 140 and the light-emitting element 120, which can reduce the heat transfer contact surface and improve the heat dissipation efficiency.

2. This creation has two ways of heat pipe heat transfer and back plate heat dissipation, which can enhance the heat dissipation effect and reduce the accumulation of heat energy.

3. Using the geometric design of the heat sink fins and the heat pipe can improve the overall heat dissipation efficiency of the backlight module.

4. This creation uses the heat pipe as a heat transfer medium, which can quickly transfer heat and reach a state of thermal equilibrium by the high conductivity of the heat pipe.

The above description is only for the convenience of explaining the preferred embodiments of the present invention, and the scope of the present invention is not limited to the preferred embodiments, and any changes made in accordance with the present creation are not deviated from the spirit of the present creation. It belongs to the scope of patent application for this creation.

<p>10. . . LED liquid crystal display device</p><p>11. . . Front frame</p><p>12. . . LED unit</p><p>13. . . Diffuser</p><p>14. . . A reflective sheet</p><p>15. . . Optical material layer</p><p>18. . . Backplane</p><p>17. . . LCD panel</p><p>121. . . led</p><p>122. . . Substrate</p><p>twenty four. . . Fixed seat</p><p>twenty two. . . Heat pipe</p><p>110. . . Backplane</p><p>120. . . Light-emitting element</p><p>130. . . Substrate</p><p>140. . . Heat pipe</p><p>150. . . Heat sink</p><p>160. . . A reflective sheet</p><p>170. . . Diffuser</p><p>180. . . LCD panel</p><p>1101. . . Opening</p><p>131. . . Connecting element</p><p>132. . . Connection</p><p>1301. . . First side</p><p>1302. . . Second side</p><p>112. . . Connection</p><p>151. . . Heat transfer element</p><p>152. . . Heat sink fin</p><p>153. . . fan</p>

Figure 1 is a side view of a conventional LED liquid crystal display device; Figure 2 is a side view of another LED liquid crystal display device; Figure 3 is a front view of Figure 2; Figure 4 is a side view of an embodiment of the present display; Figure 5 is a side view of another structure of the present back sheet; Figure 6 is a side view of another structure of the present back sheet; Figure 7 is the side of the display with heat transfer elements, heat sink fins and fan heat sink elements Figure 8 is a side view of another structure of the heat sink fin; Fig. 9 is a side view of another structure of the heat pipe; Fig. 10 is a side view of the structure of the heat pipe with bending treatment; This creation has a side view of the structure of the heat pipe that is lapped.