Load port and EFEM

Load port and load port driver method

The present invention relates to a loading port capable of reducing the amount of gas used even in the case of a special gas atmosphere in a wafer transfer chamber.

Conventionally, semiconductors have been manufactured by applying various processing steps to wafers. In recent years, the high integration of components and the miniaturization of circuits have been further improved. In order to prevent particles or moisture from adhering to the wafer surface, it is sought to maintain the cleanliness of the wafer periphery. In addition, in order not to change the surface properties such as oxidation of the wafer surface, the periphery of the wafer may be set in a nitrogen atmosphere of an inert gas, and may be made into a vacuum state.

In order to properly maintain the above-mentioned atmosphere around the wafer, the wafer is managed inside a closed storage unit called FOUP (Front-Opening Unified Pod), and the inside is filled with nitrogen gas. Furthermore, in order to carry out transfer of the wafer between the processing apparatus for processing the wafer and the FOUP, an EFEM (Equipment Front End Module) disclosed in Patent Document 1 below is used. EFEM is a wafer transfer chamber whose interior is roughly closed to form a frame, and has a load port (Load Port) that functions as an interface between FOUP and FOUP on one of its facing walls, and is connected to a Load interlock of part of processing device vacuum chamber. A wafer transfer device for transferring wafers is installed in the wafer transfer chamber, and wafers are carried out and in between the FOUP connected to the load port and the load-lock vacuum chamber using the wafer transfer device.

That is, a wafer is taken out by a wafer transfer device through a FOUP (load port) serving as a transfer position of one side, and transported to a load-lock vacuum chamber serving as a transfer position of the other side. In addition, the processing device processes the wafers transported through the load-lock vacuum chamber in a processing unit called a processing chamber. After the processing is completed, the wafer is taken out again through the load-lock vacuum chamber and returned to the FOUP.

A special atmosphere such as a vacuum corresponding to the processing is set in the processing device so that the wafer can be processed quickly. In addition, the inside of EFEM's wafer transfer chamber is made of clean air with high cleanliness by introducing the air that has been purified by chemical filters, etc., and the surface of the wafer being transferred will not be polluted by the adhesion of particles and the like.

[Prior Art Literature]

[Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-49382

<p>However, in recent years, with increasing integration and miniaturization, EFEM's wafer handling room has a higher degree of cleanliness than the impact of the different air atmosphere in FOUP or processing equipment.</p><p>That is, when exposed to the air atmosphere, moisture or oxygen tends to adhere to the surface of the wafer, which may cause corrosion or oxidation. In addition, when the corrosive gas etc. used in the processing apparatus remains on the surface of the wafer, the wiring material on the surface of the wafer may be corroded and the yield may be deteriorated. Moreover, the presence of water in corrosive elements accelerates the corrosion reaction, so the presence of both corrosive gas and water may further accelerate corrosion.</p><p>In order to avoid this, it is conceivable to make the inside of the wafer transfer chamber into a dry nitrogen atmosphere similar to FOUP. In addition, in addition to dry nitrogen, it is also possible to use an appropriate special gas atmosphere according to the processing content of the wafer.</p><p>However, conventional EFEMs only increase the internal pressure so that particles do not enter from the outside, and little consideration is given to the wafer handling chamber that constitutes the EFEM or the suppression of the flow from the gas loading port to the outside. Therefore, even if a special gas such as dry nitrogen is supplied to the wafer transfer chamber, the gas still flows out to the outside, making it difficult to properly maintain and manage the internal atmosphere, and a large amount of gas is required, resulting in increased gas costs. Also, when a large amount of gas flows out of the EFEM, depending on the type of the gas, there is a possibility that the working environment outside the EFEM may be deteriorated.</p><p>The purpose of the present invention is to effectively solve the above-mentioned problems. Specifically, when the wafer transfer chamber constituting the EFEM is provided with a special gas, the outflow of the used gas to the outside or the inflow of air or the like from the outside is suppressed. The purpose of reducing the supply of gas used is to improve the quality of the wafer and improve the loading port and EFEM.</p>

