Light-emitting diode lamp having active heat transferring and temperature lowering function
Abstract
An active cooling semiconductor lighting fixture includes a heat dissipation cover, an active heat transfer and temperature reduction device, and a light emitting diode module; the active heat transfer and temperature reduction device is disposed in the heat dissipation cover and includes a heat dissipation cover An evaporator, a condenser, a compressor, an expansion valve and a cryopanel, wherein the cryopanel is disposed on the evaporator, the condenser is disposed on the heat dissipation cover, the compressor, the condenser, the expansion valve, and the evaporation The devices are connected to each other to form a closed circuit, and a refrigerant is disposed in the circuit; the light emitting diode module is in contact with the cryopanel and includes at least one light emitting diode; and the low temperature refrigerant is used to absorb and cool the light emitting diode It can reduce the temperature of the light-emitting diode, prolong the life of the light-emitting diode and improve the brightness of the light-emitting diode.

Term
No projected expiry on record.
- Priority and filed
- Granted
- Today
14 claims: 14 independent, 0 dependent
- 1A light-emitting diode lamp with active heat transfer and cooling functions includes:a heat dissipation cover;an active heat transfer device, which is arranged in the heat dissipation cover, and includes an evaporator, a condenser, and a compression device. A compressor, an expansion valve and a low temperature plate, wherein the low temperature plate is arranged on the evaporator, the condenser is arranged on the heat dissipation cover, the compressor, the condenser, the expansion valve and the evaporator are connected to each other, and the connection sequence is compression The compressor is connected to the condenser, the condenser is connected to the expansion valve, the expansion valve is connected to the evaporator, and the evaporator is connected to the compressor to form a closed circuit. A refrigerant is arranged in the circuit. The compressor can compress the gaseous refrigerant, and the expansion valve can expand the refrigerant;The diode module is arranged on the active heat transfer and cooling device to be in contact with the low-temperature plate, and includes at least one light-emitting diode. M286464 九、申請專利範圍: 1 · 一種且主說JU /、王動式移熱與降溫功能的發光二極體燈 兴,彳糸包含有: 一散熱外罩; 主動式移熱裝置’係設置在散熱外軍内,且包含有 一蒸發器、一;^ g % ^ 定态、一壓縮機、一膨脹閥及一低溫板, 其中4低溫板係設置在該蒸發器i,該冷凝H係設置在散 熱外罩上’壓縮機、冷凝器、膨脹閥及蒸發器相互連接, 連接順序為壓縮機接合冷凝器、冷凝器接合膨脹閥、膨脹 閥接口蒸發器、蒸發器接合壓縮機,構成一封閉迴路,迴 路内没置有一冷媒,壓縮機可壓縮氣態冷媒,膨脹閥可膨 脹冷媒;及 一發光二極體模組,係設置在該主動式移熱與降溫裝 置上而與低溫板接觸,且包含有至少一個發光二極體。 2 ·如申晴專利範圍第1項所述具主動式移熱與降溫 功能的發光二極體燈具,其中冷凝器係環繞設置在散熱外 罩上。 3 ·如申請專利範圍第2項所述具主動式移熱與降溫 功能的發光二極體燈具,其中低溫板係由二板體相固設組 成’其中一板體一為導熱板體,另一板體為一保溫板體, 該蒸發器係夾設於兩板體之間。 4 ·如申請專利範圍第3項所述具主動式移熱與降溢 功能的發光二極體燈具,其中發光二極體模組係包含有一 基座,在基座與低溫板接觸的一面上形成有一内容室,在 M286464 基座上形成有數個與内容室相連通且貫穿基座的穿孔,且 在穿孔内壁上設有一高反射物質,在内容室内設置有一電 路板,該等發光二極體係設置在該電路板上而伸入相對應 的穿孔。 5 ·如申請專利範圍第4項所述具主動式移熱與降溫 功此的發光二極體燈具,其中各穿孔剖面係成一梯形,梯 形較闊的一端係背對低溫板。 6 ·如申請專利範圍第5項所述具主動式移熱與降溫 功此的發光二極體燈具,其中基座背對低溫板的一面上形 成有一與穿孔相連通的氣體容室,於氣體容室内填充有一 低露點氣體,於基座上設置有一密封覆蓋氣體容室的外透 明板。 