Method for manufacturing semiconductor device

Manufacturing method of semiconductor device

Method for manufacturing semiconductor device

The present invention relates to a method of manufacturing a semiconductor device using an oxide semiconductor.

In recent years, a technique of forming a thin film transistor (TFT) using a semiconductor thin film (thickness of about several nm to several hundreds nm) formed on a substrate having an insulating surface has attracted attention. Thin film transistors are widely used in electronic devices such as ICs or electro-optical devices. In particular, the research and development of thin film transistors as switching elements of image display devices has become increasingly popular.

There are many types of metal oxides and a wide range of uses. Indium oxide is a relatively common material, which is used as a transparent electrode material required for liquid crystal displays and the like.

Among the metal oxides, there are metal oxides exhibiting semiconductor characteristics. As metal oxides exhibiting semiconductor characteristics, for example, there are tungsten oxide, tin oxide, indium oxide, zinc oxide, etc., and thin film transistors that use these metal oxides exhibiting semiconductor characteristics as channel formation regions are already well known (see patent Documents 1 to 4, Non-Patent Document 1).

In addition, it is known that metal oxides are not only monobasic oxides but also multicomponent oxygens. Chemical.For example, as a multi-element oxide containing In, Ga, and Zn, InGaO having a homogeneous series₃(ZnO)_m(m: natural number) is well known (refer to Non-Patent Documents 2 to 4).

In addition, it has been confirmed that an oxide semiconductor composed of an In-Ga-Zn-based oxide as described above can be used as a channel layer of a thin film transistor (see Patent Document 5 and Non-Patent Documents 5 and 6).

[Patent Document 1] Japanese Patent Application Publication No. 60-198861

[Patent Document 2] Japanese Patent Application Publication No. 8-264794

[Patent Document 3] PCT International Application Japanese Publication No. 11-505377

[Patent Document 4] Japanese Patent Application Publication No. 2000-150900

[Patent Document 5] Japanese Patent Application Publication No. 2004-103957

[Non-Patent Document 1] MW Prins, KO Grosse-Holz, G. Muller, JFM Cillessen, JB Giesbers, RP Weening, and RM Wolf, "A ferroelectric transparent thin-film transistor", Appl . Phys. Lett., 17 June 1996, Vol. 68 p. 3650-3652

[Non-Patent Document 2] M. Nakamura, N. Kimizuka, and T. Mohri, "The Phase Relations in the In₂O₃-Ga₂ZnO₄-ZnO System at 1350 °C" (In₂O₃-Ga₂ZnO₄-ZnO type at 1350°C Phase relationship), J. Solid State Chem., 1991, Vol. 93, p. 298-315

[Non-Patent Document 3] N. Kimizuka, M. Isobe, and M. Nakamura, "Syntheses and Single-Crystal Data of Homologous Compounds, In₂O₃(ZnO)_m (m=3, 4, and 5), InGaO₃(ZnO)₃, and Ga₂O₃(ZnO)_m (m=7, 8, 9, and 16) in the In₂O₃-ZnGa₂O₄-ZnO System" (Synthesis and single crystal data of homogeneous materials, In₂O₃-ZnGa₂O₄-ZnO type In₂O₃(ZnO)_m (m=3, 4, and 5), InGaO₃(ZnO)₃, and Ga₂O₃(ZnO)_m (m=7, 8, 9, and 16)), J. Solid State Chem., 1995, Vol. 116, p. 170-178

[Non-Patent Document 4]: M. Nakamura, N. Kimizuka, T. Mohri, and M. Isobe, "Syntheses and crystal structures of new homologous compounds, indium iron zinc oxides (InFeO3(ZnO)m) (m: natural number ) and related compounds" (homogeneous, indium iron zinc oxide (InFeO₃(ZnO)_m) (m is a natural number) and the synthesis and crystal structure of its homologous compounds), KOTAI BUTSURI (SOLID STATE PHYSICS), 1993, Vol. 28, No. 5, p. 317-327

[Non-Patent Document 5] K. Nomura, H. Ohta, K. Ueda, T. Kamiya, M. Hirano, and H. Hosono, "Thin-film transistor fabricated in single-crystalline transparent oxide semiconductor" Thin film transistors made of oxide semiconductors), SCIENCE, 2003, Vol. 300, p. 1269-1272

[Non-Patent Document 6] K. Nomura, H. Ohta, A. Takagi, T. Kamiya, M. Hirano, and H. Hosono, "Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors", NATURE , 2004, Vol. 432 p. 488-492

One of the objects of the present invention is to provide a highly reliable semiconductor device including a thin film transistor with stable electrical characteristics.

In the following method of manufacturing a semiconductor device, the purity of the oxide semiconductor layer is increased and the heat treatment (heat treatment for dehydration or dehydrogenation) to reduce moisture or the like as an impurity is performed, the semiconductor device including a semiconductor device including a channel forming region The semiconductor layer, the source region, and the drain region use thin film transistors of an oxide semiconductor layer. In addition, it not only reduces impurities such as moisture present in the semiconductor layer, but also reduces impurities such as moisture present in the gate insulating layer, and also reduces impurities such as moisture present at the interface between the oxide semiconductor layer and the film contacting it. .

In this specification, the oxide semiconductor film used for the semiconductor layer including the channel formation region will be referred to as the first oxide semiconductor film (first oxide semiconductor layer), and will be used for the oxidation of the source region and the drain region. The material semiconductor film is referred to as a second oxide semiconductor film (second oxide semiconductor layer).

In order to reduce impurities such as moisture, after forming the first oxide semiconductor film and the second oxide semiconductor film, the first oxide semiconductor film is used under an inert atmosphere of nitrogen or a rare gas (argon, helium, etc.) or under reduced pressure. as well as The exposed state of the second oxide semiconductor film is subjected to heat treatment at 200° C. or higher, preferably 400° C. or higher and 600° C. or lower, in order to reduce the moisture contained in the first oxide semiconductor film and the second oxide semiconductor film. After heating, slow cooling is performed in an oxygen atmosphere to a range of room temperature or higher and lower than 100°C.

The use of the first oxide semiconductor film and the second oxide semiconductor film that reduce the moisture contained in the film by heat treatment under an inert atmosphere such as nitrogen or argon or under reduced pressure can improve the electrical characteristics of the thin film transistor and realize Thin film transistors with both mass productivity and high functionality.

FIG. 29 shows the results of measuring a plurality of samples subjected to heat treatment by the thermal desorption method (TDS: Thermal Desorption Spectroscopy) using a thermal desorption device under the conditions of the heating temperature.

The thermal desorption device is a device that uses a quadrupole mass spectrometer to detect the gas components detached from the sample when the sample is heated/increased in a high vacuum. The gas and molecules detached from the surface and inside of the sample can be observed. The thermal desorption device (product name: 1024amuQMS) manufactured by Electronic Science Co., Ltd. was used, and the measurement conditions were as follows:^-8(Pa) Start the measurement, and the vacuum degree during the measurement is 1×10^-7(Pa) Around. In addition, the SEM voltage was set to 1500V, the dwell time (Dwell Time) was set to 0.2 [sec], and the number of channels used was set to 23. In addition, H₂The ionization coefficient of O is set to 1.0, and H₂The fragmentation coefficient of O is set to 0.805, and H₂The pass-through coefficient of O is set to 1.56, and H₂The pumping rate of O is set to 1.0.

In Figure 29, the following samples are compared to show that the H₂For the TDS measurement of O, the above-mentioned sample is a sample (Sample 1) in which an In-Ga-Zn-O-based non-single crystal film with a thickness of 50 nm is formed on a glass substrate; the heating temperature is set to 250 °C and performed in a nitrogen atmosphere. One-hour heat-treated sample (Sample 4); In a nitrogen atmosphere, the heating temperature is set to 350°C and heat-treated for 1 hour (Sample 3); In a nitrogen atmosphere, the heating temperature is set to 450°C and perform A sample heated for 1 hour (Sample 5); a sample heated at 350°C for 10 hours in a nitrogen atmosphere (Sample 6). According to the results in Fig. 29, it can be seen that the higher the heating temperature in the nitrogen atmosphere, the higher the moisture (H₂O) and other impurities are reduced.

In addition, according to the graph of Fig. 29, it was confirmed that the moisture (H₂O) and the first peak of the desorption of impurities and the indicated moisture (H₂O) The second peak of the separation of impurities.

In addition, the sample which was then placed in a nitrogen atmosphere and heat-treated at 450°C in the atmosphere at room temperature was not observed to desorb water at a temperature of 200°C or higher. It can be seen that the heat treatment of In-Ga-Zn -O type non-single crystal film stabilization.

In addition, when measured by TDS in addition to H₂In addition to O measurement, H, O, OH, H₂, O₂, N, N₂And Ar are measured separately, you can clearly observe H₂Peaks of O, H, O and OH, but no H is observed₂, O₂, N, N₂And the peak of Ar. The sample uses an In-Ga-Zn-O non-single crystal film formed on a glass substrate with a thickness of 50nm. The heating conditions are In a nitrogen atmosphere at 250°C for 1 hour, in a nitrogen atmosphere at 350°C for 1 hour, in a nitrogen atmosphere at 350°C for 10 hours, and in a nitrogen atmosphere at 450°C for 1 hour, and as a comparative example, the heat treatment was not applied. The In-Ga-Zn-O non-single crystal film and the glass substrate are compared. Fig. 30 shows the TDS result of H, Fig. 31 shows the TDS result of O, Fig. 32 shows the TDS result of OH, and Fig. 33 shows H₂The TDS results. In addition, the oxygen density of the nitrogen atmosphere under the above heating conditions is 20 ppm or less.

From the above results, it can be seen that the heat treatment of the In-Ga-Zn-O-based non-single crystal film mainly releases moisture. In other words, by heating the water (H₂O) Mainly detached from the In-Ga-Zn-O-based non-single crystal film, and the substances generated by the decomposition of water molecules affect the TDS of H shown in FIG. 30, O shown in FIG. 31, and OH shown in FIG. 32 measured value. In addition, since it is considered that hydrogen and OH are also contained in the In-Ga-Zn-O-based non-single crystal film, hydrogen and OH are also released by the heat treatment.

In this specification, heat treatment under an inert atmosphere of nitrogen or rare gas (argon, helium, etc.) or under reduced pressure is referred to as heat treatment for dehydration or dehydrogenation. In this manual, not only will H₂The state of separation is referred to as dehydrogenation, and the state of separation of H, OH, etc. is also referred to as dehydration or dehydrogenation for convenience.

The heat treatment in an inert gas atmosphere reduces the impurities contained in the oxide semiconductor layer (H₂O, H, OH, etc.) to increase the carrier density, and then slowly cool in an oxygen atmosphere. After slow cooling, an oxide insulating film or the like is formed in contact with the oxide semiconductor layer to reduce the carrier density of the oxide semiconductor layer to improve reliability.

The resistance of the first oxide semiconductor film and the second oxide semiconductor film is reduced by heat treatment in a nitrogen atmosphere (improved carrier density, preferably 1×10¹⁸/cm³The above), so that the first oxide semiconductor film and the second oxide semiconductor film that have been reduced in resistance can be formed. The first oxide semiconductor film and the second oxide semiconductor film reduced in resistance are processed by an etching process to form a first oxide semiconductor layer and a second oxide semiconductor layer, and the semiconductor layer is processed by an etching process to form a semiconductor layer , Source area and drain area.

Then, when the oxide insulating film is formed in contact with the low-resistance first oxide semiconductor layer, at least the region of the low-resistance first oxide semiconductor layer that is in contact with the oxide insulating film can be increased. Resistance (decrease in carrier density, preferably less than 1×10¹⁸/cm³) To form a high-resistance oxide semiconductor region. In the method of manufacturing a semiconductor device, heating under an inert atmosphere (or under reduced pressure), slow cooling under an oxygen atmosphere, and formation of an oxide insulating film are used to increase or decrease the first oxide semiconductor film and the second oxide. The carrier density of the semiconductor film is important. In addition, it can also be said that the first oxide semiconductor film and the second oxide semiconductor film of type I are subjected to a heat treatment for dehydration or dehydrogenation, so that the first oxide semiconductor film and the second oxide semiconductor film become Oxygen-deficient type and make it N-type (N^-, N⁺Etc.), and then the first oxide semiconductor layer is made into an I-type by forming an oxide insulating film to put the first oxide semiconductor layer in an over-oxygen state. As described above, a semiconductor device including a thin film transistor with high electrical characteristics and high reliability can be manufactured and provided.

In addition, contact with the low-resistance first oxide semiconductor layer topography The formed oxide insulating film is used to block moisture, hydrogen ions, OH^-As an inorganic insulating film containing impurities, specifically, a silicon oxide film or a silicon oxynitride film is used.

In addition, it is also possible to form an oxide insulating film as a protective film on the semiconductor layer, the source region and the drain region, and then perform the second heating. When an oxide insulating film as a protective film is formed on the semiconductor layer, the source region, and the drain region, and then the second heating is performed, the unevenness of the electrical characteristics of the thin film transistor can be reduced.

In one embodiment of the structure of the invention disclosed in this specification: forming a gate electrode layer; forming a gate insulating layer on the gate electrode layer; forming a first oxide semiconductor film on the gate insulating layer; A second oxide semiconductor film is formed on the oxide semiconductor film; the first oxide semiconductor film and the second oxide semiconductor film are heated for dehydration or dehydrogenation, and then slowly cooled in an oxygen atmosphere; The slow cooling first oxide semiconductor film and the second oxide semiconductor film are selectively etched to form a first oxide semiconductor layer and a second oxide semiconductor layer; in the first oxide semiconductor layer and the second oxide semiconductor layer A conductive film is formed on the layer; the first oxide semiconductor layer, the second oxide semiconductor layer, and the conductive film are selectively etched to form a semiconductor layer, a source region, a drain region, a source electrode layer, and a drain electrode layer ; On the gate insulating layer, the semiconductor layer, the source region, the drain region, the source electrode layer and the drain electrode layer, an oxide insulating film contacting a part of the semiconductor layer is formed to reduce the carrier density.

In one embodiment of the structure of the invention disclosed in this specification: forming a gate electrode layer; forming a gate insulating layer on the gate electrode layer; forming a first oxide semiconductor film on the gate insulating layer; Oxide semiconductor A second oxide semiconductor film is formed on the film; the first oxide semiconductor film and the second oxide semiconductor film are heated in an inert atmosphere to increase the carrier density, and then slowly cooled in an oxygen atmosphere; The cold first oxide semiconductor film and the second oxide semiconductor film are selectively etched to form a first oxide semiconductor layer and a second oxide semiconductor layer; in the first oxide semiconductor layer and the second oxide semiconductor layer A conductive film is formed thereon; the first oxide semiconductor layer, the second oxide semiconductor layer, and the conductive film are selectively etched to form a semiconductor layer, a source region, a drain region, a source electrode layer, and a drain electrode layer; An oxide insulating film contacting a part of the semiconductor layer is formed on the gate insulating layer, the semiconductor layer, the source region, the drain region, the source electrode layer, and the drain electrode layer to reduce the carrier density.

In one embodiment of the structure of the invention disclosed in this specification: forming a gate electrode layer; forming a gate insulating layer on the gate electrode layer; forming a first oxide semiconductor film on the gate insulating layer; A second oxide semiconductor film is formed on the oxide semiconductor film; the first oxide semiconductor film and the second oxide semiconductor film are heated under reduced pressure to increase the carrier density, and then slowly cooled in an oxygen atmosphere; The first oxide semiconductor film and the second oxide semiconductor film that are slowly cooled down are selectively etched to form a first oxide semiconductor layer and a second oxide semiconductor layer; on the first oxide semiconductor layer and the second oxide semiconductor layer A conductive film is formed on the semiconductor layer; the first oxide semiconductor layer, the second oxide semiconductor layer, and the conductive film are selectively etched to form a semiconductor layer, a source region, a drain region, a source electrode layer, and a drain Electrode layer; in the gate insulating layer, semiconductor layer, source region, drain region, source electrode layer and drain electrode layer to form contacts in the semiconductor The oxide insulating film is part of the bulk layer to reduce the carrier density.

As an oxide semiconductor layer that can be used as a semiconductor layer, a source region, and a drain region, an oxide material having semiconductor characteristics may be used. For example, you can use the form expressed as InMO₃(ZnO)_m(m>0) thin film, and fabricate thin film transistors using the thin film as a semiconductor layer, a source region, and a drain region. In addition, M represents one metal element or multiple metal elements selected from Ga, Fe, Ni, Mn, and Co. For example, as M, in addition to the case where Ga is contained, there are cases where the metal element other than Ga such as Ga and Ni or Ga and Fe is contained. In addition, among the above-mentioned oxide semiconductors, there are oxide semiconductors that contain not only the metal element as M but also other transition metal elements such as Fe and Ni as impurity elements, or oxides of the transition metal. In this specification, in the case of InMO₃(ZnO)_mAmong the oxide semiconductors having a structure of (m>0), an oxide semiconductor having a structure containing at least Ga as M is referred to as an In-Ga-Zn-O-based oxide semiconductor, and this thin film is also referred to as In-Ga -Zn-O type non-single crystal film.

In addition, as an oxide semiconductor applied to the oxide semiconductor layer, in addition to the above-mentioned materials, In-Sn-Zn-O, In-Al-Zn-O, Sn-Ga-Zn-O can also be used. Type, Al-Ga-Zn-O type, Sn-Al-Zn-O type, In-Zn-O type, Sn-Zn-O type, Al-Zn-O type, In-O type, Sn-O type , Zn-O type oxide semiconductor. In addition, the above-mentioned oxide semiconductor layer may contain silicon oxide. By making the oxide semiconductor layer contain silicon oxide (SiO_x(X>0)), when heat treatment is performed after the oxide semiconductor layer is formed in the manufacturing method, it can prevent Stop crystallization. In addition, the oxide semiconductor layer is preferably in an amorphous state, but a part of the oxide semiconductor layer may be crystallized.

The oxide semiconductor is preferably an oxide semiconductor containing In, and more preferably an oxide semiconductor containing In and Ga. When the oxide semiconductor layer is made I type (intrinsic), dehydration or dehydrogenation is effective.

