Ic chip appearance inspection module

IC chip appearance inspection module

IC CHIP APPEARANCE INSPECTION MODULE

The present invention relates to an IC chip appearance inspection module, in particular to an IC chip appearance inspection module with adjustable optical IC chip stage spacing.

In the semiconductor device manufacturing process, after the IC (Integrated Circuit) chip is manufactured and tested, it usually undergoes an appearance inspection before leaving the factory to ensure that the appearance of the IC chip is complete.

Please refer to Figures 1A~1D for a schematic diagram of the inspection steps of the conventional IC chip appearance inspection module. As shown in Figure 1A, the appearance inspection method of the IC chip appearance inspection module 9 currently on the market uses a suction nozzle 91 The linear transfer device 90 transfers an IC chip 92 to an inspection module formed by four optical IC inspection sockets 95. Each optical IC inspection socket 95 has a mirror 951 that can reflect The image of the IC chip 92, because there are four optical IC inspection sockets 95 that can simultaneously view the four sides of the IC chip 92, plus the bottom surface of the IC chip 92, the imaging module (not shown) can be used once. At the same time, check whether the five faces of the IC chip 92 are complete in appearance.

As shown in Figures 1B and 1C, after the linear transfer device 90 transfers the IC chip 92 to the top of the inspection module, the linear transfer device 90 moves the IC chip 92 down to the fixed point of the optical IC inspection stand 95 for fetching Like module view. As shown in FIG. 1D, after the inspection is completed, the linear transfer device 90 moves the IC chip 92 upward, and after the upward movement, the linear transfer device 90 moves the IC chip 92 forward to the next stage.

As shown above, the above-mentioned conventional IC chip appearance inspection module 9 can only take one IC chip 92 at a time, and is limited by the structural limitation of the inspection module 9, so the linear transfer device 90 needs to pick up the IC chip 92. The image can only be captured by shifting to a fixed point and then lowering to the fixed point of the optical IC inspection stand 95. After the image has been captured, the linear transfer device 90 needs to rise again and then move to another location before the next image capture can be performed. The overall mechanism needs to be increased, resulting in the inability to increase the inspection capacity for inspecting the appearance of IC chips, which is not very ideal, and there is room for improvement.

This is the reason for the inventor. Based on the spirit of active invention and creation, he was eager to think of an "IC chip appearance inspection module" that could solve the above-mentioned problems. After several researches and experiments, the invention was finally completed.

The IC chip appearance inspection module of the present invention is used for the appearance inspection of an IC chip, and includes: a machine, two optical IC inspection stands, an imaging module and a driving device. The machine has a conveying unit, the two optical IC inspection bases are correspondingly arranged on the machine, the image capturing module is arranged on the machine; the driving device is connected to the two optical IC inspection bases, thereby Adjust the distance between the two optical IC inspection seats according to the size of the IC chip.

Therefore, the present invention can quickly adjust the distance between the two optical IC inspection bases according to different IC chip sizes through the adjustable optical IC inspection base, and the overall machine has an adjustable optical IC inspection base, which can reduce Optical IC inspection sockets need to be re-purchased and replaced due to different IC chip sizes, which reduces the cost of developing fixtures.

Each of the above-mentioned optical IC inspection mounts has a reflector, and the reflector can reflect the image of the IC chip.

The two optical IC inspection seats can be driven by a motor and a belt, and the distance between the two optical IC inspection seats can be adjusted according to the size of the IC chip.

In addition, the conveying unit can be a conveying belt or a conveying track or other equivalent conveying mechanism.

In addition, the above-mentioned machine table may be provided with a nozzle steering mechanism connected with the conveying unit. The nozzle steering mechanism includes a motor, a rack and at least one nozzle, and each nozzle has a nozzle head and A gear that meshes with the rack, the motor can drive the rack to slide linearly, and then drive each suction nozzle to rotate horizontally at a specific angle; wherein, the conveying unit transfers the head of each suction nozzle to the two Between optical IC inspection bases, the imaging module first inspects the images of the corresponding two sides of the IC chip sucked on each nozzle head, and then rotates the nozzle steering mechanism by 90° horizontally for inspection The other side of the IC chip corresponds to the image on both sides.

Therefore, the present invention can use the nozzle turning mechanism. After the nozzle turning mechanism is positioned by the conveyor unit of the machine, there is no need to perform up and down movements. The four-sided image of the IC chip can be obtained by rotating motion, which can reduce the number of machines. The conveying unit moves up and down, effectively increasing the productivity of IC chip appearance inspection.