7 ·如申請專利範圍第6項所述具主動式移熱與降溫 功能的發光二極體燈具,其中基座上形成有至少一熱氣旁 通官,用以加熱透明板,避免低溫時結霜或凝露於透明板 _ 的表面上,阻擋光線射出。 8 ·如申凊專利範圍第7項所述具主動式移熱與降溫 功能的發光二極體燈具,其中基座係由一設置在低溫板上 的隔熱板、一設置在隔熱板上的内基座及一設置在内基座 上的外基座相固設組成。 9 ·如申請專利範圍第8項所述具主動式移熱與降溫 功能的發光二極體燈具,其中基座的氣體容室底部設置有 一介於内基座及外基座之間的内透明板,該内透明板係覆 盍基座穿孔及發光二極體。 15 M286464 ^ : 〇如申凊專利範圍第9項所述具主動式移熱與降 皿力月b的發光一極體燈具,丨中低露點氣體係介於内透明 ”卜透月板之間’低露點氣體可避免低溫時結霜或凝露 於透明板的表面上,以致於阻擋光線射出。 11·如申請專利範圍第1〇項所述具主動式移熱與 降酿功旎的發光二極體燈具,其中低露點氣體係為氮氣。 12·如申請專利範圍第11項所述具主動式移熱與 降恤功忐的發光二極體燈具,其中透明板係以玻璃製造。 1 3 ·如申請專利範圍第1 1項所述具主動式移熱與 降恤功旎的發光二極體燈具,其中透明板係以塑膠製造。 1 4 ·如申請專利範圍第1到1 3項中任一項所述具 主動式移熱與降溫功能的發光二極體燈具,其中散熱外罩 係以金屬製造。 十、囷式·· 如次頁 16 一種具主動式移熱與降溫功能的發光二極體燈具,係包含有:一散熱外罩;一主動式移熱裝置,係設置在散熱外罩內,且包含有一蒸發器、一冷凝器、一壓縮機、一膨脹閥及一低溫板,其中該低溫板係設置在該蒸發器上,該冷凝器係設置在散熱外罩上,壓縮機、冷凝器、膨脹閥及蒸發器相互連接,連接順序為壓縮機接合冷凝器、冷凝器接合膨脹閥、膨脹閥接合蒸發器、蒸發器接合壓縮機,構成一封閉迴路,迴路內設置有一冷媒,壓縮機可壓縮氣態冷媒,膨脹閥可膨脹冷媒;及一發光二極體模組,係設置在該主動式移熱與降溫裝置上而與低溫板接觸,且包含有至少一個發光二極體。
- 2As described in item 1 of the scope of patent application, the light-emitting diode lamp with the function of active heat transfer and temperature reduction, wherein the condenser is arranged on the heat-dissipating enclosure around. 如申請專利範圍第1項所述具主動式移熱與降溫功能的發光二極體燈具,其中冷凝器係環繞設置在散熱外罩上。
- 3The light-emitting diode lamp with active heat transfer and temperature reduction function as described in item 2 of the scope of the patent application, wherein the low-temperature plate is composed of two plate phases, one of which is a heat-conducting plate and the other plate The body is a thermal insulation plate body, and the evaporator is sandwiched between two plate bodies. 如申請專利範圍第2項所述具主動式移熱與降溫功能的發光二極體燈具,其中低溫板係由二板體相固設組成,其中一板體一為導熱板體,另一板體為一保溫板體,該蒸發器係夾設於兩板體之間。
- 4The light-emitting diode lamp with active heat transfer and cooling function as described in item 3 of the scope of patent application, wherein the light-emitting diode module system includes a base, and a content is formed on the side of the base that is in contact with the low-temperature board. In the chamber, a plurality of perforations communicating with the content chamber and penetrating the base are formed on the base, and a highly reflective substance is provided on the inner wall of the perforation. A circuit board is disposed in the content chamber, and the light-emitting diode systems are disposed in the chamber. The corresponding perforations are extended into the circuit board. 如申請專利範圍第3項所述具主動式移熱與降溫功能的發光二極體燈具,其中發光二極體模組係包含有一基座,在基座與低溫板接觸的一面上形成有一內容室,在基座上形成有數個與內容室相連通且貫穿基座的穿孔,且在穿孔內壁上設有一高反射物質,在內容室內設置有一電路板,該等發光二極體係設置在該電路板上而伸入相對應的穿孔。
- 5As described in item 4 of the scope of the patent application, the light-emitting diode lamp with active heat transfer and cooling functions, wherein each of the perforated sections is trapezoidal, and the wider end of the trapezoid is facing away from the cryogenic plate. 如申請專利範圍第4項所述具主動式移熱與降溫功能的發光二極體燈具,其中各穿孔剖面係成一梯形,梯形較闊的一端係背對低溫板。
- 6As described in item 5 of the scope of the patent application, the light-emitting diode lamp with active heat transfer and cooling functions, wherein a gas chamber connected to the perforation is formed on the side of the base facing away from the low-temperature board, and the gas chamber is filled. There is a low dew point gas, and an outer transparent plate sealedly covering the gas container is arranged on the base. 如申請專利範圍第5項所述具主動式移熱與降溫功能的發光二極體燈具,其中基座背對低溫板的一面上形成有一與穿孔相連通的氣體容室,於氣體容室內填充有一低露點氣體,於基座上設置有一密封覆蓋氣體容室的外透明板。