Used as the source and drain regions of thin film transistors (also called n⁺The oxide semiconductor layer of the layer, buffer layer) preferably has a higher conductivity than the oxide semiconductor layer used as the channel formation region.

In addition, since static electricity can easily damage the thin film transistors, it is better to provide a protection circuit for protecting the drive circuit on the same substrate as the gate line or the source electrode line. Preferably, the protection circuit is formed of a non-linear element using an oxide semiconductor.

In addition, the gate insulating layer, the first oxide semiconductor film, and the second oxide semiconductor film may be continuously connected to the gate insulating layer, the first oxide semiconductor film, and the second oxide semiconductor film so that the gate insulating layer, the first oxide semiconductor film, and the second oxide semiconductor film are not exposed to the atmosphere. Processing (also called continuous processing, insitu processing, continuous film formation). By continuously processing without contacting the atmosphere, the gate insulating layer, the first oxide semiconductor film, and the second oxide semiconductor film can not be contaminated by atmospheric components such as water or hydrocarbons or impurity elements suspended in the atmosphere. The interface is used to form each laminated interface, which can reduce the non-uniformity of the characteristics of the thin film transistor.

In this specification, continuous treatment refers to a state in which a series of processes from the first treatment process performed by the PCVD method or sputtering method to the second treatment process performed by the PCVD method or sputtering method Process In this, the atmosphere in which the substrate to be processed is arranged is not in contact with a contaminated atmosphere such as the atmosphere, but is always controlled by a vacuum or an inert gas atmosphere (nitrogen atmosphere or rare gas atmosphere). By performing continuous processing, it is possible to perform processing such as film formation and avoid re-adhesion of moisture and the like to the processed substrate to be cleaned.

The scope of continuous processing in this specification also includes the case where a series of processes from the first processing process to the second processing process are performed in the same processing chamber.

In addition, the scope of continuous processing in this specification also includes: when a series of processes from the first processing process to the second processing process are performed in different processing chambers, there is no difference between the processing chambers after the first processing process is completed. When the substrate is transported in contact with the atmosphere and the second process is performed.

In addition, the scope of continuous processing in this specification also includes: between the first processing process and the second processing process, there is a substrate transport process, an alignment process, a slow cooling process, or heating or cooling for setting the temperature required for the second process. Circumstances such as the manufacturing process of the substrate.

However, the scope of the continuous processing described in this specification does not include: a cleaning process, wet etching, resist formation, and other processes that use liquids between the first process process and the second process process.

Note that ordinal numbers such as "first" and "second" are used for convenience, and the ordinal numbers do not indicate the order of manufacturing processes or the order of stacking. In addition, it does not indicate the unique name of the matter of the specific invention in this specification.

In addition, as a display device including a driving circuit, in addition to a liquid crystal display device, a light-emitting display device using a light-emitting element, and a display device also called electronic paper using an electrophoretic display element can be cited.

In a light-emitting display device using a light-emitting element, a plurality of thin-film transistors are included in the pixel portion, and the pixel portion also has a wiring or drain connecting the gate electrode of one thin-film transistor and the source electrode of another transistor The electrode wiring part. In addition, a driving circuit of a light-emitting display device using a light-emitting element includes a portion that connects the gate electrode of the thin film transistor and the source electrode wiring or the drain electrode wiring of the thin film transistor.

In addition, in this specification, semiconductor devices refer to all devices that can perform their functions by utilizing semiconductor characteristics, and therefore optoelectronic devices, semiconductor circuits, and electronic equipment are all semiconductor devices.

It can be provided by manufacturing thin film transistors with stable electrical characteristics. Therefore, it is possible to provide a semiconductor device including a thin film transistor with good electrical characteristics and high reliability.

<p>34Oxide semiconductor layer</p><p>100Substrate</p><p>101Gate electrode layer</p><p>102Gate insulation layer</p><p>103Semiconductor layer</p><p>107Protective insulation layer</p><p>108Capacitor wiring</p><p>110Pixel electrode layer</p><p>121First terminal</p><p>122Second terminal</p><p>125Contact hole</p><p>126Contact hole</p><p>127Contact hole</p><p>128Transparent conductive film</p><p>129Transparent conductive film</p><p>131Oxide semiconductor film</p><p>132Conductive film</p><p>133Oxide semiconductor film</p><p>134Oxide semiconductor layer</p><p>135Oxide semiconductor layer</p><p>136Oxide semiconductor film</p><p>137Oxide semiconductor film</p><p>138Oxide semiconductor layer</p><p>150Second terminal</p><p>151First terminal</p><p>152Gate insulation layer</p><p>153Connect the electrode layer</p><p>154Protective insulating film</p><p>155Transparent conductive film</p><p>156electrode layer</p><p>170Thin Film Transistor</p><p>400Substrate</p><p>401Gate electrode layer</p><p>402Gate insulation layer</p><p>403Semiconductor layer</p><p>407Oxide insulating film</p><p>408Conductive layer</p><p>409Conductive layer</p><p>410Insulation layer</p><p>411Pixel electrode layer</p><p>430Oxide semiconductor film</p><p>431Oxide semiconductor layer</p><p>432Oxide semiconductor layer</p><p>433Oxide semiconductor film</p><p>434Oxide semiconductor film</p><p>435Oxide semiconductor film</p><p>436Oxide semiconductor layer</p><p>470Thin Film Transistor</p><p>471Thin Film Transistor</p><p>472Thin Film Transistor</p><p>580Substrate</p><p>581Thin Film Transistor</p><p>583Insulation film</p><p>585Insulation layer</p><p>587electrode layer</p><p>588electrode layer</p><p>589Spherical particles</p><p>594Void</p><p>595Packing</p><p>596Substrate</p><p>601Electric stove</p><p>602Processing room</p><p>603Heater</p><p>604Substrate</p><p>605Pedestal</p><p>606Gas supply unit</p><p>607Exhaust unit</p><p>703Low oxygen density layer</p><p>705High oxygen density layer</p><p>707Solid line</p><p>709dotted line</p><p>104asource area or drain area</p><p>104bsource area or drain area</p><p>105asource or drain electrode layer</p><p>105bsource or drain electrode layer</p><p>2600TFT substrate</p><p>2601Opposite substrate</p><p>2602Sealing material</p><p>2603Pixel</p><p>2604Display element</p><p>2605Coloring layer</p><p>2606Polarizer</p><p>2607Polarizer</p><p>2608Wiring circuit department</p><p>2609flexible circuit board</p><p>2610Cold cathode tube</p><p>2611Reflector</p><p>2612Circuit board</p><p>2613Diffuser plate</p><p>2700E-book reader</p><p>2701Frame</p><p>2703Frame</p><p>2705Display</p><p>2707Display</p><p>2711Shaft</p><p>2721Power</p><p>2723Operation keys</p><p>2725Speaker</p><p>4001First substrate</p><p>4002Pixel</p><p>4003Signal line drive circuit</p><p>4004Scan line drive circuit</p><p>4005Sealing material</p><p>4006Second substrate</p><p>4008Liquid crystal layer</p><p>4010Thin Film Transistor</p><p>4011Thin Film Transistor</p><p>4013Liquid crystal element</p><p>4015Connecting terminal electrode</p><p>4016Terminal electrode</p><p>4018FPC</p><p>4019Anisotropic conductive film</p><p>4020Insulation layer</p><p>4021Insulation layer</p><p>4030Pixel electrode layer</p><p>4031Counter electrode layer</p><p>4032Insulation layer</p><p>404asource area or sink area</p><p>404bsource area or sink area</p><p>405asource or drain electrode layer</p><p>405bsource or drain electrode layer</p><p>4501First substrate</p><p>4502Pixel</p><p>4505Sealing material</p><p>4506Second substrate</p><p>4507Packing</p><p>4509Thin Film Transistor</p><p>4510Thin Film Transistor</p><p>4511Light-emitting element</p><p>4512Electroluminescent layer</p><p>4513Second electrode layer</p><p>4515Connecting terminal electrode</p><p>4516Terminal electrode</p><p>4517First electrode layer</p><p>4519Anisotropic conductive film</p><p>4520Separating Wall</p><p>5300Substrate</p><p>5301Pixel</p><p>5302Scan line drive circuit</p><p>5303Signal line drive circuit</p><p>5400Substrate</p><p>5401Pixel</p><p>5402Scan line drive circuit</p><p>5403Signal line drive circuit</p><p>5404Scan line drive circuit</p><p>5501First wiring</p><p>5502Second wiring</p><p>5503Third wiring</p><p>5504Fourth wiring</p><p>5505Fifth wiring</p><p>5506Sixth wiring</p><p>5543node</p><p>5544node</p><p>5571First Thin Film Transistor</p><p>5572Second thin film transistor</p><p>5573Third Thin Film Transistor</p><p>5574The fourth thin film transistor</p><p>5575Fifth Thin Film Transistor</p><p>5576The sixth thin film transistor</p><p>5577The seventh thin film transistor</p><p>5578Eighth Thin Film Transistor</p><p>5601Driver IC</p><p>5602Switch Group</p><p>5611First wiring</p><p>5612Second wiring</p><p>5613Third wiring</p><p>5621Wiring</p><p>5701Flip-Flop</p><p>5711First wiring</p><p>5712Second wiring</p><p>5713Third wiring</p><p>5714Fourth wiring</p><p>5715Fifth wiring</p><p>5716Sixth wiring</p><p>5717Seventh wiring</p><p>5721Signal</p><p>5821Signal</p><p>590aBlack Zone</p><p>590bWhite area</p><p>611aGas supply source</p><p>611bGas supply source</p><p>612aPressure regulating valve</p><p>612bPressure regulating valve</p><p>613aRefiner</p><p>613bRefiner</p><p>614aMass flow controller</p><p>614bMass flow controller</p><p>615aStop valve</p><p>615bStop valve</p><p>6400 pixels</p><p>6401Switching Transistor</p><p>6402Drive Transistor</p><p>6403Capacitive element</p><p>6404Light-emitting element</p><p>6405Signal line</p><p>6406Scan line</p><p>6407Power cord</p><p>6408Common electrode</p><p>7001TFT</p><p>7002Light-emitting element</p><p>7003Cathode</p><p>7004Light-emitting layer</p><p>7005Anode</p><p>7011Drive TFT</p><p>7012Light-emitting element</p><p>7013Cathode</p><p>7014Light-emitting layer</p><p>7015Anode</p><p>7016Mask film</p><p>7017Conductive film</p><p>7021Drive TFT</p><p>7022Light-emitting element</p><p>7023Cathode</p><p>7024Light-emitting layer</p><p>7025Anode</p><p>7027Conductive film</p><p>9201Display</p><p>9202Display button</p><p>9203Operation switch</p><p>9204Adjustable belt</p><p>9205Regulator</p><p>9206Camera Department</p><p>9207Speaker</p><p>9208Microphone</p><p>9301Upper frame</p><p>9302Lower frame</p><p>9303Display</p><p>9304Keyboard</p><p>9305External port</p><p>9306Positioning device</p><p>9307Display</p><p>9600TV installation</p><p>9601Frame</p><p>9603Display</p><p>9605Support</p><p>9607Display</p><p>9609Operation keys</p><p>9610Remote control</p><p>9700Digital Photo Frame</p><p>9701Frame</p><p>9703Display</p><p>9881Frame</p><p>9882Display</p><p>9883Display</p><p>9884Speaker Department</p><p>9885Operation keys</p><p>9886Recording media insertion section</p><p>9887Connecting terminal</p><p>9888Sensor</p><p>9889Microphone</p><p>9890LED light</p><p>9891Frame</p><p>9893Connecting part</p><p>9900Coin Machine</p><p>9901Frame</p><p>9903Display</p><p>4503aSignal line drive circuit</p><p>4503bSignal line drive circuit</p><p>4504aScan line driver circuit</p><p>4504bScan line driver circuit</p><p>4518aFPC</p><p>4518bFPC</p><p>5603aThin Film Transistor</p><p>5603bThin Film Transistor</p><p>5603cThin Film Transistor</p><p>5703aTiming</p><p>5703bTiming</p><p>5703cTiming</p><p>5803aTiming</p><p>5803bTiming</p><p>5803cTiming</p>

In the drawings: FIGS. 1A to 1C are diagrams illustrating a method of manufacturing a semiconductor device; FIGS. 2A and 2B are diagrams illustrating a method of manufacturing a semiconductor device; FIGS. 3A and 3B are diagrams illustrating a semiconductor device; FIGS. 4A to 4C is a diagram illustrating a method of manufacturing a semiconductor device; FIGS. 5A to 5C are diagrams illustrating a method of manufacturing a semiconductor device; FIGS. 6A and 6B are diagrams illustrating a method of manufacturing a semiconductor device; FIG. 7 is a diagram illustrating a semiconductor device 8A1 to 8B2 are diagrams illustrating the semiconductor device; FIG. 9 is a diagram illustrating the semiconductor device; 10A1 to 10B are diagrams illustrating a semiconductor device; FIGS. 11A and 11B are diagrams illustrating a semiconductor device; FIG. 12 is a diagram illustrating a pixel equivalent circuit of the semiconductor device; FIGS. 13A to 13C are diagrams illustrating a semiconductor device; 14A and 14B are diagrams illustrating a block diagram of a semiconductor device; FIG. 15 is a diagram illustrating the structure of a signal line driver circuit; FIG. 16 is a timing chart illustrating the operation of the signal line driver circuit; FIG. 17 is a diagram illustrating the signal line driver circuit FIG. 18 is a diagram illustrating the structure of the shift register; FIG. 19 is a diagram illustrating the connection structure of the flip-flop shown in FIG. 18; FIG. 20 is a diagram illustrating the semiconductor device; FIG. 21 is Fig. 22 is an external view showing an example of an e-book reader; Figs. 23A and 23B are external views showing an example of a television device and a digital photo frame; Figs. 24A and 24B is an external view showing an example of a game machine; FIGS. 25A and 25B are perspective views showing an example of a portable computer and a mobile phone, respectively; FIG. 26 is a diagram illustrating a semiconductor device; FIG. 27 is a diagram illustrating a semiconductor device Figure 28 is a cross-sectional view illustrating the electric furnace; Figure 29 is a graph showing the results of TDS measurement; Figure 30 is a graph showing the results of H TDS; FIG. 31 is a graph showing the TDS result of O; FIG. 32 is a graph showing the TDS result of OH; FIG. 33 is a graph showing H₂A graph of the TDS results of, and FIG. 34 is a diagram illustrating the structure of the oxide semiconductor layer used for the simulation.

The embodiment mode will be explained in detail with reference to the drawings. However, the present invention is not limited to the following description, and those skilled in the art can easily understand that its modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the description of the embodiment modes shown below. In the structure described below, the same reference numerals are used in different drawings to denote the same parts or parts having the same functions, and repeated descriptions are omitted.

Example Mode 1

A semiconductor device and a method of manufacturing the semiconductor device will be described with reference to FIGS. 1A to 3B.

FIG. 3A is a plan view of a thin film transistor 470 included in the semiconductor device, and FIG. 3B is a cross-sectional view along the line C1-C2 of FIG. 3A. The thin film transistor 470 is a reverse staggered thin film transistor, and includes a gate electrode layer 401, a gate insulating layer 402, a semiconductor layer 403, source or drain regions 404a, 404b, and a source on a substrate 400 with an insulating surface. Electrode layer or drain electrode layer 405a, 405b. In addition, a cover film transistor is provided 470 and in contact with the oxide insulating film 407 of the semiconductor layer 403.

The first oxide semiconductor film and the second oxide semiconductor film are reduced after at least the first oxide semiconductor film and the second oxide semiconductor film that become the semiconductor layer 403 and the source or drain regions 404a, 404b are formed Heat treatment of impurities such as moisture (heat treatment for dehydration or dehydrogenation) to reduce resistance (improvement of carrier density, preferably 1×10¹⁸/cm³Above), and then the oxide insulating film 407 is formed in contact with the first oxide semiconductor layer, so that the resistance can be increased (the carrier density is reduced, preferably less than 1×10¹⁸/cm³, Preferably 1×10¹⁴/cm³The first oxide semiconductor layer below) is used as a channel formation region.

In addition, it is better to make the moisture (H₂0) After the impurity is released, slowly cooling is performed in an oxygen atmosphere. The carrier density of the first oxide semiconductor layer is reduced by forming an oxide insulating film in contact with the first oxide semiconductor layer after heat treatment for dehydration or dehydrogenation and slow cooling in an oxygen atmosphere. The reliability of the thin film transistor 470.

In addition, it not only reduces impurities such as moisture existing in the semiconductor layer 403 and the source or drain regions 404a, 404b, but also reduces the presence in the gate insulating layer 402 and the semiconductor layer 403 as an oxide semiconductor layer in contact with Impurities such as moisture in the interface between the upper and lower films specifically reduce impurities such as moisture present in the interface between the gate insulating layer 402 and the semiconductor layer 403 and the interface between the oxide insulating film 407 and the semiconductor layer 403.

In addition, a semiconductor layer 403 as an oxide semiconductor layer, a source electrode layer or a drain electrode layer in contact with the source and drain regions 404a, 404b 405a and 405b use any one or more materials selected from titanium, aluminum, manganese, magnesium, zirconium, beryllium, and thorium. In addition, an alloy film or the like in which the above-mentioned elements are combined may be laminated.

As the semiconductor layer 403 including the channel formation region and the source or drain regions 404a and 404b, an oxide material having semiconductor characteristics may be used. For example, you can use₃(ZnO)_mIn the oxide semiconductor of the structure of (m&gt;0), an In-Ga-Zn-O-based oxide semiconductor is particularly preferably used. In addition, M represents a metal element or multiple metal elements selected from gallium (Ga), iron (Fe), nickel (Ni), manganese (Mn), and cobalt (Co). For example, as M, in addition to the case where Ga is contained, there are cases where the metal element other than Ga such as Ga and Ni or Ga and Fe is contained. In addition, in the above-mentioned oxide semiconductor, in addition to the case of containing a metal element as M, there are cases where another transition metal element such as Fe or Ni or an oxide of the transition metal is contained as an impurity element. In this specification, will be expressed as InMO₃(ZnO)_mAmong the oxide semiconductors of the structure (m&gt;0), an oxide semiconductor having a structure containing at least Ga as M is referred to as an In-Ga-Zn-O-based oxide semiconductor, and this thin film is also referred to as In-Ga- Zn-O type non-single crystal film.