<p>The present invention employs the following means to achieve the above object.</p><p>That is, the loading port of the present invention is provided with: a panel portion forming an opening for opening the wafer transfer chamber; a door portion for opening and closing the opening; The wafer storage container is placed opposite to the door, and can move forward and backward toward the panel; and the clamping unit engages with the flange provided on the wafer storage container to pull the flange On the side of the above-mentioned panel part, it is characterized in that the above-mentioned clamping unit includes: an engaging piece that can be engaged with a flange portion provided around the above-mentioned cover in the above-mentioned wafer storage container, and the engaging piece In an operating cylinder capable of advancing and retreating, the engaging piece rotates along with the advancing and retreating movement of the cylinder, and is engaged with the flange portion.</p><p>According to the above configuration, the wafer storage container and the loading table are moved toward the plate-shaped part, and the opening of the plate-shaped part and the periphery of the cover are connected through the elastic material, even if the wafer storage container is connected between the cover and the plate-shaped part. When the door is open, it is still possible to prevent gas from flowing out of the wafer handling chamber to the outside. Therefore, even if the wafer transfer chamber is in an atmosphere of inert gas, clean gas, or dry gas, the amount of gas used can be reduced and the cost of gas management can be reduced, and the cost caused by gas outflow can be suppressed. The deterioration of the working environment outside the wafer handling room. In addition, since the inflow of gas from the outside into the wafer transfer chamber can also be suppressed, fine particles can also be prevented from entering the wafer storage container or the wafer transfer chamber, and the quality of the wafer can be maintained.</p><p>Preferably, the above-mentioned clamping units are arranged on the left and right of the above-mentioned opening respectively.</p><p>When the cylinder moves the engaging piece to a predetermined position, it is preferable to arrange the engaging piece at a position where it does not interfere with the flange portion.</p><p>Moreover, it is preferable that the said engagement part engages with the said flange part so that the said flange part may press and engage with the elastic material attached to the opening peripheral edge of the said panel part.</p><p>The method for driving a loading port of the present invention is a method for driving a loading port that connects a wafer storage container to an opening of a panel portion constituting a wafer transfer chamber, and is characterized by comprising: loading the above-mentioned wafer storage container The step of moving the stage toward the above-mentioned panel part, and the step of actuating the clamping unit that can be engaged with the flange part of the above-mentioned wafer storage container. It is preferable to engage the cylinder of the engaging piece of the flange portion so that the engaging piece is engaged with the flange portion of the wafer storage container.</p>

<p>According to the present invention described above, when the inside of the EFEM is set as a special gas atmosphere, it is possible to suppress the outflow of the used gas to the outside or the inflow of air from the outside, and it is possible to reduce the supply amount of the used gas and reduce the cost. , and can obtain the load port and EFEM with improved wafer quality.</p>

<p>1: EFEM</p><p>2: Wafer transfer chamber (frame)</p><p>3: Load port</p><p>5: Clamping unit (traction means)</p><p>7: FOUP (wafer storage container)</p><p>31: panel (plate-shaped part)</p><p>34: Carrying platform</p><p>34c: gas supply nozzle (gas supply means)</p><p>37: Gasket (sealing member)</p><p>42: opening</p><p>44, 46: O ring (sealing member)</p><p>51: snap-in piece</p><p>61: door department</p><p>71c: Flange</p><p>72: cover</p><p>73: Gas supply valve</p><p>144, 146: Gasket (elastic material)</p><p>244b, 244c: elastic part (elastic material)</p><p>W: Wafer</p>

Fig. 1 is a perspective view of an EFEM provided with a loading port related to the first embodiment of the present invention.

Figure 2 is a side view of the same EFEM.

Fig. 3 is a perspective view showing a state where a part of the load port is separated from the EFEM.

Figure 4 is a perspective view of the same loading port.

Figure 5 is a front view of the same loading port.

Figure 6 is the rear view of the same loading port.

Figure 7 is a side sectional view of the same loading port.

Fig. 8 is a side cross-sectional view showing a state in which the FOUP is moved toward the plate-like portion from the state shown in Fig. 7 .

Fig. 9 is a side cross-sectional view showing a state in which the door portion and the cover portion of the FOUP are separated from the plate portion from the state of Fig. 8 .

Fig. 10 is a side cross-sectional view showing a state in which the door and the cover of the FOUP are moved downward together from the state in Fig. 9 .

Fig. 11 is an enlarged perspective view showing an enlarged main part of a window unit and a door constituting the loading port device.

Fig. 12 is an enlarged cross-sectional view of main parts shown by enlarging the AA cross-section in Fig. 11 .

Fig. 13 is an enlarged cross-sectional view of main parts shown by enlarging the BB cross-section in Fig. 11 .

Fig. 14 shows an enlarged front view of main parts of a holding unit provided in a classmate unit.

Fig. 15 is an enlarged perspective view showing an enlarged main part of a window unit and a door constituting a loading port according to the second embodiment of the present invention.

Fig. 16 is an enlarged cross-sectional view of main parts shown by enlarging the section CC in Fig. 15 .

Fig. 17 is an enlarged perspective view showing an enlarged main part of a window unit and a door constituting a loading port according to a third embodiment of the present invention.

Fig. 18 is an explanatory view showing a sealing member attached near the opening of the window unit.

Fig. 19 is an enlarged cross-sectional view of main parts shown by enlarging the DD cross-section in Fig. 17 .

Fig. 20 is an enlarged cross-sectional view of main parts corresponding to Fig. 12 showing a modified example of the loading port according to the first embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

&lt;First Embodiment&gt;

Fig. 1 shows a load port 3 and an EFEM 1 including the load port in the first embodiment. The EFEM 1 has three loading ports 3 arranged and connected to the front 21 of a part of the wall surface of the wafer transfer chamber 2 constituting a box-shaped frame.