- 7As described in item 6 of the scope of the patent application, a light-emitting diode lamp with active heat transfer and cooling functions, wherein at least one hot gas bypass tube is formed on the base to heat the transparent plate to avoid frost or condensation at low temperatures. Exposed on the surface of the transparent plate, blocking light from exiting. 如申請專利範圍第6項所述具主動式移熱與降溫功能的發光二極體燈具,其中基座上形成有至少一熱氣旁通管,用以加熱透明板,避免低溫時結霜或凝露於透明板的表面上,阻擋光線射出。
- 8The light-emitting diode lamp with active heat transfer and cooling function as described in item 7 of the scope of the patent application, wherein the base is composed of a heat-insulating plate provided on a low-temperature plate and an inner base provided on the heat-insulating plate. The base and an outer base arranged on the inner base are fixedly composed. 如申請專利範圍第7項所述具主動式移熱與降溫功能的發光二極體燈具,其中基座係由一設置在低溫板上的隔熱板、一設置在隔熱板上的內基座及一設置在內基座上的外基座相固設組成。
- 9As described in item 8 of the scope of the patent application, a light-emitting diode lamp with active heat transfer and cooling functions, wherein the bottom of the gas chamber of the base is provided with an inner transparent plate between the inner base and the outer base, The inner transparent plate covers the perforation of the base and the light emitting diode. 如申請專利範圍第8項所述具主動式移熱與降溫功能的發光二極體燈具,其中基座的氣體容室底部設置有一介於內基座及外基座之間的內透明板,該內透明板係覆蓋基座穿孔及發光二極體。
- 10As described in item 9 of the scope of the patent application, a light-emitting diode lamp with active heat transfer and cooling functions, wherein the low dew point gas system is between the inner transparent plate and the outer transparent plate, and the low dew point gas can prevent frost at low temperatures Or condensed on the surface of the transparent plate, so as to block the light from coming out. 如申請專利範圍第9項所述具主動式移熱與降溫功能的發光二極體燈具,其中低露點氣體係介於內透明板與外透明板之間,低露點氣體可避免低溫時結霜或凝露於透明板的表面上,以致於阻擋光線射出。
- 11As described in item 10 of the scope of the patent application, the light-emitting diode lamp with active heat transfer and cooling functions, wherein the low dew point gas system is nitrogen. 如申請專利範圍第10項所述具主動式移熱與降溫功能的發光二極體燈具,其中低露點氣體係為氮氣。
- 12The light-emitting diode lamp with active heat transfer and cooling function as described in item 11 of the scope of patent application, wherein the transparent plate is made of glass. 如申請專利範圍第11項所述具主動式移熱與降溫功能的發光二極體燈具,其中透明板係以玻璃製造。
- 13As described in item 11 of the scope of patent application, the light emitting diode lamp with active heat transfer and cooling functions, wherein the transparent plate is made of plastic. 如申請專利範圍第11項所述具主動式移熱與降溫功能的發光二極體燈具,其中透明板係以塑膠製造。
Independent claims14
50 paragraphs, as filed
Light emitting diode lamp with active heat transfer and cooling function
This creative system belongs to a light-emitting diode device, especially a method that uses low-temperature refrigerant in a compression cycle to absorb and cool the light-emitting diode.