In addition, as the oxide semiconductor used for the oxide semiconductor layer, in addition to the above-mentioned materials, In-Sn-Zn-O, In-Al-Zn-O, Sn-Ga-Zn-O can also be used. Type, Al-Ga-Zn-O type, Sn-Al-Zn-O type, In-Zn-O type, Sn-Zn-O type, Al-Zn-O type, In-O type, Sn-O type , Zn-O type oxide semiconductor. In addition, you can make The above-mentioned oxide semiconductor includes silicon oxide.

There is a source region between the semiconductor layer (also referred to as the first oxide semiconductor layer) and the source electrode layer, and there is a drain region between the semiconductor layer and the drain electrode layer. An oxide semiconductor layer exhibiting n-type conductivity (also referred to as a second oxide semiconductor layer) can be used for the source region and the drain region.

In addition, the thickness of the second oxide semiconductor layer used as the source region or drain region 404a, 404b of the thin film transistor is preferably thinner than the thickness of the first oxide semiconductor layer used as the channel formation region, and the second oxide semiconductor layer The conductivity of the physical semiconductor layer is preferably higher than the conductivity of the first oxide semiconductor layer.

In addition, the first oxide semiconductor layer used as a channel formation region has an amorphous structure, and the second oxide semiconductor layer used as a source region and a drain region sometimes has crystal grains (nanocrystalline ). The diameter of the crystal grains (nanocrystals) in the second oxide semiconductor layer used as the source region and the drain region is 1 nm to 10 nm, typically about 2 nm to 4 nm.

In this embodiment mode, as the semiconductor layer 403 including the channel formation region and the source region or the drain region (also referred to as n⁺(Layer, buffer layer) 404a, 404b, In-Ga-Zn-O-based non-single crystal films are used.

1A to 2B show cross-sectional views of the manufacturing process of the thin film transistor 470.

A gate electrode layer 401 is provided on a substrate 400 having an insulating surface. An insulating film serving as a base film may be provided between the substrate 400 and the gate electrode layer 401. The base film has a function of preventing the diffusion of impurity elements from the substrate 400, and it can use one of a silicon nitride film, a silicon oxide film, a silicon oxynitride film, and a silicon oxynitride film or a stack of multiple films. Structural shape become. The material of the gate electrode layer 401 can be formed by using metal materials such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, or a single layer or a stack of alloy materials with these materials as the main component .

For example, as the double-layer laminated structure of the gate electrode layer 401, it is best to adopt: a double-layer structure in which a molybdenum layer is laminated on an aluminum layer; a double-layer structure in which a molybdenum layer is laminated on a copper layer; A two-layer structure in which a titanium nitride layer or a tantalum nitride layer is laminated; or a two-layer structure in which a titanium nitride layer and a molybdenum layer are laminated. As a three-layer laminated structure, it is preferable to adopt a structure in which the following layers are laminated: a tungsten layer or a tungsten nitride layer; an alloy layer of aluminum and silicon or an alloy layer of aluminum and titanium; and a titanium nitride layer or a titanium layer.

A gate insulating layer 402 is formed on the gate electrode layer 401.

The gate insulating layer 402 can be formed by using a single layer or a stack of a silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, or a silicon oxynitride layer by using a plasma CVD method, a sputtering method, or the like. For example, SiH is used as the film forming gas₄, Oxygen and nitrogen and form a silicon oxynitride layer by plasma CVD method.

A first oxide semiconductor film 430 and a second oxide semiconductor film 433 are stacked on the gate insulating layer 402 (see FIG. 1A). The first oxide semiconductor film 430 becomes a semiconductor layer serving as a channel formation region, and the second oxide semiconductor film 433 becomes a source region and a drain region.

In addition, it is preferable to perform reverse sputtering in which plasma is generated by introducing argon gas before forming the oxide semiconductor film by the sputtering method to remove dust adhering to the surface of the gate insulating layer 402. Reverse sputtering refers to a method in which a voltage is not applied to the target side and an RF power source is used to apply a voltage to the substrate side in an argon atmosphere to form plasma near the substrate to modify the surface. sex. In addition, nitrogen, helium, etc. may be used instead of the argon atmosphere. In addition, oxygen and N can also be added to the argon atmosphere.₂Reverse sputtering is performed in an atmosphere such as O. In addition, Cl can also be added to the argon atmosphere₂, CF₄Reverse sputtering is performed under the atmosphere of the same.

As the oxide semiconductor film, an In-Ga-Zn-O-based non-single crystal film is used. The oxide semiconductor film uses an In-Ga-Zn-O-based oxide semiconductor target and is formed by a sputtering method. In addition, the oxide semiconductor film can be formed by a sputtering method under a rare gas (typically argon) atmosphere, an oxygen atmosphere, or a rare gas (typically argon) and oxygen atmosphere.

The gate insulating layer 402, the first oxide semiconductor film 430, and the second oxide semiconductor film 433 may be continuously formed without being exposed to the atmosphere. By continuously forming without contact with the atmosphere, the laminated interfaces can be formed without being contaminated by atmospheric components such as water or hydrocarbons or impurity elements suspended in the atmosphere, thereby reducing the unevenness of the characteristics of thin film transistors.

The first oxide semiconductor film 430 and the second oxide semiconductor film 433 are heated under an inert gas atmosphere (nitrogen or helium, neon, argon, etc.) or under reduced pressure, and then slowly cooled in an oxygen gas atmosphere ( Refer to Figure 1B). By heating the first oxide semiconductor film 430 and the second oxide semiconductor film 433 in the above atmosphere, the hydrogen and water contained in the first oxide semiconductor film 430 and the second oxide semiconductor film 433 can be removed. And other impurities.

In addition, in the heat treatment, it is preferable that a rare gas such as nitrogen, helium, neon, and argon does not contain impurities such as moisture and hydrogen. Alternatively, it is better to set the purity of the rare gas such as nitrogen or helium, neon, argon, etc., introduced into the heat treatment device to 6N (99.9999%) or more, preferably 7N (99.99999%) or more (that is, set the impurity density to 1 ppm or less, preferably 0.1 ppm or less).

In addition, as the heating treatment, a heating method using an electric furnace, a GRTA (Gas Rapid Thermal Anneal) method using heated gas, or a LRTA (Lamap Rapid Thermal Anneal) method using a lamp can be used. The instant heating method and so on.

Here, a heating method using the electric furnace 601 as one method of the heating treatment of the first oxide semiconductor film 430 and the second oxide semiconductor film 433 will be described with reference to FIG. 28.

FIG. 28 is a schematic diagram of the electric furnace 601. A heater 603 is provided outside the processing chamber 602 to heat the processing chamber 602. In addition, a susceptor 605 on which the substrate 604 is mounted is provided in the processing chamber 602, and the susceptor 605 carries the substrate 604 into the processing chamber 602 or carries the substrate 604 out. In addition, the processing chamber 602 is provided with a gas supply unit 606 and an exhaust unit 607. The gas is introduced into the processing chamber 602 by the gas supply unit 606. In addition, the inside of the processing chamber 602 is exhausted by the exhaust unit 607 or the inside of the processing chamber 602 is put in a reduced pressure state. In addition, it is preferable to set the temperature increase characteristic of the electric furnace 601 to 0.1° C./min or more and 20° C./min or less. It is preferable to set the temperature drop characteristic of the electric furnace 601 to 0.1°C/min or more and 15°C/min or less.

The gas supply unit 606 has a gas supply source 611a, a gas supply source 611b, a pressure regulating valve 612a, a pressure regulating valve 612b, and a refiner 613a, refiner 613b, mass flow controller 614a, mass flow controller 614b, stop valve 615a, and stop valve 615b. In this embodiment mode, it is preferable to provide refiners 613a and 613b between the gas supply source 611a, the gas supply source 611b, and the processing chamber 602. By installing the purifiers 613a and 613b, the purifiers 613a and 613b remove impurities such as moisture and hydrogen in the gas introduced into the processing chamber 602 from the gas supply source 611a and the gas supply source 611b, thereby preventing the intrusion of impurities such as moisture and hydrogen into the processing chamber 602. Inside the processing chamber 602.

In this embodiment mode, nitrogen or rare gas is introduced into the processing chamber 602 from the gas supply source 611a and the gas supply source 611b, so that the processing chamber is in a nitrogen or rare gas atmosphere, and is heated to 200°C or higher and 600°C. Hereinafter, it is preferable to heat the first oxide semiconductor film 430 and the second oxide semiconductor film 433 formed on the substrate 604 in a processing chamber 602 heated to 400°C or higher and 450°C or lower, so that the first oxide semiconductor film can be processed. 430 and the dehydration or dehydrogenation of the second oxide semiconductor film 433.

In addition, the first oxide formed on the substrate 604 is heated in a processing chamber 602 heated to a temperature of not less than 20°C and not more than 600°C, preferably not less than 400°C and not more than 450°C, under reduced pressure using an exhaust unit. The semiconductor film 430 and the second oxide semiconductor film 433 can perform dehydration or dehydrogenation of the first oxide semiconductor film 430 and the second oxide semiconductor film 433.

Next, the introduction of nitrogen or rare gas from the gas supply source 611a into the processing chamber 602 is stopped, and the heater is turned off. Then, from The gas supply source 611b introduces oxygen into the processing chamber 602, and gradually cools the processing chamber 602 of the heating device. That is, the inside of the processing chamber 602 is set to an oxygen atmosphere, and the substrate 604 is gradually cooled. Here, it is preferable that the oxygen introduced into the processing chamber 602 from the gas supply source 611b does not contain impurities such as water and hydrogen. Alternatively, it is better to set the purity of the oxygen introduced from the gas supply source 611b into the processing chamber 602 to be 6N (99.9999%) or higher, more preferably to 7N (99.99999%) or higher (that is, it is better to reduce the impurities in the oxygen The density is set to 1 ppm or less, more preferably 0.1 ppm or less). Heat treatment under inert gas or reduced pressure reduces the resistance of the oxide semiconductor film (improved carrier density, preferably 1×10¹⁸/cm³The above), the first oxide semiconductor film 434 and the second oxide semiconductor film 435 that have been reduced in resistance can be formed.

As a result, the reliability of the thin film transistor to be formed later can be improved.

In addition, when the heat treatment is performed under reduced pressure, after the heat treatment, oxygen flows through the treatment chamber 602 to restore the pressure to the atmospheric pressure for cooling.

In addition, at the same time oxygen is introduced into the processing chamber 602 from the gas supply source 611b, one or both of rare gases such as helium, neon, and argon or nitrogen may be introduced into the processing chamber 602.

In addition, the substrate 604 in the processing chamber 602 of the heating device may be cooled to 300° C., and then the substrate 604 may be moved to a room temperature atmosphere. As a result, the cooling time of the substrate 604 can be shortened.

In addition, when the heat treatment is a multi-chamber type, it can be used in different treatment chambers. Carry out heating treatment and cooling treatment. Typically, the oxide semiconductor film on the substrate is heated in a first processing chamber filled with nitrogen or a rare gas and heated to 200°C or more and 600°C or less, preferably 400°C or more and 450°C or less. Next, through a transfer chamber in which nitrogen or a rare gas is introduced, the heat-treated substrate is moved into a second processing chamber filled with oxygen and below 100°C, preferably at room temperature, for cooling. Through the above process, the processing capacity can be improved.

Heat treatment is performed under an inert gas atmosphere or under reduced pressure, and then slowly cooled in an oxygen atmosphere until the temperature is higher than room temperature and lower than 100°C, and the first oxide semiconductor film 434 and the second oxide are taken out from the heating device. The substrate of the semiconductor film 435 is formed, and the photolithography process is performed.

In addition, the state of the first oxide semiconductor film 434 and the second oxide semiconductor film 435 after heat treatment under an inert gas or under reduced pressure is preferably an amorphous state, but the first oxide semiconductor film 434 and the second oxide semiconductor film 435 may be A part of the second oxide semiconductor film 435 is crystallized.

The first oxide semiconductor film 434 and the second oxide semiconductor film 435 are processed by photolithography processing into a first oxide semiconductor layer 431 and a second oxide semiconductor layer 436 as island-shaped oxide semiconductor layers (see FIG. 1C).

A conductive film is formed on the gate insulating layer 402, the first oxide semiconductor layer 431, and the second oxide semiconductor layer 436.

Examples of the material of the conductive film include: elements selected from Al, Cr, Ta, Ti, Mo, and W; alloys containing the aforementioned elements as components; alloy films in which the aforementioned elements are combined, and the like.

In addition, when the heat treatment is performed after the formation of the conductive film, it is preferable that the conductive film has heat resistance to withstand the heat treatment. Since there are problems such as low heat resistance and easy corrosion when using Al alone, Al and a heat-resistant conductive material are combined to form a conductive film. As a heat-resistant conductive material combined with Al, use: an element selected from titanium (Ti), tantalum (Ta), tungsten (W), molybdenum (Mo), chromium (Cr), neodymium (Nd), and scandium (Sc) ; Alloys with the above-mentioned elements as components; alloy films with the above-mentioned elements; or nitrides with the above-mentioned elements as components.

The first oxide semiconductor layer 431, the second oxide semiconductor layer 436, and the conductive film are etched by an etching process to form a first oxide semiconductor layer 432, source or drain regions 404a, 404b, and a source electrode layer Or drain electrode layers 405a, 405b (refer to FIG. 2A). In addition, only a part of the first oxide semiconductor layer 431 is etched to become the first oxide semiconductor layer 432 having grooves (recesses).

A silicon oxide film is formed as the oxide insulating film 407 by a sputtering method in contact with the first oxide semiconductor layer 432. The oxide semiconductor film 407 formed in contact with the low-resistance oxide semiconductor layer does not contain moisture, hydrogen ions, and OH^-Specifically, a silicon oxide film or a silicon oxynitride film is used as an inorganic insulating film that prevents the above-mentioned impurities from entering from the outside.

In this embodiment mode, a silicon oxide film with a thickness of 300 nm is formed as the oxide insulating film 407. The substrate temperature at the time of film formation may be set to room temperature or higher and 300°C or lower. In this embodiment mode, the substrate temperature is set to 100°C. It can be used in a rare gas (typically argon) atmosphere, an oxygen atmosphere, or a rare gas (typically argon) and oxygen atmosphere. The silicon oxide film is formed by a sputtering method. In addition, as the target material, a silicon oxide target material or a silicon target material can be used. For example, silicon oxide can be formed by sputtering using a silicon target in an oxygen and nitrogen atmosphere.

When the oxide insulating film 407 is formed in contact with the first oxide semiconductor layer 432 whose resistance is reduced by a sputtering method, a PCVD method, or the like, at least one of the first oxide semiconductor layers 432 whose resistance is reduced can be realized. The resistance of the region in contact with the oxide insulating film 407 is increased (the carrier density is reduced, preferably less than 1×10¹⁸/cm³, Preferably 1×10¹⁴/cm³Below), a high-resistance oxide semiconductor region can be formed. In the manufacturing method of a semiconductor device, it is important to increase the carrier density of the oxide semiconductor layer by heating under an inert gas (or under reduced pressure), slow cooling under an oxygen atmosphere, and forming an oxide insulating film, etc. . The first oxide semiconductor layer 432 becomes the semiconductor layer 403 having a high-resistance oxide semiconductor region, so that a thin film transistor 470 can be manufactured (refer to FIG. 2B).

By performing the above-mentioned heat treatment for dehydration treatment or dehydrogenation treatment, the impurities contained in the first oxide semiconductor film and the second oxide semiconductor film (H₂O, H, OH, etc.) to increase the carrier density, and then slowly cool. After slow cooling, the first oxide semiconductor film is processed into an island-shaped first oxide semiconductor layer, and an oxide insulating film is formed in contact with the first oxide semiconductor layer to reduce the carrier density of the first oxide semiconductor layer. And the first oxide semiconductor layer is used as a semiconductor layer, so that the reliability of the thin film transistor 470 can be improved.

In addition, after the oxide insulating film 407 is formed, the thin film transistor 470 may be heated in a nitrogen atmosphere or an atmospheric atmosphere (in the atmosphere). Treatment (preferably above 150°C and below 350°C). For example, heat treatment is performed at 250°C for 1 hour in a nitrogen atmosphere. By performing this heating process, heating is performed in a state where the semiconductor layer 403 is in contact with the oxide insulating film 407, so that the unevenness of the electrical characteristics of the thin film transistor 470 can be reduced. The heating treatment (preferably 150°C or higher and lower than 350°C) is not particularly limited as long as it is performed after the oxide insulating film 407 is formed. By combining the heating treatment with other processes, such as heating for forming a resin film The treatment or the heating treatment for reducing the resistance of the transparent conductive film can be performed without increasing the number of processes.

Example Mode 2

The semiconductor device and the manufacturing method of the semiconductor device will be described with reference to FIG. 26. The same parts or parts having the same functions and processes as those of the embodiment mode 1 can be performed in the same manner as in the embodiment mode 1, and therefore, repetitive descriptions are omitted.

The thin film transistor 471 shown in FIG. 26 is an example in which the conductive layer 408 is provided so as to overlap the channel regions of the source electrode layer 401 and the semiconductor layer 403 with an insulating film interposed therebetween.

FIG. 26 is a cross-sectional view of a thin film transistor 471 included in the semiconductor device. The thin film transistor 471 is a bottom gate type thin film transistor, and includes a gate electrode layer 401, a gate insulating layer 402, a semiconductor layer 403, source or drain regions 404a, 404b, and a source on a substrate 400 with an insulating surface. Electrode layer or drain electrode layer 405a, 405b, conductive layer 408. The conductive layer 408 is provided on the oxide semiconductor film 407 so as to overlap the gate electrode layer 401.

The conductive layer 408 can be formed using the same material and method as the gate electrode layer 401, the source electrode layer, or the drain electrode layer 405a, 405b. When the pixel electrode layer is provided, the same material and method as the pixel electrode layer can also be used to form the conductive layer 408. In this embodiment mode, as the conductive layer 408, a stack of a titanium film, an aluminum film, and a titanium film is used.