Here, in the present invention, the orientation of the connection side defining the load port 3 from the wafer transfer chamber 2 is defined as the front, and the orientation of the rear surface 22 side opposite to the front surface 21 is the rear, and a direction orthogonal to the front-rear direction and the vertical direction is defined. Orientation is sideways. That is, the three loading ports 3 are arranged side by side.

FIG. 2 is a side view showing the load port 3 and the EFEM 1 provided with the load port. The load port 3 is connected to the front surface 21 of the wafer transfer chamber 2 as described above. The loading port 3 is equipped with a panel as a plate-shaped part at the rear 31. This panel 31 is integrally formed with the front surface 21 and constitutes a part of the wall surface of the EFEM 1 . The loading port 3 is provided with a mounting table 34 extending forward from the panel 31 , and a FOUP 7 serving as a wafer storage container for storing a wafer W can be mounted on the mounting table 34 .

The EFEM1 is installed on the ground floor FL, and the processing device 9 for applying predetermined processing to the wafer W can be connected to the rear surface 22 side, and the internal space of the wafer transfer chamber 2 is communicated through a gate valve (not shown) provided on the rear surface 22 of the EFEM1. Between Se and the processing device 9. In addition, in the internal space Se of the wafer transfer chamber 2, a wafer transfer device 8 for transferring the wafer W is provided. Using the wafer transfer device 8, the wafer transfer device 8 can be placed between the FOUP 7 provided in the loading port 3 and the processing device 9. , carrying out the transfer of the wafer W.

The wafer transfer chamber 2 is configured by connecting the loading port 3 and the processing device 9 to make the internal space Se in a substantially sealed state, and purging with dry nitrogen gas through the gas supply port and the gas discharge port not shown in the figure can improve The nitrogen concentration of Se in the inner space. In addition, a fan filter unit 25 is installed on the upper part of the wafer transfer chamber 2 to send gas downward, and the gas is sucked from the chemical filter 26 arranged at the lower part, and the gas passes through the circulation line 27 provided adjacent to the inner side of the rear surface 22. Return flow towards the upper fan filter unit 25 . In this way, a downflow of airflow from above to below is formed in the wafer transfer chamber 2, and the internal gas circulation can be maintained in a clean state. Also, even if there are particles contaminating the surface of the wafer W in the inner space Se of the wafer transfer chamber 2, the particles are pushed downward by the downdraft, thereby preventing the particles from adhering to the surface of the wafer W being transported. And can use the chemical formula filter 26 to capture the processing device 9 The residual gas can further keep the internal space Se in a clean state.

FIG. 3 shows a state in which one load port 3A is removed from the wafer transfer chamber 2 from the state in FIG. 1 . An opening 23 slightly smaller than the panel 31 of the loading port 3 is provided on the front surface 21 connected to the loading port 3A, and the internal space Se can be opened through the opening 23 . Along the periphery of the opening 23 , a step-like abutment surface 24 is formed that goes deep in the rear, and the abutment surface 24 abuts the rear surface of the panel 31 .

Figures 4, 5 and 6 are a perspective view showing the loading port 3, a front view when it is displayed from the front, and a rear view when it is displayed from the rear, respectively. Hereinafter, using these diagrams, the configuration of the load port 3 will be described. In addition, these figures show the state which removed the external cover 32 (refer FIG. 2) located under the mounting table 34, and exposed a part of internal structure.

The loading port 3 vertically erects the panel 31 from the rear of the foot 35 on which casters and feet are installed, and is provided with a horizontal base 33 facing forward from a height position of about 60% of the panel 31 . And, on the upper portion of the horizontal base 33, a mounting table 34 for mounting the FOUP 7 (see FIG. 2 ) is provided. The FOUP 7 is shown schematically in FIG. 7, and consists of a main body 71 with an internal space Sf for accommodating the wafer W (see FIG. 2 ), and an opening 71a that can be closed on one side of the main body 71 that becomes the entrance and exit of the wafer W. The cover part 72 is constituted, and the cover part 72 is made to face the panel 31 when it is correctly placed on the placement table 34 .

Returning to FIGS. 4 to 6 , on the placement table 34 , positioning pins 34 a for positioning the FOUP 7 are provided, and locking pawls 34 b for fixing the FOUP 7 to the placement table 34 are provided. Locking by locking pawl 34b The action is coordinated with the positioning pin 34a to guide the FOUP 7 to the correct position and fix it, and the loosening action makes the FOUP 7 detachable from the placement table 34 .

