The improved structure of a heat sink with heat pipes

Heat pipe radiator structure improvement

This creation is about the improvement of a heat pipe radiator structure, especially one that can make the heat pipe more simplified in the manufacturing process, not only improve the heat transfer efficiency, but also make the production cost lower, and not only can be used as a whole. It has excellent heat transfer and heat dissipation performance, and it can also improve product yield and provide an innovative structural improvement application for heat pipe radiators with competitive products.

Press, various computer mainframes, computer-related equipment in use, in order to enable internal chips [such as: central processing unit (CPU), graphics chip (GPU) ...] to operate at a higher working clock, making it necessary Increasing the number of transistors disposed in the wafer, and as the number of the transistors increases, the power consumption and power are increased, and the wafer causes a high heat to be used in the use of the wafer. If the heat dissipation efficiency of the chip is not good, it may cause the chip to malfunction or the computer to crash. Therefore, in the current market where the performance of the chip and the working clock are constantly increasing, the heat dissipation efficiency of the chip is extremely important. The problem.

As shown in the fifth figure, it is a common heat sink (5) having a heat sink fin (51), and a fan (52) is disposed above the heat sink fin (51). The heat sink (5) is mounted on the computer chip (54) along with a layer of thermal paste (53), thereby transferring the heat generated by the computer chip (54) to the heat sink fins (51), and then borrowing The fan (52) winds the cooling fins (51) to achieve the purpose of dissipating heat from the computer chip (54), so that the computer can operate stably and stably; however, due to the increase in the area available for heat dissipation by the wind, the industry mostly adopts a reduction. The distance between the two fins increases the number of fins, but as a result, the fins are thinned, so that the heat at the bottom of the fins cannot be effectively and completely and quickly transmitted to the top. When the wind of the fan reaches the bottom of the fin, the wind pressure has been reduced. As a result, the temperature difference between the top and bottom of the fin is increased, and the heat dissipation efficiency is not good. In addition, in order to have better heat dissipation efficiency, Increase the fins and replace the fan with faster speed and stronger wind; however, this A large-volume radiator is inevitably not suitable for notebook computers that are light, short, and mobile.

Therefore, the industry has developed a heat sink (6) as shown in the sixth figure, the heat sink (6) is attached to a heat sink fin (61) to install a heat pipe (62) cooler, the heat pipe (62) Please refer to the seventh diagram together, which is composed of a casing (621), a working liquid [heat medium liquid] and a capillary structure (622). After the vacuum tube (62) is evacuated, it is filled in an appropriate amount. The working liquid is absorbed by the capillary structure (622), and the working tube is filled with the heat pipe (62). The heat pipe (62) has an evaporation section at one end and a cooling section at the other end. When the heat can evaporate and vaporize the working liquid in the evaporation section. Flowing to the cooling section under the pressure difference of the vapor pressure to release the heat energy, while being condensed into a liquid state, being absorbed by the capillary structure (622), and flowing back to the evaporation section by capillary force, and circulating by the continuous phase change of the working liquid The heat is removed for heat dissipation, and a metal sheet (63) is mounted on the evaporation section of the heat pipe (62), whereby the metal piece (63) is separated from the computer chip (65) on the motherboard (66) by a layer. The thermal paste (64) is attached to absorb the heat energy of the computer chip (65), and is transferred by the excellent heat conduction performance of the heat pipe (62). Can be in heat-dissipating fins (61), and by the fan (67) of the cooling wind.

However, although the heat pipe has excellent heat conduction performance and is a hot superconductor, it only has the function of transferring heat energy, and still has to rely on heat sink fins and fan heat dissipation. As mentioned above, the heat sink fin still has a defect to be improved. It is impossible to take away heat with high efficiency.

Therefore, on February 17, 1992, the creator proposed a "heat pipe radiator structure improvement" [application number: 92202448], which was approved by the bureau on March 22, 1993. The heat sink structure is improved mainly by providing a metal agglomerate in the heat sink, and forming a hollow and evacuated heat sink fin in the cooling section of the heat sink, and the heat sink fin has high isothermality at any position, so The heat energy transferred by the working fluid in the vapor state can be quickly taken away with the fan, so that the computer chip does not overheat, and the operation is stable and stable.

However, although the "heat pipe heat sink structure improvement" can achieve the expected effect of making the computer chip not overheat and stable operation, it is still found in the actual implementation process that the metal sintered block of the structure is sintered by metal powder. It is not only difficult to produce, but also costly, and its technical level is relatively high, which is not easy to manufacture, so that the overall structure still has great problems in production. Improve.

The heat pipe radiator of the present invention is improved in structure, which is mainly provided with a heating body between the cover and the base of the heat pipe evaporation section, and a capillary structure is arranged on the heating body, and the capillary structure can be a glass fiber cloth. A plurality of laminated metal mesh or ceramic wool is filled with a working liquid between the upper cover and the base; thereby, the heat pipe is made simpler and more convenient, and at the same time, the manufacturing cost can be reduced.

First of all, please refer to the first and second figures. The creation consists of the upper cover (1), the heated body (2), the capillary structure (3) and the base (4). Among them, the upper cover (1), The heat-dissipating fins (11) are hollow on the side of the upper end surface, and the heat-dissipating fins (11) are hollow, and the end faces of the heat-dissipating fins (11) are wavy, and the upper cover (1) The concave portion is provided with a plurality of concave curved portions (12).