The potential of the conductive layer 408 may be the same as or different from the potential of the gate electrode layer 401, and the conductive layer 408 may be used as the second gate electrode layer. In addition, the conductive layer 408 may also be in a floating state.

By disposing the conductive layer 408 at a different position from the semiconductor layer 403, the bias-temperature test (hereinafter referred to as the BT test) used to investigate the reliability of the thin film transistor can reduce the thin film transistor before and after the BT test. The amount of change in the threshold voltage of 471. In particular, in the -BT test in which a voltage of -20V is applied to the gate electrode after raising the substrate temperature to 150°C, the variation of the threshold voltage can be suppressed.

This embodiment mode can be implemented in combination with embodiment mode 1 as appropriate.

Example Mode 3

The semiconductor device and the method of manufacturing the semiconductor device will be described with reference to FIG. 27. The same parts or parts having the same functions and processes as those of the embodiment mode 1 can be performed in the same manner as in the embodiment mode 1, and therefore, repetitive descriptions are omitted.

The thin film transistor 472 shown in FIG. 27 is based on an oxide insulating film An example in which the conductive layer 409 is provided in such a way that the 407 and the insulating layer 410 overlap the channel region of the source electrode layer 401 and the semiconductor layer 403.

FIG. 27 is a cross-sectional view of a thin film transistor 472 included in the semiconductor device. The thin film transistor 472 is a bottom gate type thin film transistor, and includes a gate electrode layer 401, a gate insulating layer 402, a semiconductor layer 403, source or drain regions 404a, 404b, and a source on a substrate 400 with an insulating surface. Electrode layer or drain electrode layer 405a, 405b, conductive layer 409. The conductive layer 409 is provided on the oxide semiconductor film 407 and the insulating layer 410 so as to overlap the gate electrode layer 401.

In this embodiment mode, an insulating layer 410 serving as a planarization film is laminated on the oxide insulating film 407, and the oxide insulating film 407 and the insulating layer 410 are formed to reach the source electrode layer or the drain electrode layer 405b. Open up. A conductive film is formed on the openings formed in the oxide insulating film 407 and the insulating layer 410, and it is etched into a desired shape to form the conductive layer 409 and the pixel electrode layer 411. The same materials and methods can be used to form the conductive layer 409 in the above process of forming the pixel electrode layer 411. In this embodiment mode, as the pixel electrode layer 411 and the conductive layer 409, an indium oxide tin oxide alloy containing silicon oxide (In-Sn-O-based oxide containing silicon oxide) is used.

In addition, the conductive layer 409 can be formed using the same material and method as the gate electrode layer 401, the source electrode layer, or the drain electrode layer 405a, 405b.

The potential of the conductive layer 409 may be the same as the potential of the gate electrode layer 401, or may be different from the potential of the gate electrode layer 401, and the conductive layer 409 may be The electrical layer 409 serves as the second gate electrode layer. In addition, the conductive layer 409 may also be in a floating state.

By disposing the conductive layer 409 at a different position from the semiconductor layer 403, the bias-temperature test (hereinafter referred to as the BT test) used to investigate the reliability of the thin film transistor can reduce the thin film transistor before and after the BT test. 472 threshold voltage change amount.

This embodiment mode can be implemented in appropriate combination with the structures described in the other embodiment modes.

Embodiment Mode 4

The manufacturing process of a semiconductor device including a thin film transistor is described using FIGS. 4A to 8B2.

In FIG. 4A, as the light-transmitting substrate 100, a glass substrate such as barium borosilicate glass and aluminoborosilicate glass can be used.

Next, after forming a conductive layer on the entire surface of the substrate 100, a first photolithography process is performed to form a resist mask, and unnecessary parts are removed by etching to form wiring and electrodes (including the gate electrode layer 101). The gate wiring, the capacitor wiring 108 and the first terminal 121). At this time, etching is performed to form at least the end of the gate electrode layer 101 into a tapered shape.

Preferably, a heat-resistant conductive material is used to form the gate wiring including the gate electrode layer 101, the capacitor wiring 108, and the first terminal 121 of the terminal portion. The heat-resistant conductive material is selected from titanium (Ti), tantalum (Ta), and tungsten. (W), molybdenum (Mo), chromium (Cr), neodymium (Nd), scandium (Sc); an alloy containing the above elements; an alloy film combining the above elements; or Nitride consisting of the above elements. In the case of using low-resistance conductive materials such as aluminum (Al) or copper (Cu), because Al or Cu alone has problems such as low heat resistance and susceptibility to corrosion, the low-resistance conductive material is combined with the above-mentioned heat-resistant conductive material. Conductive materials are used in combination.

Next, a gate insulating layer 102 is formed on the entire surface of the gate electrode layer 101 (refer to FIG. 4A). The gate insulating layer 102 having a thickness of 50 nm to 250 nm is formed by a sputtering method, a PCVD method, or the like.

For example, the gate insulating layer 102 with a thickness of 100 nm is formed by a sputtering method using a silicon oxide film. It goes without saying that the gate insulating layer 102 is not limited to such a silicon oxide film, and a single-layer structure or other insulating film such as a silicon oxynitride film, a silicon nitride film, an aluminum oxide film, a tantalum oxide film, etc. can be used. The stacked structure forms the gate insulating layer 102.

Next, a first oxide semiconductor film 131 (a first In-Ga-Zn-O-based non-single crystal film) is formed on the gate insulating layer 102. It is effective to form the first oxide semiconductor film 131 without being exposed to the atmosphere after the plasma treatment because dust and moisture do not adhere to the interface between the gate insulating layer and the semiconductor film. Here, the film formation was performed under the following conditions: an oxide semiconductor target (In₂O₃: Ga₂O₃: ZnO=1:1:1); the distance between the substrate and the target is 170mm; the pressure is 0.4Pa; the direct current (DC) power supply is 0.5kW; and it is formed in an atmosphere of argon and oxygen. It is best to use a pulsed direct current (DC) power supply, because dust can be reduced and the film thickness distribution becomes uniform. The thickness of the first oxide semiconductor film 131 is 5 nm to 200 nm. Using In-Ga-Zn-O oxide semiconductor target material and sputtering method to form a thickness of 50nm An In-Ga-Zn-O-based non-single crystal film is used as the first oxide semiconductor film 131.

Next, a second oxide semiconductor film 136 (a second In-Ga-Zn-O-based non-single crystal film) is formed by a sputtering method without exposure to the atmosphere (see FIG. 4B). Here, use In₂O₃: Ga₂O₃: ZnO=1:1:1 target material and sputtering film formation under the following film formation conditions, the film formation conditions are: pressure is 0.4Pa; power is 500W; film formation temperature is room temperature; and the flow rate is 40sccm Of argon gas. Although using In₂O₃: Ga₂O₃: ZnO = 1:1:1 target, but an In-Ga-Zn-O-based non-single crystal film including crystal grains with a size of 1 nm to 10 nm is sometimes formed immediately after the film is formed. In addition, it can be said that by appropriately adjusting the composition ratio of the target material, the film forming pressure (0.1Pa to 2.0Pa), power (250W to 3000W: 8 inches Φ), temperature (room temperature to 100°C), reactive sputtering Film formation conditions and the like can be adjusted to the presence or absence of crystal grains and the density of crystal grains, and the diameter size can also be adjusted to a range of 1 nm to 10 nm. The film thickness of the second In-Ga-Zn-O-based non-single crystal film is set to 5 nm to 20 nm. Of course, when crystal grains are included in the film, the size of the crystal grains included does not exceed the film thickness. The film thickness of the second In-Ga-Zn-O-based non-single crystal film is set to 5 nm.

The film forming conditions of the first In-Ga-Zn-O-based non-single crystal film are different from the film forming conditions of the second In-Ga-Zn-O-based non-single crystal film. For example, the following conditions are adopted: the ratio of the oxygen gas flow rate to the argon gas flow rate in the film formation conditions of the first In-Ga-Zn-O-based non-single crystal film is higher than that of the second In-Ga-Zn-O based non-single crystal film. The ratio of the oxygen gas flow rate to the argon gas flow rate in the film formation conditions of the crystal film. Specifically, the film formation conditions of the second In-Ga-Zn-O-based non-single crystal film are under a rare gas (argon or helium, etc.) atmosphere (or set the oxygen gas to 10% or less, the argon gas is set to 90% or more), and the film forming condition of the first In-Ga-Zn-O-based non-single crystal film is in an oxygen mixed atmosphere (the oxygen gas flow rate is more than the rare gas flow rate).

The second In-Ga-Zn-O-based non-single-crystal film can be formed in the same processing chamber as the processing chamber that was previously subjected to reverse sputtering, or a processing chamber different from the processing chamber that was previously subjected to reverse sputtering can be used to form the second In-Ga-Zn-O non-single crystal film.

Among the sputtering methods, there are an RF sputtering method and a DC sputtering method that use a high-frequency power source as a sputtering power source, and there is also a pulsed DC sputtering method that applies a bias voltage in a pulsed manner. The RF sputtering method is mainly used for the formation of insulating films, and the DC sputtering method is mainly used for the formation of metal films.

In addition, there is also a multi-element sputtering device that can set a plurality of targets of different materials. The multi-element sputtering device can not only laminate and form films of different materials in the same processing chamber, but also discharge multiple materials simultaneously to form films in the same processing chamber.

In addition, there are sputtering devices that use the following sputtering method: a magnetron sputtering method equipped with a magnet mechanism in a processing chamber; and an ECR sputtering method that uses plasma generated using microwaves without using glow discharge Shooting method.

In addition, as a film formation method using a sputtering method, there are reactive sputtering methods in which a target material and a sputtering gas component are chemically reacted during the film formation period to form their compound thin film, and a reactive sputtering method is applied to the substrate during the film formation period. Bias sputtering method in which voltage is also applied.

Next, the first oxide semiconductor film 131 and the second oxide semiconductor film 136 are subjected to heat treatment for dehydration or dehydrogenation. In inertia Heat treatment under a gas atmosphere (nitrogen or helium, neon, argon, etc.) or under reduced pressure, and then slow cooling under oxygen gas.

It is preferable to perform the heat treatment at a temperature of 200°C or higher. For example, heat treatment at 450°C for 1 hour is performed in a nitrogen atmosphere. By this heating treatment in a nitrogen atmosphere, the resistance of the first oxide semiconductor film 131 and the second oxide semiconductor film 136 is reduced (the carrier density is increased, preferably 1×10¹⁸/cm³Above), and the conductivity is improved. In this way, the first oxide semiconductor film 133 and the second oxide semiconductor film 137 that have been reduced in resistance are formed (see FIG. 4C). The conductivity of the first oxide semiconductor film 133 and the second oxide semiconductor film 137 is preferably 1×10^-1S/cm or more and 1×10²S/cm or less.

Next, a second photolithography process is performed to form a resist mask, and the first oxide semiconductor film 133 and the second oxide semiconductor film 137 are etched. For example, by wet etching using a solution mixed with phosphoric acid, acetic acid, and nitric acid, unnecessary portions are removed, thereby forming the first oxide semiconductor layer 134 and the second oxide semiconductor layer 138. Note that the etching here is not limited to wet etching, but dry etching may also be used.

As the etching gas used for dry etching, it is preferable to use a gas containing chlorine (chlorine-based gas, such as chlorine (Cl₂), boron chloride (BCl₃), silicon chloride (SiCl₄), carbon tetrachloride (CCl₄)Wait).

In addition, a gas containing fluorine (fluorine-based gas, such as carbon tetrafluoride (CF₄), sulfur hexafluoride (SF₆), nitrogen trifluoride (NF₃), trifluoromethane (CHF₃), etc.), hydrogen bromide (HBr), oxygen (O₂), or adding rare gas such as helium (He) or argon (Ar) to the above gas Body and so on. Body and so on. Body and so on. Body and so on.

As the dry etching method, a parallel plate type RIE (Reactive Ion Etching) method or an ICP (Inductively Coupled Plasma) etching method can be used. The etching conditions (the amount of electric power applied to the coil-shaped electrode, the amount of electric power applied to the electrode on the substrate side, the temperature of the electrode on the substrate side, etc.) are appropriately adjusted to etch the film into a desired processing shape.

As an etchant used for wet etching, a solution in which phosphoric acid, acetic acid, and nitric acid are mixed can be used. In addition, ITO07N (manufactured by Kanto Chemical Co., Ltd.) can also be used.

The wet etched etchant and the etched material are removed by cleaning. The waste liquid of the etchant including the etched material can also be purified to reuse the contained material. By collecting and reusing materials such as indium contained in the oxide semiconductor layer from the waste liquid after the etching, resources can be used efficiently and cost reduction can be achieved.

The etching conditions (etchants, etching time, temperature, etc.) are appropriately adjusted according to the material so that the material can be etched into a desired shape.

Next, a conductive film 132 made of a metal material is formed on the first oxide semiconductor layer 134 and the second oxide semiconductor layer 138 by a sputtering method or a vacuum evaporation method (see FIG. 5B).

As the material of the conductive film 132, an element selected from Al, Cr, Ta, Ti, Mo, and W; an alloy containing the above-mentioned elements as a component; an alloy film in which the above-mentioned elements are combined, and the like can be mentioned.

When the heat treatment is performed after the conductive film 132 is formed, it is better to make the conductive film 132 The electric film has heat resistance to withstand this heat treatment.

Then, a third photolithography process is performed to form a resist mask, and unnecessary parts are removed by etching to form the source electrode layer or drain electrode layer 105a, 105b, the first oxide semiconductor layer 135, and the source The pole regions or drain regions 104a, 104b and the second terminal 122 (refer to FIG. 5C). As the etching method at this time, wet etching or dry etching is used. For example, in the case of using an aluminum film or an aluminum alloy film as the conductive film 132, wet etching using a solution mixed with phosphoric acid, acetic acid, and nitric acid may be performed. In addition, the conductive film 132 may be etched by wet etching using a mixture of ammonia water and hydrogen peroxide (hydrogen peroxide: ammonia: water = 5: 2: 2) to form a source electrode layer or a drain electrode. Layers 105a, 105b. In this etching process, a part of the exposed area of the first oxide semiconductor layer 134 is also etched to become the first oxide semiconductor layer 135. Therefore, the first oxide semiconductor layer 135 between the source electrode layer or the drain electrode layer 105a, 105b becomes a region with a thin film thickness. In FIG. 5C, since the source electrode layer or drain electrode layer 105a, 105b, the first oxide semiconductor layer 135, the source or drain region 104a, 104b are all etched by dry etching, the source electrode The ends of the layer or drain electrode layers 105a, 105b, the first oxide semiconductor layer 135, and the source or drain regions 104a, 104b are aligned to form a continuous structure.

In addition, in the third photolithography process, the second terminal 122 made of the same material as the source electrode layer or the drain electrode layer 105a, 105b is left in the terminal portion. In addition, the second terminal 122 is electrically connected to the source electrode wiring (the source electrode wiring including the source electrode layer or the drain electrode layer 105a, 105b). connect.

In addition, by using a resist mask with multiple (typically two) thickness regions formed by using a multi-tone mask, the number of resist masks can be reduced, thereby simplifying and reducing the manufacturing process. Cost-based.

Next, the resist mask is removed to form a protection covering the gate insulating layer 102, the first oxide semiconductor layer 135, the source or drain regions 104a, 104b, the source electrode layer or the drain electrode layer 105a, 105b Insulation layer 107. The protective insulating layer 107 uses a silicon oxynitride film formed by a PCVD method. The exposed area of the first oxide semiconductor layer 135 and the silicon oxynitride film as the protective insulating layer 107 provided between the source electrode layer and the drain electrode layer 105a, 105b are provided in contact with each other to achieve contact protection Higher resistance of the insulating layer 107 in the region of the first oxide semiconductor layer 135 (the carrier density is reduced, preferably less than 1×10¹⁸/cm³, Preferably 1×10¹⁴/cm³Hereinafter), it is possible to form the semiconductor layer 103 having a channel formation region whose resistance is increased.

The thin film transistor 170 can be manufactured by the above-mentioned manufacturing process. In addition, the plan view of this step corresponds to FIG. 7.

Next, a fourth photolithography process is performed to form a resist mask, and a contact hole 125 reaching the source electrode layer or the drain electrode layer 105b is formed by etching the protective insulating layer 107 and the gate insulating layer 102. In addition, by etching here, a contact hole 127 reaching the second terminal 122 and a contact hole 126 reaching the first terminal 121 are also formed. Fig. 6B shows a cross-sectional view of this step.

Next, after removing the resist mask, a transparent conductive film is formed. As The material of the transparent conductive film is formed of indium oxide (In₂O₃), indium oxide tin oxide alloy (In₂O₃-SnO₂, Abbreviated as ITO) and so on. These materials are etched using a hydrochloric acid solution. However, since the etching of ITO is particularly prone to residues, indium oxide zinc oxide alloy (In₂O₃-ZnO) in order to improve the etching processability. In addition, an indium oxide tin oxide alloy containing silicon oxide (In-Sn-O-based oxide containing silicon oxide) may also be used.

In addition, when a reflective electrode layer is used as the pixel electrode layer, it can be selected from tungsten (W), molybdenum (Mo), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb) , Tantalum (Ta), chromium (Cr), cobalt (Co), nickel (Ni), titanium (Ti), platinum (Pt), aluminum (Al), copper (Cu), silver (Ag) and other metals; the above Alloys of metals; or one or more of the above-mentioned metal nitrides.

Next, a fifth photolithography process is performed to form a resist mask, and unnecessary parts are removed by etching to form the pixel electrode layer 110.

In addition, in the fifth photolithography process, the gate insulating layer 102 and the protective insulating layer 107 in the capacitor portion are used as dielectrics, and the capacitor wiring 108 and the pixel electrode layer 110 are used to form a storage capacitor.

In addition, in the fifth photolithography process, the first terminal 121 and the second terminal 122 are covered with a resist mask and the transparent conductive films 128 and 129 formed in the terminal portions are left. The transparent conductive films 128 and 129 serve as electrodes or wirings for connecting to the FPC. The transparent conductive film 128 formed on the first terminal 121 becomes a terminal electrode for connection used as an input terminal of the gate wiring. The transparent conductive film 129 formed on the second terminal 122 is used as a source The terminal electrode used for connection of the input terminal of the pole electrode wiring.

Next, the resist mask is removed, and FIG. 6B shows a cross-sectional view of this step.