Also, on the mounting table 34, there are respectively provided at two places: a gas supply nozzle 34c constituting a gas supply means for supplying gas to the inside of the FOUP7 (see FIG. 2 ), and a gas discharge nozzle 34c constituting a gas supply means for discharging gas from the inside of the FOUP7. Means the gas exits the nozzle 34d. These are usually located below the top of the loading platform 34, and are connected to the gas supply valve 73 and the gas discharge valve 74 (refer to FIG. 7 ) of the FOUP 7 when in use. Furthermore, by supplying gas such as dry nitrogen from the gas supply nozzle 34c toward the internal space Sf of the FOUP 7 (refer to FIG. 7 ) through the gas supply valve 73, and discharging the gas in the internal space Sf from the gas discharge nozzle 34d through the gas discharge valve 74, it is possible to This is used for gas purging. Also, since the gas supply amount is larger than the gas discharge amount, the pressure of the internal space Sf can be positively pressurized higher than the pressure of the outside or the internal space Se (see FIG. 2 ) of the wafer transfer chamber 2 .

Furthermore, the mounting table 34 is movable in the front-rear direction in a state where the FOUP 7 (see FIG. 7 ) is mounted.

The panel 31 constituting the loading port 3 is composed of: pillars 31a, 31a erected on both sides; a panel main body 31b supported by these; constitute. Here, the substantially rectangular shape referred to in this case is a shape in which one side is a rectangle having four sides as a basic shape and the four corners are smoothly connected by circular arcs. In the vicinity of the rear periphery of the panel main body 31b, there is a The washer 37 of the material. The gasket 37 is formed of a rubber material with little gas penetration. The gasket 37 is formed to abut against the abutment surface 24 (see FIG. 3 ) set near the edge of the opening 23 of the above-mentioned wafer transfer chamber 2 to eliminate the gap between the periphery of the panel main body 31b and the opening 23 and to suppress the gas from flowing out. The inside of the wafer transfer chamber 2 leaks to the outside.

The window unit 4 is provided at a position opposite to the cover portion 72 of the FOUP 7 (see FIG. 7 ), and as will be described in detail later, a substantially rectangular opening 42 (see FIG. 7 ) is provided so that the wafer can be opened through the opening 42. The inner space Se of the transfer chamber 2 . Furthermore, the load port 3 is provided with an opening and closing mechanism 6 for opening and closing the opening 42 .

The opening and closing mechanism 6 has: a door 61 for opening and closing the opening 42; a support frame 63 for supporting the door; a movable block 65 that supports the support frame 63 through a sliding support means 64 to move forward and backward; supports the movable block 65 The slide rail 66 is movable up and down with respect to the panel main body 31b. The support frame 63 is for supporting the lower part of the rear part of the door part 61 as shown in FIG. shape. Further, the slide support means 64 for supporting the support frame 63, the movable block 65, and the slide rail 66 are provided in front of the panel main body 31b. That is to say, the sliding part for moving the door part 61 is positioned at the outside of the wafer transfer chamber 2, just in case there are occasions where particles are generated in these parts, because the insertion hole 31d is in the shape of a small slit, it can be suppressed by this. The fine particles enter the wafer transfer chamber 2 .

In addition, the door portion 61 is moved forward and backward and up and down. Actuators (not shown) for directional movement are provided in respective directions, and a drive command from the control unit Cp is given thereto to move the door 61 in the front-rear direction and the up-down direction.

Also, a cover 36 extending from directly below the horizontal base 33 toward the lower side is provided in front of the panel main body 31b, and the inside of the cover 36 covers the support frame 63, the sliding support means 64, the movable block 65, and the slide rails. 66, become airtight. Therefore, the gas in the wafer transfer chamber 2 (see FIG. 3 ) is prevented from flowing out to the outside through the portion of the insertion hole 31d formed in the panel main body 31b.

The door portion 61 is provided with a hooking operation for opening and closing a lid portion 72 (see FIG. 7 ) of the FOUP 7 or a coupling means 62 for holding the lid portion 72 . The hooking operation of the connecting means 62 on the cover 72 can make the cover 72 open and connect the cover 72 and the door 61 into an integrated state. Also, on the contrary, the connection between the lid portion 72 and the door portion can be released, and the lid portion 72 can be attached to the main body 71 to be in a closed state.

Here, the detailed structure of the above-mentioned window unit 4 is demonstrated using FIG. 11. FIG. The window unit 4 is composed of: a window frame portion 41; O-rings 44, 46 (see FIG. 12 ) installed on the window frame portion as elastic materials; The part 41 is formed by the clamping unit 5 used as the pulling means in close contact.

The window frame portion 41 has a frame shape with a substantially rectangular opening 42 formed inside. The window frame portion 41 constitutes a part of the above-mentioned panel 31 (see FIG. 3 ) as a component of the window unit 4 , and the opening 42 is opened to the front surface 21 as a frame wall surface constituting the wafer transfer chamber 2 . opening 42 It is slightly larger than the periphery of the cover part 72 (refer to FIG. 7 ) of the FOUP7, and the cover part 72 is movable through the opening 42 . In addition, in a state where the FOUP 7 is placed on the mounting table 34 , the front surface of the main body 71 serving as the periphery of the cover 72 contacts the window frame 41 through the O-ring 44 as the contact surface 71 b.