In addition, another aspect of the IC chip appearance inspection module of the present invention includes: a machine, two optical IC inspection bases, an imaging module, and a driving device. Wherein, the machine has a conveying unit; the two optical IC inspection bases are correspondingly arranged on the machine, and each optical IC inspection base is L-shaped; the imaging module is arranged on the machine The driving device is connected to the two optical IC inspection bases, and the driving device can adjust the distance between the two optical IC inspection bases according to the size of the IC chip.

The above-mentioned driving device can be a motor for driving the two optical IC inspection bases. In addition, the above-mentioned two optical IC inspection bases can be arranged on a base, and the two optical IC inspection bases and the base are respectively provided with a sliding groove and a sliding rail corresponding to each other, and each optical IC inspection base Connect a rack, and the motor connects and drives the rack and each optical IC inspection base, so that each optical IC inspection base is on the base, and the two optics are adjusted through the sliding groove and the sliding rail. The distance between adjacent IC test sockets.

The base can be provided with an opening, and the image capturing module can be accommodated under the opening.

In addition, another aspect of the IC chip appearance inspection module of the present invention includes: a machine, two optical IC inspection bases, an imaging module, and a driving device. Wherein, the machine has a conveying unit; the two optical IC inspection bases are correspondingly arranged on two bases, the two bases are set on the machine, and each optical IC inspection base is L The imaging module is set on the machine; the driving device is connected to the two bases, so as to adjust the distance between the two optical IC inspection bases according to the size of the IC chip.

The above-mentioned driving device may be a motor for driving the two bases, whereby the motor can be driven to slide to adjust the distance between the two bases, thereby adjusting the distance between the two optical IC inspection bases. In addition, the image capturing module can be accommodated under the two bases.

The above summary and the following detailed description are all exemplary in order to further illustrate the patent application scope of the present invention. The other objectives and advantages of the present invention will be described in the following description and drawings.

Please refer to Figure 2, Figure 3, Figure 4 and Figure 5, which are the three-dimensional view of the IC chip appearance inspection module of the first preferred embodiment of the present invention, the three-dimensional view of the IC chip appearance inspection module from another perspective, and the nozzle The three-dimensional view of the steering mechanism and the three-dimensional view of the optical IC inspection base. The IC chip appearance inspection module 1 of this embodiment includes a machine 10, two optical IC inspection seats 20, an imaging module 2, a driving device, and a nozzle steering mechanism 40.

As shown in FIG. 2, the machine 10 has a conveying unit 11, two optical IC inspection seats 20, an image capturing module 2, and a nozzle steering mechanism 40 are all set on the machine 10, and the two optical The IC inspection stand 20 is correspondingly arranged on the machine 10. In addition, the nozzle steering mechanism 40 is connected to the conveying unit 11. The nozzle steering mechanism 40 includes a motor 41, a rack 42 and eight nozzles 43. Each nozzle 43 has a nozzle head 431 and a nozzle head 431. The gear 432 meshed with the rack 42 can drive the rack 42 to slide linearly by the motor 41, thereby driving each suction nozzle 43 to rotate horizontally by a specific angle. Wherein, each nozzle head 431 can suck an IC chip 45, and the conveying unit 11 of the machine 10 transfers each nozzle head 431 between the two optical IC inspection bases 20, and each optical IC inspection base 20 has a reflector 21 for reflecting the image of the IC chip 45. The image capturing module 2 first looks at the images of the corresponding two sides of the IC chip 45, and then rotates 90 horizontally by the nozzle turning mechanism 40 ° (as shown in Figure 4) to view the images of the other corresponding two sides of the IC chip 45.

In this embodiment, the driving device for driving the two optical IC inspection bases 20 refers to a motor 22 and a belt 23, that is, the two optical IC inspection bases 20 are driven by the motor 22 and the belt 23, according to the The size of the IC chip 45 adjusts the distance between the two optical IC inspection seats 20. In addition, the conveying unit 11 may be a conveying belt or a conveying track. The image capturing module 2 can be a camera, and the image capturing module 2 can capture images of the IC chip 45 on the two optical IC inspection pedestals 20.

Therefore, in this embodiment, the adjustable optical IC inspection base 20 can quickly adjust the distance between the two optical IC inspection bases 20 according to different IC chip 45 sizes, and the overall machine 10 has an adjustable optical IC. The inspection base 20 can reduce the cost of repurchasing and replacing the optical IC inspection base 20 due to different IC chip 45 sizes, and reduces the cost of developing fixtures. In addition, this embodiment can also use the nozzle turning mechanism 40. After the nozzle turning mechanism 40 is positioned by the conveying unit 11 of the machine 10, there is no need to perform up and down movements. The four sides of the IC chip 45 can be obtained by rotating. The image can reduce the up and down movement of the conveying unit 11 of the machine 10, and effectively increase the productivity of the appearance inspection of the IC chip 45.