Next, heat treatment may be performed after the protective insulating layer 107 or the pixel electrode layer 110 is formed. The heat treatment may be performed at 150°C or higher and lower than 350°C in an atmospheric atmosphere or a nitrogen atmosphere. When this heating treatment is performed, heating is performed in a state where the semiconductor layer 103 is in contact with the protective insulating layer 107 to increase the resistance of the semiconductor layer 103 to improve the electrical characteristics of the transistor and reduce the unevenness of the electrical characteristics. The heat treatment is not particularly limited as long as it is performed after the protective insulating layer 107 is formed. The heat treatment can be combined with other processes, such as heat treatment when forming a resin film or heat treatment for lowering the resistance of the transparent conductive film. , The heat treatment can be performed without increasing the number of processes.

In addition, FIG. 8A1 and FIG. 8A2 respectively show a cross-sectional view and a plan view of the gate wiring terminal portion in this step. Fig. 8A1 corresponds to a cross-sectional view taken along the line E1-E2 in Fig. 8A2. In FIG. 8A1, the transparent conductive film 155 formed on the protective insulating film 154 is a terminal electrode for connection used as an input terminal. In addition, in FIG. 8A1, in the terminal portion, the first terminal 151 formed using the same material as the gate wiring and the connection electrode layer 153 formed using the same material as the source electrode wiring are interposed with the gate insulating layer 152. Overlap, and conduction is achieved by the transparent conductive film 155. In addition, the portion where the transparent conductive film 128 shown in FIG. 6B is in contact with the first terminal 121 corresponds to the portion where the transparent conductive film 155 and the first terminal 151 of FIG. 8A1 are in contact.

In addition, FIGS. 8B1 and 8B2 respectively show the source electrode shown in FIG. 6B A cross-sectional view and a plan view of a source electrode wiring terminal portion with different electrode wiring terminal portions. In addition, FIG. 8B1 corresponds to a cross-sectional view along the line F1-F2 in FIG. 8B2. In FIG. 8B1, the transparent conductive film 155 formed on the protective insulating film 154 is a terminal electrode for connection used as an input terminal. In addition, in FIG. 8B1, in the terminal portion, under the second terminal 150 electrically connected to the source electrode wiring, an electrode layer 156 formed of the same material as the gate wiring with a gate insulating layer 152 interposed therebetween overlaps with The source electrode wire is electrically connected to the second terminal 150. The electrode layer 156 is not electrically connected to the second terminal 150. By setting the electrode layer 156 to a different potential from the second terminal 150, such as floating potential, GND, 0V, etc., a capacitor for countermeasures against noise can be formed. Or capacitors used for measures against static electricity. In addition, the second terminal 150 is electrically connected to the transparent conductive film 155 via the protective insulating film 154.

A plurality of gate wirings, a plurality of source electrode wirings, and a plurality of capacitor wirings are arranged according to the pixel density. In addition, a plurality of first terminals having the same potential as the gate wiring, a plurality of second terminals having the same potential as the source electrode wiring, and a plurality of second terminals having the same potential as the capacitor wiring are arranged in the terminal portion. Three terminals and so on. The number of each terminal may be arbitrary, and the implementer may determine the number of each terminal appropriately.

In this way, through five photolithography processes and five photomasks, the pixel thin film transistor part and the storage capacitor including the bottom gate type interlaced thin film transistor 170 can be completed. Furthermore, by arranging the pixel thin film transistor part and the storage capacitor in a matrix for each pixel to form a pixel part, it can be used as a substrate for manufacturing an active matrix display device. In this specification, for the sake of convenience, this kind of substrate is called the active moment Array substrate.

When manufacturing the active matrix type liquid crystal display device, a liquid crystal layer is provided between the active matrix substrate and the counter substrate provided with the counter electrode to fix the active matrix substrate and the counter substrate. In addition, a common electrode electrically connected to the counter electrode provided on the counter substrate is provided on the active matrix substrate, and a fourth terminal electrically connected to the common electrode is provided in the terminal portion. The fourth terminal is a terminal used to set the common electrode to a fixed potential, such as GND, 0V, and so on.

In addition, the capacitor wiring may not be provided, and the pixel electrode and the gate wiring of an adjacent pixel may be overlapped with a protective insulating film and a gate insulating layer to form a storage capacitor.

In an active matrix liquid crystal display device, a display pattern is formed on the screen by driving pixel electrodes arranged in a matrix. In detail, by applying a voltage between the selected pixel electrode and the counter electrode corresponding to the pixel electrode, the optical modulation of the liquid crystal layer disposed between the pixel electrode and the counter electrode is performed. The optical modulation is The observer recognizes as a display pattern.

When the liquid crystal display device displays a moving image, since the response of the liquid crystal molecules itself is slow, there is a problem of after-image or blurring of the moving image. There is a driving technique called black insertion. In this driving technique, in order to improve the dynamic image characteristics of the liquid crystal display device, black display of the entire screen is performed every other frame.

In addition, there is also a driving technology called double-speed driving, in which the vertical synchronization frequency is set to 1.5 times or more, preferably 2 times or more, to improve the dynamic image characteristics.

In addition, there is the following driving technology: in order to improve the dynamic image characteristics of the liquid crystal display device, as a backlight, multiple LED (light emitting diode) light sources or multiple EL light sources are used to form a surface light source, and the surface light source is Each light source independently performs intermittent lighting drive during one frame period. As the surface light source, three or more types of LEDs or white-emitting LEDs can be used. Since multiple LEDs can be independently controlled, the light-emitting timing of the LEDs can also be synchronized according to the switching timing of the optical modulation of the liquid crystal layer. Because the LED can be partially turned off in this driving technology, especially in the case of image display with a high proportion of the black display area in a screen, the effect of reducing power consumption can be obtained.

By combining these driving technologies, it is possible to further improve the display characteristics such as the dynamic image characteristics of the liquid crystal display device compared with the existing liquid crystal display device.

Since the oxide semiconductor film is used for the channel formation region in the n-channel type transistor disclosed in this specification and has good dynamic image characteristics, these driving techniques can be combined.

In addition, when manufacturing light-emitting display devices, because one electrode (also referred to as the cathode) of the organic light-emitting element is set to a low power supply potential, such as GND, 0V, etc., a terminal portion is provided to set the cathode to a low power supply potential. , Such as the fourth terminal of GND, 0V, etc. In addition, when manufacturing a light-emitting display device, a power supply line is provided in addition to the source electrode wiring and the gate wiring. As a result, the fifth terminal electrically connected to the power supply line is provided in the terminal portion.

In addition, when manufacturing light-emitting display devices, sometimes in each organic light-emitting element A partition wall using an organic resin layer is provided between the parts. At this time, since the organic resin layer is subjected to heat treatment, this heat treatment can be used as both the heat treatment and the heat treatment for improving the electrical characteristics of the transistor and reducing the unevenness of the electrical characteristics.

By using a thin film transistor using an oxide semiconductor to form it, the manufacturing cost can be reduced. In particular, because the purity of the oxide semiconductor film is improved by reducing moisture as impurities by the heat treatment for dehydration or dehydrogenation, even if a special sputtering device that lowers the dew point in the film formation processing chamber is not used Or ultrahigh-purity oxide semiconductor targets can also be used to manufacture semiconductor devices including thin-film transistors with good electrical characteristics and high reliability.

Since the semiconductor layer in the channel formation region is a high resistance region, the electrical characteristics of the thin film transistor are stabilized, and an increase in off current can be prevented. Therefore, a semiconductor device including a thin film transistor with good electrical characteristics and high reliability can be manufactured.

This embodiment mode can be implemented in appropriate combination with the structures described in the other embodiment modes.

Embodiment Mode 5

Hereinafter, in a display device as an example of a semiconductor device, at least a part of a driving circuit and a thin film transistor arranged in a pixel portion are manufactured on the same substrate.

The thin film transistors arranged in the pixel portion are formed according to Embodiment Mode 1 to Embodiment Mode 4. In addition, because the thin film transistors shown in Embodiment Mode 1 to Embodiment Mode 4 are n-channel type TFTs, they can be used in the driving circuit. A part of the drive circuit composed of n-channel type TFTs and the thin film transistor of the pixel portion are formed on the same substrate.

FIG. 14A shows an example of a block diagram of an active matrix liquid crystal display device which is an example of a semiconductor device. The display device shown in FIG. 14A includes on a substrate 5300: a pixel portion 5301 having a plurality of pixels provided with display elements; a scanning line drive circuit 5302 for selecting each pixel; and a signal line drive for controlling video signal input to the selected pixel Circuit 5303.

The pixel portion 5301 is connected to the signal line driving circuit 5303 through a plurality of signal lines S1 to Sm (not shown) extending in the row direction from the signal line driving circuit 5303, and is connected to the signal line driving circuit 5303 by the scanning line driving circuit 5302 in the column direction. A plurality of scanning lines G1 to Gn (not shown) arranged to extend upward is connected to the scanning line driving circuit 5302, and the pixel portion 5301 has multiple scanning lines arranged in a matrix corresponding to the signal lines S1 to Sm and the scanning lines G1 to Gn. Pixels (not shown). In addition, each pixel is connected to a signal line Sj (any one of the signal lines S1 to Sm) and a scanning line Gi (any one of the scanning lines G1 to Gn).

In addition, the thin film transistors shown in Embodiment Mode 1 to Embodiment Mode 4 are n-channel type TFTs, and a signal line driver circuit composed of n-channel type TFTs will be described using FIG. 15.

The signal line driving circuit shown in FIG. 15 includes a driver IC 5601, switch groups 5602_1 to 5602_M, a first wiring 5611, a second wiring 5612, a third wiring 5613, and wirings 5621_1 to 5621_M. The switch groups 5602_1 to 5602_M respectively have a first thin film transistor 5603a, a second thin film transistor 5603b, and a third thin film transistor 5603c.

The driver IC 5601 is connected to the first wiring 5611, the second wiring 5612, the third wiring 5613, and the wirings 5621_1 to 5621_M. Also, the switch groups 5602_1 to 5602_M are connected to the first wiring 5611, the second wiring 5612, the third wiring 5613, and the corresponding wirings 5621_1 to 5621_M of the switch groups 5602_1 to 5602_M, respectively. Moreover, the wirings 5621_1 to 5621_M are connected to three signal lines by a first thin film transistor 5603a, a second thin film transistor 5603b, and a third thin film transistor 5603c, respectively. For example, the wiring 5621_J (any one of the wiring 5621_1 to the wiring 5621_M) of the J-th row has the first thin film transistor 5603a, the second thin film transistor 5603b, and the third thin film transistor 5603c and the signal line of the switch group 5602_J. Sj-1, the signal line Sj, and the signal line Sj+1 are connected.

In addition, signals are input to the first wiring 5611, the second wiring 5612, and the third wiring 5613, respectively.

In addition, the driver IC 5601 is preferably formed on a single crystal substrate. In addition, the switch groups 5602_1 to 5602_M are preferably formed on the same substrate as the pixel portion. Therefore, the driver IC 5601 and the switch groups 5602_1 to 5602_M are preferably connected by FPC or the like.

Next, the operation of the signal line driver circuit shown in FIG. 15 will be described with reference to the timing chart of FIG. 16. In addition, the timing chart of FIG. 16 shows a timing chart when the scan line Gi of the i-th column is selected. In addition, the selection period of the scan line Gi of the i-th column is divided into a first sub-selection period T1, a second sub-selection period T2, and a third sub-selection period T3. Furthermore, the signal line driver circuit of FIG. 15 performs the same operation as that of FIG. 16 even when the scanning lines of other columns are selected.

In addition, the timing chart of FIG. 16 shows that the wiring 5621_J of the Jth row is The first thin film transistor 5603a, the second thin film transistor 5603b, and the third thin film transistor 5603c are connected to the signal line Sj-1, the signal line Sj, and the signal line Sj+1.

In addition, the timing chart of FIG. 16 shows the timing when the scan line Gi of the i-th column is selected, the on/off timing 5703a of the first thin film transistor 5603a, the on/off timing 5703b of the second thin film transistor 5603b, and the third The on/off timing 5703c of the thin film transistor 5603c and the signal 5721_J input to the J-th row wiring 5621_J.

In addition, in the first sub-selection period T1, the second sub-selection period T2, and the third sub-selection period T3, different video signals are input to the wirings 5621_1 to 5621_M, respectively. For example, the video signal input to the wiring 5621_J in the first sub-selection period T1 is input to the signal line Sj-1, and the video signal input to the wiring 5621_J in the second sub-selection period T2 is input to the signal line Sj. The video signal input to the wiring 5621_J in the selection period T3 is input to the signal line Sj+1. In addition, the video signals input to the wiring 5621_J in the first sub-selection period T1, the second sub-selection period T2, and the third sub-selection period T3 are sequentially denoted as Data_j-1, Data_j, and Data_j+1, respectively.

As shown in FIG. 16, in the first sub-selection period T1, the first thin film transistor 5603a is turned on, and the second thin film transistor 5603b and the third thin film transistor 5603c are turned off. At this time, Data_j-1 input to the wiring 5621_J is input to the signal line Sj-1 through the first thin film transistor 5603a. In the second sub-selection period T2, the second thin film transistor 5603b is turned on, and the first thin film transistor 5603a and the third thin film transistor 5603c are turned off. At this point, enter Data_j of the wiring 5621_J is input to the signal line Sj through the second thin film transistor 5603b. In the third sub-selection period T3, the third thin film transistor 5603c is turned on, and the first thin film transistor 5603a and the second thin film transistor 5603b are turned off. At this time, Data_j+1 input to the wiring 5621_J is input to the signal line Sj+1 through the third thin film transistor 5603c.

According to this, the signal line driver circuit of FIG. 15 divides one gate selection period into three parts, so that a video signal can be input from one wiring 5621 to three signal lines in one gate selection period. Therefore, in the signal line drive circuit of FIG. 15, the number of connections between the substrate on which the driver IC 5601 is formed and the substrate on which the pixel portion is formed can be set to about 1/3 of the number of signal lines. Since the number of connections becomes about 1/3, the reliability, yield, etc. of the signal line drive circuit of FIG. 15 can be improved.

In addition, as long as one gate selection period can be divided into a plurality of sub-selection periods as shown in FIG. There are no restrictions on the configuration, number and driving method of transistors.

For example, when a video signal is input from one wiring to three or more signal lines in each of three or more sub-selection periods, a thin film transistor and wiring for controlling the thin film transistor may be added. However, if one gate selection period is divided into four or more sub-selection periods, each sub-selection period becomes shorter. Therefore, it is better to divide a gate selection period into two or three sub-selection periods.

As another example, as shown in the timing chart of FIG. 17, a gate selection period may be divided into a precharge period Tp and a first sub-selection period. T1, the second sub-selection period T2, and the third sub-selection period T3. In addition, the timing chart of FIG. 17 shows the timing when the scan line Gi of the i-th column is selected, the on/off timing 5803a of the first thin film transistor 5603a, the on/off timing 5803b of the second thin film transistor 5603b, and the third The turn-on/off timing 5803c of the thin film transistor 5603c and the signal 5821_J input to the J-th row wiring 5621_J. As shown in FIG. 17, during the precharge period Tp, the first thin film transistor 5603a, the second thin film transistor 5603b, and the third thin film transistor 5603c are turned on. At this time, the precharge voltage Vp input to the wiring 5621_J is input to the signal line Sj-1, the signal line Sj, and the signal line Sj through the first thin film transistor 5603a, the second thin film transistor 5603b, and the third thin film transistor 5603c, respectively. +1. In the first sub-selection period T1, the first thin film transistor 5603a is turned on, and the second thin film transistor 5603b and the third thin film transistor 5603c are turned off. At this time, Data_j-1 input to the wiring 5621_J is input to the signal line Sj-1 through the first thin film transistor 5603a. In the second sub-selection period T2, the second thin film transistor 5603b is turned on, and the first thin film transistor 5603a and the third thin film transistor 5603c are turned off. At this time, Data_j input to the wiring 5621_J is input to the signal line Sj through the second thin film transistor 5603b. In the third sub-selection period T3, the third thin film transistor 5603c is turned on, and the first thin film transistor 5603a and the second thin film transistor 5603b are turned off. At this time, Data_j+1 input to the wiring 5621_J is input to the signal line Sj+1 through the third thin film transistor 5603c.

Accordingly, the signal line driver circuit of FIG. 15 applying the timing chart of FIG. 17 can precharge the signal line by providing a precharge period before the sub-selection period, thereby enabling high-speed writing of video signals to pixels. enter. In addition, in FIG. 17, the same parts as those in FIG. 16 are denoted by common symbols, and detailed descriptions of the same parts or parts having the same functions are omitted.

In addition, the configuration of the scanning line drive circuit will be described. The scan line driving circuit includes a shift register. In addition, depending on the situation, a level shifter and a buffer may also be included. In the scan line driving circuit, a selection signal is generated by inputting a clock signal (CLK) and a start pulse signal (SP) to the shift register. The generated selection signal is buffered and amplified in the buffer and supplied to the corresponding scan line. The scan line is connected to the gate electrode of the transistor of the pixel of a row. In addition, since the transistors of the pixels of a row must be turned on at the same time, a buffer capable of flowing a large current is used.

A mode of the shift register used as a part of the scanning line driver circuit will be explained using FIGS. 18 and 19.

Fig. 18 shows the circuit structure of the shift register. The shift register shown in FIG. 18 is composed of a plurality of flip-flops 5701_1 to 5701_n. In addition, input the first clock signal, the second clock signal, the start pulse signal, and the reset signal to operate.

The connection relationship of the shift register shown in FIG. 18 will be described. In the shift register shown in FIG. 18, as for the i-th stage flip-flop 5701_i (any one of the flip-flops 5701_1 to 5701_n), the first wiring 5501 shown in FIG. 19 is connected to the seventh wiring 5717_i- 1. The second wiring 5502 shown in FIG. 19 is connected to the seventh wiring 5717_i+1, the third wiring 5503 shown in FIG. 19 is connected to the seventh wiring 5717_i, and the sixth wiring 5506 shown in FIG. 19 is connected to the fifth wiring. 5715.