Light Emitting Diodes (LEDs) have the effect of saving power and energy, and they are rapidly gaining popularity recently. They are often used in electronic equipment such as traffic lights, electronic signs, flashlights, table lamps, and projection lamps. However, the light emitting diode generates high heat during operation. If the light emitting diode is not equipped with a proper heat dissipation design, the life of the light emitting diode will be greatly shortened or even burned due to high temperature during operation.
Generally speaking, the core temperature of a light-emitting diode can tolerate 120 degrees Celsius, which is much lower than the temperature of a traditional light bulb during operation. The heat dissipation design of high-brightness light-emitting diode devices will deeply affect its service life.
In addition, the luminous brightness of a light-emitting diode is related to its core temperature. As shown in Table 1 below, effectively reducing the core temperature can significantly increase the brightness of the light-emitting diode. For example, when the core temperature is 90 degrees Celsius from the general design value When it is reduced to 25 degrees Celsius, its brightness can be increased by 33%.
<tables><img file="TWM286464U_D0001.tif" /></tables>
In addition, reducing the core temperature can also extend the life. For example, under a fixed current, the temperature of a base where the light emitting diode is located (the core temperature is about 101 degrees Celsius) drops from 85 degrees Celsius to 55 degrees Celsius (core temperature At about 81 degrees Celsius), the life of a light-emitting diode (defined as 0.7 light decay) can be increased from 15,000 hours to 60,000 hours, which is four times longer than the original life.
Obviously, reducing the temperature of the light-emitting diode core will help the light-emitting diode to improve its brightness and life. To reduce the temperature of the light-emitting diode, it is necessary to start with its heat dissipation.
For 50-100 watt high-power light-emitting diode lighting fixtures, it is extremely difficult to make an effective heat dissipation design in a small interior space of the lighting fixture.
In terms of traditional aluminum or copper radiators and fans, the heat dissipation design is not only bulky, but also generates noise during fan operation, so it is not suitable for light-emitting diode devices.
Please refer to the fourth figure. In addition, a circuit heat pipe is used to dissipate the light emitting diodes. A heat conducting base (90) is mainly provided in a heat dissipation cover (93), and a plurality of light emitting diodes are provided outside. (91) A loop heat pipe (LHP) (92) is provided on the heat conducting base (90), and the loop heat pipe (92) is wound around the heat dissipation cover (93), and the interior is provided with volatile With this liquid, the loop heat pipe (92) can absorb the high heat of the light emitting diode (91) from the internal liquid, and exchange heat with the outside to dissipate heat. Although this design can effectively dissipate the light emitting diode (91), however When the heating power of the light-emitting diode (91) exceeds 150 watts, or the size of the light-emitting diode lamp is increased, the loop heat pipe (92) is insufficiently effective or the performance is greatly attenuated.
In addition, the above-mentioned heat dissipation structures are all passive heat dissipation designs, that is, only the light-emitting diode is used to dissipate heat due to the temperature difference between its own high temperature and normal temperature during operation. Impact.