The heat receiving body (2) has a plurality of recessed grooves (21) formed by the upper end surface of the recess, and the recessed grooves (21) are just for the joint portion (31) of the capillary structure (3) to be in contact with each other. In this case, the heat exchange area can be increased, and the heat absorbing portion (22) is protruded from the bottom end surface of the heat receiving body (2).

The capillary structure (3) may be made of a glass fiber cloth, a plurality of laminated metal meshes or ceramic wool, and is bent at a lower end surface of one of the capillary structures (3) to form a plurality of joint portions (31). ).

The base (4) is adapted to be received by the heating body (2) and the capillary structure (3), and is simultaneously sealed and fixed with the upper cover (1), and the heating body (2) corresponding to the base (4) The heat absorbing portion (22) is opened with a through hole (41).

When the creation of the creation is combined, please refer to the first and second figures. The heating body (2) and the capillary structure (3) are respectively accommodated in the base (4), and the heating body (2) The heat absorbing portion (22) protrudes outwardly from the through hole (41) of the base (4), and welds the two in advance, and at the same time, the joint portion (31) of the capillary structure (3) is accommodated in the heat receiving body. (2) In the trench (21), cover the upper cover (1) above the base (4), and seal the upper cover (1) and the base (4) to vacuum, and the upper cover (1) and the base ( 4) The room is filled with working fluid.

In this way, the heat absorbing portion (22) of the heat receiving body (2) can be attached to the wafer, so that the heat energy is directly transmitted from the groove (21) to the capillary structure (3) by the heat receiving body (2). On the joint portion (31), the working fluid which is saturated with the capillary structure (3) is vaporized into the heat-dissipating fin portion (11) of the upper cover (1), and the heat-dissipating fin portion (11) is further provided with a fan [not shown) The working liquid is cooled and vaporized, so that the working liquid is recondensed and liquefied and dripped and absorbed by the capillary structure (3), and the working liquid is flowed to the joint portion (31) by capillary force, thereby achieving the purpose of repeatedly accelerating heat dissipation.

In addition, please refer to the third figure. When the notebook is applied to a desktop computer, the upper cover (1), the heated body (2), and the capillary structure (3) may be respectively provided for the size of the computer chip. And the base (4), the upper cover (1) has a heat dissipation fin portion (11) protruding directly from the upper end surface, and both end faces are wavy, and the heat receiving body (2) is directly on the upper end surface The concave member is formed with a groove (21) for abutting against the joint portion (31) corresponding to the capillary structure (3) by the groove (21), and the heat absorption of the lower end surface of the heat receiving body (2) The portion (22) is also protruded outwardly from the through hole (41) of the base (4), and the two are welded in advance, so that the heat absorbing portion (22) can be attached to the table. On the chip of the computer, not only can the thermal resistance be reduced, but also the heat transfer efficiency can be increased, and the effect of rapid heat dissipation can be achieved.

In addition, please refer to the fourth figure, the upper cover (1) of the creation can directly form a hollow tubular shape, and the other end can be vacuumed and sealed, and then the upper cover (1) is directly sealed and sealed. The periphery of the heated body (2), and the groove (21) of the heated body (2) is also embedded and bonded to the joint portion (31) of the capillary structure (3), and the heat dissipation effect can be accelerated.

From the above, the composition of the component and the implementation description show that compared with the conventional application, this creation uses the heat absorbing portion of the heating body to directly transfer the thermal energy to the metal bonded by the glass fiber cloth and several layers. The capillary structure made of mesh or ceramic wool makes the creation more rapid and convenient than the conventional metal agglomerate. In addition to increasing the product yield, the production cost can be reduced.

In summary, the present embodiment can achieve the expected use efficiency, and the specific structure disclosed therein has not been seen in similar products, nor has it been disclosed before the application, and has fully complied with the provisions of the Patent Law. And the request, the application for a new type of patent in accordance with the law, please forgive the review, and grant the patent, it is really sensible.

<p>(1). . . Upper cover</p><p>(11). . . Heat sink fin</p><p>(12). . . Reinforcement department</p><p>(2). . . Heater</p><p>(twenty one). . . Trench</p><p>(twenty two). . . Heat absorption</p><p>(3). . . Capillary structure</p><p>(31). . . Joint</p><p>(4). . . Base</p><p>(41). . . Through hole</p><p>(5). . . heat sink</p><p>(51). . . Heat sink fin</p><p>(52). . . fan</p><p>(53). . . Thermal paste</p><p>(54). . . Computer chip</p><p>(6). . . heat sink</p><p>(61). . . Heat sink fin</p><p>(62). . . Heat pipe</p><p>(621). . . Shell</p><p>(622). . . Capillary structure</p><p>(63). . . Metal sheets</p><p>(64). . . Thermal paste</p><p>(65). . . Computer chip</p><p>(66). . . motherboard</p><p>(67). . . fan</p>

The first picture: the exploded view of the creation

Figure 2: Side view of the creation

Third Figure: A cross-sectional view of another embodiment of the present creation

Fourth: another embodiment of the present creation, an end view

Figure 5: Usage status reference diagram

Figure 6: Another usage status reference map

Figure 7: Another schematic diagram of a conventional section