In addition, the fourth wiring 5504 shown in FIG. 19 is connected to the second wiring 5712 in the flip-flops of odd-numbered stages, and the fourth wiring 5504 shown in FIG. 19 is connected to the third wiring 5713 in the flip-flops of even-numbered stages. And the fifth wiring 5505 shown in FIG. 19 is connected to the fourth wiring 5714.

However, the first wiring 5501 shown in FIG. 19 of the first-stage flip-flop 5701_1 is connected to the first wiring 5711, and the second wiring 5502 shown in FIG. 19 of the n-th stage flip-flop 5701_n is connected to the sixth wiring 5716 .

In addition, the first wiring 5711, the second wiring 5712, the third wiring 5713, and the sixth wiring 5716 may also be referred to as a first signal line, a second signal line, a third signal line, and a fourth signal line, respectively. In addition, the fourth wiring 5714 and the fifth wiring 5715 may also be referred to as a first power supply line and a second power supply line, respectively.

Next, the detailed structure of the flip-flop shown in FIG. 18 is shown using FIG. 19. The flip-flop shown in FIG. 19 includes a first thin film transistor 5571, a second thin film transistor 5572, a third thin film transistor 5573, a fourth thin film transistor 5574, a fifth thin film transistor 5575, and a sixth thin film transistor 5576. , The seventh thin film transistor 5577 and the eighth thin film transistor 5578. In addition, the first thin film transistor 5571, the second thin film transistor 5572, the third thin film transistor 5573, the fourth thin film transistor 5574, the fifth thin film transistor 5575, the sixth thin film transistor 5576, and the seventh thin film transistor 5577 And the eighth thin film transistor 5578 is an n-channel type transistor, and is in a conducting state when the gate-source voltage (Vgs) is higher than the threshold voltage (Vth).

Next, the connection structure of the flip-flop shown in FIG. 19 is shown below.

The first electrode (source electrode or drain electrode) of the first thin film transistor 5571 One of the electrodes) is connected to the fourth wiring 5504, and the second electrode (the other of the source electrode or the drain electrode) of the first thin film transistor 5571 is connected to the third wiring 5503.

The first electrode of the second thin film transistor 5572 is connected to the sixth wiring 5506, and the second electrode of the second thin film transistor 5572 is connected to the third wiring 5503.

The first electrode of the third thin film transistor 5573 is connected to the fifth wiring 5505, the second electrode of the third thin film transistor 5573 is connected to the gate electrode of the second thin film transistor 5572, and the gate electrode of the third thin film transistor 5573 It is connected to the fifth wiring 5505.

The first electrode of the fourth thin film transistor 5574 is connected to the sixth wiring 5506, the second electrode of the fourth thin film transistor 5574 is connected to the gate electrode of the second thin film transistor 5572, and the gate electrode of the fourth thin film transistor 5574 Connect with the gate electrode of the first thin film transistor 5571.

The first electrode of the fifth thin film transistor 5575 is connected to the fifth wiring 5505, the second electrode of the fifth thin film transistor 5575 is connected to the gate electrode of the first thin film transistor 5571, and the gate electrode of the fifth thin film transistor 5575 It is connected to the first wiring 5501.

The first electrode of the sixth thin film transistor 5576 is connected to the sixth wiring 5506, the second electrode of the sixth thin film transistor 5576 is connected to the gate electrode of the first thin film transistor 5571, and the gate electrode of the sixth thin film transistor 5576 Connect with the gate electrode of the second thin film transistor 5572.

The first electrode of the seventh thin film transistor 5577 is connected to the sixth wiring 5506, and the second electrode of the seventh thin film transistor 5577 is connected to the first thin film transistor The gate electrode of 5571 is connected, and the gate electrode of the seventh thin film transistor 5577 is connected to the second wiring 5502. The first electrode of the eighth thin film transistor 5578 is connected to the sixth wiring 5506, the second electrode of the eighth thin film transistor 5578 is connected to the gate electrode of the second thin film transistor 5572, and the gate electrode of the eighth thin film transistor 5578 It is connected to the first wiring 5501.

In addition, the gate electrode of the first thin film transistor 5571, the gate electrode of the fourth thin film transistor 5574, the second electrode of the fifth thin film transistor 5575, the second electrode of the sixth thin film transistor 5576, and the seventh thin film The junction of the second electrode of the transistor 5577 is denoted as node 5543. In addition, the gate electrode of the second thin film transistor 5572, the second electrode of the third thin film transistor 5573, the second electrode of the fourth thin film transistor 5574, the gate electrode of the sixth thin film transistor 5576, and the eighth thin film transistor The junction of the second electrode of the transistor 5578 is referred to as the node 5544.

In addition, the first wiring 5501, the second wiring 5502, the third wiring 5503, and the fourth wiring 5504 may also be referred to as a first signal line, a second signal line, a third signal line, and a fourth signal line, respectively. In addition, the fifth wiring 5505 may also be referred to as a first power supply line, and the sixth wiring 5506 may also be referred to as a second power supply line.

In addition, only the n-channel type TFTs shown in Embodiment Mode 1 to Embodiment Mode 4 may be used to manufacture the signal line driver circuit and the scan line driver circuit. Since the transistor mobility of the n-channel type TFT shown in Embodiment Mode 1 to Embodiment Mode 4 is large, the driving frequency of the driving circuit can be increased. In addition, because the parasitic capacitance of the n-channel type TFT shown in Embodiment Mode 1 to Embodiment Mode 4 is reduced, the frequency characteristic (referred to as f characteristic) is reduced. Sex) is high. For example, since the scanning line driver circuit using the n-channel type TFT shown in Embodiment Mode 1 to Embodiment Mode 4 can perform high-speed operation, it is possible to achieve an increase in frame frequency or black screen insertion.

In addition, by increasing the channel width of the transistor of the scan line driving circuit or arranging multiple scan line driving circuits, a higher frame frequency can be achieved. In the case of disposing a plurality of scanning line driving circuits, by arranging the scanning line driving circuit for driving the scanning lines of the even-numbered rows on one side, the scanning line driving circuit for driving the scanning lines of the odd-numbered rows is arranged thereon. On the opposite side, the frame frequency can be increased. In addition, if a plurality of scan line driving circuits output signals to the same scan line, it is beneficial to enlarge the display device.

In addition, in the case of manufacturing an active matrix light-emitting display device as an example of a semiconductor device, since a plurality of thin film transistors are arranged in at least one pixel, it is preferable to arrange a plurality of scan line driving circuits. FIG. 14B shows an example of a block diagram of an active matrix type light-emitting display device.

The light-emitting display device shown in FIG. 14B includes on a substrate 5400: a pixel portion 5401 having a plurality of pixels provided with display elements; a first scan line driving circuit 5402 and a second scan line driving circuit 5404 for selecting each pixel; The video signal of the selected pixel is input to the signal line driver circuit 5403.

When the video signal input to the pixel of the light-emitting display device shown in FIG. 14B is in a digital mode, by switching the on and off of the transistor, the pixel presents a light-emitting or non-light-emitting state. Therefore, the area gray scale method or the time gray scale method can be used to display the gray scale. The area gray scale method is to divide a pixel into multiple sub-pixels and drive each sub-pixel independently according to the video signal. Pixel-based driving method for grayscale display. In addition, the time gray scale method is a driving method for gray scale display by controlling the time when the pixel emits light.

Since the response speed of the light-emitting element is faster than that of the liquid crystal element, etc., the light-emitting element is more suitable for the time gray scale method than the liquid crystal element. Specifically, when the time gray scale method is used for display, one frame period is divided into a plurality of sub-frame periods. Then, according to the video signal, the light-emitting element of the pixel is placed in a light-emitting or non-light-emitting state in each sub-frame period. By dividing into a plurality of sub-frame periods, the total length of time during which the pixels actually emit light in one frame period can be controlled by the video signal, and grayscale display can be performed.

In addition, the light-emitting display device shown in FIG. 14B shows an example in which when two switching TFTs are arranged in one pixel, the first scan line driver circuit 5402 is used to generate a second gate wiring input to one switching TFT. For the signal of one scan line, the second scan line driver circuit 5404 is used to generate the signal input to the second scan line as the gate wiring of the other switching TFT. However, it is also possible to use one scan line driver circuit to generate the signal input to the first scan line. The signal of the scan line and the signal input to the second scan line. In addition, for example, a plurality of scanning lines for controlling the operation of the switching element may be provided in each pixel according to the number of switching TFTs included in one pixel. In this case, one scan line driving circuit may be used to generate all the signals input to the multiple scan lines, or multiple scan line driving circuits may be used to generate the signals input to the multiple scan lines.

In addition, in the light-emitting display device, a part of the driving circuit that can be composed of n-channel type TFTs in the driving circuit may be formed on the same substrate as the thin film transistor of the pixel portion. In addition, it is also possible to use only the examples The n-channel type TFT shown in Mode 1 to Embodiment Mode 4 is used to manufacture a signal line driver circuit and a scan line driver circuit.

Through the above process, a highly reliable display device as a semiconductor device can be manufactured.

In addition, this embodiment mode can be implemented in appropriate combination with the configurations shown in other embodiment modes.

Embodiment Mode 6

By manufacturing a thin film transistor and using the thin film transistor in the pixel portion and the driving circuit, a semiconductor device with a display function (also called a display device) can be manufactured. In addition, a thin film transistor can be used to integrally form part or the whole of the driving circuit on the same substrate as the pixel portion to form a system-on-panel.

The display device includes a display element. As the display element, a liquid crystal element (also referred to as a liquid crystal display element) and a light-emitting element (also referred to as a light-emitting display element) can be used. The category of light-emitting elements includes elements that use current or voltage to control brightness, and specifically includes inorganic EL (Electro Luminescence) elements, organic EL elements, and the like. In addition, display media such as electronic ink whose contrast changes due to electrical effects can also be used.

In addition, the display device includes a panel in which a display element is sealed and a module in which an IC including a controller and the like are mounted. Furthermore, an embodiment of the present invention relates to an element substrate equivalent to an embodiment before the display element in the process of manufacturing the display device is completed, and the element substrate is Each of the plurality of pixels includes a unit for supplying current to the display element. Specifically, the element substrate may be in a state where only the pixel electrode of the display element is formed, or may be in a state after forming a conductive film to be the pixel electrode and before forming the pixel electrode by etching, and may be in any state.

Note that the display device in this specification refers to an image display device, a display device, or a light source (including a lighting device). In addition, the display device also includes: a module mounted with connectors such as FPC (Flexible Printed Circuit), TAB (Tape Automated Bonding) tape, or TCP (Tape Carrier Package) ; A module with a printed circuit board is arranged on the end of the TAB tape or TCP; a module in which IC (integrated circuit) is directly mounted on the display element by COG (Chip On Glass) method.

The appearance and cross section of a liquid crystal display panel corresponding to an embodiment of a semiconductor device will be described with reference to FIGS. 10A1, 10A2, and 10B. 10A1 and 10A2 are plan views of a panel, in which a sealing material 4005 is used to include the oxide semiconductor layer shown in Embodiment Mode 4 formed on the first substrate 4001, and the highly reliable thin film transistors 4010, 4011 and liquid crystal The element 4013 is sealed between the first substrate 4001 and the second substrate 4006. Fig. 10B corresponds to a cross-sectional view along MN in Figs. 10A1 and 10A2.

A sealing material 4005 is provided in a manner to surround the pixel portion 4002 and the scan line driving circuit 4004 provided on the first substrate 4001. In addition, a second substrate is provided on the pixel portion 4002 and the scan line driving circuit 4004 4006. Therefore, the pixel portion 4002 and the scan line driving circuit 4004 are sealed by the first substrate 4001, the sealing material 4005, and the second substrate 4006 together with the liquid crystal layer 4008. In addition, a signal line driver circuit 4003 is mounted on the first substrate 4001 in a region different from the region surrounded by the sealing material 4005. The signal line driver circuit 4003 is formed using a single crystal semiconductor film or a polycrystalline semiconductor film in a separately prepared area. On the substrate.

Note that there is no particular limitation on the connection method of the separately formed drive circuit, and the COG method, wire bonding method, TAB method, or the like may be adopted. 10A1 is an example of mounting the signal line driving circuit 4003 by the COG method, and FIG. 10A2 is an example of mounting the signal line driving circuit 4003 by the TAB method.

In addition, the pixel portion 4002 and the scan line driving circuit 4004 provided on the first substrate 4001 include a plurality of thin film transistors. FIG. 10B illustrates a thin film transistor 4010 included in the pixel portion 4002 and a thin film transistor 4011 included in the scan line driving circuit 4004. Insulating layers 4020 and 4021 are provided on the thin film transistors 4010 and 4011.

The highly reliable thin film transistors including the oxide semiconductor layer shown in Embodiment Mode 4 can be used for the thin film transistors 4010 and 4011. In addition, the thin film transistors shown in Embodiment Mode 1 to Embodiment Mode 3 can also be used. In this embodiment mode, the thin film transistors 4010 and 4011 are n-channel type thin film transistors.

In addition, the pixel electrode layer 4030 of the liquid crystal element 4013 is electrically connected to the thin film transistor 4010. Furthermore, the counter electrode layer 4031 of the liquid crystal element 4013 is formed on the second substrate 4006. Pixel electrode layer 4030, right The overlapping portion of the electrode layer 4031 and the liquid crystal layer 4008 corresponds to the liquid crystal element 4013. Note that the pixel electrode layer 4030 and the counter electrode layer 4031 are respectively provided with insulating layers 4032 and 4033 serving as alignment films, and a liquid crystal layer 4008 is sandwiched between the insulating layers 4032 and 4033.

In addition, as the first substrate 4001 and the second substrate 4006, glass, metal (typically stainless steel), ceramic, and plastic can be used. As the plastic, FRP (Fiberglass-Reinforced Plastics; glass fiber reinforced plastic) board, PVF (polyvinyl fluoride) film, polyester film, or acrylic resin film can be used. In addition, a sheet having a structure in which an aluminum foil is sandwiched between PVF films or polyester films can also be used.

In addition, reference numeral 4035 denotes a columnar spacer obtained by selectively etching an insulating film, and it is used to control the distance between the pixel electrode layer 4030 and the counter electrode layer 4031 (cell gap )) and set. In addition, spherical spacers can also be used. In addition, the counter electrode layer 4031 is electrically connected to a common potential line provided on the same substrate as the thin film transistor 4010. It is possible to use a common connection portion and electrically connect the counter electrode layer 4031 and the common potential line through conductive particles disposed between a pair of substrates. In addition, conductive particles are contained in the sealing material 4005.

In addition, a liquid crystal exhibiting a blue phase that does not use an alignment film can also be used. The blue phase is a type of liquid crystal phase, and refers to the phase that appears before the cholesteric phase is converted to the homogeneous phase when the temperature of the cholesteric liquid crystal is increased. Since the blue phase only appears in a narrow temperature range, in order to improve the temperature range, a liquid crystal composition mixed with 5 wt% or more of a chiral agent is used for the liquid crystal layer 4008. Since the response speed of a liquid crystal composition containing a blue phase liquid crystal and a chiral agent is short, that is, 1 msec or less, and it has optical isotropy, alignment treatment is not required, and the viewing angle dependence is low.

In addition, in addition to being applied to a transmissive liquid crystal display device, it can also be applied to a reflective liquid crystal display device or a semi-transmissive liquid crystal display device.

In addition, although an example is shown in which a polarizing plate is provided on the outer side (visible side) of the substrate in the liquid crystal display device, and the colored layer and the electrode layer for the display element are sequentially provided on the inner side, the polarized light may also be provided on the inner side of the substrate. plate. In addition, the laminated structure of the polarizing plate and the colored layer is not limited to the structure of this embodiment mode, and the laminated structure of the polarizing plate and the colored layer may be appropriately set according to the materials of the polarizing plate and the colored layer or the manufacturing process conditions. In addition, a light-shielding film used as a black matrix can also be provided.

In the thin film transistors 4010 and 4011, an insulating film 4020 is formed as a protective insulating film in contact with the semiconductor layer including the channel formation region. The insulating film 4020 may be formed using the same material and method as the oxide insulating film 407 shown in Embodiment Mode 1. In addition, a structure for covering with an insulating layer 4021 serving as a planarizing insulating film is adopted in order to reduce surface irregularities.

Here, an insulating layer 4020 of a laminated structure is formed as a protective film. Here, a silicon oxide film is formed as the first layer of the insulating layer 4020 by a sputtering method. When a silicon oxide film is used as the protective film, there is an effect of preventing hillocks in the aluminum film used as the source electrode layer and the drain electrode layer.

In addition, an insulating layer is formed as the second layer of the protective film. Here, use A silicon nitride film is formed as the second layer of the insulating layer 4020 by a sputtering method. When a silicon nitride film is used as a protective film, it is possible to prevent mobile ions such as sodium from entering the semiconductor region to change the electrical characteristics of the TFT.

In addition, after the protective film is formed, heat treatment (300°C or less) may be performed in a nitrogen atmosphere or an atmospheric atmosphere.

In addition, an insulating layer 4021 is formed as a planarizing insulating film. As the insulating layer 4021, an organic material having heat resistance such as polyimide, acrylic resin, benzocyclobutene, polyamide, epoxy resin, etc. can be used. In addition, in addition to the above-mentioned organic materials, low dielectric constant materials (low-k materials), silicone resins, PSG (phosphosilicate glass), BPSG (borophosphosilicate glass), etc. can also be used. In addition, the insulating layer 4021 may be formed by stacking a plurality of insulating films formed of these materials.

In addition, the silicone-based resin is equivalent to a resin containing Si-O-Si bonds formed from a silicone-based material as a starting material. As the substituent of the silicone resin, an organic group (for example, an alkyl group, an aryl group) and a fluorine group can also be used. In addition, the organic group may have a fluorine group.

The method of forming the insulating layer 4021 is not particularly limited. Sputtering method, SOG method, spin coating, dipping, spraying, droplet spraying method (inkjet method, screen printing, offset printing, etc.), scraping method can be used according to the material. Sheet, roll coater, curtain coater, knife coater, etc. By combining the firing process of the insulating layer 4021 and the annealing of the semiconductor layer, the semiconductor device can be efficiently manufactured.