Please refer to FIG. 6 which is a perspective view of the optical IC inspection base of the second preferred embodiment of the present invention. The optical IC inspection base 201 of this embodiment has a reflector 211 which is similar to the optical IC inspection base of the first embodiment. The reflectors 21 of 20 are the same, and the overall structure is almost the same. The only difference is that the area of the optical IC inspection base 201 of the second embodiment is larger, and the area of the reflector 211 on the optical IC inspection base 201 is larger. It is also larger and can reflect the images of multiple IC chips 45 at the same time, that is, it can be used for appearance inspection of multiple IC chips 45 at a time.

From the above description, it can be seen that the second embodiment, like the first embodiment, has the ability to quickly adjust the distance between the two optical IC inspection sockets 201, which can reduce the need for re-purchasing and replacement of the optical IC inspection socket 201 due to different IC chip 45 sizes. Cost, reduce the cost of developing fixtures. In addition, in this embodiment, the nozzle steering mechanism 40 can also be used to obtain the four-sided image of the IC chip 45 by rotating without the need for up and down movements. This can reduce the up and down movement of the conveying unit 11 of the machine 10 and effectively improve The production capacity of IC chip 45 appearance inspection.

Please refer to FIG. 7 which is a three-dimensional view of the optical IC inspection base of the third preferred embodiment of the present invention, and also refer to FIG. 2. The main difference between the structure of this embodiment and the first embodiment is that the optical IC inspection base 70 of this embodiment is L-shaped, while the optical IC inspection base 20 of the first embodiment is rectangular, and the overall structure of this embodiment The nozzle turning mechanism 40 of the first embodiment is not required.

The IC chip appearance inspection module 6 of this embodiment can simultaneously inspect the appearance of four IC chips 45. The inspection of each IC chip 45 needs to correspond to two optical IC inspection seats 70 and an imaging module 2 (drawn in Figure 2). ) And a driving device, which will be explained first. Here, the inspection of a single IC chip 45 is used for illustration. The IC chip appearance inspection module 6 of this embodiment includes a machine 10 (shown in FIG. 2), two optical IC inspection seats 70, and an imaging module 2 , A base 72 and a driving device. The machine 10 has a conveying unit 61; two optical IC inspection bases 70 and image capturing modules 2 are all arranged on the machine 10, and each optical IC inspection base 70 is L-shaped; the driving device is connected to the two optical IC inspection bases. For the IC inspection base 70, the driving device can adjust the distance between the two optical IC inspection bases 70 according to the size of the IC chip 45. In this embodiment, the base 72 is provided with an opening 721, and the image capturing module 2 is accommodated under the opening 721. The image capturing module 2 can be a camera, which can inspect two optical ICs. The IC chip 45 on the base 70 captures images.

In this embodiment, the driving device for driving the two optical IC inspection pedestals 70 refers to the motor 65. As shown in FIG. 7, the two optical IC inspection sockets 70 are arranged on a base 72. Each optical IC inspection socket 70 is L-shaped, and each optical IC inspection socket 70 has an L-shaped reflector. 71. To reflect the image of the IC chip 45, each optical IC inspection seat 70 and the base 72 are respectively provided with a sliding groove 66 and a sliding rail 67 corresponding to each other, and a rack 68 and an optical IC inspection The base 70 and the motor 65 are connected. Therefore, the motor 65 can adjust the distance between the two optical IC inspection bases 70 through the sliding groove 66 and the sliding rail 67 by driving the rack 68.

The conveying unit 61 on the machine 10 of this embodiment is connected to four suction nozzles 43. Each suction nozzle 43 has a suction nozzle head 431. Each suction nozzle head 431 can suck an IC chip 45. The conveying unit 61 of the table 10 can transfer the four nozzle heads 431 between the eight optical IC inspection bases 70, that is, the conveying unit 61 on the machine 10 can convey each nozzle head 431 and its suction An IC chip 45 is located between two corresponding optical IC inspection sockets 70.