Therefore, based on the shortcomings of the existing light emitting diode (LED) device using only inefficient passive cooling design to dissipate heat, the author improved the shortcomings and deficiencies, and then created an active type of light emitting diode lamp. Heat transfer and cooling device.
The main purpose of this creation is to provide a light-emitting diode lamp with active heat transfer and cooling functions. The low-temperature refrigerant in the compressor cycle is used to absorb and cool the light-emitting diode.
In order to achieve the above purpose, the aforementioned light emitting diode lamp with active heat transfer and cooling functions includes: a heat dissipation cover; an active heat transfer and cooling device, which is arranged in the heat dissipation cover and includes an evaporator A condenser, a compressor, an expansion valve and a low temperature plate, wherein the low temperature plate is arranged on the evaporator, the condenser is arranged on the heat dissipation cover, and the compressor, the condenser, the expansion valve and the evaporator are mutually Connection, the connection sequence is that the compressor is connected to the condenser, the condenser is connected to the expansion valve, the expansion valve is connected to the evaporator, and the evaporator is connected to the compressor to form a closed circuit. A refrigerant is arranged in the circuit. The compressor can compress the gaseous refrigerant, and the expansion valve can Expansion refrigerant; and a light-emitting diode module, which is arranged on the active heat transfer and cooling device and is in contact with the low-temperature plate, and includes at least one light-emitting diode.
With the above technical means, the heat generated by the light-emitting diode is transferred to the liquid refrigerant in the evaporator via the low-temperature plate. After the refrigerant absorbs heat, it evaporates into a gaseous state and enters the compressor, which is compressed by the compressor to become a high-temperature and high-pressure gas. The gaseous refrigerant passes through the condenser to dissipate heat and condense into a high-pressure high-temperature liquid refrigerant. After passing through the expansion valve, it becomes a low-pressure gas-liquid mixed refrigerant whose temperature is lower than the ambient temperature. Finally, the refrigerant enters the evaporator to complete a compression cycle. Low-temperature refrigerants absorb and cool the light-emitting diodes, which can reduce the impact of changes in ambient temperature and poor ventilation on the light-emitting diodes, and even maintain the temperature of the light-emitting diodes below the ambient temperature. Light-emitting diode temperature, prolong the life of the light-emitting diode and increase the brightness of the light-emitting diode.
The aforementioned condenser is disposed on the heat dissipation cover.
The aforementioned low-temperature plate is composed of two plate bodies, one of which is a heat-conducting plate body and the other plate is a heat-insulating plate body. The evaporator is sandwiched between the two plate bodies.
The aforementioned light-emitting diode module system includes a base, and a content chamber is formed on a side of the base that is in contact with the low-temperature plate. A plurality of perforations communicating with the content chamber and penetrating the base are formed on the base. A highly reflective substance is arranged on the wall, and a circuit board is arranged in the content room. The light emitting diode systems are arranged on the circuit board and extend into corresponding holes.
Each of the aforementioned perforated sections is formed in a trapezoid shape, and the wider end of the trapezoid shape faces away from the cryogenic plate.
On the side of the base facing away from the low-temperature plate, a gas container communicating with the perforation is formed, and the gas container is filled with a low dew point gas. An external transparent plate sealingly covering the gas container is provided on the base, and the low dew point gas It can avoid frost or condensation on the surface of the transparent plate at low temperature, so as to block light from being emitted.
At least one hot gas bypass pipe is formed on the base to heat the transparent plate to avoid frost or condensation on the surface of the transparent plate at low temperatures, so as to block light from being emitted.
The base is composed of a heat insulation plate provided on the low-temperature plate, an inner base provided on the heat insulation plate, and an outer base provided on the inner base.
An inner transparent plate interposed between the inner base and the outer base is provided at the bottom of the gas container of the aforementioned base, and the inner transparent plate covers the perforation of the base and the light emitting diode.
The aforementioned low dew point gas system is interposed between the inner transparent plate and the outer transparent plate.
The hot gas bypass pipe is formed on an outer base near the transparent plate.
The aforementioned low dew point gas system is nitrogen.
The transparent plate is made of glass.