As the pixel electrode layer 4030 and the counter electrode layer 4031, a light-transmitting conductive material such as indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, and oxygen containing titanium oxide can be used. Indium tin oxide, indium tin oxide (hereinafter referred to as ITO), indium zinc oxide, indium tin oxide added with silicon oxide, etc.

In addition, the pixel electrode layer 4030 and the counter electrode layer 4031 can be formed using a conductive composition containing a conductive polymer (also referred to as a conductive polymer). The sheet resistance of the pixel electrode formed using the conductive composition is preferably 10000 Ω/sq (ohm per square) or less, and the light transmittance at a wavelength of 550 nm is preferably 70% or more. In addition, the resistivity of the conductive polymer contained in the conductive composition is preferably 0.1Ω. cm below.

As the conductive polymer, a so-called π-electron conjugated conductive polymer can be used. For example, polyaniline or a derivative thereof, polypyrrole or a derivative thereof, polythiophene or a derivative thereof, or a copolymer of two or more of the above-mentioned materials, and the like can be mentioned.

In addition, various signals and potentials supplied to the separately formed signal line driver circuit 4003, scanning line driver circuit 4004, or pixel portion 4002 are supplied from the FPC 4018.

The connection terminal electrode 4015 is formed of the same conductive film as the pixel electrode layer 4030 of the liquid crystal element 4013, and the terminal electrode 4016 is formed of the same conductive film as the source electrode layer and drain electrode layer of the thin film transistors 4010 and 4011.

The connection terminal electrode 4015 is electrically connected to the terminal of the FPC 4018 through the anisotropic conductive film 4019.

In addition, although it is shown in FIGS. 10A1, 10A2, and 10B that the signal line driver circuit 4003 is separately formed and mounted on the first substrate 4001 Examples, but not limited to this structure. The scanning line driver circuit may be separately formed and mounted, or only a part of the signal line driver circuit or a part of the scanning line driver circuit may be separately formed and mounted.

FIG. 20 shows an example in which a TFT substrate 2600 manufactured by the manufacturing method disclosed in this specification is used to form a liquid crystal display module as a semiconductor device.

20 is an example of a liquid crystal display module. The TFT substrate 2600 and the counter substrate 2601 are fixed with a sealing material 2602, and a pixel portion 2603 including TFTs, etc., a display element 2604 including a liquid crystal layer, and a colored layer 2605 are provided in between to form a display Area. A colored layer 2605 is required for color display, and when the RGB method is adopted, a colored layer corresponding to each color of red, green, and blue is provided corresponding to each pixel. A polarizing plate 2606, a polarizing plate 2607, and a diffusion plate 2613 are arranged outside the TFT substrate 2600 and the counter substrate 2601. The light source is composed of a cold cathode tube 2610 and a reflector 2611. The circuit board 2612 is connected to the wiring circuit portion 2608 of the TFT board 2600 by a flexible circuit board 2609, and external circuits such as a control circuit and a power supply circuit are incorporated therein. In addition, it may be laminated with a phase difference plate between the polarizing plate and the liquid crystal layer.

As a liquid crystal display module, TN (Twisted Nematic) mode, IPS (In-Plane-Switching) mode, FFS (Fringe Field Switching) mode, MVA (multi-domain vertical Orientation; Multi-domain Vertical Alignment) mode, PVA (Vertical orientation configuration; Patterned Vertical Alignment) mode, ASM (Axisymmetric arrangement) Micro-cell; Axially Symmetric Aligned Micro-cell) mode, OCB (Optical Compensated Birefringence) mode, FLC (Ferroelectric Liquid Crystal) mode, AFLC (AntiFerroelectric Liquid Crystal) mode Wait.

Through the above process, a highly reliable liquid crystal display panel as a semiconductor device can be manufactured.

This embodiment mode can be implemented in appropriate combination with the structures described in the other embodiment modes.

Embodiment Mode 7

As a semiconductor device, an example of electronic paper is shown.

The semiconductor device can also be used for electronic paper that uses an element electrically connected to a switching element to drive electronic ink. Electronic paper is also called an electrophoretic display device (electrophoretic display), and has the following advantages: the same legibility as paper; power consumption is smaller than other display devices; and it can be formed into a thin and light shape.

As an electrophoretic display, various methods can be considered. In an electrophoretic display, a plurality of microcapsules containing positively charged first particles and negatively charged second particles are dispersed in a solvent or solute, and an electric field is applied to the microcapsules to cause the particles in the microcapsules to move toward Move in opposite directions to show only the color of the particles gathered on one side. In addition, the first particle or the second particle contains a dye and does not move when there is no electric field. In addition, the colors of the first particles and the second particles are different (including colorless).

Like this, an electrophoretic display is a display that uses the so-called dielectrophoresis effect. In the dielectrophoresis effect, the substance with high dielectric constant moves to the high electric field area. The electrophoretic display does not require the polarizing plate required by the liquid crystal display device.

The solution in which the above-mentioned microcapsules are dispersed in a solvent is called electronic ink, and the electronic ink can be printed on the surface of glass, plastic, cloth, paper, etc. In addition, it is also possible to perform color display by using color filters or particles with pigments.

In addition, by appropriately disposing a plurality of the above-mentioned microcapsules on the active matrix substrate so that the microcapsules are sandwiched between two electrodes, an active matrix display device is completed, and display can be performed by applying an electric field to the microcapsules. For example, an active matrix substrate obtained from the thin film transistors according to Embodiment Mode 1 to Embodiment Mode 4 can be used.

In addition, as the first particles and the second particles in the microcapsules, selected from conductive materials, insulating materials, semiconductor materials, magnetic materials, liquid crystal materials, ferroelectric materials, electroluminescent materials, electrochromic materials, and magnetophoretic materials are used. One of the materials or a combination of these materials may be sufficient.

In FIG. 9, an active matrix type electronic paper is shown as an example of a semiconductor device. The thin film transistor 581 used in the semiconductor device can be manufactured in the same manner as the thin film transistor shown in Embodiment Mode 1, and the thin film transistor 581 is a highly reliable thin film transistor including an oxide semiconductor layer. In addition, the thin film transistors shown in Embodiment Mode 2 to Embodiment Mode 4 can also be used for the thin film transistor 581 of this embodiment mode.

The electronic paper in FIG. 9 is an example of a display device adopting a twisting ball display method. The rotating ball display method refers to a method in which spherical particles colored in white and black are arranged in A potential difference is generated between the first electrode layer and the second electrode layer of the electrode layer used in the display element, and a potential difference is generated between the first electrode layer and the second electrode layer to control the direction of the spherical particles for display.

The thin film transistor 581 sealed between the substrate 580 and the substrate 596 is a thin film transistor of a bottom gate structure, and is covered by an insulating film 583 in contact with the semiconductor layer. The source electrode layer or the drain electrode layer of the thin film transistor 581 is in contact with and electrically connected to the first electrode layer 587 in the openings formed in the insulating film 583 and the insulating layer 585. Spherical particles 589 are arranged between the first electrode layer 587 and the second electrode layer 588. The spherical particles 589 have a black area 590a and a white area 590b, and the black area 590a and the white area 590b include a cavity 594 filled with liquid. And the spherical particles 589 are filled with fillers 595 such as resin (refer to FIG. 9). The first electrode layer 587 corresponds to a pixel electrode, and the second electrode layer 588 corresponds to a common electrode. The second electrode layer 588 is electrically connected to a common potential line provided on the same substrate as the thin film transistor 581. The common connection portion may be used to electrically connect the second electrode layer 588 and the common potential line through conductive particles disposed between the substrate 580 and the substrate 596.

In addition, electrophoretic elements can also be used instead of rotating balls. A microcapsule with a diameter of about 10 μm to 200 μm is used, and a transparent liquid, positively charged white particles, and negatively charged black particles are enclosed in the microcapsules. In the microcapsules disposed between the first electrode layer and the second electrode layer, when an electric field is applied from the first electrode layer and the second electrode layer, the white particles and the black particles move in opposite directions, so that white or black can be displayed . The display element that applies this principle is an electrophoretic display element, which is generally called electronic paper. The electrophoretic display element has It has a higher reflectivity than the liquid crystal display element, so no auxiliary lamp is needed. In addition, the power consumption is low, and the display can be recognized even in dark places. In addition, even if power is not supplied to the display unit, the image once displayed can be maintained. Therefore, even if a semiconductor device with a display function (simply called a display device or a semiconductor device with a display device) is removed from the radio wave emission source, the displayed image can be saved.

Through the above process, it is possible to manufacture electronic paper with high reliability as a semiconductor device.

This embodiment mode can be implemented in appropriate combination with the structures described in the other embodiment modes.

Embodiment Mode 8

As a semiconductor device, an example of a light-emitting display device is shown. Here, a light-emitting element using electroluminescence is shown as a display element included in a display device. Light-emitting elements using electroluminescence are distinguished according to whether the light-emitting material is an organic compound or an inorganic compound. Generally, the former is called an organic EL element, and the latter is called an inorganic EL element.

In an organic EL element, by applying a voltage to a light-emitting element, electrons and holes are respectively implanted from a pair of electrodes into a layer containing a light-emitting organic compound, and current flows therethrough. Also, by recombination of these carriers (electrons and holes), the light-emitting organic compound forms an excited state, and when the excited state returns to a ground state, light is obtained. According to this mechanism, such a light-emitting element is called a current-excited light-emitting element.

Inorganic EL elements are classified as dispersed inorganic EL according to their element structure Elements and thin-film inorganic EL elements. The dispersion-type inorganic EL element includes a light-emitting layer in which particles of a light-emitting material are dispersed in a binder, and its light-emitting mechanism is donor-acceptor recombination light emission using a donor level and an acceptor level. The thin-film inorganic EL element has a structure in which a light-emitting layer is sandwiched by a dielectric layer, and the dielectric layer sandwiching the light-emitting layer is sandwiched by an electrode, and its light-emitting mechanism is localized light-emission using inner electron transitions of metal ions. In addition, here, an organic EL element is used as a light-emitting element for description.

FIG. 12 is a diagram showing an example of a pixel structure that can use digital time gray scale driving as an example of a semiconductor device.

Describes the structure of the pixel that can be driven by digital time grayscale and the operation of the pixel. Here, an example is shown in which two n-channel type transistors are used in one pixel, and an oxide semiconductor layer is used for the channel formation region in this n-channel type transistor.

The pixel 6400 includes a switching transistor 6401, a driving transistor 6402, a light-emitting element 6404, and a capacitor element 6403. In the switching transistor 6401, the gate is connected to the scan line 6406, the first electrode (one of the source electrode and the drain electrode) is connected to the signal line 6405, and the second electrode (the one of the source electrode and the drain electrode) is connected to the signal line 6405. The other side) is connected to the gate of the driving transistor 6402. In the driving transistor 6402, the gate is connected to the power line 6407 through the capacitive element 6403, the first electrode is connected to the power line 6407, and the second electrode is connected to the first electrode (pixel electrode) of the light-emitting element 6404. The second electrode of the light emitting element 6404 corresponds to the common electrode 6408. The common electrode 6408 is electrically connected to a common potential line formed on the same substrate catch.

In addition, the second electrode (common electrode 6408) of the light-emitting element 6404 is set to a low power supply potential. In addition, the low power supply potential refers to a potential that satisfies low power supply potential&lt;high power supply potential based on the high power supply potential set by the power supply line 6407, and the low power supply potential can be set to, for example, GND, 0V, or the like. The potential difference between the high power supply potential and the low power supply potential is applied to the light-emitting element 6404, in order to allow current to flow through the light-emitting element 6404 so that the light-emitting element 6404 emits light, so that the potential difference between the high power supply potential and the low power supply potential becomes the positive value of the light-emitting element 6404. The potentials are set to be above the threshold voltage.

In addition, the gate capacitor of the driving transistor 6402 can be used instead of the capacitive element 6403, and the capacitive element 6403 can be omitted. As for the gate capacitance of the driving transistor 6402, a capacitance may also be formed between the channel area and the gate electrode.

Here, when the voltage input voltage driving method is adopted, the gate of the driving transistor 6402 is inputted with a video signal that can make the driving transistor 6402 fully on or off. That is, the driving transistor 6402 is operated in the linear region. Since the driving transistor 6402 is operated in the linear region, a voltage higher than the voltage of the power supply line 6407 is applied to the gate of the driving transistor 6402. In addition, a voltage of (power supply line voltage+Vth of driving transistor 6402) or higher is applied to the signal line 6405.

In addition, when the analog gray scale driving is performed instead of the digital time gray scale driving, the same pixel structure as in FIG. 12 can be used by making the signal input different.

When performing analog gray scale driving, a voltage equal to or higher than (forward voltage of the light-emitting element 6404 + Vth of the driving transistor 6402) is applied to the gate of the driving transistor 6402. The forward voltage of the light emitting element 6404 refers to the voltage when set to a desired brightness, and includes at least the forward threshold voltage. In addition, by inputting a video signal for operating the driving transistor 6402 in the saturation region, a current can flow through the light-emitting element 6404. In order to make the driving transistor 6402 work in the saturation region, the potential of the power line 6407 is set higher than the gate potential of the driving transistor 6402. By setting the video signal to the analog mode, a current corresponding to the video signal can flow through the light-emitting element 6404 to perform analog gray scale driving.

In addition, the pixel structure shown in FIG. 12 is not limited to this. For example, a switch, a resistance element, a capacitance element, a transistor, a logic circuit, etc. may be added to the pixel shown in FIG. 12.

Next, the structure of the light-emitting element will be described with reference to FIGS. 13A to 13C. Here, the cross-sectional structure of the pixel will be described by taking a case where the driving TFT is an n-type as an example. The driving TFTs 7001, 7011, 7021 used in the semiconductor devices of FIGS. 13A, 13B, and 13C can be manufactured in the same manner as the thin film transistors shown in Embodiment Mode 1, and the driving TFTs 7001, 7011, 7021 are reliable including an oxide semiconductor layer. High thin film transistors. In addition, the thin film transistors shown in Embodiment Mode 2 to Embodiment Mode 4 can also be used as the TFTs 7001, 7011, and 7021.

In order to extract light, at least one of the anode or the cathode of the light-emitting element may be transparent. In addition, thin film transistors and light-emitting elements are formed on the substrate, and the light-emitting elements have the following structure, which is obtained from the surface opposite to the substrate The top emission of light emission, the bottom emission of light emission from one side of the substrate, and the double-sided emission structure where light emission is obtained from the side of the substrate and the surface opposite to the substrate. The pixel structure can be applied to light-emitting elements of any emission structure.

The light-emitting element of the top emission structure will be described using FIG. 13A.

A cross-sectional view of the pixel when the driving TFT 7001 is an n-type and the light emitted from the light emitting element 7002 passes to the anode 7005 side is shown in FIG. 13A. In FIG. 13A, the cathode 7003 of the light-emitting element 7002 is electrically connected to the driving TFT 7001, and the light-emitting layer 7004 and the anode 7005 are sequentially stacked on the cathode 7003. As the cathode 7003, various materials can be used as long as it is a conductive film that has a small work function and reflects light. For example, Ca, Al, MgAg, AlLi, etc. are preferably used. Also, the light-emitting layer 7004 may be composed of a single layer or a stack of multiple layers. When the light emitting layer 7004 is composed of multiple layers, an electron implantation layer, an electron transport layer, a light emitting layer, a hole transport layer, and a hole implant layer are sequentially stacked on the cathode 7003. Note that it is not necessary to set all the layers mentioned above. The anode 7005 is formed of a light-transmitting conductive material that transmits light, and a light-transmitting conductive film can also be used, such as indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, Indium tin oxide of titanium oxide, indium tin oxide (hereinafter referred to as ITO), indium zinc oxide, indium tin oxide added with silicon oxide, and the like.

The area where the light-emitting layer 7004 is sandwiched between the cathode 7003 and the anode 7005 corresponds to the light-emitting element 7002. In the pixel shown in FIG. 13A, the light emitted from the light-emitting element 7002 is emitted to the anode 7005 side as indicated by the arrow.

Next, a light-emitting element having a bottom emission structure will be described using FIG. 13B. picture 13B shows a cross-sectional view of the pixel in the case where the driving TFT 7011 is an n-type, and the light emitted from the light-emitting element 7012 is emitted to the cathode 7013 side. In FIG. 13B, a cathode 7013 of a light emitting element 7012 is formed on a light-transmitting conductive film 7017 electrically connected to a driving TFT 7011, and a light emitting layer 7014 and an anode 7015 are sequentially stacked on the cathode 7013. In addition, when the anode 7015 has translucency, a mask film 7016 for reflecting light or shielding light may be formed to cover the anode. As in the case of FIG. 13A, as the cathode 7013, various materials can be used as long as it is a conductive material with a small work function. However, the thickness is set to the degree of light transmission (preferably about 5 nm to 30 nm). For example, an aluminum film with a film thickness of 20 nm can also be used as the cathode 7013. Furthermore, as in FIG. 13A, the light-emitting layer 7014 may be composed of a single layer or a stack of multiple layers. The anode 7015 does not need to transmit light, but can be formed using a light-transmitting conductive material as in FIG. 13A. In addition, as the mask film 7016, for example, a light-reflecting metal or the like can be used, but it is not limited to a metal film. For example, resin to which black pigments are added, etc. can also be used.

The area where the light-emitting layer 7014 is sandwiched by the cathode 7013 and the anode 7015 corresponds to the light-emitting element 7012. In the pixel shown in FIG. 13B, the light emitted from the light-emitting element 7012 is emitted toward the cathode 7013 side as indicated by the arrow.

Next, a light-emitting element having a double-emission structure will be described using FIG. 13C. In FIG. 13C, a cathode 7023 of a light-emitting element 7022 is formed on a light-transmitting conductive film 7027 electrically connected to a driving TFT 7021, and a light-emitting layer 7024 and an anode 7025 are sequentially laminated on the cathode 7023. As in the case of FIG. 13A, as the cathode 7023, as long as it has a small work function, For electrical materials, various materials can be used. However, the film thickness is set to the degree of light transmission. For example, an aluminum film with a film thickness of 20 nm can be used as the cathode 7023. Also, similar to FIG. 13A, the light-emitting layer 7024 may be composed of a single layer or a stack of multiple layers. The anode 7025 can be formed using a light-transmitting conductive material similar to FIG. 13A.