Please refer to FIGS. 8A-8C for a schematic diagram of the inspection steps of the optical IC inspection stand of the third preferred embodiment of the present invention. The appearance inspection method of the IC chip appearance inspection module 6 of this embodiment is first driven and adjusted by a motor 65 The distance between the two optical IC inspection seats 70 expands the distance so that the IC chip 45 sucked by the nozzle head 431 can enter, and the four nozzle heads 431 are transferred to the position by the conveying unit 61 (as shown in FIG. 8A). Show). Then, the motor 65 is used to drive and adjust the distance between the two optical IC inspection bases 70 (as shown in 8B), because the optical IC inspection base 70 and the reflector 71 provided on the optical IC inspection base 70 of this embodiment are all L-shaped. Therefore, the four sides of the IC chip 45 can be viewed at the same time, and the image is reflected to the imaging module 2 (shown in FIG. 2) to capture the image of the IC chip 45. After the image capture is completed, the motor 65 is used to drive and adjust the distance between the two optical IC inspection seats 70 to expand the distance, and the conveying unit 61 is used to transfer the four nozzle heads 431 to the next stage (such as Shown in Figure 8C).

Please refer to FIG. 9 is a three-dimensional view of the optical IC inspection stand of the fourth preferred embodiment of the present invention. The IC chip appearance inspection module 8 of this embodiment has roughly the same structure as that of the third embodiment. The optical IC of this embodiment The inspection base 86 is also L-shaped like the optical IC inspection base 70 of the third embodiment, and the overall structure of this embodiment does not require the nozzle turning mechanism 40. The difference between this embodiment and the third embodiment lies in the difference between this embodiment and the third embodiment. The two optical IC inspection bases 86 are assembled on the two bases 83 and 84 respectively. The two bases 83 and 84 respectively have an opening 831, 841. The two bases 83 and 84 can be connected to a driving device (not shown), The two optical IC inspection sockets 86 on the two symmetrical bases 83 and 84 are caused to move away or approach, that is, the driving device can adjust the distance between the two optical IC inspection sockets 86 according to the size of the IC chip 45.

That is, the IC chip appearance inspection module 8 of this embodiment includes a machine 10 (drawn in FIG. 2), two optical IC inspection bases 86, an imaging module 2 (drawn in FIG. 2), and two bases 83,84 and a driving device. The machine 10 has a conveying unit 81; two optical IC inspection bases 86 and the image capturing module 2 are all installed on the machine 10, and each optical IC inspection base 86 is L-shaped. The driving device is connected to the two bases 83 and 84, and the driving device can adjust the distance between the two optical IC inspection seats 86 according to the size of the IC chip 45. In this embodiment, the driving device is the same as the motor of the first embodiment.

Therefore, the third and fourth embodiments can use the adjustable optical IC inspection bases 70, 86 to quickly adjust the distance between the two optical IC inspection bases 70, 86 according to different IC chip 45 sizes. The machine 10 has adjustable optical IC inspection bases 70, 86, which can reduce the cost of repurchasing and replacing the optical IC inspection bases 70, 86 due to different IC chip 45 sizes, and reduce the cost of developing fixtures.

The above-mentioned embodiments are merely examples for the convenience of description, and the scope of rights claimed in the present invention should be subject to the scope of the patent application, rather than being limited to the above-mentioned embodiments.

<p>1, 6, 8: IC chip appearance inspection module <br />10: Machine <br />11, 61, 81: Conveying unit <br />2: Acquisition module <br />20, 201, 70, 86: optical IC inspection seat <br />21, 211, 71: Reflector <br />22, 65: Motor <br />23: belt <br />40: Nozzle steering mechanism <br />41: Motor <br />42,68: rack <br />43: Nozzle <br />431: Nozzle Head <br />432: Gear <br />45: IC chip <br />66: Chute <br />67: Slide <br />72, 83, 84: pedestal <br />721,831,841: opening <br />9: IC chip appearance inspection module <br />90: Linear transfer device <br />91: Nozzle <br />92: IC chip <br />95: Optical IC inspection base <br />951: Reflector</p>

Figures 1A~1D are schematic diagrams of the inspection steps of the conventional IC chip appearance inspection module. <br />Fig. 2 is a perspective view of the IC chip appearance inspection module according to the first preferred embodiment of the present invention. <br />3 is another perspective view of the IC chip appearance inspection module of the first preferred embodiment of the present invention. <br />Fig. 4 is a perspective view of the nozzle turning mechanism of the first preferred embodiment of the present invention. <br />Fig. 5 is a perspective view of the optical IC inspection stand of the first preferred embodiment of the present invention. <br />Fig. 6 is a perspective view of the optical IC inspection stand of the second preferred embodiment of the present invention. <br />Fig. 7 is a three-dimensional view of the optical IC inspection stand of the third preferred embodiment of the present invention. <br />8A-8C are schematic diagrams of the inspection steps of the optical IC inspection seat of the third preferred embodiment of the present invention. <br />Fig. 9 is a perspective view of the optical IC inspection stand of the fourth preferred embodiment of the present invention.

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