The transparent plate is made of plastic.
The heat radiation cover is made of metal.
Please refer to the first and second figures. This creative light emitting diode lamp with active heat transfer and cooling functions includes: a heat dissipation cover (10), an active heat transfer and cooling device and a light emitting diode. (Light Emitting Diode, LED) module (20).
Please refer to the third figure further. The active heat transfer and cooling device is disposed in the heat dissipation cover (10), and includes a low temperature plate (70), an evaporator (30), a condenser (40), and a compressor. Machine (50) and an expansion valve (60).
The low-temperature plate (70) is arranged in the heat-dissipating cover (10) and is composed of two plates. One plate system is a heat-conducting plate body (71) made of a highly thermally conductive material such as metal, and the other plate The system is a thermal insulation board (72) made of a material with low thermal conductivity such as Polyron.
The evaporator (30) is sandwiched between the heat conducting plate body (71) and the heat insulating plate body (72).
The condenser (40) is arranged on the heat radiation cover (10), and by contacting the heat radiation cover (10), the heat on the condenser (40) can be dissipated by the large surface area of the heat radiation cover (10).
The compressor (50), the condenser (40), the expansion valve (60), and the evaporator (30) are connected to each other. The connection sequence is that the compressor (50) is connected to the condenser (40) and the condenser (40) is connected to the expansion valve. (60) The expansion valve (60) is connected to the evaporator (30) and the evaporator (30) is connected to the compressor (50) to form a closed circuit. A refrigerant (80) is arranged in the circuit. The compressor (40) can compress the gaseous refrigerant (80), and the expansion valve (60) can expand the refrigerant (80).
The light-emitting diode module (20) is arranged on the active heat transfer and cooling device to contact the low-temperature plate (70), and includes a base (21), an outer transparent plate (22), and an inner The transparent plate (23), a low dew point gas, a circuit board (24), at least one light emitting diode (25), and two sealing pads (26) (27).
The base (21) is arranged on the low-temperature plate (70), and includes a heat insulation plate (211), an inner base (212), an outer base (213), a content room (214), and at least one Perforation (215), a gas container (216), at least one hot gas bypass pipe (217), a gasket (218), and at least one highly reflective substance (219); the heat insulation plate (211) is ring-shaped And arranged on the heat-conducting plate body (71) of the low-temperature plate (70); the inner base (212) is arranged on the heat insulation plate (211); the outer base (213) is arranged on the inner base ( 212); the content room (214) is formed on the side of the base (21) facing the low-temperature plate (70), and is located between the inner base (212) and the heat insulation plate (211); the perforation (215) is formed on the inner base (212) and communicates with the content chamber (214). The cross-section of the perforation (215) is trapezoidal, and the wider end of the trapezoid is facing away from the cryogenic plate (70); the highly reflective substance (219 ) Is provided on the inner wall of the perforation (215); the gas container (216) is formed on the outer base (213) and communicates with the perforation (215); the hot gas bypass pipe (217) is formed in a ring shape and is formed outside The base (213) is used to heat the transparent plate to avoid frost or condensation in the gas container (216) at low temperatures. Stop emitting light; the gasket (218) disposed on the inner base line (212) between the base and outer (213).
The outer transparent plate (22) can be made of glass or plastic, and is arranged on the base (21) to hermetically cover the gas container (216).
The inner transparent plate (23) can be made of glass or plastic, and is arranged at the bottom of the gas container (216) of the base (21), between the inner base (212) and the outer base (213), and covers the perforation ( 215). By passing hot gas into the hot gas bypass pipe (217), frost or condensation on the surface of the inner / outer transparent plate (22) (23) can be removed.
The low dew point gas can be nitrogen, which is arranged in the gas container (216) of the base (21) and interposed between the outer transparent plate (22) and the inner transparent plate (23). The low dew point gas can avoid condensation at low temperatures. The frost or condensation is on the surface of the transparent plates (22) (23) so as to block light from being emitted.
The circuit board (24) is arranged in a content chamber (214) of the base (21).