The overlapping portion of the cathode 7023, the light-emitting layer 7024, and the anode 7025 corresponds to the light-emitting element 7022. In the pixel shown in FIG. 13C, the light emitted from the light-emitting element 7022 is emitted to both sides of the anode 7025 side and the cathode 7023 side as indicated by arrows.

Note that although an organic EL element used as a light-emitting element is described here, an inorganic EL element may also be provided as a light-emitting element.

Note that although an example in which a thin film transistor (drive TFT) that controls driving of the light-emitting element is electrically connected to the light-emitting element is shown here, a structure in which a current control TFT is connected between the drive TFT and the light-emitting element may also be adopted.

Note that the semiconductor device is not limited to the structure shown in FIGS. 13A to 13C and can be variously modified according to the technical idea disclosed in this specification.

Next, the appearance and cross section of a light-emitting display panel (also referred to as a light-emitting panel) corresponding to one aspect of a semiconductor device will be described with reference to FIGS. 11A and 11B. FIG. 11A is a plan view of a panel in which a thin film transistor and a light-emitting element formed on a first substrate are sealed between a first substrate and a second substrate with a sealing material. FIG. 11B corresponds to a cross-sectional view along HI of FIG. 11A.

A sealing material 4505 is provided so as to surround the pixel portion 4502 provided on the first substrate 4501, the signal line driver circuits 4503a, 4503b, and the scan line driver circuits 4504a, 4504b. In addition, a second substrate 4506 is provided on the pixel portion 4502, the signal line driver circuits 4503a, 4503b, and the scan line driver circuits 4504a, 4504b. Therefore, the pixel portion 4502, the signal line driver circuits 4503a, 4503b, and the scan line driver circuits 4504a, 4504b, together with the filler 4507, are sealed by the first substrate 4501, the sealing material 4505, and the second substrate 4506. In this way, in order not to be exposed to the air, it is better to use a protective film (laminated film, ultraviolet curable resin film, etc.) and a covering material with high airtightness and less air leakage for encapsulation (sealing).

In addition, the pixel portion 4502, the signal line driver circuits 4503a, 4503b, and the scan line driver circuits 4504a, 4504b provided on the first substrate 4501 include a plurality of thin film transistors. The thin film transistor 4510 included in the pixel portion 4502 and the thin film transistor 4509 included in the signal line driver circuit 4503a are illustrated in FIG. 11B.

As the thin film transistors 4509 and 4510, the highly reliable thin film transistors including the oxide semiconductor layer shown in Embodiment Mode 3 can be used. In addition, the thin film transistors shown in Embodiment Mode 1 to Embodiment Mode 4 can also be used. Thin film transistors 4509 and 4510 are n-channel thin film transistors.

In addition, reference numeral 4511 corresponds to a light-emitting element, and the first electrode layer 4517 as a pixel electrode of the light-emitting element 4511 is electrically connected to the source electrode layer or the drain electrode layer of the thin film transistor 4510. Note that although Although the structure of the light-emitting element 4511 is a stacked structure of the first electrode layer 4517, the electroluminescent layer 4512, and the second electrode layer 4513, it is not limited to the structure shown. The structure of the light-emitting element 4511 can be appropriately changed according to the direction of light obtained from the light-emitting element 4511 and the like.

The partition wall 4520 is formed using an organic resin film, an inorganic insulating film, or organic polysiloxane. It is particularly preferable to use a photosensitive material to form an opening in the first electrode layer 4517 to form the side wall of the opening into an inclined surface formed with a continuous curvature.

The electroluminescent layer 4512 may be composed of a single layer or a stack of multiple layers.

A protective film may be formed on the second electrode layer 4513 and the partition wall 4520 to prevent oxygen, hydrogen, moisture, carbon dioxide, etc. from entering the light emitting element 4511. As the protective film, a silicon nitride film, a silicon oxynitride film, a DLC film, etc. can be formed.

In addition, various signals and potentials supplied to the signal line driver circuits 4503a, 4503b, scanning line driver circuits 4504a, 4504b, or the pixel portion 4502 are supplied from FPCs 4518a, 4518b.

The connection terminal electrode 4515 is formed of the same conductive film as the first electrode layer 4517 of the light-emitting element 4511, and the terminal electrode 4516 is formed of the same conductive film as the source electrode layer and the drain electrode layer of the thin film transistors 4509 and 4510. Film formation.

The connection terminal electrode 4515 is electrically connected to the terminal of the FPC 4518a via the anisotropic conductive film 4519.

The second substrate located in the direction of light extraction from the light-emitting element 4511 4506 needs to be transparent. In this case, a light-transmitting material such as a glass plate, a plastic plate, a polyester film, or an acrylic resin film is used.

In addition, as the filler 4507, in addition to inert gases such as nitrogen and argon, ultraviolet curable resins or thermosetting resins can also be used. PVC (polyvinyl chloride), acrylic resin, polyimide, epoxy resin, silicone resin, PVB (polyvinyl butyral), or EVA (ethylene vinyl acetate) can be used. For example, nitrogen may be used as the filler.

In addition, if necessary, a polarizing plate, a circular polarizing plate (including an elliptical polarizing plate), a phase difference plate (λ/4 plate, λ/2 plate), and color filter can also be appropriately provided on the emitting surface of the light-emitting element. Optical films such as films. In addition, an anti-reflection film may be provided on the polarizing plate or the circular polarizing plate. For example, anti-glare treatment may be performed, which is a treatment that uses unevenness on the surface to diffuse reflected light and reduce glare.

The signal line driver circuits 4503a and 4503b and the scan line driver circuits 4504a and 4504b may also be mounted as driver circuits formed of a single crystal semiconductor film or a polycrystalline semiconductor film on a separately prepared substrate. In addition, only a signal line driver circuit or a part thereof, or a scanning line driver circuit or a part thereof may be separately formed and mounted. Accordingly, it is not limited to the structure of FIGS. 11A and 11B.

Through the above process, a highly reliable light-emitting display panel (light-emitting panel) as a semiconductor device can be manufactured.

This embodiment mode can be implemented in appropriate combination with the structures described in the other embodiment modes.

Example Mode 9

The semiconductor device disclosed in this specification can be used for electronic paper. Electronic paper can be used for electronic devices in all fields that display information. For example, electronic paper can be used for display in various cards such as e-book readers, posters, and train compartment advertisements of vehicles such as trams, and credit cards. Fig. 22 shows an example of an electronic device.

In addition, FIG. 22 shows an example of the e-book reader 2700. For example, the e-book reader 2700 is composed of two frames, namely, a frame 2701 and a frame 2703. The frame body 2701 and the frame body 2703 are integrally formed by a shaft portion 2711, and can open and close with the shaft portion 2711 as an axis. With this structure, it is possible to perform operations like a paper book.

The frame body 2701 is assembled with a display portion 2705, and the frame body 2703 is assembled with a display portion 2707. The structure of the display portion 2705 and the display portion 2707 may be a structure for displaying a continuous screen, or a structure for displaying different screens. By adopting a structure that displays different screens, for example, an article can be displayed on the right display portion (display portion 2705 in FIG. 22), and an image can be displayed on the left display portion (display portion 2707 in FIG. 22).

In addition, FIG. 22 shows an example in which the housing 2701 is provided with an operation unit and the like. For example, the housing 2701 includes a power supply 2721, operation keys 2723, a speaker 2725, and the like. Use the operation key 2723 to turn pages. In addition, it is also possible to adopt a configuration in which a keyboard, a pointing device, etc. are provided on the same surface as the display portion of the housing. In addition, it is also possible to use external connection terminals (earphone terminal, USB terminal or compatible with AC adapter and Various cable connection terminals, such as a USB cable, etc.), the structure of the recording medium insertion section, etc. Furthermore, the e-book reader 2700 may also have the function of an electronic dictionary.

In addition, the e-book reader 2700 may also adopt a structure for sending and receiving information wirelessly. It is also possible to adopt a structure in which desired book materials, etc., are purchased wirelessly from an e-book server and downloaded.

Embodiment Mode 10

The semiconductor device disclosed in this specification can be applied to various electronic devices (including game consoles). Examples of electronic equipment include: television devices (also called televisions or television receivers); monitors used in computers, etc.; image capturing devices such as digital cameras and digital cameras; digital photo frames, mobile phones (also called Mobile phones, mobile phone devices); portable game machines; portable information terminals; sound reproduction devices; large game machines such as pachinko machines, etc.

FIG. 23A shows an example of a television device 9600. In the television device 9600, a display portion 9603 is incorporated in a housing 9601. The display unit 9603 can display images. In addition, the structure in which the frame 9601 is supported by the bracket 9605 is shown here.

The television device 9600 can be operated by using the operation switch provided in the housing 9601 and the separately provided remote operation machine 9610. By using the operation keys 9609 provided in the remote operating machine 9610, the channel and volume can be operated, and the image displayed on the display unit 9603 can be operated. In addition, you can also use the remote control operating machine 9610 to set the display The structure of the display unit 9607 of the information output from the remote control 9610 is shown.

In addition, the television device 9600 adopts a structure including a receiver, a modem, and the like. By using the receiver, general TV broadcasts can be received. Furthermore, by connecting a modem to a wired or wireless communication network, it can also be one-way (from sender to receiver) or two-way (between sender and receiver or between receivers, etc.) Information communication.

FIG. 23B shows an example of a digital photo frame 9700. For example, in the digital photo frame 9700, a display portion 9703 is incorporated in a housing 9701. The display portion 9703 can display various images. For example, by displaying image data taken with a digital camera or the like, it can perform the same functions as a general photo frame.

In addition, the digital photo frame 9700 has a structure including an operation unit, external connection terminals (USB terminals, terminals that can be connected to various cables such as a USB cable, etc.), a recording medium insertion unit, and the like. This structure can also be assembled on the same surface as the display part, but it is better to install it on the side or back to improve the design. For example, a memory storing image data taken by a digital camera can be inserted into the recording medium insertion portion of the digital photo frame 9700 and the image data can be extracted, and then the extracted image data can be displayed on the display portion 9703.

In addition, the digital photo frame 9700 can also adopt a structure for sending and receiving information wirelessly. It is also possible to adopt a structure in which the desired image data is extracted and displayed wirelessly.

FIG. 24A shows a portable game machine, which is composed of two frames of a frame 9881 and a frame 9891, and can be connected in an open and closed manner by a connecting portion 9893. The frame 9881 is equipped with a display 9882, and the frame 9891 A display unit 9883 is installed. In addition, the portable game machine shown in FIG. 24A also has a speaker unit 9884, a recording medium insertion unit 9886, an LED light 9890, an input unit (operation keys 9885, connection terminals 9887, and a sensor 9888 (including functions for measuring the following factors) : Force, displacement, position, speed, acceleration, angular velocity, speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, electricity, radiation, flow, humidity, tilt Temperature, vibration, smell or infrared) and microphone 9889) and so on. Of course, the structure of the portable game machine is not limited to the above-mentioned structure, as long as the structure is equipped with at least the semiconductor device disclosed in this specification, and a structure in which other accessory equipment is appropriately provided may be adopted. The portable game machine shown in FIG. 24A has the following functions: read out the program or data stored in the recording medium and display it on the display unit; and realize information by wirelessly communicating with other portable game machines Shared. In addition, the functions of the portable game machine shown in FIG. 24A are not limited to this, and may have various functions.

FIG. 24B shows an example of a slot machine 9900 which is a kind of large gaming machine. A display unit 9903 is installed in the housing 9901 of the slot machine 9900. In addition, the slot machine 9900 is also equipped with operating units such as a start handle and a stop switch, a coin slot, and a speaker. Of course, the structure of the slot machine 9900 is not limited to this, as long as the structure is equipped with at least the semiconductor device disclosed in this specification. Therefore, it is possible to adopt a structure in which other accessory equipment is appropriately provided.

FIG. 25A is a perspective view showing an example of a portable computer.

In the portable computer shown in Figure 25A, when the upper frame is connected When the hinge device of the 9301 and the lower frame 9302 is set in the closed state, the upper frame 9301 with the display portion 9303 and the lower frame 9302 with the keyboard 9304 can be in an overlapping state, which is convenient to carry, and when the user uses the keyboard When inputting, the hinge device is set to the open state, and the input operation can be performed while looking at the display portion 9303.

In addition, the lower housing 9302 includes a positioning device 9306 for performing input operations in addition to the keyboard 9304. In addition, when the display portion 9303 is a touch screen input panel, input operations can be performed by touching a part of the display portion. In addition, the lower housing 9302 also includes arithmetic function units such as a CPU and a hard disk. In addition, the lower housing 9302 also has other devices, such as an external connection port 9305 for inserting a communication cable that complies with the USB communication standard.

The upper housing 9301 also has a display portion 9307 that can be stored by sliding it inside the upper housing 9301, so that a wide display screen can be realized. In addition, the user can adjust the direction of the screen of the display portion 9307 that can be stored. In addition, when the storageable display portion 9307 is a touch screen input panel, input operations can be performed by touching a part of the storageable display portion.

The display portion 9303 or the accommodating display portion 9307 uses an image display device such as a light-emitting display panel such as a liquid crystal display panel, an organic light-emitting element, or an inorganic light-emitting element.

In addition, the portable computer of FIG. 25A is equipped with a receiver, etc., and can receive television broadcasts and display images on the display unit. In addition, the user can close the hinge device connecting the upper frame 9301 and the lower frame 9302. In the closed state, slide the display portion 9307 to expose the entire surface and adjust the screen angle to watch TV broadcasts. At this time, instead of setting the hinge device to the open state to display on the display portion 9303, only the circuit that only displays the TV broadcast is activated, so the power consumption can be controlled to a minimum. This is especially true for portable computers with limited battery capacity. The words are very advantageous.

In addition, FIG. 25B is a perspective view showing an example of a mobile phone that can be worn on a user's arm like a watch.

The mobile phone includes: at least a communication device with a telephone function and a main body with a battery; a belt portion 9204 for wearing the main body on an arm; an adjusting portion 9205 for adjusting the fixed state of the belt portion 9204 and the arm; a display portion 9201 ; Speaker 9207; and microphone 9208.

In addition, the main body has an operation switch 9203, which can correspond to various functions by using the operation switch 9203, such as a power input switch, a display changeover switch, a camera start instruction switch, a switch that can activate a network program with one click, and so on.

The input operation of the mobile phone is performed by touching the display portion 9201 with a finger, an input pen, etc.; operating the operation switch 9203; or inputting a voice to the microphone 9208. In addition, in FIG. 25B, a display button 9202 displayed on the display portion 9201 is shown, and input can be performed by touching the display button 9202 with a finger or the like.

In addition, the main body has a camera portion 9206 having a photographing unit that converts an image of an object formed by a photographing lens into an electronic video signal. In addition, the camera section may not be provided in particular.

In addition, the mobile phone shown in Figure 25B is equipped with TV broadcast reception. It can receive TV broadcasts and display images on the display portion 9201, and it also has a storage device such as a memory, etc., and can record the TV broadcasts in the memory. In addition, the mobile phone shown in FIG. 25B may also have a function of collecting location information such as GPS.

The display portion 9201 uses an image display device such as a light-emitting display panel such as a liquid crystal display panel, an organic light-emitting element, or an inorganic light-emitting element. Since the mobile phone shown in FIG. 25B is small and light in weight, its battery capacity is limited. Therefore, it is best to use a panel that can be driven with low power consumption as a display device for the display portion 9201.

In addition, although the electronic device in the form of being worn on the "arm" is shown in FIG. 25B, it is not limited to this, as long as it has a shape that can be carried.

Example 1

Here, the results of simulating changes in the oxide semiconductor layer having a low oxygen density region and a high oxygen density region before and after the heat treatment will be described using FIGS. 21 and 34. Here, as the simulation software, Materials Explorer 5.0 manufactured by Fujitsu Co., Ltd. is used.

FIG. 34 shows a model of the oxide semiconductor layer used for the simulation. Here, the oxide semiconductor layer 701 has a structure in which a low oxygen density layer 703 and a high oxygen density layer 705 are laminated.

Here, the low oxygen density layer 703 adopts an amorphous structure composed of 15 In atoms, 15 Ga atoms, 15 Zn atoms, and 54 O atoms. Structure.

In addition, the high oxygen density layer 705 has an amorphous structure composed of 15 In atoms, 15 Ga atoms, 15 Zn atoms, and 66 O atoms.

In addition, the density of the oxide semiconductor layer 701 is set to 5.9 g/cm³。

Next, a classical MD (Molecular Dynamics) simulation was performed on the oxide semiconductor layer 701 at a temperature of 250° C. in the NVT ensemble. With a time step of 0.2fs, the total simulation time is set to 200ps. In addition, the potential of the metal-oxygen bond and the oxygen-oxygen bond uses the Born-Mayer-Huggins type potential. In addition, the operation of fixing the atoms at the upper end and the lower end of the oxide semiconductor layer 701.

Next, Fig. 21 shows the simulation result. 0 nm to 1.15 nm in the z-axis coordinate is the low oxygen concentration layer 703, and 1.15 nm to 2.3 nm in the z-axis coordinate is the high oxygen concentration layer 705. The solid line 707 represents the density distribution of oxygen before the MD simulation, and the broken line 709 represents the density distribution of oxygen after the MD simulation.

According to the solid line 707, the oxygen density in the side of the high oxygen density layer 705 is higher than the interface of the low oxygen density layer 703 and the high oxygen density layer 705. On the other hand, according to the broken line 709, it can be seen that the oxygen density in the low oxygen density layer 703 and the high oxygen density layer 705 is uniform.

From this, it can be seen that when there is a deviation in the oxygen density distribution as in the laminated state of the low oxygen density layer 703 and the high oxygen density layer 705, the heat treatment of oxygen diffuses from the high oxygen density region to the low oxygen density region, and the oxygen The density becomes uniform.

In other words, as shown in Embodiment Mode 1, by the first oxidation An oxide insulating film 407 is formed on the semiconductor layer 432. The oxygen density at the interface between the first oxide semiconductor layer 432 and the oxide semiconductor film 407 is increased, so that the oxygen diffuses into the low oxygen density region of the first oxide semiconductor layer 432. In order to achieve high resistance of the first oxide semiconductor layer. Accordingly, the reliability of the thin film transistor can be improved.