And, on the rear surface of the window frame portion 41, the above-mentioned door portion 61 abuts through the O-ring 46 (see FIG. 12 ). Specifically, a flange-shaped thin-walled portion 61 a abuts against the outer periphery of the door portion 61 . At this time, the thick portion 61 b formed inside the thin portion 61 a is formed smaller than the opening 42 and extends forward through the opening 42 .

Fig. 12 is an enlarged view showing the AA cross-section in Fig. 11 . A trapezoidal cross-sectional dovetail groove 43 is formed around the vicinity of the opening 42 on the front surface of the window frame portion 41 , and an O-ring 44 is inserted therein. The dovetail groove 43 is formed with a small opening and has a cross-sectional shape that expands inwardly, which can properly support the O-ring 44 inside, and simply prevent the O-ring 44 from coming off. Also, a part of the O-ring 44 protrudes forward from the opening of the dovetail groove 43 , and the protruding part can be brought into contact with the contact surface 71 b set on the FOUP 7 . Therefore, the FOUP 7 mounted on the mounting table 34 (see FIG. 7 ) moves toward the panel 31 side together with the mounting table 34 , and the O-ring 44 can be elastically contacted to the contact surface.

Similarly, a dovetail groove 45 with a trapezoidal cross-section is formed around the periphery of the opening 42 on the rear surface of the window frame portion 41, and an O-ring 46 is inserted therein. And, the door portion 61 is closed, thereby being snapped onto the front surface of the outer peripheral thin portion 61a. The dovetail groove 45 is formed on the inner side of the dovetail groove 43, so that the wall thickness between the two is extremely thin so that the strength is not insufficient.

Returning to FIG. 11 , the clamping unit 5 is provided on both sides of the window frame portion 41 at four locations separated in the vertical direction. Each holding unit 5 is roughly constituted by an engaging piece 51 and an air cylinder 52 for actuating the engaging piece.

Fig. 13 is an enlarged view showing the BB cross-section in Fig. 11 . The air cylinder 52 constituting the clamping unit 5 is attached to the rear of the window frame portion 41 and has a shaft 53 capable of moving forward and backward through a hole provided in the window frame portion 41 . The base end 51 a of the engaging piece 51 is attached to the front end of the shaft 53 , and is formed such that the front end 51 b extends from the base end 51 a toward the outer periphery of the shaft 53 . On the outer periphery of the shaft 53, a guide groove 53a twisted by 90° in the axial direction is formed, and a guide pin 54 fixed to the window frame portion 41 side is inserted into the guide groove 53a from the radial direction. Therefore, as the cylinder 52 advances and retreats, the guide pin 54 guides the guide groove 53a, so that the shaft 53 rotates 90° around the shaft center. And, as shown in FIG. 13b, when the engaging piece 51 protrudes forward together with the shaft 51, the front end 51b faces upward, and when pulled backward, the front end 51b faces the inner FOUP 7. The engaging piece 51 has its front end 51b facing inward, and can engage with a flange portion 71c extending laterally from the FOUP 7 . As the above-mentioned one side keeps the engaged state, the shaft 53 is further pulled by the cylinder 52, as shown in FIG. 12, the abutting surface 71b of the FOUP 7 can be formed into a clamping state that is further firmly in close contact with the O-ring 44. By virtue of the above-mentioned function of the clamping unit 5 at 4, the deformation amount of the O-ring 44 can be made uniform to further improve the sealing performance. Moreover, when the engaging piece 51 moves forward, the front-end|tip 51b will face upward, and will become the position which does not interfere with the flange part 71c shown from the front. In this way, the FOUP7 and the loading table can be 34 (see Fig. 7) to move together. Furthermore, when the front end 51b moves forward, it only needs to simply not interfere with the flange portion 71c, and the front end 51b is not limited to the upward direction, and may be set in the downward or outward direction.

In addition, a cable guide 55 extending in the vertical direction is provided in front of the engaging piece 51 . The cable guide 55 is formed by a bendable sheet metal, which can prevent other components from being involved in the engaging piece 51 . Pipes, distribution wires, etc. are also preferably fixed to the outside of the cable guide 55 .

The load port 3 configured as above operates by giving drive commands to each part by the control part Cp shown in FIG. 4 . Hereinafter, an operation example in the case of using the loading port 3 of this embodiment will be described using FIGS. 7 to 10 .

FIG. 7 shows a state in which the FOUP 7 is placed on the placing table 34 and separated from the panel portion 31 . In this state, the door portion 61 is abutted against the door portion 61 through the O-ring 46 behind the window frame portion 41 (see FIG. 12 ) constituting the window unit 4, so there is no gap between the window frame portion 41 and the door portion 61. High airtightness can be obtained. Therefore, even in a state where the inner space Sf of the wafer transfer chamber 2 is filled with nitrogen gas or the like, the outflow of gas to the outside or the inflow of gas from the outside into the inner space Sf can be suppressed.