The light emitting diode (25) is arranged on the circuit board (24) and penetrates into the corresponding base (21) perforation (215). With the trapezoidal cross section of the perforation (215) and the highly reflective substance (219), The light emitted by the light-emitting diode (25) can be emitted in a concentrated manner.
One of the gaskets (26) is disposed between the circuit board (24) and the heat insulation plate (211) of the base (21), and the other gasket (27) is disposed between the circuit board (24) and the low temperature board (30). )between.
With the above technical means, the heat generated by the light-emitting diode (25) is transferred to the liquid refrigerant (80) in the evaporator (30) through the low-temperature plate (70). The liquid refrigerant (80) absorbs heat and evaporates into a gaseous state and enters compression. The compressor (50) becomes a high-temperature and high-pressure gas through the compression of the compressor (50). The gaseous refrigerant (80) is radiated through the condenser (40) to condense into a high-pressure and high-temperature liquid refrigerant (80) and passes through the expansion valve. (60) Become a low-pressure gas-liquid mixed refrigerant (80) whose temperature is lower than the ambient temperature. Finally, the refrigerant (80) enters the evaporator (30) to complete a compression cycle. The compressor (50) and the low-temperature refrigerant (80) are used to The endothermic and cooling of the light-emitting diode (25) can reduce the influence of ambient temperature changes and poor ventilation on the light-emitting diode, and even maintain the temperature of the light-emitting diode (25) below the ambient temperature, and By reducing the temperature of the light-emitting diode (25), the life of the light-emitting diode (25) can be extended and the brightness of the light-emitting diode (25) can be improved.
<p>(10). . .Cooling cover</p><p>(20). . .Light-emitting diode module</p><p>(twenty one). . .Base</p><p>(211). . .Heat shield</p><p>(212). . .Inner base</p><p>(213). . .Outer base</p><p>(214). . .Content room</p><p>(215). . .perforation</p><p>(216). . .Gas chamber</p><p>(217). . .Hot gas bypass</p><p>(218). . .Seal</p><p>(219). . .Highly reflective substance</p><p>(twenty two). . .Outer transparent board</p><p>(twenty three). . .Inner transparent plate</p><p>(twenty four). . .Circuit board</p><p>(25). . .Light-emitting diode</p><p>(26). . .Seal</p><p>(27). . .Seal</p><p>(30). . .Evaporator</p><p>(40). . .Condenser</p><p>(50). . .compressor</p><p>(60). . .Expansion valve</p><p>(70). . .Cryogenic plate</p><p>(71). . .Thermal plate</p><p>(72). . .Insulation board</p><p>(80). . .Refrigerant</p><p>(90). . .Thermal base</p><p>(91). . .Light-emitting diode</p><p>(92). . .Loop heat pipe</p><p>(93). . .Cooling cover</p>
The first picture is a partial cross-sectional view of the side of this creation.
The second picture is the three-dimensional appearance of this creation.
The third picture is an enlarged side sectional view of the creation.
The fourth picture is a side sectional view of an old light-emitting diode lamp.
3 sheets
Sheet 1 Sheet 2 Sheet 3
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| TWI512436B | Cited by | Taiwan Province of China | Examiner |
| US9705115B2 | Cited by | United States of America | Applicant |
| US9735528B2 | Cited by | United States of America | Applicant |
| US9946316B2 | Cited by | United States of America | Applicant |
| US10673035B2 | Cited by | United States of America | Applicant |
2 priority claims, no other members on record
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 94218229 | Taiwan Province of China | U | |
| TW20050218229U | – | – | – |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Annulment or lapse of a utility model due to non-payment of feesLapsedMM4K | MM4K |
Numbers
- Publication
- M286464
- Publication, DOCDB
- M286464
- Publication, EPODOC
- TWM286464U
- Application
- 94218229
- Application, DOCDB
- 94218229
- Application, EPODOC
- TW20050218229U
Titles2
- English
- Light-emitting diode lamp having active heat transferring and temperature lowering function
- Chinese
- ???????????????????