Although omitted in this figure, the FOUP 7 can be fixed in an appropriate position relative to the loading platform 34 by the locking action of the locking claw 53 (see FIG. 4 ) and the positioning action with the positioning pin 34 .

Furthermore, the gas supply nozzle 34c and the gas discharge nozzle 34d provided on the mounting table 34 protrude upward, and are respectively connected to the gas supply valve 73 and the gas discharge valve 74 provided to the FOUP 7 . Thereafter, from the gas supply Fresh dry nitrogen gas is supplied to the nozzle 34 c through the gas supply valve 73 , and the gas remaining in the internal space Sf until now is discharged from the gas supply nozzle 34 c through the gas discharge valve 74 . By performing the gas purging as described above, the internal space Sf can be filled with nitrogen gas, and the pressure of the internal space Sf of the wafer transfer chamber 2 can be brought into a higher pressure state.

Next, as shown in FIG. 8 , the mounting table 34 is moved backward, and the contact surface 71 b of the FOUP 7 is brought into contact with the window frame portion 41 . Specifically, the contact surface 71b is brought into contact with the O-ring 44 provided on the front surface of the window frame portion 41 (see FIG. 12 ) to form a sealed state. As mentioned above, when moving the placing table 34, the cylinder 52 constituting the holding unit 5 protrudes the engaging piece 51 (see FIG. 13 ) toward the front so that the front end 51b faces upward without interfering with the FOUP 7. .

In addition, the connecting means 62 (refer to FIG. 6 ) provided on the door 61 is actuated, whereby the cover 72 can be detached from the main body 71 to be in an unhooked state, and the cover 72 can be integrally held by the door 61. status. At the same time, the engaging piece 51 (refer to FIG. 13 ) is pulled toward the rear by the cylinder 52 constituting the clamping unit 5, and is engaged with the flange portion 71c of the FOUP 7 with the front end 51b facing inward, and is pulled The contact surface 71b of the FOUP 7 is brought into closer contact with the O-ring 44 to improve the sealing performance.

In this state, as shown in FIG. 9 , the door portion 61 and the support frame 63 move backward together. In this way, the inner space Sf can be opened by separating the lid part 72 of the FOUP 7 from the main body 71 . At this time, since the contact surface 71b of the FOUP 7 and the window unit 4 are firmly in close contact, the outflow or flow of gas between the wafer transfer chamber 2 and the FOUP 7 and the outside can be suppressed. enter.

Furthermore, since the pressure of the FOUP 7 is increased, the gas flows from the internal space Sf of the FOUP 7 into the wafer transfer chamber 2 . Therefore, entry of fine particles and the like from the wafer transfer chamber 2 into the FOUP 7 is suppressed, and the inside of the FOUP 7 can be kept clean. Also, continuously supplying a low flow rate of gas through the gas supply nozzle 34c is also suitable for the prevention of ingress of fine particles.

Next, the door portion 61 is moved downward together with the support frame 63 . In this way, the rear of the opening 71a of the FOUP 7, which is the loading and unloading entrance, can be largely opened, and the wafer W can be moved between the FOUP 7 and the processing device 9 (see FIG. 2 ). All the mechanisms for moving the door portion 61 as described above are covered with the cover 36 , so that gas in the wafer transfer chamber 2 can be suppressed from leaking to the outside.

As mentioned above, although the operation|movement at the time of opening the opening 71a of FOUP7 was demonstrated, when closing the opening 71a of FOUP7, what is necessary is just to perform the operation reversed to the above.

Repeating the above-mentioned operation, the O-rings 44 and 46 are repeatedly spring-bonded between the cover portion 72 or the door portion 61, and new fine particles may be generated. Such fine particles move downward by the downdraft formed inside the wafer transfer chamber 2 when the lid portion 72 or the door portion 61 is opened (see FIG. 2 ). Therefore, it does not adhere to the surface of the wafer W, and the clean state of the surface of the wafer W can be maintained.

As described above, the loading port 3 of this embodiment is provided adjacent to the wafer transfer chamber 2, and is used for carrying in and out the wafer W between the wafer transfer chamber 2 and the FOUP 7 of the wafer storage container, and includes: Part of the wall surface of the transfer chamber 2 is a panel 31 forming a plate-like portion for opening the opening 42 in the wafer transfer chamber 2; a door 61 for opening and closing the opening 42; and a cover for opening and closing the internal space Sf. 72 is opposite to the door portion 61 and places the FOUP 7 and is able to move forward and backward toward the panel 31; The loading table 34 moves toward the panel 31 , thereby constituting the abutment surface 71 b that the O-ring 44 snaps onto the periphery of the cover portion 72 of the FOUP 7 .

With the above configuration, the movement of the FOUP 7 and the loading table 34 toward the panel 31 connects the opening 42 of the panel 31 and the periphery of the cover 72 through the O-ring 44 , even if the cover 72 of the FOUP 7 and the panel 31 are connected. When the door portion 61 is opened, the outflow of gas from the wafer transfer chamber 2 to the outside can still be prevented. Therefore, even if the wafer transfer chamber 2 is in a special gas atmosphere such as an inert gas, a clean gas, or a dry gas, it is possible to reduce the amount of gas used and the cost of gas management, and to suppress the gas The outflow leads to deterioration of the working environment outside the wafer handling chamber 2 . In addition, the inflow of gas from the outside into the wafer transfer chamber 2 can be suppressed, and the entry of fine particles from the outside into the FOUP 7 or the wafer transfer chamber 2 can be prevented, thereby maintaining the quality of the wafer W.

In addition, since the gas supply nozzle 34c as a gas supply means for supplying gas to the inside of the FOUP 7 through the gas supply valve 73 provided in the FOUP 7 is further provided, even if particles are generated due to the elastic contact of the O-ring 44, only the gas can be used. The supply nozzle 34c makes the pressure in the FOUP 7 higher than the pressure in the wafer transfer chamber 2, and the gas is directed from the inside of the FOUP 7 toward the wafer while the lid 72 and the door 61 are opened. The flow on both sides of the transfer chamber can prevent particles from entering the FOUP7 and maintain a clean state.

In addition, since the FOUP 7 is equipped with the engaging piece 51 that can engage with the flange portion 71c provided around the cover portion 72, and the engagement piece 51 is pulled to the panel 31 side in a state engaged with the flange portion 71c The clamping unit 5 as a pulling means pulls the engaging piece 51 to the panel 31 side in a state where the clamping unit 5 is engaged with the flange portion 71c of the FOUP 7 together with the movement of the placing table 34. The tightness of the O-ring 44 can further enhance the above-mentioned effect.

Also, it is further equipped with an O-ring 46 as an elastic material provided on the door 61 side of the panel 31 along the periphery of the opening 42. 61. Therefore, by making the O-ring 46 provided on the side of the door 61 snap to the door 61, when the door 61 is closed, no matter whether the FOUP 7 is connected or not, the outflow of gas from the opening 42 can be suppressed. , can save more gas.

In addition, since the elastic materials for sealing are the O-rings 44 and 46, the sealing structure can be constructed at low cost.

In addition, the EFEM 1 of this embodiment includes the aforementioned load port 3 and the frame body 2 constituting the wafer transfer chamber, and a gasket 37 as a sealing member is provided between the panel 31 constituting the load port 3 and the frame body 2 . Therefore, the airtightness in the wafer transfer chamber 2 can be improved, the outflow of gas to the outside or the inflow of gas from the outside can be suppressed, and the management of the gas atmosphere in the wafer transfer chamber 2 can be easily performed, while maintaining a clean state and reducing management costs. required fee.

In addition, since the inside of the wafer transfer chamber 2 is formed from above Therefore, even if particles are generated due to the elastic connection of the O-rings 44 and 46 as elastic materials, the particles can be moved downward by the fluid facing downward while the door 61 or cover 72 is open, without attached to the wafer W being transported.

&lt;Second Embodiment&gt;

Fig. 15 shows a window unit 104 constituting part of the EFEM 101 and the load port 103 of the second embodiment. The door portion 61 shown in the same figure is the same as that of the first embodiment, and the points other than the window unit 104 have the same configuration as that of the first embodiment. In the present embodiment, the same parts as in the first embodiment are given the same reference numerals, and description thereof will be omitted.

In the window unit 104, a gasket 144 as a plate-shaped elastic material is provided in a portion near the periphery of the opening 142 in front of the window frame portion 141 . The gasket 144 has a substantially rectangular frame shape and has the same size as the opening 142 . And, similarly, it is sandwiched and fixed between a substantially rectangular frame-shaped baffle 143 and the window frame portion 141 .

Also as shown in FIG. 16, the back of the window frame portion 141 is similar to the front, using a substantially rectangular frame-shaped baffle plate 145 to fix a washer 146 which is a plate-shaped elastic material constituting a substantially rectangular frame shape.

The gaskets 144 and 146 are made of a rubber material with little gas penetration, and abut against the abutting surface 71b of the FOUP 7 or the thin-walled portion 61a of the door 61 to improve sealing performance.

The gaskets 144, 146 are properly changed in hardness or thickness to increase the contact area with the abutting surface 71b of the FOUP 7 or the door portion 61, which can improve Due to the design of high adhesion performance, it is not necessary to install the clamping unit 5 shown in the first embodiment on the window frame portion 141 . However, when a high sealing performance is required due to an increase in the pressure difference between the inside and outside, the clamping unit 5 may be provided to improve the adhesion performance.

Even in the case of the above-mentioned configuration, the same effect as that of the above-mentioned first embodiment can be obtained.

In addition, since the elastic material for sealing is formed in a plate shape, the sealing structure can be formed at low cost.

&lt;Third Embodiment&gt;

FIG. 17 shows a window unit 204 constituting part of the EFEM 201 and the load port 203 of the third embodiment. The door portion 61 shown in the figure is the same as that of the first and second embodiments, and the points other than the window unit 204 are the same as those of the first embodiment. In this embodiment, the same reference numerals are assigned to the same parts as those in the first and second embodiments, and description thereof will be omitted.

In the window unit 204 , a sealing member 244 serving as an elastic member extending slightly inward from the periphery of the opening 242 is specifically provided in a portion near the periphery of the opening 242 serving as the window frame portion 241 .

The sealing member 244 is formed in a substantially rectangular frame shape as shown in FIG. 18(a) and has a cross-sectional shape as shown in FIG. 18(b). A flat plate portion 244a is formed on the outer peripheral side, and a branch branching into an inverted Y is formed on the inner peripheral side. The two elastic portions 244b, 244c of the font. The elastic portions 244b and 244c are each formed in a shape protruding from the inside of the flat plate portion 244a while being curved and protruding to the front and rear. Due to the above shape, the elastic part 244b and 244c have a large amount of deformation and can be easily deformed in the front-rear direction.

When the above-mentioned shape of the sealing member 244 is from another point of view, the elastic portion 244b of an elastic material protruding forward for sealing between the FOUP 7 and the door portion 61 may be formed integrally through the flat plate portion 244a. The elastic portion 244c is an elastic material protruding forward for sealing.

As shown in FIG. 19, the sealing member 244 is fixed between the window frame portion 241 and a substantially rectangular frame-shaped baffle plate 243 formed behind it, sandwiching the flat plate portion 244, and is fixed from the window frame portion 241. The opening 242 of the opening 242 locates the elastic portions 244b, 244c on the inside.

The elastic parts 244b, 244c can be elastically connected to the abutting surface 71b of the FOUP 71 and the thin-walled part 61a of the door part 61 to perform sealing. At this time, the elastic portions 244b and 244c can be greatly elastically deformed. The contact area between the contact surface 71b of the FOUP 71 and the thin wall portion 61a of the door portion 61 can be enlarged and made uniform, and high sealing performance can be obtained. Therefore, similarly to the second embodiment, it is not necessary to provide the clamping unit 5 as shown in the first embodiment in the frame window portion 141, but when higher sealing performance is required, the clamping unit 5 may be provided to improve the adhesion performance. constitute.

Also in the case of the above configuration, the same effect as that of the above-mentioned first embodiment can be obtained.

In addition, since the elastic portion 244b of elastic material provided on the side of the loading table 34 and the elastic portion 244c of elastic material provided on the side of the door 61 are integrally formed for sealing, the sealing structure can be constituted with a small number of components, A reduction in manufacturing costs can also be achieved.

In addition, the specific structure of each part is not limited to the above-mentioned embodiment.

For example, in the above-mentioned embodiment, the window unit 4 is attached to the panel body part 31b to constitute the panel 31 as a plate-shaped part, but both may be integrally formed without distinction. Specifically, the window frame portion 41 constituting the window unit 5 may not be divided from the panel main body portion 31 b but may be integrally configured.

And in the first embodiment, since the sealing between the window frame portion 41 and the door portion 61 is performed, although the O-ring 46 is provided behind the window frame portion 41, as shown in FIG. 20, the window unit 304 and the The door portion 361 is deformed. That is, instead of the rear of the window frame portion 341, the dovetail groove 345 is formed in the thin wall portion 361a of the door portion 361, and the O-ring 346 is inserted and installed inside. The same sealing performance is obtained by making the thin wall portion 361a of the door portion 361 contact the rear surface of the window frame portion 341 .

In addition, in the above-mentioned embodiment, the gas supply nozzle 34c of the gas supply means is incorporated into the mounting table 34 to form a so-called bottom purge method in which the gas is supplied from the lower side in the FOUP 7, but the gas supply nozzle 34c may also be combined. The inlet portion 61 constitutes a so-called front purge system in which gas is supplied from the front side in the FOUP 7 . Also, the loading port 3 may not be equipped with gas supply means, that is, a so-called purge station, etc., which is separately formed from the loading port toward the gas supply device in the FOUP3, is preliminarily supplied to the state of increasing the pressure in the FOUP7 and installed in the loading port. When port 3 is used, the above-mentioned effect can also be obtained.

Moreover, although the above-mentioned embodiment uses nitrogen as the supply The gas in EFEM1 and FOUP7 can be used, but various gases such as air and ozone can also be used according to the treatment.

Also, although the above-mentioned embodiment uses the FOUP 7 as the wafer storage container, it can also be configured in the same way when other types of wafer storage containers are used, and the above-mentioned effects can also be obtained.

Other configurations can be modified in various ways without departing from the gist of the present invention.